CN102758228B - A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid - Google Patents
A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid Download PDFInfo
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- CN102758228B CN102758228B CN201210243504.7A CN201210243504A CN102758228B CN 102758228 B CN102758228 B CN 102758228B CN 201210243504 A CN201210243504 A CN 201210243504A CN 102758228 B CN102758228 B CN 102758228B
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Abstract
The invention discloses a kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid.This sulfonic acid type semi-bright Pure Tin Plating Process liquid comprises following recipe ingredient: the sub-tin 150 ~ 280g/L of alkylsulphonic acid 60 ~ 150g/L, alkylsulphonic acid, brightening agent 0.1 ~ 10g/L, stablizer 0.5 ~ 10g/L, wetting agent 1.0 ~ 20g/L, grain-refining agent 0.1 ~ 6g/L.Sulfonic acid type semi-bright Pure Tin Plating Process liquid disclosed by the invention adopts the sub-tin of alkylsulphonic acid to be main salt, and acts synergistically with other components, makes each component disperses in tin bath solution good, effectively avoid the oxidation of the component such as hydrolysis and brightening agent of stannous ion, ensure that this half bright Pure Tin Plating Process liquid is limpid transparent, stability is high, consistency is good, highly versatile, safety, environmental protection, plating solution current efficiency is high, plating speed is fast, the pure tin coating crystallization obtained is careful, and matte degree is even, excellent property.
Description
Technical field
The invention belongs to technical field of surface, be specifically related to a kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid.
Background technology
Tin coating good stability, corrosion-resistant, anti-tarnishing ability is strong, and coating is nontoxic, soft, has good weldability and ductility, is therefore industrially widely used.In order to prevent operation or user of service's eyestrain, current trend adopts coating and the surface decoration tech of low reflective or no-reflection.Different from bright tin plating, be this kind ofly zinc-platedly called half bright tin plating, or dumb light tin plating technique, its gained coating is called as half Bright Tin or mute tin, mist tin.Half additives for bright tin plating is simply single, and plating solution is manageable, and the crystallization of energy refinement coating, improves dispersive ability, but do not make coating produce light.This process advan, in raising coating adhesion and compactness, decreases luminous reflectance simultaneously and pollutes on assembling line.Unicircuit, printed wiring version, electronic devices and components are all widely used.In the past for reaching the effect of half bright coating, many employing tinsel coating.Along with more and more higher environmental requirement, plumbous use is subject to stricter restriction, and thus half light plating pure tin technique will become main selection.
Relative to electroplating bright pure tin technology ripe day by day, about the technique of half light plating pure tin and document actually rare.Sulfate type plating solution Acidic Sn electroplating technique is mainly at present for half bright pure tin technique, namely be in the composition of basic plating solution, add the zinc-plated additive of dumb light with sulfuric acid and stannous sulfate, its principal feature plating solution current efficiency is high, easy and simple to handle, but coating is easy to long whisker, the internal stress of coating is restive, and bath stability is poor, needs often to process.Domesticly recently disclose a kind of half bright acid tin plating electrolyte based on sulfuric acid system, be characterized in that each additive amount greatly reduces, reduce cost; But binder component is too much, and plating solution is wayward, stability fails to improve.For half bright pure tin technique sulfuric acid salt form plating solution Acidic Sn electroplating technique also have outward methylsulphonic acid system and fluoroboric acid system zinc-plated etc.Fluoroborate tin plating electrolyte cost is higher than sulfate bath, also there is the shortcomings such as the pollution of fluorochemical, is used hardly at present.Methylsulphonic acid system is high with its sedimentation rate, and waste water the advantage such as easily to process and is applied to during continuous electroplating produces, but the dispersive ability of most of plating solutions of current application is poor, Bivalent Tin facile hydrolysis.Domesticly recently disclose a kind of half bright Pure Tin Plating Process liquid based on sulfonic acid system, be characterized in operate under weak acid scope, pH value is between 0.5 – 6.5; Bath stability and coating performance are good, but exist due to service temperature and current density is low and defect that plating speed that is that cause is relatively low.
Therefore, be necessary the research strengthening half-and-half bright Pure Tin Plating Process liquid and technique thereof, develop a kind of electroplate liquid of stability and high efficiency, to meet the demand of practical application and market.
Summary of the invention
The object of the invention is to the above-mentioned deficiency overcoming prior art, provide that a kind of dispersive ability is strong, stable, efficient, the sulfonic acid type semi-bright Pure Tin Plating Process liquid of gained pure tin coating performance excellence.
In order to realize foregoing invention object, technical scheme of the present invention is as follows:
A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid, comprises following recipe ingredient:
Sulfonic acid type semi-bright Pure Tin Plating Process liquid of the present invention adopts the sub-tin of alkylsulphonic acid to be main salt, under the synergy of the components such as brightening agent, stablizer, alkylsulphonic acid, wetting agent, grain-refining agent, makes this tin bath solution have following beneficial effect:
1., not containing heavy metals such as fluoroborate and lead, bismuth, ceriums, also not containing formaldehyde and inflammable substance, the waste liquid processing cost after plating is low, environmentally safe, safety, environmental protection;
2. in this sulfonic acid type semi-bright Pure Tin Plating Process liquid, each component disperses is good, by the coordinative role of each component, effectively avoid the oxidation of the component such as hydrolysis and brightening agent of stannous ion, ensure that this sulfonic acid type semi-bright Pure Tin Plating Process liquid is limpid transparent, stability is high, effectively overcomes the deficiency existed in the tin bath solution that existing Acidic Sn electroplating technique adopts;
3. this sulfonic acid type semi-bright Pure Tin Plating Process liquid phase capacitive is good, highly versatile;
4. when this sulfonic acid type semi-bright Pure Tin Plating Process liquid being electroplated, sedimentation velocity is fast, production efficiency is high, and from high district to the current density range of low district broadness in, all can obtain the half bright pure tin coating that outward appearance is consistent, and crystallization is careful in tin electrolytic coating, tin electrolytic coating is even, and it has excellent solidity to corrosion, resistance toner and weldability, the electronics finishing industrial circles such as the rolling of the connector of particularly suitable electronic apparatus, terminal and IC and semi-conductor discrete device, rack plating dumb light pure tin coating.
Embodiment
In order to make the technical problem to be solved in the present invention, technical scheme and beneficial effect clearly understand, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The embodiment of the present invention provides that a kind of dispersive ability is strong, the sulfonic acid type semi-bright Pure Tin Plating Process liquid of stability and high efficiency, gained pure tin coating performance excellence.This sulfonic acid type semi-bright Pure Tin Plating Process liquid comprises following recipe ingredient:
Like this, above-described embodiment sulfonic acid type semi-bright Pure Tin Plating Process liquid adopts the sub-tin of alkylsulphonic acid to be main salt, under the synergy of the components such as brightening agent, stablizer, alkylsulphonic acid, wetting agent, grain-refining agent, in sulfonic acid type semi-bright Pure Tin Plating Process liquid, each component disperses is good, by the coordinative role of each component, effectively avoid the oxidation of the component such as hydrolysis and brightening agent of stannous ion, ensure that this sulfonic acid type semi-bright Pure Tin Plating Process liquid is limpid transparent, stability is high, effectively overcomes the deficiency existed in the tin bath solution that existing Acidic Sn electroplating technique adopts.Meanwhile, this sulfonic acid type semi-bright Pure Tin Plating Process liquid phase capacitive is good, highly versatile.In addition, this sulfonic acid type semi-bright Pure Tin Plating Process liquid is not containing fluoroborate and lead, and also not containing formaldehyde and inflammable substance, the waste liquid processing cost after plating is low, environmentally safe, safety, environmental protection.When this sulfonic acid type semi-bright Pure Tin Plating Process liquid being carried out the plating of mute tin, sedimentation velocity is fast, and production efficiency is high, and from high district in the current density range of low district broadness as 10 ~ 100A/dm
2all can obtain the half bright pure tin coating that outward appearance is consistent, and crystallization is careful in tin electrolytic coating, tin electrolytic coating is even, and it has excellent solidity to corrosion, resistance toner and weldability, the electronics finishing industrial circles such as the rolling of the connector of particularly suitable electronic apparatus, terminal and IC and semi-conductor discrete device, rack plating dumb light pure tin coating.
Particularly, in the embodiment of above-mentioned half bright Pure Tin Plating Process liquid formula, alkylsulphonic acid component provides sour environment for sulfonic acid type semi-bright Pure Tin Plating Process liquid, plays solvent and electrolytical effect.Contriver finds under study for action, and the concentration of this alkylsulphonic acid component and the stability of the bright Pure Tin Plating Process liquid of kind p-sulfonic acid type half and electroconductibility have material impact.Therefore, when alkylsulphonic acid concentration is 60 ~ 150g/L, when alkylsulphonic acid is preferably that in methylsulphonic acid, ethylsulfonic acid, one or both are composite, this alkylsulphonic acid can make other components dissolve fully, the stability of the sulfonic acid type semi-bright Pure Tin Plating Process liquid prepared is best, and electroconductibility is stronger.
The sub-tin of abovementioned alkyl sulfonic acid is preferably stannous methanesulfonate or/and the sub-tin of ethylsulfonic acid, and its content is preferably 180 ~ 230g/L.The sub-tin of this preferred alkylsulphonic acid can better ionize out stannous ion, when electroplating, can also stablize the stable of the stannous ion content in sulfonic acid type semi-bright Pure Tin Plating Process liquid, the frequency of supplementing the sub-tin component of alkylsulphonic acid when reducing plating.Improve coating uniformity further simultaneously, and make coating have excellent weldability and ductility.In addition, in electroplating process, due to the carrying out along with plating, the content of stannous ion can decrease, and therefore, needs according to circumstances suitably to supplement the sub-tin component of this alkylsulphonic acid, ensures the stannous ion concentration in this sulfonic acid type semi-bright Pure Tin Plating Process liquid.
Above-mentioned brightening agent is preferably a kind of 2-Naphthol ethoxylate, and as the LugalvanBNO-12 of BASF AG, its preferred content is 2 ~ 6g/L.For existing tin bath solution, brightening agent can make tin coating light.The brightener that this area is commonly used generally is made up of the organism of aldehyde, phenol and so on and the tensio-active agent etc. of solubilising.But contriver finds under study for action, such existing brightener content can reduce cathode efficiency too much, and too much brightener oxidation in the plating solution simultaneously can accelerate again the muddiness of tin plating electrolyte.Contriver's preferred 2-Naphthol ethoxylate brightening agent, particularly BNO-12 and preferred content effectively can overcome the deficiency that existing brightening agent exists, ensure that above-described embodiment sulfonic acid type semi-bright Pure Tin Plating Process liquid keeps very high cathode efficiency when electroplating, and prevent high Current Zone from burning, increase covering power; Avoid the oxidation of himself simultaneously, ensure the limpid transparent of this sulfonic acid type semi-bright Pure Tin Plating Process liquid.And the brightening agent of this preferred content and kind and the main salt system of the sub-tin of alkylsulphonic acid act synergistically, and can also obtain half bright pure tin coating of uniformity.
Aforementioned stable agent is preferably Resorcinol, and preferred content is 0.8 ~ 3g/L.Concerning tin bath solution, stablizer can make each component disperses even, ensure the stability of this electroplate liquid, the mixture of existing stablizer mainly complexing agent, oxidation inhibitor and reductive agent, as γ-picolinic acid, ferrous sulfate etc., but such existing stablizer well can not prevent the stannous ion hydrolysis of the sub-tin of the alkylsulphonic acid in above-described embodiment sulfonic acid type semi-bright Pure Tin Plating Process liquid, the stannous ion that the sub-tin of the alkylsulphonic acid in the present embodiment can be caused like this to ionize out causes electroplate liquid to be milky turbidity because of hydrolysis.Therefore, this preferred Resorcinol stablizer on the uniform basis of each component disperses, can also effectively prevent stannous ion to be hydrolyzed, ensure the limpid transparent of this electroplate liquid in guarantee above-described embodiment sulfonic acid type semi-bright Pure Tin Plating Process liquid.In electroplating process particularly, stablizer can taking out of and need to supplement in time with plating solution, could keep the stability of acid bright tinning solution.
Above-mentioned wetting agent is preferably polyoxyethylene nonylphenol ether NP series, and as nonionic surface active agent such as NP-10 to NP-20, wherein, wetting agent is preferably NP-12, and preferred content is 1.5 ~ 6.0g/L.This wetting agent plays the solvent of the components such as brightening agent and the effect of carrier in this sulfonic acid type semi-bright Pure Tin Plating Process liquid, thus ensure that electroplate liquid stability and limpid transparent, improves the cathode efficiency of electroplate liquid.
Above-mentioned grain-refining agent is preferably coconut oil fat polyoxyethylenated alcohol, and as the GENAPOL C-050 that Clariant company produces, preferred content is 0.5 ~ 3.0g/L.This preferred coconut oil fat polyoxyethylenated alcohol, particularly GENAPOL C-050 can improve the dispersive ability of each component of this sulfonic acid type semi-bright Pure Tin Plating Process liquid, make grain refining in tin layers, tin layers is even, thus ensures the uniform matte degree of pure tin coating and excellent performance.
Application embodiment of the present invention sulfonic acid type semi-bright Pure Tin Plating Process liquid preparation steps is: in the aqueous solution of alkylsulphonic acid, add brightening agent, wetting agent, grain-refining agent and stablizer successively to dissolving completely, then add the sub-tin of alkylsulphonic acid, each component is mixed.In addition, before plating solution opens cylinder, preferably first adopt 10% methylsulphonic acid diafiltration coating bath, filtration pump, anode and anode, then rinse with water, more thoroughly clean up with deionized water.
In order to be further elaborated to the present invention, more preferred examples are as follows:
Embodiment 1
A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid, comprises following recipe ingredient:
This sulfonic acid type semi-bright Pure Tin Plating Process liquid open cylinder:
1., with 10% methylsulphonic acid diafiltration coating bath, filtration pump, anode and anode, then rinse with water, more thoroughly clean up with deionized water; Add deionized water to cell body long-pending 25%;
2. stir while add required alkylsulphonic acid;
3. stir while add brightening agent, wetting agent, grain-refining agent and stablizer successively to dissolving completely;
4. stir while add stannous methanesulfonate;
5. add deionized water to final volume.
The above-mentioned sulfonic acid type semi-bright Pure Tin Plating Process liquid opening cylinder is electroplated 2 minutes according to electroplating operations method on copper sheet, and plating conditions is current density 10A/dm
2, temperature 40 ~ 45 DEG C.Result plates the pure tin coating that 10.5um is even dumb light on copper sheet.
Embodiment 2
A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid, comprises following recipe ingredient:
The cylinder method of opening of this sulfonic acid type semi-bright Pure Tin Plating Process liquid is with reference to embodiment 1.
The above-mentioned sulfonic acid type semi-bright Pure Tin Plating Process liquid opening cylinder is electroplated 1 minute according to electroplating operations method on copper sheet, and plating conditions is current density 30A/dm
2, temperature 40 ~ 45 DEG C.Result plates the pure tin coating in even dumb light of 15um on copper sheet.
Embodiment 3
A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid, comprises following recipe ingredient:
The cylinder method of opening of this sulfonic acid type semi-bright Pure Tin Plating Process liquid is with reference to embodiment 1.
The above-mentioned sulfonic acid type semi-bright Pure Tin Plating Process liquid opening cylinder is electroplated 0.5 minute according to electroplating operations method on copper sheet, and plating conditions is current density 50A/dm
2, temperature 40 ~ 45 DEG C.Result plates the pure tin coating in even dumb light of 13.5um on copper sheet.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a sulfonic acid type semi-bright Pure Tin Plating Process liquid, comprises following recipe ingredient:
Described brightening agent is 2-Naphthol ethoxylate, and described stablizer is Resorcinol.
2. sulfonic acid type semi-bright Pure Tin Plating Process liquid according to claim 1, is characterized in that: the sub-Theil indices of described alkylsulphonic acid is 180 ~ 230g/L.
3. sulfonic acid type semi-bright Pure Tin Plating Process liquid according to claim 1, is characterized in that: described brightening agent 2 ~ 6g/L.
4. according to the arbitrary described sulfonic acid type semi-bright Pure Tin Plating Process liquid of claims 1 to 3, it is characterized in that: the sub-tin of described alkylsulphonic acid is that stannous methanesulfonate is or/and the sub-tin of ethylsulfonic acid.
5. according to the arbitrary described sulfonic acid type semi-bright Pure Tin Plating Process liquid of claims 1 to 3, it is characterized in that: described wetting agent is polyoxyethylene nonylphenol ether NP series.
6. sulfonic acid type semi-bright Pure Tin Plating Process liquid according to claim 5, is characterized in that: described wetting agent is NP-12.
7., according to the arbitrary described sulfonic acid type semi-bright Pure Tin Plating Process liquid of claims 1 to 3, it is characterized in that: described grain-refining agent is coconut oil fat polyoxyethylenated alcohol.
8., according to the arbitrary described sulfonic acid type semi-bright Pure Tin Plating Process liquid of claims 1 to 3, it is characterized in that: described alkylsulphonic acid is that methylsulphonic acid is or/and ethylsulfonic acid.
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| CN108103540B (en) * | 2018-01-24 | 2020-01-07 | 永星化工(上海)有限公司 | Tin alloy electroplating solution |
| JP7070360B2 (en) * | 2018-11-16 | 2022-05-18 | トヨタ自動車株式会社 | A tin solution for forming a tin film and a method for forming a tin film using the solution. |
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| CN115948776A (en) * | 2023-02-14 | 2023-04-11 | 艾森半导体材料(南通)有限公司 | High-speed bright electroplating additive and electroplating solution |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2457152A (en) * | 1943-07-07 | 1948-12-28 | Du Pont | Electrodepositing composition and bath |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| CN102162113A (en) * | 2011-05-30 | 2011-08-24 | 长春工业大学 | Tin-silver-copper ternary alloy electroplating solution and electroplating method |
| CN102418123A (en) * | 2011-11-25 | 2012-04-18 | 上海应用技术学院 | High-speed electroplating luminous tin-plating electroplating liquid as well as preparation method and application thereof |
-
2012
- 2012-07-13 CN CN201210243504.7A patent/CN102758228B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2457152A (en) * | 1943-07-07 | 1948-12-28 | Du Pont | Electrodepositing composition and bath |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| CN102162113A (en) * | 2011-05-30 | 2011-08-24 | 长春工业大学 | Tin-silver-copper ternary alloy electroplating solution and electroplating method |
| CN102418123A (en) * | 2011-11-25 | 2012-04-18 | 上海应用技术学院 | High-speed electroplating luminous tin-plating electroplating liquid as well as preparation method and application thereof |
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