CN108712819A - A kind of printed wiring board scrapping method - Google Patents
A kind of printed wiring board scrapping method Download PDFInfo
- Publication number
- CN108712819A CN108712819A CN201810474385.3A CN201810474385A CN108712819A CN 108712819 A CN108712819 A CN 108712819A CN 201810474385 A CN201810474385 A CN 201810474385A CN 108712819 A CN108712819 A CN 108712819A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- copper
- layer
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of printed wiring board scrapping method, which is characterized in that includes the following steps：S1. preceding procedure of processing, printed wiring board finished product is obtained after premenstrual procedure of processing, and the printed wiring board finished product is equipped with copper patch；S2. copper pastes visual examination；S3. electrical testing：Printed wiring board finished product is subjected to powered test；S4. it will not carry out scrapping processing by the wiring board of electrical testing in the printed wiring board of abnormal appearance in step S2 or step S3, it is pasted including conductive copper, the conductive copper patch includes copper sheet layer and glue-line, conductive copper patch and copper patch are connected, so that conductive copper patch is connected to form short circuit with the circuit figure layer of printed wiring board, scrapping for printed wiring board is completed.Printed wiring board scrapping method product yield height, the production cost of the present invention is low, and production efficiency is high.
Description
Technical field
The invention belongs to wiring board processing technique fields, and in particular to a kind of printed wiring board scrapping method.
Background technology
Printed wiring board (abbreviation PCB) is the important component of electronic product, recently as the development of electronics industry,
Printed wiring board production development is extremely rapid.In printed wiring board process, it usually will produce some and scrap or unqualified
Wiring board intermediate products, these intermediate products scrapped obtain cupric dust after crushing, and copper content is up to 20~30%, remain
Remaining organic material is mainly glass fibre, if these waste materials are directly burned, fill or abandoned, not only waste of resource, can also
Serious pollution is brought to environment.The recycling that PCB copper-bearing waste materials are realized by industrializing means, economizes on resources, and protects
Environment realizes the sustainable development of IT industries, is a major issue with strategic importance.
In assist side production process, it will produce and largely scrap wiring board, this kind of usual copper content of printed circuit board is about
20-30%, remaining be epoxy glass fiber board group at.If the waste material is not used, the serious waste of resource has not only been caused, but also
Serious pollution is caused to environment.The component most basic as electronic product, the harmlessness disposing or resource of waste printed circuit board
Change to recycle and becomes key.
Conventional printed wiring board scrapping method is mainly two kinds:1. destructive scrapping method (punching/pneumatic pen polishing etc.),
Such method is also easy to produce copper scale and easily causes the exception such as short circuit, causes unnecessary scrap；2. marking scrapping method (white paint pen
Deng), such non-fast-drying type of method spent material needs certain time to go to dry or dry, it is necessary to possess personnel, place and set
It is standby, and influence producing line week transfer efficient.With development in science and technology, line width spacing is more and more intensive, and influence of the copper scale for yield is also got over
Come bigger；Personnel, place and equipment need the input of bigger simultaneously.
Invention content
The invention reside in overcoming the deficiencies of existing technologies, a kind of novel printed wiring board scrapping method, the print are provided
Wiring board scrapping method product yield processed is high, production cost is low, and production efficiency is high.
The technical scheme is that：A kind of printed wiring board scrapping method, which is characterized in that include the following steps：
S1. preceding procedure of processing, printed wiring board finished product is obtained after premenstrual procedure of processing, and the printed wiring board finished product is equipped with copper
Patch；
S2. copper pastes visual examination；
S3. electrical testing：Printed wiring board finished product is subjected to powered test；
S4. it will not scrapped by the wiring board of electrical testing in the printed wiring board of abnormal appearance in step S2 or step S3
Processing, including conductive copper patch, the conductive copper patch include copper sheet layer and glue-line, conductive copper patch and copper patch are connected so that conductive
Copper patch is connected to form short circuit with the circuit figure layer of printed wiring board, completes scrapping for printed wiring board.
Further, the circuit figure layer of the copper sheet layer and printed wiring board connects.
Further, the glue-line is conductive adhesive layer.
Further, the copper sheet layer is located at the lower section of glue-line, and the surface area of the copper sheet layer is more than the surface area of glue-line.
Further, the horizontal cross-section of the copper sheet layer and glue-line is concentric circles.
Further, the glue-line is Nian Jie with printed wiring board.
Further, the preceding procedure of processing further includes：
S1. sawing sheet：Shearing is carried out to copper-clad plate；
S2. internal layer and internal layer AOI：Printed wiring inner cord is carried out to make and internal layer inspection；
S3. it presses：Individual or multiple printed wiring board inner platings are pressed together；
S4. brown subtracts copper：Printed wiring plate surface copper foil is thinned and to surface brown；
S5. laser drilling：By radium-shine laser position processing blind hole required for printed wiring board surface layer and time outer layer, after being convenient for
Process formation electrically conducts；
S6. machine drilling：Process via hole required for client and rear process used tool hole；
S7. it is electroplated：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
S8. the making of outer layer dry film and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
S9. conductive copper is attached to AOI to examine on abnormal plate dense wire and copper face, them is made to form conducting network；
S10. anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
S11. word：Identify the position of each part onboard；
S12. change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
S13.CNC：External form processing is carried out to pcb board.
The present invention improves the scrapping method of printed wiring board, by conductive copper be attached to copper patch position on and and line
Road figure layer connection, makes circuit figure layer and copper face layer be connected to form short circuit, can select abnormal plate by appearance in this way, while can
To avoid abnormal plate from missing by electrical testing.
The beneficial effects of the present invention are：The present invention improves scrapping method, and conductive copper is attached to circuit figure layer
It is sticked with copper, circuit figure layer and copper face layer is made to be connected to form short circuit, can select abnormal plate by appearance in this way, while can be with
Abnormal plate is avoided to miss by electrical testing, and production efficiency is high, 2S can be completed；Yield is high, not will produce copper scale.
Description of the drawings
Fig. 1 is the structural schematic diagram of the printed wiring board of an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of conductive copper patch.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment
A kind of printed wiring board scrapping method, which is characterized in that include the following steps：
S1. preceding procedure of processing, printed wiring board finished product is obtained after premenstrual procedure of processing, and the printed wiring board finished product is equipped with copper patch
2；
S2. copper pastes visual examination；
S3. electrical testing：Printed wiring board finished product is subjected to powered test；
S4. it will not scrapped by the wiring board of electrical testing in the printed wiring board of abnormal appearance in step S2 or step S3
Processing, including conductive copper patch 3, the conductive copper patch include copper sheet layer 32 and glue-line 31, and conductive copper patch and copper patch are connected so that
Conductive copper is pasted forms short circuit with the conducting of the circuit figure layer 1 of printed wiring board, completes scrapping for printed wiring board.
Further, the circuit figure layer of the copper sheet layer and printed wiring board connects.
Further, the glue-line is conductive adhesive layer.
Further, the copper sheet layer is located at the lower section of glue-line, and the surface area of the copper sheet layer is more than the surface area of glue-line.
Further, the horizontal cross-section of the copper sheet layer and glue-line is concentric circles.
Further, the glue-line is Nian Jie with printed wiring board.
Further, the preceding procedure of processing further includes：
S1. sawing sheet：Shearing is carried out to copper-clad plate；
S2. internal layer and internal layer AOI：Printed wiring inner cord is carried out to make and internal layer inspection；
S3. it presses：Individual or multiple printed wiring board inner platings are pressed together；
S4. brown subtracts copper：Printed wiring plate surface copper foil is thinned and to surface brown；
S5. laser drilling：By radium-shine laser position processing blind hole required for printed wiring board surface layer and time outer layer, after being convenient for
Process formation electrically conducts；
S6. machine drilling：Process via hole required for client and rear process used tool hole；
S7. it is electroplated：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
S8. the making of outer layer dry film and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
S9. conductive copper is attached to AOI to examine on abnormal plate dense wire and copper face, them is made to form conducting network；
S10. anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
S11. word：Identify the position of each part onboard；
S12. change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
S13.CNC：External form processing is carried out to pcb board.
The present invention improves the scrapping method of printed wiring board, by conductive copper be attached to copper patch position on and and line
Road figure layer connection, makes circuit figure layer and copper face layer be connected to form short circuit, can select abnormal plate by appearance in this way, while can
To avoid abnormal plate from missing by electrical testing.
The beneficial effects of the present invention are：The present invention improves scrapping method, and conductive copper is attached to circuit figure layer
It is sticked with copper, circuit figure layer and copper face layer is made to be connected to form short circuit, can select abnormal plate by appearance in this way, while can be with
Abnormal plate is avoided to miss by electrical testing, and production efficiency is high, 2S can be completed；Yield is high, not will produce copper scale.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.It is noted that the technical characteristic not being described in detail in the present invention, it can be by appointing
One prior art is realized.
Claims (6)
1. a kind of printed wiring board scrapping method, which is characterized in that include the following steps：
S1. preceding procedure of processing, printed wiring board finished product is obtained after premenstrual procedure of processing, and the printed wiring board finished product is equipped with copper
Patch；
S2. copper pastes visual examination；
S3. electrical testing：Printed wiring board finished product is subjected to powered test；
S4. it will not scrapped by the wiring board of electrical testing in the printed wiring board of abnormal appearance in step S2 or step S3
Processing, including conductive copper patch, the conductive copper patch include copper sheet layer and glue-line, conductive copper patch and copper patch are connected so that conductive
Copper patch is connected to form short circuit with the circuit figure layer of printed wiring board, completes scrapping for printed wiring board.
2. printed wiring board scrapping method according to claim 1, which is characterized in that the copper sheet layer and printed wiring board
Circuit figure layer connection.
3. printed wiring board scrapping method according to claim 1, which is characterized in that the glue-line is conductive adhesive layer.
4. printed wiring board scrapping method according to claim 1, which is characterized in that the copper sheet layer is located under glue-line
Side, the surface area of the copper sheet layer are more than the surface area of glue-line.
5. printed wiring board scrapping method according to claim 1, which is characterized in that the level of the copper sheet layer and glue-line
Section is concentric circles.
6. printed wiring board scrapping method according to claim 1, which is characterized in that the preceding procedure of processing further includes：
S1. sawing sheet：Shearing is carried out to copper-clad plate；
S2. internal layer and internal layer AOI：Printed wiring inner cord is carried out to make and internal layer inspection；
S3. it presses：Individual or multiple printed wiring board inner platings are pressed together；
S4. brown subtracts copper：Printed wiring plate surface copper foil is thinned and to surface brown；
S5. laser drilling：By radium-shine laser position processing blind hole required for printed wiring board surface layer and time outer layer, after being convenient for
Process formation electrically conducts；
S6. machine drilling：Process via hole required for client and rear process used tool hole；
S7. it is electroplated：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
S8. the making of outer layer dry film and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
S9. conductive copper is attached to AOI to examine on abnormal plate dense wire and copper face, them is made to form conducting network；
S10. anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
S11. word：Identify the position of each part onboard；
S12. change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
S13.CNC：External form processing is carried out to pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810474385.3A CN108712819B (en) | 2018-05-17 | 2018-05-17 | Printed circuit board scrapping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810474385.3A CN108712819B (en) | 2018-05-17 | 2018-05-17 | Printed circuit board scrapping method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108712819A true CN108712819A (en) | 2018-10-26 |
| CN108712819B CN108712819B (en) | 2021-02-26 |
Family
ID=63869063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810474385.3A Active CN108712819B (en) | 2018-05-17 | 2018-05-17 | Printed circuit board scrapping method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108712819B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890128A (en) * | 2019-03-19 | 2019-06-14 | 信泰电子（西安）有限公司 | Circuit board defective products scraps identification method |
| CN111913072A (en) * | 2020-07-24 | 2020-11-10 | 胜宏科技（惠州）股份有限公司 | Method for identifying waste coil plate reporting |
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| CN102036480A (en) * | 2010-07-30 | 2011-04-27 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
| CN102821552A (en) * | 2012-09-12 | 2012-12-12 | 高德（无锡）电子有限公司 | Method for improving scrapped PCB (printed circuit board) marking process |
| CN105430943A (en) * | 2015-11-06 | 2016-03-23 | 高德（江苏）电子科技有限公司 | Method for monitoring discarded inner layer of multilayer board of printed circuit board |
| CN205249596U (en) * | 2015-10-21 | 2016-05-18 | 胜宏科技（惠州）股份有限公司 | Circuit board of defective products convenient to discernment |
| CN106961801A (en) * | 2017-04-06 | 2017-07-18 | 宜兴硅谷电子科技有限公司 | A kind of preparation method of constant line width tolerance printed substrate |
| JP2018056168A (en) * | 2016-09-26 | 2018-04-05 | 日立化成株式会社 | Manufacturing method of multi-wire wiring board, wiring board and multi-wire wiring board |
| CN108040428A (en) * | 2017-12-12 | 2018-05-15 | 惠州市金百泽电路科技有限公司 | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole |
-
2018
- 2018-05-17 CN CN201810474385.3A patent/CN108712819B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034678A (en) * | 2006-07-31 | 2008-02-14 | Epson Toyocom Corp | Sheet-like substrate base, and electronic device |
| CN102036480A (en) * | 2010-07-30 | 2011-04-27 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
| CN102821552A (en) * | 2012-09-12 | 2012-12-12 | 高德（无锡）电子有限公司 | Method for improving scrapped PCB (printed circuit board) marking process |
| CN205249596U (en) * | 2015-10-21 | 2016-05-18 | 胜宏科技（惠州）股份有限公司 | Circuit board of defective products convenient to discernment |
| CN105430943A (en) * | 2015-11-06 | 2016-03-23 | 高德（江苏）电子科技有限公司 | Method for monitoring discarded inner layer of multilayer board of printed circuit board |
| JP2018056168A (en) * | 2016-09-26 | 2018-04-05 | 日立化成株式会社 | Manufacturing method of multi-wire wiring board, wiring board and multi-wire wiring board |
| CN106961801A (en) * | 2017-04-06 | 2017-07-18 | 宜兴硅谷电子科技有限公司 | A kind of preparation method of constant line width tolerance printed substrate |
| CN108040428A (en) * | 2017-12-12 | 2018-05-15 | 惠州市金百泽电路科技有限公司 | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890128A (en) * | 2019-03-19 | 2019-06-14 | 信泰电子（西安）有限公司 | Circuit board defective products scraps identification method |
| CN111913072A (en) * | 2020-07-24 | 2020-11-10 | 胜宏科技（惠州）股份有限公司 | Method for identifying waste coil plate reporting |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108712819B (en) | 2021-02-26 |
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