CN104988544A - Electrolytic tinning annexing agent - Google Patents
Electrolytic tinning annexing agent Download PDFInfo
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- CN104988544A CN104988544A CN201510356835.5A CN201510356835A CN104988544A CN 104988544 A CN104988544 A CN 104988544A CN 201510356835 A CN201510356835 A CN 201510356835A CN 104988544 A CN104988544 A CN 104988544A
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- eleetrotinplate
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- additive according
- brightening agent
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Abstract
The invention belongs to the technical field of chemical tinning, in particular to an electrolytic tinning annexing agent. The electrolytic tinning annexing agent is formed by matching of following ingredients. The ingredients comprise 25-55 g/l of tin methanesulfonate, 90-140 g/l of methanesulfonic acid, 15-20 g/l of a stabilizing agent, 10-15 g/l of brightening agent, 15-25 g/l of polyacrylamide and aluminium polychlorid, 3-8 g/l of a rare earth annexing agent and the balance deionized water. The electrolytic tinning annexing agent has the advantages that the plating solution property is stable, a plating solution can be maintained to be clear and free of turbidity, a cladding layer crystal is refining, the brightness area is large, the evenness is good, lead does not exist, and the environment is further protected.
Description
Technical field
The invention belongs to chemical plating stannum technical field, be specifically related to a kind of eleetrotinplate additive.
Background technology
Early stage Electronic Packaging and electronic circuit board are all using tinsel as solderable coating, have low temperature welding, and bonding force is good, do not produce the features such as tin palpus.The mankind more and more pay attention to healthy and environmental problem in recent years, European countries have promulgated RoHS instruction and WEEE instruction in succession, Chinese Government has also promulgated " electronics and IT products prevention and cure of pollution management method " thereupon, require that the primary electron product of China's export all realizes unleaded, therefore study environment-friendly type electroplating technology imperative.
But, also there is more problem in Pure Tin Plating Process, such as bad dispersibility, porosity greatly, very easily variable color in atmosphere, easily burn, the problem such as zinc-plated easy muddiness and tin one of the main divisions of the male role in traditional opera are long, affect the corrosion resistance nature of overall product coating.
Summary of the invention
The object of the invention is to overcome the technical problem that in prior art, Pure Tin Plating Process exists, provide a kind of formula rationally, tin plating solution stability is good, the tin plating solution additive of tin-plated product corrosion resistance and good.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
A kind of eleetrotinplate additive, is formed by following composition proportion: stannous methanesulfonate 25-55g/l, methylsulphonic acid 90-140g/l, stablizer 15-20g/l, brightening agent 10-15g/l, polyacrylamide and polymerize aluminum chloride 15-25g/l, rare earth addition 3-8g/l, all the other are deionized water.
Further, described stablizer is selected in: at least one in oxalic acid, citric acid, tartrate.
Further, described brightening agent by key light agent, auxiliary brightener, carrier brightening agent is composite forms.
Further, described key light agent is selected from the one in benzylideneacetone, cumylene, benzophenone, o-chlorobenzaldehyde.
Further, described auxiliary brightener is selected from: the one in phenolphthalein, vinylformic acid, styracin.
Further, be selected from described in described carrier brightening agent: the one in polyoxyethylene, polyethenoxy ether.
Further, the mol ratio of described polyacrylamide and polymerize aluminum chloride is 1:1.2-1.8.
Further, described rare earth addition is selected from: the one in lanthanum trichloride, neodymium trichloride, Dysprosium trioxide, Erbium trichloride.
Further, a kind of eleetrotinplate additive is formed by following composition proportion: stannous methanesulfonate 30g/l, methylsulphonic acid 100g/l, stablizer 18g/l, brightening agent 12g/l, polyacrylamide and polymerize aluminum chloride 20g/l, rare earth addition 5g/l, all the other are deionized water.
The present invention adopts the object of methylsulphonic acid to be: methylsulphonic acid have reduce stannous ion activity, prevent its hydrolysis, improve the effect such as plating solution conductivity and anodic current efficiency.
The present invention adopts and by the object of the composite brightening agent of key light agent, auxiliary brightener, carrier brightening agent is: key light agent can only play light and act in a certain current density range, desirable coating can not be obtained so be used alone, but with auxiliary brightener is with the use of playing synergistic effect, thus make coating crystallization refinement, bright current density region expands further; Add carrier brightening agent, utilize its solublization can improve brightening agent content in the plating solution, also there is wetting and crystallization of refinement function simultaneously.
Employing the invention has the beneficial effects as follows: plating solution stable in properties, can keep limpid not turbid for a long time; Coating crystallization refinement, bright district are large, good uniformity, unleaded environmental protection more.
Embodiment
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1
A kind of eleetrotinplate additive is formed by following composition proportion: stannous methanesulfonate 25g/l, methylsulphonic acid 90g/l, stablizer 15g/l, brightening agent 10g/l, polyacrylamide and polymerize aluminum chloride 15g/l, rare earth addition 3g/l, all the other are deionized water, fully stir.
Embodiment 2
A kind of eleetrotinplate additive is formed by following composition proportion: stannous methanesulfonate 30g/l, methylsulphonic acid 100g/l, stablizer 18g/l, brightening agent 12g/l, polyacrylamide and polymerize aluminum chloride 20g/l, rare earth addition 5g/l, all the other are deionized water, fully stir.
The present embodiment is preferred forms.
Embodiment 3
A kind of eleetrotinplate additive, is formed by following composition proportion: stannous methanesulfonate 55g/l, methylsulphonic acid 140g/l, stablizer 20g/l, brightening agent 15g/l, polyacrylamide and polymerize aluminum chloride 25g/l, rare earth addition 8g/l, all the other are deionized water, fully stir.
Claims (9)
1. an eleetrotinplate additive, it is characterized in that being formed by following composition proportion: stannous methanesulfonate 25-55g/l, methylsulphonic acid 90-140g/l, stablizer 15-20g/l, brightening agent 10-15g/l, polyacrylamide and polymerize aluminum chloride 15-25g/l, rare earth addition 3-8g/l, all the other are deionized water.
2. a kind of eleetrotinplate additive according to claim 1, is characterized in that described stablizer is selected from: at least one in oxalic acid, citric acid, tartrate.
3. a kind of eleetrotinplate additive according to claim 1, it is characterized in that described brightening agent by key light agent, auxiliary brightener, carrier brightening agent is composite forms.
4. a kind of eleetrotinplate additive according to claim 3, is characterized in that described key light agent is selected from: the one in benzylideneacetone, cumylene, benzophenone, o-chlorobenzaldehyde.
5. a kind of eleetrotinplate additive according to claim 3, is characterized in that described auxiliary brightener is selected from: the one in phenolphthalein, vinylformic acid, styracin.
6. a kind of eleetrotinplate additive according to claim 3, is characterized in that being selected from described in described carrier brightening agent: the one in polyoxyethylene, polyethenoxy ether.
7. a kind of eleetrotinplate additive according to claim 1, is characterized in that the mol ratio of described polyacrylamide and polymerize aluminum chloride is 1:1.2-1.8.
8. a kind of eleetrotinplate additive according to claim 1, is characterized in that described rare earth addition is selected from: the one in lanthanum trichloride, neodymium trichloride, Dysprosium trioxide, Erbium trichloride.
9. a kind of eleetrotinplate additive according to claim 1, it is characterized in that being formed by following composition proportion: stannous methanesulfonate 30g/l, methylsulphonic acid 100g/l, stablizer 18g/l, brightening agent 12g/l, polyacrylamide and polymerize aluminum chloride 20g/l, rare earth addition 5g/l, all the other are deionized water.
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CN201510356835.5A CN104988544A (en) | 2015-06-26 | 2015-06-26 | Electrolytic tinning annexing agent |
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CN201510356835.5A CN104988544A (en) | 2015-06-26 | 2015-06-26 | Electrolytic tinning annexing agent |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105755492A (en) * | 2016-05-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Solder ball soaking liquid and preparation method thereof |
CN105755513A (en) * | 2016-04-28 | 2016-07-13 | 四川昊吉科技有限公司 | Tinning preservative |
CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
CN106086948A (en) * | 2016-08-11 | 2016-11-09 | 太仓市凯福士机械有限公司 | A kind of high temperature resistant type electroplate liquid additive |
CN106119904A (en) * | 2016-08-11 | 2016-11-16 | 太仓市凯福士机械有限公司 | A kind of heavy duty detergent electroplate liquid additive |
CN107130270A (en) * | 2017-05-08 | 2017-09-05 | 安徽长青电子机械(集团)有限公司 | A kind of Pure Tin Plating Process method |
CN109778258A (en) * | 2017-11-10 | 2019-05-21 | 丹阳市宁大卫防检测技术有限公司 | A kind of electrotinning additive |
CN110205659A (en) * | 2019-07-17 | 2019-09-06 | 广州三孚新材料科技股份有限公司 | Electrotinning additive and preparation method thereof |
CN110306213B (en) * | 2019-07-08 | 2020-08-04 | 广州三孚新材料科技股份有限公司 | Tin plating solution for solar cell and preparation method thereof |
CN113549963A (en) * | 2021-07-23 | 2021-10-26 | 南昌大学 | Additive for plating rhenium coating on tungsten and tungsten alloy matrix and preparation method thereof |
CN113930812A (en) * | 2021-11-15 | 2022-01-14 | 广东羚光新材料股份有限公司 | Tin plating solution and tin plating method for chip electronic component |
CN116313339A (en) * | 2023-04-01 | 2023-06-23 | 东莞市科蓬达电子科技有限公司 | NTC patch glass-sealed thermistor and production process |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
CN105755512B (en) * | 2016-03-04 | 2018-01-05 | 昆山艾森半导体材料有限公司 | A kind of tin methane sulfonate antioxidant and preparation method thereof and application method |
CN105755513A (en) * | 2016-04-28 | 2016-07-13 | 四川昊吉科技有限公司 | Tinning preservative |
CN105755492A (en) * | 2016-05-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Solder ball soaking liquid and preparation method thereof |
CN106086948A (en) * | 2016-08-11 | 2016-11-09 | 太仓市凯福士机械有限公司 | A kind of high temperature resistant type electroplate liquid additive |
CN106119904A (en) * | 2016-08-11 | 2016-11-16 | 太仓市凯福士机械有限公司 | A kind of heavy duty detergent electroplate liquid additive |
CN107130270A (en) * | 2017-05-08 | 2017-09-05 | 安徽长青电子机械(集团)有限公司 | A kind of Pure Tin Plating Process method |
CN109778258A (en) * | 2017-11-10 | 2019-05-21 | 丹阳市宁大卫防检测技术有限公司 | A kind of electrotinning additive |
CN110306213B (en) * | 2019-07-08 | 2020-08-04 | 广州三孚新材料科技股份有限公司 | Tin plating solution for solar cell and preparation method thereof |
CN110205659A (en) * | 2019-07-17 | 2019-09-06 | 广州三孚新材料科技股份有限公司 | Electrotinning additive and preparation method thereof |
CN110205659B (en) * | 2019-07-17 | 2020-06-16 | 广州三孚新材料科技股份有限公司 | Electrotinning additive and preparation method thereof |
CN113549963A (en) * | 2021-07-23 | 2021-10-26 | 南昌大学 | Additive for plating rhenium coating on tungsten and tungsten alloy matrix and preparation method thereof |
CN113549963B (en) * | 2021-07-23 | 2023-02-03 | 南昌大学 | Additive for plating rhenium coating on tungsten and tungsten alloy matrix and preparation method thereof |
CN113930812A (en) * | 2021-11-15 | 2022-01-14 | 广东羚光新材料股份有限公司 | Tin plating solution and tin plating method for chip electronic component |
CN113930812B (en) * | 2021-11-15 | 2023-10-31 | 广东羚光新材料股份有限公司 | Tin plating liquid and tin plating method for chip electronic component |
CN116313339A (en) * | 2023-04-01 | 2023-06-23 | 东莞市科蓬达电子科技有限公司 | NTC patch glass-sealed thermistor and production process |
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Application publication date: 20151021 |