CN108690998A - A kind of standard nut plating solution formula - Google Patents
A kind of standard nut plating solution formula Download PDFInfo
- Publication number
- CN108690998A CN108690998A CN201810658904.1A CN201810658904A CN108690998A CN 108690998 A CN108690998 A CN 108690998A CN 201810658904 A CN201810658904 A CN 201810658904A CN 108690998 A CN108690998 A CN 108690998A
- Authority
- CN
- China
- Prior art keywords
- plating solution
- additive
- standard nut
- solution formula
- good
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/003—Threaded pieces, e.g. bolts or nuts
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The present invention relates to a kind of standard nut plating solution formulas, it is characterised in that:The pH of the plating solution is 5.0, including aluminium hydroxide 20-36g, alundum (Al2O3) 20-46g, sodium hydroxide 12-16g, silicic acid 15-18g, magnesium carbonate 50-64g, methyl methacrylate 12-16g, potassium chloride 7-12g, ferroso-ferric oxide 3-11g, silver nitrate 2-5g, stannous sulfate 30-40g;Additive bismuth oxide 0.5-2g;Additive nonionic surface active agent 0.5-2g;Stabilizer hydroquinone 5-8g;Brightener gelatin 2-4g and deionized water 300-500g.Electroplate liquid formulation provided by the invention is simple and environmentally-friendly, stability is good, and electroplating technology is easily controllable, and the coating being electroplated out is uniformly, fine and close, binding force is good, is widely used in terms of welding.Plating solution not will produce bubble in electroplating process, and plating solution be always maintained at it is limpid.
Description
Technical field
The present invention relates to standard component field of electroplating more particularly to a kind of standard nut plating solution formulas.
Background technology
In recent years, the high speed development of electronics industry makes requirement of the people to solderable coating higher and higher.Due to tin
Solderability is preferable, and the use of lead is restricted, so people have done and largely ground to plating tin coating and plating tin alloy coat
Study carefully.
There are many technique tin plating at present, are divided into two large divisions:Alkaline system is tin plating and acid system is tin plating.Alkaline system plates
Tin have disadvantages that as:Deposition velocity is slower, and cathode efficiency is relatively low, evolving hydrogen reaction can be caused tight when alkali concentration is excessively high
Weight, also have an impact to tin anode etc..Acid system is tin plating general to have that sulfate system is tin plating, fluoboric acid system is tin plating, methyl
Sulfonic acid system is tin plating.Acid system is tin plating also all to be considered high current efficiency, the stability of plating solution, plating solution and has mostly
The problems such as covering power and covering power, pollution of the plating solution to environment, the period of plating solution, processing cost of electroplating effluent etc., and
Various additives will be added into plating solution by solving these problems, and some additives will cause shadow to the solderability of coating
It rings.Need to use the standard nut with good solderable coating in some welding in photovoltaic industry at present, and prior art
In few electrotinnings on standard nut can reach that coating is uniform, and surface is smooth, binding force is high and the good electricity of welding performance
Plating solution.
Invention content
The technical problem to be solved in the present invention is to provide a kind of standard nut plating solution formulas, can solve general standard
For nut in plating, general electroplate liquid can not ensure that coating is uniform and can have good welding performance.
In order to solve the above technical problems, the technical scheme is that:A kind of standard nut plating solution formula, innovative point
It is:The pH of the plating solution be 5.0, including aluminium hydroxide 20-36g, alundum (Al2O3) 20-46g, sodium hydroxide 12-16g,
Silicic acid 15-18g, magnesium carbonate 50-64g, methyl methacrylate 12-16g, potassium chloride 7-12g, ferroso-ferric oxide 3-
11g, silver nitrate 2-5g, stannous sulfate 30-40g;0 .5-2g of additive bismuth oxide;Additive nonionic surface active agent
0 .5-2g;Stabilizer hydroquinone 5-8g;Brightener gelatin 2-4g and deionized water 300-500g.
Further, the additive nonionic surface active agent is polyoxyethylene(EO15)Lauryl alcohol and OP emulsifiers
In any one or two kinds of mixtures with arbitrary ratio.
The advantage of the invention is that:
1)Electroplate liquid formulation provided by the invention is simple and environmentally-friendly, stability is good, and electroplating technology is easily controllable, and the coating being electroplated out is equal
It is even, fine and close, binding force is good, be widely used in terms of welding.Plating solution not will produce bubble in electroplating process, and plating solution is protected always
It holds limpid.
Specific implementation mode
The following examples can make professional and technical personnel that the present invention be more fully understood, but therefore not send out this
It is bright to be limited among the embodiment described range.
Embodiment 1:
A kind of standard nut plating solution formula, the pH of the plating solution are 5.0, including aluminium hydroxide 20g, alundum (Al2O3) 20g,
Sodium hydroxide 12g, silicic acid 15g, magnesium carbonate 50g, methyl methacrylate 12g, potassium chloride 7g, ferroso-ferric oxide 3g,
Silver nitrate 2g, stannous sulfate 30g;0 .5g of additive bismuth oxide;0 .5g of additive nonionic surface active agent;Stablize
Agent hydroquinone 5g;Brightener gelatin 2g and deionized water 300g.
Additive nonionic surface active agent is polyoxyethylene(EO15)Any one in lauryl alcohol and OP emulsifiers
Or two kinds of mixtures with arbitrary ratio.
Embodiment 2:
A kind of standard nut plating solution formula, the pH of the plating solution are 5.0, including aluminium hydroxide 28g, alundum (Al2O3) 33g,
Sodium hydroxide 14g, silicic acid 16.5g, magnesium carbonate 57g, methyl methacrylate 14g, potassium chloride 9.5g, ferroso-ferric oxide
7g, silver nitrate 3.5g, stannous sulfate 3.5g;Additive bismuth oxide 1.25g;Additive nonionic surface active agent
1.25g;Stabilizer hydroquinone 6.5g;Brightener gelatin 3g and deionized water 400g.
Additive nonionic surface active agent is polyoxyethylene(EO15)Any one in lauryl alcohol and OP emulsifiers
Or two kinds of mixtures with arbitrary ratio.
Embodiment 3:
A kind of standard nut plating solution formula, the pH of the plating solution are 5.0, including aluminium hydroxide 36g, alundum (Al2O3) 46g,
Sodium hydroxide 16g, silicic acid 18g, magnesium carbonate 64g, methyl methacrylate 16g, potassium chloride 12g, ferroso-ferric oxide 11g,
Silver nitrate 5g, stannous sulfate 40g;Additive bismuth oxide 2g;Additive nonionic surface active agent 2g;Stabilizer is to benzene
Diphenol 8g;Brightener gelatin 4g and deionized water 500g.
Additive nonionic surface active agent is polyoxyethylene(EO15)Any one in lauryl alcohol and OP emulsifiers
Or two kinds of mixtures with arbitrary ratio.
It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, above-described embodiment and explanation
Merely illustrating the principles of the invention described in book, without departing from the spirit and scope of the present invention, the present invention also has
Various changes and modifications, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention
It is defined by the appending claims and its equivalent thereof.
Claims (2)
1. a kind of standard nut plating solution formula, it is characterised in that:The pH of the plating solution is 5.0, including aluminium hydroxide 20-
36g, alundum (Al2O3) 20-46g, sodium hydroxide 12-16g, silicic acid 15-18g, magnesium carbonate 50-64g, methyl methacrylate
Ester 12-16g, potassium chloride 7-12g, ferroso-ferric oxide 3-11g, silver nitrate 2-5g, stannous sulfate 30-40g;Additive oxygen
Change 0 .5-2g of bismuth;0 .5-2g of additive nonionic surface active agent;Stabilizer hydroquinone 5-8g;Brightener gelatin
2-4g and deionized water 300-500g.
2. a kind of standard nut plating solution formula according to claim 1, it is characterised in that:The additive nonionic
Surfactant is polyoxyethylene(EO15)Any one in lauryl alcohol and OP emulsifiers or two kinds of mixtures with arbitrary ratio.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658904.1A CN108690998A (en) | 2018-06-25 | 2018-06-25 | A kind of standard nut plating solution formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658904.1A CN108690998A (en) | 2018-06-25 | 2018-06-25 | A kind of standard nut plating solution formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108690998A true CN108690998A (en) | 2018-10-23 |
Family
ID=63848940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810658904.1A Withdrawn CN108690998A (en) | 2018-06-25 | 2018-06-25 | A kind of standard nut plating solution formula |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108690998A (en) |
-
2018
- 2018-06-25 CN CN201810658904.1A patent/CN108690998A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181023 |
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| WW01 | Invention patent application withdrawn after publication |