CN102418123A - High-speed electroplating luminous tin-plating electroplating liquid as well as preparation method and application thereof - Google Patents
High-speed electroplating luminous tin-plating electroplating liquid as well as preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses a high-speed electroplating luminous tin-plating electroplating liquid as well as a preparation method and application thereof. The high-speed electroplating luminous tin-plating electroplating liquid comprises the following raw materials calculated according to each liter of high-speed electroplating luminous tin-plating electroplating liquid: 120-200mL of tin methyl sulfonate, 100-175mL of 70 percent by weight methylsulfonic acid, 0.03-5g of brightening agent, 30-45g of conducting salt, 1-10g of grain refiner, 5-20g of antioxidant, 0.5-2g of wetting agent, 0.0005-0.001g of antifoaming agent and the balance water. The preparation method comprises the following steps of: dissolving the tin methyl sulfonate into the 70 percent by weight methylsulfonic acid; diluting the mixed solution with a proper amount of water; then adding the brightening agent, the conducting salt, the grain refiner, the antioxidant, the wetting agent and the antifoaming agent into the solution; and uniformly stirring and filtering to obtain filtrate, namely the high-speed electroplating luminous tin-plating electroplating liquid. The high-speed electroplating luminous tin-plating electroplating liquid disclosed by the invention has high coating speed, excellent dispersion capability and antifoaming capability and is suitable for a high-speed electroplating process.
Description
Technical field
The invention belongs to the technical field of electrochemical deposition of metal, particularly high speed electrodeposition bright tin plating electroplate liquid.
Background technology
Adopt full-automatic mass production techniques, market competition fierce day by day today in the electronic devices and components industry; People also have higher requirement to the electronics electroplating industry of service for it; All must be consistent like every batch of product plating thickness, uniformity coefficient, hardness, brightness; The strict control in plating area, cost reduces.But the common electrical coating apparatus has satisfied not demand of practical production, also is difficult to reach simultaneously the product performance requirement.High speed electrodeposition more suits the actual needs of microelectronics Packaging, therefore becomes first in the electronic devices and components plating gradually and selects.
In order to satisfy the development of high speed electrodeposition, the relevant Study on Additive of electroplating also need be greatly developed.At present, a large amount of electroplating additive research work is main with common plating, just is difficult to be competent at for the high speed electrodeposition that adopts very high currents density.Though have external electroplating additive manufacturer that the additive of specializing in high speed electrodeposition and using is all had darker research at present, and all have actual product to use, although still there is certain defective in some aspect of performance.For domestic, the research of high speed electrodeposition processing unit is more, but very limited for the research of the electroplating additive that matches.
Based on the protection to ecotope, through forbidding plumbous and other objectionable impurities use, China is also just formulating the RoHS that is fit to national conditions to the WEEE/ RoHS of European Union bill.RoHS is " some objectionable impurities instruction is used in restriction in electric, the electronics ", is a kind of inspecting standard that European Union is provided with.If the electric equipment products of outlet European Union do not reach this standard, can't get into customs.Chinese Government has also issued electronics and IT products prevention and cure of pollution management method thereupon, and the main electronic product that requires to strive for China's outlet after on July 1st, 2006 is all realized unleaded.And electroplate pure tin technology because Coating composition is single, be easy to coupling with various lead-free solders, use range is wide, and plating bath is simple, is convenient to maintenance and management, and cost is also lower, in electron trade, gains universal acceptance.Yet plating bath is done to circulate at a high speed and inevitably can be involved in a large amount of air in high speed electrodeposition; For the high speed electrodeposition pure tin; Under a large amount of air conditionses, not only can cause stannous oxidation, and cause the plating bath foam to increase easily, influence the wettability of sample and plating bath; Cause the properties of sample variation, and the present invention proposes for head it off just.
Therefore development of new high speed electrodeposition bright tin plating electroplate liquid not only helps reducing environmental pollution, and the quality that promotes China's high speed electrodeposition industry and electronic product is all had more important meaning.
Summary of the invention
One of the object of the invention is in order to solve above-mentioned technical problem a kind of high speed electrodeposition bright tin plating electroplate liquid to be provided.
The preparation method of a kind of high speed electrodeposition bright tin plating that two of the object of the invention is to provide above-mentioned.
Three of the object of the invention is to provide a kind of above-mentioned application method of a kind of high speed electrodeposition bright tin plating electroplate liquid in high speed electrodeposition tin process.
Technical scheme of the present invention
A kind of high speed electrodeposition bright tin plating electroplate liquid, its feed composition calculates by the zinc-plated electroplate liquid of the fast electroplating bright of every rising, and its composition and content are following:
Tin methane sulfonate 120 ~ 200mL
70wt% methylsulphonic acid 100 ~ 175mL
Brightening agent 0.03 ~ 5g
Conducting salt 30 ~ 45g
Grain-refining agent 1 ~ 10g
Oxidation inhibitor 5 ~ 20g
Wetting agent 0.5 ~ 2g
Foam preventer 0.0005～0.001g
Surplus is a water;
Described brightening agent is the mixture that phenyl aldehyde and propenal are formed; Be phenyl aldehyde by mass ratio preferably: propenal is 2～5:1;
Described conducting salt is the mixture of one or more compositions in sodium sulfate, novalgin or the Supragil GN; Preferably sulfuric acid sodium, novalgin and Supragil GN are sodium sulfate by mass ratio: novalgin: Supragil GN is 0～2:3:0～2;
Described grain-refining agent is the mixture of one or more compositions in thiadiazoles, alkyl benzene amine, pyrrolotriazine derivatives or the salicyclic acid derivatives; Preferred thiadiazoles, alkyl benzene amine, pyrrolotriazine derivatives or salicyclic acid derivatives are thiadiazoles by mass ratio: alkyl benzene amine: pyrrolotriazine derivatives: salicyclic acid derivatives is 1:0～3:0～4:0～1.5;
Wherein said alkyl benzene amine is preferably monomethylaniline;
Described pyrrolotriazine derivatives is preferably 2-methylamino-4-methyl-6-methoxyl group-1,3,5-triazines;
Described salicyclic acid derivatives is preferably wintergreen oil;
Described oxidation inhibitor is the mixture of one or more compositions in para toluene sulfonamide, benzoic sulfimide, 2,6 ditertbutylparacresols; Preferred para toluene sulfonamide, benzoic sulfimide, 2,6 ditertbutylparacresols are para toluene sulfonamide by mass ratio: benzoic sulfimide: 2,6 ditertbutylparacresols are 2～4:1:0～1;
Described wetting agent is the mixture of ethoxylated dodecyl alcohol and sodium laurylsulfonate or hexadecanol Soxylat A 25-7 and sodium laurylsulfonate composition;
Described foam preventer is a methyl-silicone oil;
Described water is zero(ppm) water.
The preparation method of above-mentioned a kind of high speed electrodeposition bright tin plating electroplate liquid comprises the steps:
(1), respectively the tin methane sulfonate of calculated amount is dissolved in the 70wt% methylsulphonic acid;
(2), the water that the solution of step (1) gained is added calculated amount;
(3), brightening agent, conducting salt, grain-refining agent, oxidation inhibitor, wetting agent, the foam preventer with calculated amount joins in the mixing solutions of step (2) gained; Stir after B control vacuum tightness is that 0.06Pa filters, the filtrating of gained is a kind of high speed electrodeposition bright tin plating electroplate liquid.
The above-mentioned application of a kind of high speed electrodeposition bright tin plating electroplate liquid in high speed electrodeposition tin process, the current density of its use is 5.0 ~ 50.0 A/dm
2, be preferably 15A/dm
2, temperature is 14 ~ 35 ℃, is preferably 25 ℃, and the brightening agent consumption is 0.2 ~ 0.5g/Ah, is preferably 0.3～0.4g/Ah, and the grain-refining agent consumption is 3 ~ 10g/Ah, is preferably 5～7g/Ah, and the oxidation inhibitor consumption is 0.03 ~ 0.08g/Ah, is preferably 0.05g/Ah.
Beneficial effect of the present invention
A kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention; Owing to adopted tin methane sulfonate as main salt; Compare with the tin sulphate of present commercialization; A kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention has lower stress, and this provides a basis for the problem that solves bonding force difference between coating.Again because a kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention has good coating speed, dispersive ability and anti-bubble ability, plating bath can be fit to high speed electrodeposition technology fully simultaneously.
In addition; A kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention; Owing to chosen brightening agent, grain-refining agent meticulously, reaching under the situation of same thickness of coating in the electroplating process, can improve electroplating velocity with respect to present commercial high speed electrodeposition light tin product; Also reduce simultaneously the consumption of additive, so also can reduce the production cost of high speed electrodeposition bright tin plating.
Embodiment
In order to understand the present invention better, through embodiment the present invention is further set forth below, but do not limit the present invention.
The sedimentation rate of a kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention and the testing method of dispersive ability: people's such as employing Xiao Faxin testing method (Xiao Faxin, Mao Jianwei, Cao Dao; The danger second place; Benzyl acetone and gelatin again electroplates and environmental protection 2011 to the influence of acid tin coating; Vol31, (5): 6 ~ 9);
The testing method of the anti-bubble property of a kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention: the testing method (He Yanfeng, Zhao Huiran, the Sun Jiangyan that adopt people such as He Yan peak; The research of the plumbous electroplating additive of lead frame high speed tin, electronics manufacturing engineering, 2004; Vol25, (5): 216 ~ 221)
The equipment that people such as the continuous electroplating equipment employing He Yan peak of the sedimentation rate of a kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention and the use of anti-bubble property mensuration use;
The dispersive ability of a kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention is measured the equipment of people's uses such as plating tank use Xiao Faxin of using.
Embodiment 1
A kind of high speed electrodeposition bright tin plating electroplate liquid, its feed composition calculates by the zinc-plated electroplate liquid of the fast electroplating bright of every rising, and its composition and content are following:
Tin methane sulfonate 140 mL
70wt% methylsulphonic acid 120 mL
Brightening agent 2 g
Conducting salt 45 g
Grain-refining agent 5 g
Oxidation inhibitor 10 g
Wetting agent 1 g
Foam preventer 0.001g
Surplus is a water;
Described brightening agent is phenyl aldehyde and propenal, is phenyl aldehyde by mass ratio: propenal is the mixture that 5:1 forms;
Described conducting salt is sodium sulfate and novalgin, is sodium sulfate by mass ratio: novalgin is the mixture that 2:3 forms;
Described grain-refining agent is thiadiazoles, monomethylaniline and wintergreen oil, is thiadiazoles according to mass ratio: monomethylaniline: wintergreen oil is the mixture that 1:3:4 forms;
Described oxidation inhibitor is para toluene sulfonamide, benzoic sulfimide and 2,6 ditertbutylparacresols, is para toluene sulfonamide by mass ratio: benzoic sulfimide: 2,6 ditertbutylparacresols are the mixture that 2:1:1 forms;
Described wetting agent is ethoxylated dodecyl alcohol and sodium laurylsulfonate, is the lauryl alcohol Soxylat A 25-7 by mass ratio: sodium laurylsulfonate is the mixture that 2:1 forms;
Described foam preventer is a methyl-silicone oil;
Described water is zero(ppm) water.
The preparation method of above-mentioned a kind of high speed electrodeposition bright tin plating electroplate liquid comprises the steps:
(1), respectively the tin methane sulfonate of calculated amount is dissolved in the 70wt% methylsulphonic acid;
(2), the water that the solution of step (1) gained is added calculated amount;
(3), brightening agent, conducting salt, grain-refining agent, oxidation inhibitor, wetting agent, the foam preventer with calculated amount joins in the mixing solutions of step (2) gained; Stirring, control vacuum tightness is that 0.06Pa filters behind B, and the filtrating of gained is a kind of high speed electrodeposition bright tin plating electroplate liquid.
Application implementation example 1
Get the application of a kind of high speed electrodeposition bright tin plating electroplate liquid in high speed electrodeposition tin process of embodiment 1 gained, the processing condition of high speed electrodeposition bright tin plating electroplate liquid are following:
| Processing condition | Scope | Optimum value |
| Temperature | 14~35℃ | 25℃ |
| Current density | 5.0~50.0 A/dm 2 | 15.0 A/dm 2 |
| The brightening agent consumption | 0.2~0.5 g/Ah | 0.3 g/Ah |
| Grain-refining agent | 3~10 g/Ah | 5 g/Ah |
| Oxidation inhibitor | 0.03~0.08 g/Ah | 0.05 g/Ah |
The processing condition that a kind of high speed electrodeposition bright tin plating electroplate liquid solution dispersibility of embodiment 1 gained is measured the plating tank that uses are following:
| Processing condition | Scope | Optimum value |
| Temperature | 14~35℃ | 25℃ |
| Current density | 1.0~5.0 A/dm 2 | ?3.0 A/dm 2 |
| Electroplating time | / | 5 min |
The sedimentation rate of a kind of high speed electrodeposition bright tin plating electroplate liquid of embodiment 1 gained, dispersive ability and anti-bubble results of property are seen table 1.
Embodiment 2
A kind of high speed electrodeposition bright tin plating electroplate liquid, its feed composition calculates by the zinc-plated electroplate liquid of the fast electroplating bright of every rising, and its composition and content are following:
Tin methane sulfonate 170 mL
70wt% methylsulphonic acid 150 mL
Brightening agent 3 g
Conducting salt 35 g
Grain-refining agent 5.5 g
Oxidation inhibitor 10 g
Wetting agent 1 g
Foam preventer 0.001g
Surplus is a water;
Described brightening agent is phenyl aldehyde and propenal, is phenyl aldehyde by mass ratio: propenal is the mixture that 2:1 forms;
Described conducting salt is novalgin and Supragil GN, is novalgin by mass ratio: Supragil GN is the mixture that 1:2 forms;
Described grain-refining agent is thiadiazoles and 2-methylamino-4-methyl-6-methoxyl group-1,3,5-triazines, is thiadiazoles by mass ratio: 2-methylamino-4-methyl-6-methoxyl group-1,3,5-triazines is the mixture that 2:3 forms;
Described oxidation inhibitor is para toluene sulfonamide and benzoic sulfimide, is para toluene sulfonamide by mass ratio: benzoic sulfimide is the mixture that 4:1 forms;
Described wetting agent is hexadecanol Soxylat A 25-7 and sodium laurylsulfonate, is the hexadecanol Soxylat A 25-7 by mass ratio: sodium laurylsulfonate is the mixture that 2:1 forms;
Described foam preventer is a methyl-silicone oil;
Described water is zero(ppm) water.
The preparation method of above-mentioned a kind of high speed electrodeposition bright tin plating electroplate liquid comprises the steps:
(1), respectively the tin methane sulfonate of calculated amount is dissolved in the 70wt% methylsulphonic acid;
(2), the water that the solution of step (1) gained is added calculated amount;
(3), brightening agent, conducting salt, grain-refining agent, oxidation inhibitor, wetting agent, the foam preventer with calculated amount joins in the mixing solutions of step (2) gained; Stir after B control vacuum tightness is that 0.06Pa filters, the filtrating of gained is a kind of high speed electrodeposition bright tin plating electroplate liquid.
Application implementation example 2
Get the application of a kind of high speed electrodeposition bright tin plating electroplate liquid in high speed electrodeposition tin process of embodiment 2 gained, the processing condition of high speed electrodeposition bright tin plating electroplate liquid are following:
| Processing condition | Scope | Optimum value |
| Temperature | 14~35℃ | 25℃ |
| Current density | 5.0~50.0 A/dm 2 | 15.0 A/dm 2 |
| The brightening agent consumption | 0.2~0.5 g /Ah | 0.4 g /Ah |
| Grain-refining agent | 3~10 g /Ah | 7 g /Ah |
| Oxidation inhibitor | 0.03~0.08 g /Ah | 0.05 g /Ah |
The processing condition of the plating tank that the dispersive ability of a kind of high speed electrodeposition bright tin plating electroplate liquid of mensuration embodiment 2 gained is used are following:
| Processing condition | Scope | Optimum value |
| Temperature | 14~35℃ | 25℃ |
| Current density | 1.0~ 5.0 A/dm 2 | ?3.0 A/dm 2 |
| Electroplating time | / | 5 min |
The sedimentation rate of a kind of high speed electrodeposition bright tin plating electroplate liquid plating bath of embodiment 2 gained, dispersive ability and anti-bubble results of property are seen table 1.
The comparative example 1
Adopt the chemical high speed electrodeposition light of happy think of tin STANNOSTRA 1405 products as a comparison, the composition of each raw material is following in the fast eleetrotinplate technology of every rising:
| Composition/processing condition | Scope | Optimum value |
| Tin methane sulfonate | 122~183 mL | 167 mL |
| The 70wt% methylsulphonic acid | 150~225 mL | 200 mL |
| STANNOSTRA 1405 additives | 50~100 mL | 70 mL |
| STANNOSTRA addition of C 2 | 6~18 mL | 10 mL |
Get the application of high speed electrodeposition bright tin plating electroplate liquid in high speed electrodeposition tin process of comparative example's 1 gained, the processing condition of high speed electrodeposition bright tin plating electroplate liquid are following:
| Processing condition | Scope | Optimum value |
| Temperature | 14~35℃ | 25℃ |
| Current density | 5.5~ 32.0 A/dm 2 | 15.0 A/dm 2 |
| STANNOSTRA 1405 depletion of additive amounts | 0.15~0.3 mL/Ah | 0.20 mL/Ah |
| STANNOSTRA addition of C 2 consumptions | / | 0.02 mL/Ah |
The processing condition of the plating tank that the mensuration solution dispersibility uses are following:
| Processing condition | Scope | Optimum value |
| Temperature | 14~35℃ | 25℃ |
| Current density | 1.0~ 5.0 A/dm 2 | ?3.0 A/dm 2 |
| Electroplating time | / | 5 min |
The internal stress result of the sedimentation rate of plating bath, dispersive ability and coating sees table 1.
Table 1, application implementation example 1,2 and comparative example's 1 sedimentation rate, dispersive ability and internal stress contrast
| Numbering | Deposition capability * | Dispersive ability | Anti-bubble ability |
| Application implementation example 1 | 10μm | 97.0 | Excellent |
| Application implementation example 2 | 13μm | 97.8% | Excellent |
| The comparative example 1 | 9μm | 97.5% | Very |
* electroplating time is 1 minute a deposition capability
Data from table 1 can be found out; Compare with commercial high speed electrodeposition light tin STANNOSTRA 1405 products that this area is representative; A kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention has good deposition capability and anti-bubble ability, and in highly electroplating, plating bath is done to circulate at a high speed and inevitably can be involved in a large amount of air; Therefore antagonism bubble performance is paid attention to more; A kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention can overcome this shortcoming, and after working long hours, foam does not have to increase basically.And after STANNOSTRA 1405 worked long hours, foam increased more.
In addition, each feed composition and amount ratio STANNOSTRA 1405 thereof are low in a kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention, so also can reduce production cost.Therefore a kind of high speed electrodeposition bright tin plating electroplate liquid of the present invention can satisfy the production requirement of high speed electrodeposition light process of tin.
The above content is merely the basic explanation of the present invention under conceiving, and according to any equivalent transformation that technical scheme of the present invention is done, all should belong to protection scope of the present invention.
Claims (8)
1. a high speed electrodeposition bright tin plating electroplate liquid is characterized in that its feed composition calculates by the zinc-plated electroplate liquid of the fast electroplating bright of every rising, and its composition and content are following:
Tin methane sulfonate 120 ~ 200mL
70wt% methylsulphonic acid 100 ~ 175mL
Brightening agent 0.03 ~ 5g
Conducting salt 30 ~ 45g
Grain-refining agent 1 ~ 10g
Oxidation inhibitor 5 ~ 20g
Wetting agent 0.5 ~ 2g
Foam preventer 0.0005～0.001g
Surplus is a water;
Described brightening agent is the mixture that phenyl aldehyde and propenal are formed;
Described conducting salt is the mixture of one or more compositions in sodium sulfate, novalgin and the Supragil GN;
Described grain-refining agent is the mixture of one or more compositions in thiadiazoles, alkyl benzene amine, pyrrolotriazine derivatives and the salicyclic acid derivatives;
Described oxidation inhibitor is the mixture of one or more compositions in para toluene sulfonamide, benzoic sulfimide and 2,6 ditertbutylparacresols;
Described wetting agent is the mixture of ethoxylated dodecyl alcohol and sodium laurylsulfonate or hexadecanol Soxylat A 25-7 and sodium laurylsulfonate composition;
Described foam preventer is a methyl-silicone oil;
Described water is zero(ppm) water.
2. a kind of high speed electrodeposition bright tin plating electroplate liquid as claimed in claim 1 is characterized in that its feed composition calculates by the zinc-plated electroplate liquid of the fast electroplating bright of every rising, and its composition and content are following:
Tin methane sulfonate 140 ~ 170mL
70wt% methylsulphonic acid 120 ~ 150mL
Brightening agent 2 ~ 3g
Conducting salt 35 ~ 45g
Grain-refining agent 5 ~ 5.5g
Oxidation inhibitor 10g
Wetting agent 1g
Foam preventer 0.001g
Surplus is a water;
Described brightening agent is phenyl aldehyde and propenal, is phenyl aldehyde by mass ratio: propenal is the mixture that 2～5:1 forms;
Described conducting salt is sodium sulfate, novalgin and Supragil GN, is sodium sulfate by mass ratio: novalgin: Supragil GN is the mixture that 0～2:3:0～2 are formed;
Described grain-refining agent is thiadiazoles, alkyl benzene amine, pyrrolotriazine derivatives and salicyclic acid derivatives, is thiadiazoles by mass ratio: alkyl benzene amine: pyrrolotriazine derivatives: salicyclic acid derivatives is the mixture that 1:0～3:0～4:0～1.5 are formed;
Described oxidation inhibitor is that para toluene sulfonamide, benzoic sulfimide and 2,6 ditertbutylparacresols are para toluene sulfonamide by mass ratio: benzoic sulfimide: 2,6 ditertbutylparacresols are the mixture that 2～4:1:0～1 is formed.
3. a kind of high speed electrodeposition bright tin plating electroplate liquid as claimed in claim 2 is characterized in that its feed composition calculates by the zinc-plated electroplate liquid of the fast electroplating bright of every rising, and its composition and content are following:
Tin methane sulfonate 140mL
70wt% methylsulphonic acid 120mL
Brightening agent 2g
Conducting salt 45g
Grain-refining agent 5g
Oxidation inhibitor 10g
Wetting agent 1g
Foam preventer 0.001g
Surplus is a water;
Described brightening agent is phenyl aldehyde and propenal, is phenyl aldehyde by mass ratio: propenal is the mixture that 5:1 forms;
Described conducting salt is sodium sulfate and novalgin, is sodium sulfate by mass ratio: novalgin is the mixture that 2:3 forms;
Described grain-refining agent is thiadiazoles, monomethylaniline and wintergreen oil, is thiadiazoles according to mass ratio: monomethylaniline: wintergreen oil is the mixture that 1:3:4 forms;
Described oxidation inhibitor is para toluene sulfonamide, benzoic sulfimide and 2,6 ditertbutylparacresols, is para toluene sulfonamide by mass ratio: benzoic sulfimide: 2,6 ditertbutylparacresols are the mixture that 2:1:1 forms;
Described wetting agent is ethoxylated dodecyl alcohol and sodium laurylsulfonate, is the lauryl alcohol Soxylat A 25-7 by mass ratio: sodium laurylsulfonate is the mixture that 2:1 forms.
4. a kind of high speed electrodeposition bright tin plating electroplate liquid as claimed in claim 2 is characterized in that its feed composition calculates by the zinc-plated electroplate liquid of the fast electroplating bright of every rising, and its composition and content are following:
Tin methane sulfonate 170 mL
70wt% methylsulphonic acid 150 mL
Brightening agent 3 g
Conducting salt 35 g
Grain-refining agent 5.5 g
Oxidation inhibitor 10 g
Wetting agent 1 g
Foam preventer 0.001g
Surplus is a water;
Described brightening agent is phenyl aldehyde and propenal, is phenyl aldehyde by mass ratio: propenal is the mixture that 2:1 forms;
Described conducting salt is novalgin and Supragil GN, is novalgin by mass ratio: Supragil GN is the mixture that 1:2 forms;
Described grain-refining agent is thiadiazoles and 2-methylamino-4-methyl-6-methoxyl group-1,3,5-triazines, is thiadiazoles by mass ratio: 2-methylamino-4-methyl-6-methoxyl group-1,3,5-triazines is the mixture that 2:3 forms;
Described oxidation inhibitor is para toluene sulfonamide and benzoic sulfimide, is para toluene sulfonamide by mass ratio: benzoic sulfimide is the mixture that 4:1 forms;
Described wetting agent is hexadecanol Soxylat A 25-7, sodium laurylsulfonate, is the hexadecanol Soxylat A 25-7 by mass ratio: sodium laurylsulfonate is the mixture that 2:1 forms.
5. like the preparation method of claim 1,2,3 or 4 described a kind of high speed electrodeposition bright tin plating electroplate liquids, it is characterized in that comprising the steps:
(1), respectively the tin methane sulfonate of calculated amount is dissolved in the 70wt% methylsulphonic acid;
(2), the water that the solution of step (1) gained is added calculated amount;
(3), brightening agent, conducting salt, grain-refining agent, oxidation inhibitor, wetting agent, the foam preventer with calculated amount joins in the mixing solutions of step (2) gained; Stir after B control vacuum tightness is that 0.06Pa filters, the filtrating of gained is a kind of high speed electrodeposition bright tin plating electroplate liquid.
6. like claim 1,2,3 or 4 application of described a kind of high speed electrodeposition bright tin plating electroplate liquid in high speed electrodeposition tin process, the current density that it is characterized in that its use is 5.0 ~ 50.0 A/dm
2, temperature is 14 ~ 35 ℃, and the brightening agent consumption is 0.2 ~ 0.5g/Ah, and the grain-refining agent consumption is 3 ~ 10g/Ah, and the oxidation inhibitor consumption is 0.03 ~ 0.08g/Ah.
7. the application of a kind of high speed electrodeposition bright tin plating electroplate liquid as claimed in claim 6 in high speed electrodeposition tin process is characterized in that current density is preferably 15A/dm
2, temperature is 25 ℃, and the brightening agent consumption is 0.3g/Ah, and the grain-refining agent consumption is 5g/Ah, and the oxidation inhibitor consumption is 0.05g/Ah.
8. the application of a kind of high speed electrodeposition bright tin plating electroplate liquid as claimed in claim 6 in high speed electrodeposition tin process is characterized in that current density is preferably 15A/dm
2, temperature is 25 ℃, and the brightening agent consumption is 0.4g/Ah, and the grain-refining agent consumption is 7g/Ah, and the oxidation inhibitor consumption is 0.05g/Ah.
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| CN103014786A (en) * | 2013-01-22 | 2013-04-03 | 广州博泉环保材料科技有限公司 | Electroplating liquid, method for manufacturing same and tin plating process by applying electroplating liquid |
| CN103132113A (en) * | 2013-03-08 | 2013-06-05 | 大连理工大学 | Weakly alkaline tin-base lead-free solder composite plating solution and application thereof |
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| CN112064070A (en) * | 2020-09-01 | 2020-12-11 | 华东理工大学 | Electroplating liquid containing cardanol polyoxyethylene ether and preparation method thereof |
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| CN113930812A (en) * | 2021-11-15 | 2022-01-14 | 广东羚光新材料股份有限公司 | Tin plating solution and tin plating method for chip electronic component |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849059A (en) * | 1988-09-13 | 1989-07-18 | Macdermid, Incorporated | Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor |
| CN1326015A (en) * | 2000-03-31 | 2001-12-12 | 希普雷公司 | Tin electrolyte |
| CN101665961A (en) * | 2009-09-27 | 2010-03-10 | 天津六○九电缆有限公司 | High-speed matt wire plating process |
-
2011
- 2011-11-25 CN CN2011103792935A patent/CN102418123A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849059A (en) * | 1988-09-13 | 1989-07-18 | Macdermid, Incorporated | Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor |
| CN1326015A (en) * | 2000-03-31 | 2001-12-12 | 希普雷公司 | Tin electrolyte |
| CN101665961A (en) * | 2009-09-27 | 2010-03-10 | 天津六○九电缆有限公司 | High-speed matt wire plating process |
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| CN103422130A (en) * | 2012-05-14 | 2013-12-04 | 中国科学院金属研究所 | Plating solution and method for electroplating bright tin plating layer |
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| CN111647917A (en) * | 2020-05-22 | 2020-09-11 | 成都宏明双新科技股份有限公司 | Process for preventing tin-plated product from discoloring in high-temperature test |
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