CN102036480A - Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof - Google Patents
Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof Download PDFInfo
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- CN102036480A CN102036480A CN 201010242174 CN201010242174A CN102036480A CN 102036480 A CN102036480 A CN 102036480A CN 201010242174 CN201010242174 CN 201010242174 CN 201010242174 A CN201010242174 A CN 201010242174A CN 102036480 A CN102036480 A CN 102036480A
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Abstract
The embodiment of the invention discloses a circuit repair paster structure and a manufacturing method thereof as well as a circuit board and a repair method thereof, which relates to the field of manufacturing of a printed circuit board and aims at effectively solving the problem that a circuit board is scrapped as a result of circuit breakage, bonding pad break-off, IC (integrated circuit) break-off and other phenomena. The circuit repair paster structure comprises one or more circuit repair pasters corresponding to original circuit patterns of at least one damaged part of a circuit board, wherein the shapes and the dimensions of the circuit repair pasters are the same with or are similar to those of the corresponding original circuit patterns of the damaged part, and the circuit repair pasters can replace the corresponding original circuit patterns to be connected with other circuit patterns of the circuit board. The invention can be used for manufacturing a circuit board.
Description
Technical field
The present invention relates to printed circuit board and make the field, relate in particular to a kind of circuit mending paster structure and preparation method thereof, circuit board and method for repairing and mending.
Background technology
Along with the develop rapidly of electron trade, also more and more higher to the requirement of circuit board, circuit board has begun to move towards the high-density packages kenel of fine and closely woven circuit, aperture, multilayer, and fine degree strengthens gradually.Because the restriction of assembly technology and process for manufacturing circuit board etc., in the assembling process of circuit board, circuit board occurs single or phenomenon such as many rupture of lines, pads come off, IC (Integrated Circuit, integrated circuit) comes off easily, cause circuit board damage, can not normally use.
In the prior art, when above-mentioned phenomenon occurring,, can adopt the metal lead wire mode that circuit board is repaired for the simple relatively circuit board of circuit; And for the precision circuit plate of circuit relative complex, because restrictions such as size, be not suitable for adopting the metal lead wire mode to repair, phenomenons such as appearance rupture of line, pad come off, IC comes off may cause the monoblock circuit board to be scrapped, and because the cost of every veneer is more and more higher, so just cause loss at high price, improved the cost of manufacture of circuit board indirectly.Therefore, how to avoid because the circuit board due to the phenomenon such as rupture of line, pad come off, IC comes off is scrapped is the problem that needs solve.
Summary of the invention
Main purpose of the present invention is, a kind of circuit mending paster structure and preparation method thereof, circuit board and method for repairing and mending are provided, and can effectively solve the problem of scrapping of the circuit board that phenomenons such as rupture of line, pad come off, IC comes off bring.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of circuit mending paster structure, comprise with circuit board on the corresponding one or more circuit mending pasters of primary circuit figure of at least one damaged location, the shape and size of described circuit mending paster are same or similar with the shape and size of the corresponding primary circuit figure of described at least one damaged location, and the primary circuit figure that described circuit mending paster can substitute described correspondence is connected with other circuitous patterns of described circuit board.
The preparation method of the circuit mending paster structure that a kind of embodiment of the invention provides comprises:
On carrier substrate, be provided with and the corresponding coat of metal of described circuit mending paster structure;
The described coat of metal is separated from described carrier substrate, form described circuit mending paster structure.
A kind of circuit board, the replaced circuit mending paster structure that provides with the embodiment of the invention of at least one damaged location on the described circuit board makes described circuit mending paster structure can substitute described primary circuit figure and realizes the function of described primary circuit figure.
A kind of method for repairing and mending of circuit board comprises:
Damaged location on the circuit mending paster structure fix-up circuit plate that provides with the embodiment of the invention makes described circuit mending paster structure can substitute described primary circuit figure and realizes the function of described primary circuit figure.
After adopting technique scheme, the circuit mending paster structure that the embodiment of the invention provides, the manufacture method of circuit mending paster structure, circuit board, the method for repairing and mending of circuit board, when rupture of line appears in circuit board, pad comes off, during damage phenomenons such as IC comes off, the repairing of the corresponding circuit mending paster of damaged location on utilization and the circuit board, for example adopt circuit board line, the circuit mending paster of shape such as pad and IC is repaired, solve rupture of line, pad comes off, problems such as IC comes off, avoid scrapping of circuit board, and then reduced the cost of manufacture of circuit board.And because the circuitous pattern of damaged location is corresponding on circuit mending paster and the circuit board, both shape and size are identical or basic identical, guaranteed the regularity and the aesthetics of entire circuit plate plate face.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the Facad structure schematic diagram of the embodiment of the invention one;
Fig. 2 is the Facad structure schematic diagram of the embodiment of the invention two;
The flow chart of the manufacture method of the circuit mending paster structure that Fig. 3 provides for the embodiment of the invention;
Fig. 4 is the process chart of the embodiment of the invention three;
Fig. 5 is the process chart of the embodiment of the invention four.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Embodiments of the invention provide a kind of circuit mending paster structure, comprise with circuit board on the corresponding one or more circuit mending pasters of at least a portion circuitous pattern, the shape and size of corresponding circuitous pattern are same or similar on the shape and size of described circuit mending paster and the described circuit board, and the circuitous pattern that described circuit mending paster can substitute described correspondence is connected with other circuitous patterns of described circuit board.
The circuit mending paster structure that the embodiment of the invention provides can comprise one or more circuit mending pasters, and described circuit mending paster is used for the repairing of damaged location corresponding on the circuit board.When certain position on the circuit board is damaged, modes such as circuit mending paster employing conducting resinl that will be corresponding with damaged location or soldering-tin layer are bonding are arranged on the damaged location of circuit board, the primary circuit figure of damaged location is same or similar on the shape and size of the circuit mending paster that is adopted and the circuit board, the circuit mending paster will substitute the primary circuit figure and be connected with other circuitous patterns on the circuit board, thereby realize the function of primary circuit figure, like this, repairing by the circuit mending paster, avoid scrapping of circuit board, and then reduced the cost of manufacture of circuit board.And because the circuitous pattern at the shape and size of the circuit mending paster of repairing and circuit board damage position is same or similar, can either satisfy electrical connection, avoid being connected with the short circuit of other elements or circuit, can not bring extra electromagnetic effect again, guarantee the performance of entire circuit plate; And the vestige that the mode of repairing by the circuit mending paster can residual repairing has improved the regularity and the aesthetics of entire circuit plate plate face.
The primary circuit graphics circuitry that it is pointed out that damaged location on the size and dimension of circuit mending paster and the circuit board might not be identical, similarly also can.Both shape and size are similar to be meant, the shape of circuit mending paster and primary circuit figure are basic identical, size is mated substantially, can substitute the primary circuit figure equally and realize the function of primary circuit figure, in the embodiment of the invention, when the shape similarity of circuit mending paster and primary circuit figure more than 90%, dimensional discrepancy thinks all that 10% with interior both are similar.
Wherein, the shape of circuit mending paster can be corresponding with at least a shape in the circuitous patterns such as circuit, pad and integrated circuit pin, wherein pad also can comprise bar shaped pad, square pad, circular pad and oval pad etc., that is to say, circuitous pattern repair paster shape can for circuit board on the corresponding arbitrary shape of circuitous pattern, can require to be provided with according to reality.And the size of difform circuit mending paster is not limit, and multiple size can be arranged, equally can be according to the actual conditions setting.
The circuit mending paster structure that the embodiment of the invention provides can include only a circuit mending paster of the single shape of single size, also can comprise a plurality of circuit mending pasters.When the circuit mending paster structure that provides when the embodiment of the invention comprises a plurality of circuit mending paster, can include only a plurality of circuit mending pasters of single shape and single size, a plurality of circuit mending pasters that also can comprise single shape and multiple size, can comprise that also multiple shape and every kind of shape have single size or multiple shape and every kind of a plurality of circuit mending pasters that shape has at least a size, it is the circuit mending paster structure that the embodiment of the invention provides, the shape and size and the number of circuit mending paster are not limit, and can according to circumstances require to be provided with arbitrarily with reality.
In order to make those skilled in the art better understand technical scheme of the present invention, the circuit mending paster structure that the embodiment of the invention provides is elaborated below by specific embodiment.
Embodiment one
The circuit mending paster structure that present embodiment provides is a kind of circuit mending paster group, comprise a plurality of circuit mending pasters, as shown in Figure 1, present embodiment is a rectangle metal framework, be provided with a plurality of circuit mending pasters 10 in the inside casing, these circuit mending patch shape and size are in full accord, are oval pad shape, i.e. this enforcement comprises a plurality of circuit mending pasters 10 of single shape and single size.That is to say, present embodiment single at the circuitous pattern of repairing, when the pad obscission of same or similar shape and size occurring on the circuit board, can adopt the circuit mending paster 10 in the present embodiment to repair.
Certainly, the sort circuit of present embodiment is repaired paster structure, and the size and dimension of circuit mending paster 10 is not limit, and can be shape and size arbitrarily.
The sort circuit that present embodiment provides is repaired paster structure, and a plurality of circuit mending pasters can be provided, and promptly can be adapted to industrial needs for processes such as circuit board assembling provide the circuit mending paster in batches.During use, from present embodiment, the circuit mending paster of selecting is taken off, circuit board is repaired.In addition, present embodiment is also removable is divided into a plurality of independent circuit mending pasters 10 and uses.
Embodiment two
The circuit mending paster structure that present embodiment provides is similarly a kind of circuit mending paster group, comprise a plurality of circuit mending pasters, as shown in Figure 2, identical with embodiment one, present embodiment is a rectangle metal framework, be provided with a plurality of circuit mending pasters 10 in the inside casing, different with embodiment one is, the circuit mending paster 10 that comprises multiple shape in the present embodiment, include oval pad shape paster 101, circuit shape paster 102, square pad shape paster 103 and circular pad 104 etc., and the circuit mending paster 10 of every kind of shape includes at least a size.Be present embodiment various at the circuitous pattern of repairing, when fracture or obscission occurring on the circuit board, can adopt the circuitous pattern of 10 pairs of damaged locations of circuit mending paster corresponding, same or similar shape and size in the present embodiment to repair.
Certainly, the sort circuit of present embodiment is repaired paster structure, and the size and dimension of circuit mending paster 10 is not limit, and can be the combination in any of the circuit mending paster of difformity and size.Relatively and embodiment one, the circuit mending paster kind of present embodiment is more, and range of application is wider.
The sort circuit that present embodiment provides is repaired paster structure, and a plurality of circuit mending pasters can be provided, and promptly can be adapted to industrial needs for processes such as circuit board assembling provide the circuit mending paster in batches.During use, from present embodiment, the circuit mending paster of selecting is taken off, circuit board is repaired.In addition, present embodiment is also removable is divided into a plurality of independent circuit mending pasters 10 and uses.
Accordingly, the embodiment of the invention also provides a kind of foregoing circuit to repair the manufacture method of paster structure, and flow chart as shown in Figure 3 comprises the following steps:
S11 is provided with the coat of metal corresponding with the circuit mending paster structure on carrier substrate;
Wherein, described circuit mending paster structure comprise with circuit board on the corresponding one or more circuit mending pasters of at least a portion circuitous pattern, the shape and size of corresponding circuitous pattern are same or similar on the shape and size of described circuit mending paster and the described circuit board, and the circuitous pattern that can substitute described correspondence is connected with other circuitous patterns of described circuit board;
S12 separates the described coat of metal from described carrier substrate, form the circuit mending paster structure.
The manufacture method that the embodiment of the invention provides, prepared circuit mending paster structure can comprise the circuit mending paster of arbitrary shape and size, circuit board can be by repairing damaged location with the circuit mending paster of the same or similar shape and size of primary circuit figure of damaged location, avoid scrapping of circuit board, reduced the cost of manufacture of circuit board.
Further, before the S11 step, the preparation method that the embodiment of the invention provides also comprises: according to actual needs, design circuit is repaired paster structure, described design comprises that design circuit repairing paster structure comprises shape, size and the number of circuit mending paster, and the outward appearance pattern etc.The circuit mending paster structure can comprise with circuit board on the corresponding one or more circuit mending pasters of at least a portion circuitous pattern, the circuit mending paster can have any shape and size, can design according to actual needs.And then, prepare designed circuit mending paster structure by S11 and S12 step.
Wherein, because in the S12 step, need with described carrier substrate with separate with the corresponding coat of metal of circuit mending paster structure, therefore, the carrier substrate material adopts on the physical property and described coat of metal material adhesive force materials with smaller each other usually, is convenient to successfully separating of the carrier substrate and the coat of metal.Generally, coat of metal material is a copper, and the steel plate that preferably adopt this moment and copper product adhesive force is less is as carrier substrate.Carrier substrate can use repeatedly, has reduced production cost.Certainly, can also select the carrier substrate of other materials, not do qualification here.
In order to make those skilled in the art better understand technical scheme of the present invention, the manufacture method of the circuit mending paster structure that the embodiment of the invention is provided below by specific embodiment is elaborated.
Embodiment three
Present embodiment can be described as addition process, as shown in Figure 4, comprising:
S21 adopts steel plate as carrier substrate, and steel plate is carried out chemical cleaning;
This step is mainly in order to remove surface of steel plate impurity and dirt, and makes surface of steel plate smooth smooth.
Certainly, can also adopt the carrier substrate of other materials in this step.
S22 pastes dry film at surface of steel plate;
S23, the method by exposure imaging with the pattern transfer of prepared circuit mending paster structure to surface of steel plate;
After this step, will the exposing of the part that surface of steel plate is corresponding with described circuit mending paster structure, other parts are coated with dry film.Can be according to actual requirement, the pattern of circuit mending paster structure is set, can comprise in the pattern of circuit mending paster structure and satisfy the actual arbitrary shape that requires and the circuit mending paster of size that the shape and size of corresponding circuitous pattern are same or similar on the shape and size of described circuit mending paster and the circuit board.
S24 electroplates steel plate;
After this step, surface of steel plate will not electroplated by the part that dry film covers, coating material is generally copper, also can be other coating materials, be that the surface of steel plate part corresponding with prepared circuit mending paster structure will form line pattern coating, other parts will be because the barrier effect of dry film can not form coating.
Like this, through S22 to S24 step, just on steel plate, be provided with the coat of metal corresponding with prepared circuit mending paster structure.
Further, present embodiment also can comprise:
S25 is to surface of steel plate deposition nickel-gold layer;
The nickel-gold layer that this step deposited plays the anti-oxidation protection effect to the line pattern copper coating, also plays easy welding effect in follow-up paster uses.After this step, metal coating surface corresponding with the circuit mending paster structure on the steel plate has covered one deck nickel-gold layer, because other outer parts of the demetalization of surface of steel plate are also posted dry film, the nickel-gold layer of other parts can be removed simultaneously along with the step of follow-up removal dry film.
S26 removes the remaining dry film of surface of steel plate;
In this step, steel plate is immersed in NaOH (NaOH) solution the remaining dry film of stripping surface of steel plate, promptly on the surface of steel plate, partly dry film beyond the coat of metal corresponding with the circuit mending paster structure.
S27 separates the coat of metal by the mode of tearing from steel plate, the isolated coat of metal be the circuit mending paster structure that will obtain.
Embodiment four
Present embodiment can be described as subtractive process, as shown in Figure 5, comprising:
S31 adopts steel plate as carrier substrate, and steel plate is carried out chemical cleaning;
This step is mainly in order to remove surface of steel plate impurity and dirt, and makes surface of steel plate smooth smooth.
Certainly, can also adopt the carrier substrate of other materials in this step.
S32 electroplates steel plate, forms coating at surface of steel plate, is generally copper coating;
S33 pastes dry film at coating surface;
S34, the method by exposure imaging with the pattern transfer of prepared circuit mending paster structure to coating surface;
After this step, the part that surface of steel plate is corresponding with described circuit mending paster structure will be exposed, and other parts are coated with dry film.Can be according to actual requirement, the pattern of circuit mending paster structure is set, can comprise in the pattern of circuit mending paster structure and satisfy the actual arbitrary shape that requires and the circuit mending paster of size that the shape and size of corresponding circuitous pattern are same or similar on the shape and size of described circuit mending paster and the circuit board.
S35 is at coating surface deposition nickel-gold layer;
The nickel-gold layer that this step deposited plays following 2 effects:
One, in etching, play anticorrosive effect, not etched thereby protective circuit is repaired the line pattern coating of paster structure correspondence;
Two, heavy nickel-gold layer plays easy welding effect in follow-up paster uses;
After this step, metal coating surface corresponding with the circuit mending paster structure on the steel plate has covered one deck nickel-gold layer, and other parts of the coat of metal also are coated with dry film, and the nickel-gold layer of these parts can be removed simultaneously along with the step of follow-up removal dry film.
S36 removes the remaining dry film of coating surface;
After finishing heavy nickel gold,, need carry out etching and processing in order to obtain the complete line pattern coating corresponding with the circuit mending paster structure.Therefore need at first to strip circuit dry film in addition, carry out etching again, just can obtain complete line pattern coating with NaOH solution.After this step, the copper coating surface coverage has the nickel-gold layer corresponding with the circuit mending paster structure.
S37 carries out etching to steel plate;
This step adopts the mode of alkaline etching usually; steel plate is immersed in carries out etching in the sal-ammoniac alkaline etching liquid; because the part corresponding with the circuit mending paster structure is coated with nickel-gold layer on the coating; nickel-gold layer can protect this part coating not to be corroded, and other part coating that do not covered by nickel-gold layer will be corroded.Like this, through S32 to S37 step, just on steel plate, be provided with the coat of metal corresponding with prepared circuit mending paster structure.
S38, by peel manually from mode the coat of metal is separated from steel plate, the isolated coat of metal be the circuit mending paster structure that will obtain.
The preparation method that the embodiment of the invention provides, carrier substrate can use repeatedly, and is with low cost, and the fabrication cycle of this preparation flow is short, can be used to prepare the circuit mending paster structure of the circuit mending paster that comprises arbitrary number and arbitrary graphic and size.
Accordingly, embodiments of the invention provide a kind of circuit board again, the replaced circuit mending paster structure that provides with the embodiment of the invention of at least one damaged location on the described circuit board makes described circuit mending paster structure can substitute described primary circuit figure and realizes the function of described primary circuit figure.
The circuit board that the embodiment of the invention provides, thus the primary circuit figure that adopts the circuit mending paster structure to substitute damaged location is realized the function of described primary circuit figure, has so just avoided scrapping of circuit board, has reduced the cost of manufacture of circuit board.
Wherein, damaged location is meant that circuitous pattern on the circuit board fracture occurs or come off waiting the position of damage phenomenon, the damaged location that for example rupture of line, pad come off, IC comes off.The circuit mending paster structure that is adopted comprises the circuit mending paster corresponding with the primary circuit figure of damaged location, and the shape and size of the primary circuit figure of this circuit mending paster and damaged location are same or similar.
It is to be noted, the circuit board that the embodiment of the invention provides preferably adopts the identical circuit mending paster of shape and size with the primary circuit figure of damaged location, like this, the registration of circuit mending paster and primary circuit figure is good, vestige that can residual repairing has guaranteed the regularity and the aesthetics of entire circuit plate plate face.Certainly, the shape and size of circuit mending paster structure are not limited to the primary circuit figure of damaged location identical, similarly also can.Both shape and size are similar to be meant, the shape of circuit mending paster and primary circuit figure are basic identical, and size is mated substantially, can substitute the primary circuit figure equally and realizes the function of primary circuit figure.In the embodiment of the invention, when the shape similarity of circuit mending paster and primary circuit figure more than 90%, dimensional discrepancy thinks all that 10% with interior both are similar.
Wherein, the circuit mending paster can adopt the welding or the mode of conductive adhesive to be arranged on the position of primary circuit figure correspondence at circuit board damage position, the circuit mending paster is fixed on the position of primary circuit figure correspondence of damaged location, and the primary circuit figure at replace damaged position is realized being connected with the functional electric of other circuitous patterns of circuit board.
In addition, the circuit board that the embodiment of the invention provides, the shape and size of circuit mending paster are not limit, and promptly the disappearance or the damage of the circuitous pattern of Any shape and size appears in the circuitous pattern on the circuit board, all can adopt corresponding circuit mending paster to repair
Accordingly, embodiments of the invention also provide a kind of method for repairing and mending of circuit board, comprising:
Damaged location on the circuit mending paster structure fix-up circuit plate that provides with the embodiment of the invention makes described circuit mending paster structure can substitute described primary circuit figure and realizes the function of described primary circuit figure.
Wherein, damaged location is meant that circuitous pattern on the circuit board fracture occurs or come off waiting the position of damage phenomenon, the damaged location that for example rupture of line, pad come off, IC comes off.
The method for repairing and mending that the embodiment of the invention provides, thereby the primary circuit figure that adopts the circuit mending paster structure to substitute damaged location is realized the mode of the function of described primary circuit figure damaged location is repaired, so just avoid scrapping of circuit board, reduced the cost of manufacture of circuit board.
Wherein, damaged location is meant that circuitous pattern on the circuit board fracture occurs or come off waiting the position of damage phenomenon, the damaged location that for example rupture of line, pad come off, IC comes off.The circuit mending paster structure that is adopted comprises the circuit mending paster corresponding with the primary circuit figure of damaged location, and the shape and size of the primary circuit figure of this circuit mending paster and damaged location are same or similar.
When come off when rupture of line, pad appear in some position on the circuit board, IC comes off etc. damaged phenomenon, the method for repairing and mending that the embodiment of the invention provides, employing substitutes the primary circuit figure that is damaged with the circuit mending paster of the same or similar shape and size of primary circuit figure of damaged location, substitutes the function that the primary circuit figure is realized the primary circuit figure.Like this, just avoid scrapping of circuit board, reduced the cost of manufacture of circuit board.And because the shape and size and the primary circuit figure of the circuit mending paster that is used to repair are same or similar, when for example repairing circuit ruptures, how wide the fracture circuit be on the circuit board, just adopt how wide circuit shape circuit mending paster during repairing, come off circuit mending paster that the position is provided with of pad is the pad shape circuit mending paster etc. of corresponding size, therefore, the registration of circuit mending paster and primary circuit figure is very good, vestige that can residual repairing, the regularity and the aesthetics of entire circuit plate plate face have been guaranteed, and, the mode of repairing by the circuit mending paster promptly can satisfy the electrical connection between circuit, avoid being connected, can not bring extra electromagnetic effect again, guaranteed the performance of entire circuit plate with the short circuit of other elements or circuit.
It is to be noted, the method for repairing and mending that the embodiment of the invention provides, the preferred employing circuit mending paster identical with the shape and size of the primary circuit figure of damaged location substitutes described primary circuit figure, like this, the registration of circuit mending paster and primary circuit figure is good, vestige that can residual repairing has guaranteed the regularity and the aesthetics of entire circuit plate plate face.Certainly, the shape and size of circuit mending paster structure are not limited to the primary circuit figure of damaged location identical, similarly also can.In the embodiment of the invention, when the shape similarity of circuit mending paster and primary circuit figure more than 90%, dimensional discrepancy thinks all that 10% with interior both are similar.
Wherein, can adopt the mode of welding or conductive adhesive that the circuit mending paster is arranged on damaged location place on the circuit board, the circuit mending paster is fixed on the position of primary circuit figure correspondence of damaged location, and the primary circuit figure at replace damaged position is realized being connected with the functional electric of other circuitous patterns of circuit board.
In addition, the method for repairing and mending that the embodiment of the invention provides before with the damaged location on the circuit mending paster fix-up circuit plate, needs the described damaged location of cleaning earlier, is easy to follow-up repairing and connects.When occurring the circuitous pattern fracture on the circuit board or coming off, will there be at least two open circuit ports in the damaged location place, can be at first the open circuit port of circuit board damage position circuitous pattern be carried out grinding process, the port of will opening a way polishes wear down, is easy to follow-up repairing and connects.Then, between open circuit port top and port, coat solder(ing) paste, will aim at the position of primary circuit figure, be welded on the circuit board with the circuit mending paster of the primary circuit figure respective shapes of damaged location and size corresponding to the repairing area of primary circuit figure.And, in order to guarantee the regularity and the aesthetics of entire circuit plate plate face, and do not bring extra electromagnetic effect, when the circuit mending paster is set, to guarantee as far as possible that the circuit mending paster covers replacement with aiming at of primary circuit figure, but manual-alignment or employing are aimed at positioner automatically the circuit mending paster are arranged on the position corresponding on the circuit board, and the alignment precision that makes circuit mending paster and primary circuit figure is more than 90%.
After with the damaged location on the circuit mending paster fix-up circuit plate, the method for repairing and mending that the embodiment of the invention provides also comprises: the electrical property of the circuit board after test is repaired by the circuit mending paster.
After the damaged location of circuit board is provided with the circuit mending paster, can adopt electrical testing device etc. that the circuit mending paster is tested with the circuitous pattern electrical property that is connected, guarantee the reliability of repairing.
The shape that it is pointed out that the circuit mending paster that the method for repairing and mending of the embodiment of the invention adopts is not limit, and promptly the circuitous pattern on the circuit board disappearance of Any shape occurs or when damaging, all can adopt corresponding circuit mending paster to repair.
The above; only be the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (12)
1. circuit mending paster structure, it is characterized in that, comprise with circuit board on the corresponding one or more circuit mending pasters of primary circuit figure of at least one damaged location, the shape and size of described circuit mending paster are same or similar with the shape and size of the corresponding primary circuit figure of described at least one damaged location, and the primary circuit figure that described circuit mending paster can substitute described correspondence is connected with other circuitous patterns of described circuit board.
2. circuit mending paster structure according to claim 1 is characterized in that, the shape of described circuit mending paster is corresponding with at least a shape in following: circuit, pad and integrated circuit pin.
3. circuit mending paster structure according to claim 1 is characterized in that, described circuit mending paster structure comprises:
A plurality of circuit mending pasters of single shape and single size, perhaps
A plurality of circuit mending pasters of single shape and at least two kinds of sizes, perhaps
At least two kinds of shapes and every kind of shape have a plurality of circuit mending pasters of single size, perhaps
At least two kinds of shapes and every kind of a plurality of circuit mending pasters that shape has at least a size.
4. the preparation method as each described circuit mending paster structure of claim 1 to 3 is characterized in that, comprising:
On carrier substrate, be provided with and the corresponding coat of metal of described circuit mending paster structure;
The described coat of metal is separated from described carrier substrate, form described circuit mending paster structure.
5. preparation method according to claim 4 is characterized in that, describedly the coat of metal corresponding with described circuit mending paster structure is set on carrier substrate comprises:
Paste dry film on described carrier substrate surface;
Method by exposure imaging with the pattern transfer of described circuit mending paster structure to the carrier substrate surface;
Described carrier substrate is electroplated, formed and the corresponding coat of metal of described circuit mending paster structure on described carrier substrate surface.
6. preparation method according to claim 4 is characterized in that, describedly the coat of metal corresponding with described circuit mending paster structure is set on carrier substrate comprises:
Described carrier substrate is electroplated, formed coating on described carrier substrate surface;
Paste dry film at described coating surface, the method by exposure imaging with the pattern transfer of described circuit mending paster structure to coating surface;
At described coating surface deposition nickel-gold layer;
Remove the remaining dry film of described coating surface;
Described carrier substrate is carried out etching, form and the corresponding coat of metal of described circuit mending paster structure on described carrier substrate surface.
7. according to each described preparation method of claim 4 to 6, it is characterized in that described carrier substrate is a steel plate.
8. circuit board, it is characterized in that, at least one damaged location on the described circuit board is replaced with as each described circuit mending paster structure in the claim 1 to 3, makes described circuit mending paster structure can substitute described primary circuit figure and realizes the function of described primary circuit figure.
9. circuit board according to claim 8 is characterized in that, described circuit mending paster structure adopts the mode of welding or conducting resinl bonding to be arranged on the position of primary circuit figure correspondence of described damaged location.
10. the method for repairing and mending of a circuit board is characterized in that, comprising:
With as the damaged location on each described circuit mending paster structure fix-up circuit plate in the claim 1 to 3, make described circuit mending paster structure can substitute described primary circuit figure and realize the function of described primary circuit figure.
11. method for repairing and mending according to claim 10 is characterized in that,
The mode that adopts welding or conducting resinl to bond is arranged on described circuit mending paster structure at the damaged location place of described circuit board.
12. method for repairing and mending according to claim 10 is characterized in that, described method for repairing and mending also comprises:
Before with the damaged location on the circuit mending paster structure fix-up circuit plate, clear up described damaged location; And/or
After with the damaged location on the circuit mending paster structure fix-up circuit plate, the electrical property of the circuit board after test is repaired by described circuit mending paster structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102421740A CN102036480B (en) | 2010-07-30 | 2010-07-30 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN102392247A (en) * | 2011-10-26 | 2012-03-28 | 首都航天机械公 | Electroplating method for middle local area of part for diffusion welding |
| CN107249258A (en) * | 2017-06-06 | 2017-10-13 | 苏州胜科设备技术有限公司 | A kind of repair method of PCB pads |
| CN107567200A (en) * | 2017-09-22 | 2018-01-09 | 广州兴森快捷电路科技有限公司 | Board pads restorative procedure |
| CN108712819A (en) * | 2018-05-17 | 2018-10-26 | 惠州中京电子科技有限公司 | A kind of printed wiring board scrapping method |
| CN109302793A (en) * | 2017-07-25 | 2019-02-01 | 双鸿电子(惠州)有限公司 | A kind of PCB mark mending method |
| CN109561599A (en) * | 2018-12-12 | 2019-04-02 | 广东科翔电子科技有限公司 | A kind of circuit mending method of high-precision fine rule road PCB |
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| CN102392247A (en) * | 2011-10-26 | 2012-03-28 | 首都航天机械公 | Electroplating method for middle local area of part for diffusion welding |
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| CN107249258A (en) * | 2017-06-06 | 2017-10-13 | 苏州胜科设备技术有限公司 | A kind of repair method of PCB pads |
| CN109302793A (en) * | 2017-07-25 | 2019-02-01 | 双鸿电子(惠州)有限公司 | A kind of PCB mark mending method |
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| CN107567200B (en) * | 2017-09-22 | 2019-09-06 | 广州兴森快捷电路科技有限公司 | Board pads restorative procedure |
| CN108712819A (en) * | 2018-05-17 | 2018-10-26 | 惠州中京电子科技有限公司 | A kind of printed wiring board scrapping method |
| CN108712819B (en) * | 2018-05-17 | 2021-02-26 | 惠州中京电子科技有限公司 | Printed circuit board scrapping method |
| CN109561599A (en) * | 2018-12-12 | 2019-04-02 | 广东科翔电子科技有限公司 | A kind of circuit mending method of high-precision fine rule road PCB |
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Effective date of registration: 20220624 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |