CN102821552A - Method for improving scrapped PCB (printed circuit board) marking process - Google Patents
Method for improving scrapped PCB (printed circuit board) marking process Download PDFInfo
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- CN102821552A CN102821552A CN2012103356521A CN201210335652A CN102821552A CN 102821552 A CN102821552 A CN 102821552A CN 2012103356521 A CN2012103356521 A CN 2012103356521A CN 201210335652 A CN201210335652 A CN 201210335652A CN 102821552 A CN102821552 A CN 102821552A
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- Prior art keywords
- pen
- silver
- conduction
- pcb
- scrapped
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Abstract
The invention relates to a method for improving a scrapped PCB (printed circuit board) marking process, belonging to the technical field of printed circuit boards. The method comprises the following steps of: tapping the top of a conductive/silver pen on a hard surface so that the hard surface stretches out and draws back, and forcibly shaking the pen so that materials are mixed; gently pressing a nib against the intensive circuit part of a scrapped PCB, and forcibly pressing a hose so that liquid is uniformly ejected; respectively placing 1-10 min by using a plate with a mark drawn by using the conductive pen; and finally, cleaning the nib by using a non-dust fabric after the pen is completely used each time, and recovering a cap of the pen. According to the invention, a scrapped marking method is implemented by using a conductive/silver pen, so that the operating difficulty of the operating personnel can be reduced, the time consumption is short, and the working efficiency of workers is improved; and meanwhile, a defect that in a solder-mask printing process, because copper wires and copper scraps are covered by a solder mask, a short-circuit scrapping situation is caused is avoided, therefore, the method has a board industrial application prospect.
Description
Technical field
The present invention relates to a kind of PCB of improvement and beat the method for scrapping technology, belong to the printed circuit technique field.
Background technology
In the internal layer circuit and outer-layer circuit process of manufacturing PCB, can produce bad causing to scrap, but the bad mode of scrapping of beating can cause once more and pollute, increase more bad scrapping, even cause the visitor to tell, influence the benefit and the prestige of company.
It is following to beat at present the technology of scrapping: through the optical scanner of automatic optical checking equipment (AOI); The problematic plate that detects; Ectonexine AOI scraps plate to beat the mode of scrapping is hole milling machine hole milling, lancinating to break or blow device with maintenance and blowing circuit to bad; This type of dozen newspaper mode easy generation copper scale or copper wire are attached to the interior dense wire place of plate and cause little weak point, and the ET test can't test out, and is prone to cause the visitor to tell.
Repair at present to beat and scrap technology and have following problem: the employee beats to scrap and uses scraper to slice off circuit, and hole milling and blow the copper that circuit produces becomes tiny copper wire, copper scale; According to present technology, these copper wires, copper scale can not in time be removed, can be attached on the pcb board face; Get into next process with pcb board, can pollute one operation down, and clean through next process; Can not wash fully attached to the copper wire on the pcb board face, copper scale is in the pressing process and in the technology of anti-welding printing; Copper wire, copper scale be by under anti-welding the covering, and then cause short circuit to scrap, even bring hidden danger to shipment to the product quality of client.
Summary of the invention
The objective of the invention is to overcome the deficiency that exists in the prior art, a kind of not only environmental protection is provided but also can produce the method for copper scale or copper wire, reach and beat the effect of scrapping.
According to technical scheme provided by the invention, a kind of PCB of improvement beats the method for scrapping technology, and step is following:
(1) preparation of conduction/silver pen: get commercial gained conduction/silver pen, on crust, rap and make it flexible and firmly to shake the liquid mixing of conduction/silver in making even;
(2) spraying: get conduction/silver pen that step (1) is prepared, nib is pushed up gently scrap pcb board dense wire place, firmly press the flexible pipe of conduction/silver pen, an interior liquid is evenly sprayed, be sprayed on the dense wire place;
(3) dry: will spray the pcb board that finishes and hang 1 ~ 10min respectively until its drying;
(4) cleaning: use the back at every turn and use a non-dust cloth cleaning conduction/silver nib, and cover the cap for brush again.
Said pcb board places on the fence car when drying and dries, and is not overlapping between pcb board and the pcb board.
The present invention has following advantage: the present invention makes to beat scrapping method through using conduction/silver pen; Both can reduce operating personnel's operation easier, weak point consuming time improves personnel's operating efficiency; Avoided again in the technology of anti-welding printing; Copper wire, copper scale are by under anti-welding the covering, and then the defective that causes short circuit to scrap, and it has wide industrial and uses future.
Embodiment
The pen of conduction/silver described in the embodiment must also rich science and technology available from Suzhou.
A kind of PCB of improvement beats the method for scrapping technology, and step is following:
(1) preparation of conduction/silver pen: get commercial gained conduction/silver pen, on crust, rap and make it flexible and firmly to shake the liquid mixing of conduction/silver in making even;
(2) spraying: get conduction/silver pen that step (1) is prepared, nib is pushed up gently scrap pcb board dense wire place, firmly press the flexible pipe of conduction/silver pen, an interior liquid is evenly sprayed, be sprayed on the dense wire place;
(3) dry: will spray the pcb board that finishes and hang 1 ~ 10min respectively until its drying;
(4) cleaning: use the back at every turn and use a non-dust cloth cleaning conduction/silver nib, and cover the cap for brush again.
Said pcb board places on the fence car when drying and dries, and is not overlapping between pcb board and the pcb board.
To use conduction/silver pen to beat the mode of scrapping and use PCB internal layer and outer Core to beat the mode of scrapping, after using conduction/silver to beat to scrap, pre-treatment that can anti-next process (main pre-treatment soup H
2SO
4With H
2O
2Or H
2SO
4With SPS series, to CuSO
4Sting the amount of biting at 20-40 mir-inch) and do not fall, do not influence its short-circuit capability, use conduction/silver pen to beat the position of scrapping and use universal instrument measurement conductivity good.
Claims (2)
1. one kind is improved PCB and beats the method for scrapping technology, it is characterized in that step is following:
(1) preparation of conduction/silver pen: get commercial gained conduction/silver pen, on crust, rap and make it flexible and firmly to shake the liquid mixing of conduction/silver in making even;
(2) spraying: get conduction/silver pen that step (1) is prepared, nib is pushed up scrap pcb board dense wire place, firmly press the flexible pipe of conduction/silver pen, an interior liquid is evenly sprayed, be sprayed on the dense wire place;
(3) dry: will spray the pcb board that finishes and hang 1 ~ 10min respectively until its drying;
(4) cleaning: use the back at every turn and use a non-dust cloth cleaning conduction/silver nib, and cover the cap for brush again.
2. improve PCB according to claim 1 and beat the method for scrapping technology, it is characterized in that: said pcb board places on the fence car when drying and dries, and is not overlapping between pcb board and the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103356521A CN102821552A (en) | 2012-09-12 | 2012-09-12 | Method for improving scrapped PCB (printed circuit board) marking process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103356521A CN102821552A (en) | 2012-09-12 | 2012-09-12 | Method for improving scrapped PCB (printed circuit board) marking process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102821552A true CN102821552A (en) | 2012-12-12 |
Family
ID=47305314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103356521A Pending CN102821552A (en) | 2012-09-12 | 2012-09-12 | Method for improving scrapped PCB (printed circuit board) marking process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102821552A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108712819A (en) * | 2018-05-17 | 2018-10-26 | 惠州中京电子科技有限公司 | A kind of printed wiring board scrapping method |
| JP2019195018A (en) * | 2018-05-01 | 2019-11-07 | 億奇生物科技責任有限公司Ａｉｄｍｉｃｓ Ｂｉｏｔｅｃｈｎｏｌｏｇｙ（Ｈｋ） Ｃｏ．， Ｌｉｍｉｔｅｄ | Handmade circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6379745B1 (en) * | 1997-02-20 | 2002-04-30 | Parelec, Inc. | Low temperature method and compositions for producing electrical conductors |
| CN101076572A (en) * | 2004-12-11 | 2007-11-21 | 伊斯曼柯达公司 | Conductive silver dispersions and uses thereof |
| CN101742826A (en) * | 2008-11-11 | 2010-06-16 | 欣兴电子股份有限公司 | Method for repairing circuits of embedded circuit board |
| CN102307434A (en) * | 2011-08-30 | 2012-01-04 | 东莞美维电路有限公司 | UV adding line instrument and adding line method |
-
2012
- 2012-09-12 CN CN2012103356521A patent/CN102821552A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6379745B1 (en) * | 1997-02-20 | 2002-04-30 | Parelec, Inc. | Low temperature method and compositions for producing electrical conductors |
| CN101076572A (en) * | 2004-12-11 | 2007-11-21 | 伊斯曼柯达公司 | Conductive silver dispersions and uses thereof |
| CN101742826A (en) * | 2008-11-11 | 2010-06-16 | 欣兴电子股份有限公司 | Method for repairing circuits of embedded circuit board |
| CN102307434A (en) * | 2011-08-30 | 2012-01-04 | 东莞美维电路有限公司 | UV adding line instrument and adding line method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019195018A (en) * | 2018-05-01 | 2019-11-07 | 億奇生物科技責任有限公司Ａｉｄｍｉｃｓ Ｂｉｏｔｅｃｈｎｏｌｏｇｙ（Ｈｋ） Ｃｏ．， Ｌｉｍｉｔｅｄ | Handmade circuit board |
| CN108712819A (en) * | 2018-05-17 | 2018-10-26 | 惠州中京电子科技有限公司 | A kind of printed wiring board scrapping method |
| CN108712819B (en) * | 2018-05-17 | 2021-02-26 | 惠州中京电子科技有限公司 | Printed circuit board scrapping method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121212 |