CN111206272B - Plating solution additive and plating solution for electroplating matte tin on heterojunction cell, and preparation method and application of plating solution additive and plating solution - Google Patents
Plating solution additive and plating solution for electroplating matte tin on heterojunction cell, and preparation method and application of plating solution additive and plating solution Download PDFInfo
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Abstract
The invention relates to a plating solution additive and a plating solution for electroplating matte tin on a heterojunction battery piece, and a preparation method and application thereof. The plating solution additive for electroplating matte tin comprises the following components in parts by weight: 0.02-0.5: 0.5-3 of a surfactant, a grain refiner and an antioxidant; wherein the surfactant is selected from two of straight epoxy naphthol propyl sulfonic acid potassium salt, beta-naphthol ethoxylate, alkyl ethoxy propoxy compound sulfate potassium salt and bisphenol A polyoxyethylene ether. The electrolyte additive can be applied to the matte tin plating of the heterojunction battery piece, enables the plating solution to be clear for a long time, refines the crystallization of the plating layer, and enables the plating layer to be white and uniform.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a plating solution additive and a plating solution for electroplating matte tin on a heterojunction battery piece, and a preparation method and application thereof.
Background
Solar cells are a clean energy engineering project supported by the country. Compared with the traditional crystalline silicon battery assembly, the high-efficiency single crystal heterojunction solar battery is called a heterojunction battery for short, the conversion efficiency of the high-efficiency single crystal heterojunction solar battery can reach 25%, and the high-efficiency single crystal heterojunction solar battery has obvious advantages.
The heterojunction battery is a monocrystalline silicon solar power generation battery, and the production line mainly comprises the process links of texturing cleaning, amorphous silicon film deposition, ITO conductive film deposition, metal grid forming, testing and the like. The metal grid forming process changes the traditional solar cell manufacturing process, can greatly reduce the manufacturing cost and remarkably improve the power generation efficiency, and has good market prospect. The matte tin plating on the surface of the battery piece is one of important processes in metal grid formation, and the quality of the matte tin plating layer directly influences the welding performance, the conversion efficiency and the like of the battery piece. The heterojunction battery piece has higher requirements on the matte tin plating process, low process temperature, white and continuous matte tin plating layer, good welding performance, fine and fine coating crystallization, stable plating solution, difficult turbidity after long-term use, good matching with the front and the rear processes and the like. Accordingly, there is a need to develop an electroplating solution and electroplating additives suitable for use in the manufacture of heterojunction cells, which can meet normal temperature production requirements, can maintain small matte tin grain sizes, can ensure plating solderability, and can be used in conjunction with standard, solder-based component interconnection techniques.
Disclosure of Invention
Based on this, it is necessary to provide a plating solution additive for electroplating matte tin. The electrolyte additive can be applied to the matte tin plating of the heterojunction battery piece, enables the plating solution to be clear for a long time, refines the crystallization of the plating layer, and enables the plating layer to be white and uniform.
A plating solution additive for electroplating matte tin on a heterojunction battery piece comprises the following components in parts by weight: 0.02-0.5: 0.5-3 of a surfactant, a grain refiner and an antioxidant;
wherein the surfactant is selected from two of straight epoxy naphthol propyl sulfonic acid potassium salt, beta-naphthol ethoxylate, alkyl ethoxy propoxy compound sulfate potassium salt and bisphenol A polyoxyethylene ether.
In one embodiment, the surfactant is a linear epoxy naphthol propyl sulfonic acid potassium salt and a beta naphthol ethoxylate.
In one embodiment, the surfactant is a straight-chain epoxy naphthol propyl sulfonic acid potassium salt and a beta-naphthol ethoxylate in a weight ratio of 1: 0.5-1.5.
In one embodiment, the grain refiner is selected from two of 1, 10-phenanthroline, dimercaptobenzothiazole, and dimercaptobenzimidazole.
In one embodiment, the grain refiners are 1, 10-phenanthroline and dimercaptobenzothiazole.
In one embodiment, the antioxidant is selected from two of catechol, resorcinol, phloroglucinol, pyrogallol, hydroquinone, alpha naphthol, beta naphthol, and morin.
In one embodiment, the antioxidant is hydroquinone or beta naphthol.
In one embodiment, the plating solution additive for electroplating the matte tin comprises the following components in parts by weight: 0.05-0.3: 1-2 of a surfactant, a grain refiner and an antioxidant.
The invention also provides a plating solution for electroplating matte tin, which comprises a methanesulfonic acid tin plating system and the plating solution additive.
In one embodiment, the plating solution uses water as a main solvent, and comprises the following components in terms of each liter of plating solution:
in one embodiment, the plating solution for electroplating the matte tin comprises the following components in percentage by liter:
in one embodiment, the organic solvent is selected from one of ethanol, butyl diglycol and 1, 2-propylene glycol.
The invention also provides a preparation method of the plating solution for electroplating matte tin, which comprises the following steps:
adding methanesulfonic acid and tin methylsulfonate into water to obtain solution A;
adding the grain refiner and the antioxidant into the organic solvent, and dissolving to obtain a solution B;
adding the surfactant into water, mixing with the solution B, and dissolving to obtain solution C;
mixing the solution C and the solution A.
The invention also provides the application of the plating solution additive or the plating solution in the plating of the matte tin of the heterojunction battery piece.
In one embodiment, the solar cell sheet is a heterojunction cell sheet.
Compared with the prior art, the invention has the following beneficial effects:
the plating solution additive for electroplating matte tin is prepared by matching the surfactant, the grain refiner and the antioxidant according to a certain weight ratio, and compounding the specific surfactant two by two, so that excellent cathode polarization capability and higher polarization degree can be generated, the additive is suitable for electroplating matte tin on heterojunction solar cells, a prepared plating layer is white and uniform, fine in crystallization, smaller in grain size, good in welding performance and capable of meeting various performances of tin plating on solar cells, and the plating solution has stable quality and is not easy to be turbid after long-term use. In addition, the plating solution additive for electroplating matte tin is suitable for an organic acid system, so that the plating solution has low toxicity, is easy to treat waste water, and is green and environment-friendly.
Drawings
FIG. 1 is a crystal phase diagram of a matte tin-plated layer prepared using the plating solution of example 1, at 1000 times magnification;
FIG. 2 is a 2000-fold magnified crystallographic phase diagram of a matte tin-plated layer made using the plating solution of example 1;
FIG. 3 is a crystal phase diagram of a matte tin-plated layer prepared using the plating solution of example 6, at 1000 times magnification;
FIG. 4 is a 2000-fold magnified crystallographic phase diagram of a matte tin-plated layer made using the plating solution of example 6;
FIG. 5 is a crystal phase diagram of a matte tin-plated layer prepared using the plating solutions of comparative examples 1 to 2, at 1000 times magnification;
FIG. 6 is a phase diagram of a 2000-fold enlargement of a matte tin-plated layer produced using the plating solutions of comparative examples 1 to 2.
Detailed Description
The plating solution additive and the plating solution for electroplating the matte tin on the heterojunction battery piece, the preparation method and the application thereof are further described in detail with reference to the specific examples.
The embodiment of the invention provides a plating solution additive for electroplating matte tin on a heterojunction battery piece, which comprises the following components in parts by weight: 0.02-0.5: 0.5-3 of a surfactant, a grain refiner and an antioxidant;
wherein the surfactant is selected from two of straight epoxy naphthol propyl sulfonic acid potassium salt, beta-naphthol ethoxylate, alkyl ethoxy propoxy compound sulfate potassium salt and bisphenol A polyoxyethylene ether.
Specifically, the straight-chain poly epoxy naphthol propyl sulfonic acid potassium salt can be purchased from Raschig company; beta-naphthol ethoxylates are available from basf; the potassium salt of the sulfuric acid ester of an alkyl ethoxy propoxy compound is commercially available from Ribei King Kogyo Co.
Preferably, the surfactant is a straight-chain epoxy naphthol propyl sulfonic acid potassium salt and a beta-naphthol ethoxylate. The two surfactants are compounded, so that the dispersion of each component (a grain refiner and an antioxidant) of the additive is facilitated, the effect of the additive is exerted, the doping of the additive in a coating is avoided, the cathode polarization capability and the polarization degree are better, and the obtained coating is more delicate and uniform. More preferably, the surfactant is a straight-chain polyepoxy naphthol propyl sulfonic acid potassium salt and a beta-naphthol ethoxylate in a weight ratio of 1: 0.5-1.5.
On the basis, the types of the grain refiner and the antioxidant are further reasonably matched, and a pairwise compounding mode is adopted, so that the synergistic effect can be realized, and the improvement of the quality of a coating and the maintenance of the stability of the plating solution are facilitated.
Specifically, in one particular embodiment, the grain refiner is selected from two of 1, 10-phenanthroline, dimercaptobenzothiazole, and dimercaptobenzimidazole.
Preferably, the grain refiner is 1, 10-phenanthroline and dimercapto benzothiazole. The combination of the two grain refiners can optimize the crystallization precipitation and fine crystallization of tin particles, the grain size is smaller, and the formed plating layer is white and uniform. More preferably, the grain refiner is 1, 10-phenanthroline and dimercapto benzothiazole in a weight ratio of 0.2-1: 1.
In one specific embodiment, the antioxidant is selected from two of catechol, resorcinol, phloroglucinol, pyrogallol, hydroquinone, alpha-naphthol, beta-naphthol, and morin.
Preferably, the antioxidant is hydroquinone and beta-naphthol. The combination of the two antioxidants is more beneficial to keeping stable electroplating effect and clear state of the plating solution after long-term use. More preferably, the antioxidant is hydroquinone and beta-naphthol in a weight ratio of 1: 4-10.
In one specific embodiment, the plating solution additive for electroplating the matte tin comprises the following components in parts by weight: 0.05-0.3: 1-2 of a surfactant, a grain refiner and an antioxidant.
The embodiment of the invention also provides a plating solution for electroplating the matte tin on the heterojunction battery piece, which comprises a methanesulfonic acid tin plating system and the plating solution additive.
Specifically, the methanesulfonic acid tin plating system refers to a mixed electroplating system of methanesulfonic acid and methanesulfonic acid tin. Wherein, the methanesulfonic acid can be provided by electroplating-grade methanesulfonic acid solution with the content of 70% (by weight, the balance being water), which is used for conducting electricity and maintaining the acidity of the plating solution, so that bivalent tin is not easily oxidized into tetravalent tin in an acidic environment to form tetravalent tin colloid. The tin methane sulfonate can be provided by a concentrated solution of tin methane sulfonate with a concentration of 300g/L, and the solvent is water.
In one specific embodiment, the plating solution uses water as a main solvent, and comprises the following components in terms of per liter of plating solution:
in one specific embodiment, the plating solution for electroplating the matte tin comprises the following components in percentage by liter:
in one specific embodiment, the organic solvent is selected from one of ethanol, diethylene glycol butyl ether and 1, 2-propylene glycol. The organic solvent is mainly used for dissolving the grain refiner and the antioxidant. Preferably, the organic solvent is diethylene glycol butyl ether.
The invention also provides a preparation method of the plating solution for electroplating matte tin, which comprises the following steps:
adding the methanesulfonic acid and the tin methylsulfonate into water to obtain a solution A;
adding the grain refiner and the antioxidant into the organic solvent, and dissolving to obtain a solution B;
adding the surfactant into water, mixing with the solution B, and dissolving to obtain solution C;
mixing the solution C and the solution A.
The invention also provides the application of the plating solution additive or the plating solution in the plating of the matte tin of the heterojunction battery piece.
The following specific examples are provided, and the raw materials used in the examples are all commercially available unless otherwise specified.
Example 1
The embodiment is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
| composition of plating solution | Dosage of | |
| Methanesulfonic acid | 200g | |
| Tin methane sulfonate | 80g | |
| Straight poly epoxy naphthol propyl sulfonic acid potassium salt | 6g | |
| Beta- | 6g | |
| 1, 10-phenanthroline | 0.1g | |
| Dimercaptobenzothiazole compounds | 0.2g | |
| Hydroquinone | 0.2g | |
| Beta-naphthols | 1.8g | |
| Diethylene glycol butyl ether | 20g |
The preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
200g of methanesulfonic acid and 80g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And adding 0.1g of 1, 10-phenanthroline, 0.2g of dimercapto benzothiazole, 0.2g of hydroquinone and 1.8g of beta-naphthol into 20g of diethylene glycol monobutyl ether, and fully stirring to completely dissolve to obtain a solution B.
And adding 6g of straight poly epoxy naphthol propyl sulfonic acid potassium salt and 6g of beta-naphthol ethoxylate into 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
Example 2
The embodiment is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
| composition of plating solution | Dosage of | |
| Methanesulfonic acid | 160g | |
| Tin methane sulfonate | 40g | |
| Straight poly epoxy naphthol propyl sulfonic acid potassium salt | 4g | |
| Beta- | 4g | |
| 1, 10-phenanthroline | 0.02g | |
| Dimercaptobenzothiazole compounds | 0.03g | |
| Hydroquinone | 0.2g | |
| Beta-naphthols | 0.8g | |
| Diethylene glycol butyl ether | 10g |
The preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
160g of methanesulfonic acid and 40g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And 0.02g of 1, 10-phenanthroline, 0.03g of dimercapto benzothiazole, 0.2g of hydroquinone and 0.8g of beta-naphthol are added into 10g of diethylene glycol monobutyl ether, and the mixture is fully stirred to be completely dissolved to obtain a solution B.
And adding 4g of straight poly epoxy naphthol propyl sulfonic acid potassium salt and 4g of beta-naphthol ethoxylate into 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
Example 3
The embodiment is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
| composition of plating solution | Dosage of | |
| Methanesulfonic acid | 180g | |
| Tin methane sulfonate | 60g | |
| Straight poly epoxy naphthol propyl sulfonic acid potassium salt | 5g | |
| Beta- | 5g | |
| 1, 10-phenanthroline | 0.08g | |
| Dimercaptobenzothiazole compounds | 0.1g | |
| Hydroquinone | 0.2g | |
| Beta-naphthols | 1.3g | |
| Diethylene glycol butyl ether | 15g |
The preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
180g of methanesulfonic acid and 60g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And 0.08g of 1, 10-phenanthroline, 0.1g of dimercapto benzothiazole, 0.2g of hydroquinone and 1.3g of beta-naphthol are added into 15g of diethylene glycol butyl ether, and the mixture is fully stirred to be completely dissolved to obtain a solution B.
And adding 5g of straight poly epoxy naphthol propyl sulfonic acid potassium salt and 5g of beta-naphthol ethoxylate into 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
Example 4
The embodiment is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
the preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
200g of methanesulfonic acid and 80g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And adding 0.1g of 1, 10-phenanthroline, 0.2g of dimercapto benzothiazole, 0.2g of hydroquinone and 1.8g of beta-naphthol into 20g of diethylene glycol monobutyl ether, and fully stirring to completely dissolve to obtain a solution B.
And adding 6g of straight poly epoxy naphthol propyl sulfonic acid potassium salt and 6g of bisphenol A polyoxyethylene ether into 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
Example 5
The embodiment is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
the preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
200g of methanesulfonic acid and 80g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And adding 0.1g of 1, 10-phenanthroline, 0.2g of dimercapto benzothiazole, 0.2g of catechol and 1.8g of alpha-naphthol into 20g of diethylene glycol monobutyl ether, and fully stirring to completely dissolve to obtain a solution B.
And adding 6g of straight poly epoxy naphthol propyl sulfonic acid potassium salt and 6g of beta-naphthol ethoxylate into 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
Example 6
The embodiment is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
| composition of plating solution | Dosage of | |
| Methanesulfonic acid | 200g | |
| Tin methane sulfonate | 80g | |
| Straight poly epoxy naphthol propyl sulfonic acid potassium salt | 6g | |
| Beta- | 6g | |
| 1, 10-phenanthroline | 0.1g | |
| Dimercapto benzimidazole | 0.2g | |
| Hydroquinone | 0.2g | |
| Beta-naphthols | 1.8g | |
| Diethylene glycol butyl ether | 20g |
The preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
200g of methanesulfonic acid and 80g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And adding 0.1g of 1, 10-phenanthroline, 0.2g of dimercapto benzimidazole, 0.2g of hydroquinone and 1.8g of beta-naphthol into 20g of diethylene glycol monobutyl ether, and fully stirring to completely dissolve to obtain a solution B.
And adding 6g of straight poly epoxy naphthol propyl sulfonic acid potassium salt and 6g of beta-naphthol ethoxylate into 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
Comparative example 1
The comparative example is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
| composition of plating solution | Dosage of | |
| Methanesulfonic acid | 200g | |
| Tin methane sulfonate | 80g | |
| Beta- | 12g | |
| 1, 10-phenanthroline | 0.1g | |
| Dimercaptobenzothiazole compounds | 0.2g | |
| Hydroquinone | 0.2g | |
| Beta-naphthols | 1.8g | |
| Diethylene glycol butyl ether | 20g |
The preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
200g of methanesulfonic acid and 80g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And adding 0.1g of 1, 10-phenanthroline, 0.2g of dimercapto benzothiazole, 0.2g of hydroquinone and 1.8g of beta-naphthol into 20g of diethylene glycol monobutyl ether, and fully stirring to completely dissolve to obtain a solution B.
And adding 12g of beta-naphthol ethoxylate into another 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
Comparative example 2
The comparative example is an electroplating solution applied to plating of matte tin on a heterojunction battery piece, and the electroplating solution adopts the following raw materials:
| composition of plating solution | Dosage of | |
| Methanesulfonic acid | 200g | |
| Tin methane sulfonate | 80g | |
| Nonylphenol polyoxyethylene ether NP-10 | 6g | |
| Beta- | 6g | |
| 1, 10-phenanthroline | 0.1g | |
| Dimercaptobenzothiazole compounds | 0.2g | |
| Hydroquinone | 0.2g | |
| Beta-naphthols | 1.8g | |
| Diethylene glycol butyl ether | 20g |
The preparation method of the electroplating solution applied to the heterojunction battery piece matte tin plating comprises the following steps:
200g of methanesulfonic acid and 80g of tin methanesulfonate were added to 500mL of pure water, and the mixture was sufficiently dissolved by stirring, and allowed to stand for cooling to obtain solution A.
And adding 0.1g of 1, 10-phenanthroline, 0.2g of dimercapto benzothiazole, 0.2g of hydroquinone and 1.8g of beta-naphthol into 20g of diethylene glycol monobutyl ether, and fully stirring to completely dissolve to obtain a solution B.
And adding 6g of nonylphenol polyoxyethylene ether NP-10 and 6g of beta-naphthol ethoxylate into 100mL of pure water, adding the solution B, and fully stirring to obtain a solution C.
The solution C was added to the solution A, and pure water was added to the solution to a volume of 1 liter.
The plating solutions of examples 1 to 6 and comparative examples 1 to 2 were used for the plating of the heterojunction battery sheet with the dummy tin, respectively.
1. The test method comprises the following steps: taking heterojunction battery pieces in the same batch, adopting electroplating solutions of examples and comparative examples to respectively electroplate the heterojunction battery pieces, wherein the electroplating process comprises the following steps: hanging, deoiling, sulfuric acid activation, sulfuric acid copper plating, matte tin plating and blow drying. Each plating solution was used to plate 10 batches of cells.
The components and operating conditions of the degreasing solution are as follows:
SF-99001 copper acid degreaser 50mL/L
The temperature is 30-40 DEG C
The time is 2-5 min.
The components and operating conditions of the activation solution were as follows:
sulfuric acid H2SO410% (volume ratio)
Temperature room temperature
The time is 05-1.5 min.
The components and the operating conditions of the copper sulfate plating solution are as follows:
and (3) matte tin plating working conditions:
2. and (3) testing results:
and (4) judging the standard:
2.1. appearance: the visual inspection is adopted for judgment, and the coating is fine, continuous, white and uniform, and is qualified.
2.2. Welding performance: according to the national standard GB/T2423.28-2005 part 2 of the environmental test of electrical and electronic products of the people's republic of China: test methods test T: the tin soldering adopts visual judgment, the soldering tin is smooth and bright, only a small amount of dispersed defects such as pinholes, non-wetting or weak wetting are allowed, the defects are not concentrated together, and the tin soldering area is more than 95 percent of the dipping area, namely the product is qualified.
2.3. Microscopic crystalline phase: the crystal phase diagram of the plating layer prepared by the example 1 is shown in the figure 1-2, the crystal phase diagram of the plating layer prepared by the example 2-5 is similar to the example 1, the crystal phase diagram of the plating layer prepared by the example 6 is shown in the figure 3-4, the crystal phase diagram of the plating layer prepared by the electroplating solution of the comparative example 1 is shown in the figure 5-6, and the crystal phase diagram of the plating layer prepared by the comparative example 2 is similar to the comparative example 1.
2.4. The stability of the plating solution is as follows: each example was prepared by starting with 5 liters of the solution and conducting the plating test, using the same frequency, with the excellent results of maintaining the plating solution clear, free from turbidity or formation of tetravalent tin colloids. After 3 months of continuous test, the sample in example 5 is slightly turbid, and the rest of the sample is still clear after 6 months of continuous test, which proves that the plating solution has excellent stability and oxidation resistance.
The test results are specifically shown in the following table:
the results show that the plating layer prepared from the electroplating solution of the plating solution additive for electroplating matte tin compounded by the invention has excellent performance, and completely meets the requirement of plating matte tin on heterojunction battery plates.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (14)
1. The plating solution additive for electroplating matte tin on the heterojunction battery piece is characterized by comprising the following components in parts by weight: 0.02-0.5: 0.5-3 of a surfactant, a grain refiner and an antioxidant;
wherein the surfactant is selected from the combination of straight epoxy naphthol propyl sulfonic acid potassium salt and beta-naphthol ethoxylate, the combination of straight epoxy naphthol propyl sulfonic acid potassium salt and alkyl ethoxy propoxy compound sulfuric ester potassium salt, or the combination of straight epoxy naphthol propyl sulfonic acid potassium salt and bisphenol A polyoxyethylene ether;
the grain refiner is selected from two of 1, 10-phenanthroline, dimercaptobenzothiazole and dimercaptobenzimidazole;
the antioxidant is selected from two of catechol, resorcinol, phloroglucinol, pyrogallol, hydroquinone, alpha-naphthol, beta-naphthol and morin.
2. The plating solution additive for electroplating matte tin on a heterojunction cell sheet as claimed in claim 1, wherein the surfactant is a combination of a straight epoxy naphthol propyl sulfonic acid potassium salt and a beta-naphthol ethoxylate.
3. The plating solution additive for electroplating the matte tin on the heterojunction battery piece according to claim 2, wherein the surfactant is a linear epoxy naphthol propyl sulfonic acid potassium salt and a beta-naphthol ethoxylate in a weight ratio of 1: 0.5-1.5.
4. The plating solution additive for electroplating matte tin on a heterojunction battery piece according to any one of claims 1 to 3, wherein the grain refiner is 1, 10-phenanthroline and dimercapto benzothiazole.
5. The plating solution additive for electroplating matte tin on a heterojunction battery piece according to claim 4, wherein the grain refiner is 1, 10-phenanthroline and dimercapto benzothiazole in a weight ratio of 0.2-1: 1.
6. The plating solution additive for electroplating the matte tin on the heterojunction battery piece according to any one of claims 1 to 3, wherein the antioxidant is hydroquinone and beta-naphthol.
7. The plating solution additive for electroplating matte tin on a heterojunction battery piece according to claim 6, wherein the antioxidant is hydroquinone and beta-naphthol in a weight ratio of 1: 4-10.
8. The plating solution additive for electroplating the matte tin on the heterojunction battery piece according to any one of claims 1 to 3, wherein the plating solution additive comprises the following components in a weight ratio of 8-12: 0.05-0.3: 1-2 of a surfactant, a grain refiner and an antioxidant.
9. A plating solution for electroplating matte tin on a heterojunction battery piece, which is characterized by comprising a methanesulfonic acid tin plating system and the plating solution additive disclosed by any one of claims 1 to 8.
10. The plating solution for electroplating the matte tin on the heterojunction battery piece according to claim 9, wherein the plating solution takes water as a main solvent and comprises the following components in terms of per liter of plating solution:
11. the plating solution for electroplating the matte tin on the heterojunction battery piece according to claim 10, wherein the plating solution comprises the following components in terms of per liter:
12. the plating solution for electroplating matte tin on a heterojunction battery piece as claimed in claim 10 or 11, wherein the organic solvent is one selected from ethanol, diethylene glycol butyl ether and 1, 2-propylene glycol.
13. The preparation method of the plating solution for electroplating the matte tin on the heterojunction battery piece as claimed in any one of claims 10 to 12 is characterized by comprising the following steps:
adding methanesulfonic acid and tin methylsulfonate into water to obtain solution A;
adding the grain refiner and the antioxidant into the organic solvent, and dissolving to obtain a solution B;
adding the surfactant into water, mixing with the solution B, and dissolving to obtain solution C;
mixing the solution C and the solution A.
14. Use of the plating solution additive according to any one of claims 1 to 8 or the plating solution according to any one of claims 9 to 12 for plating a dummy tin on a heterojunction battery piece.
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| CN202010114363.3A CN111206272B (en) | 2020-02-25 | 2020-02-25 | Plating solution additive and plating solution for electroplating matte tin on heterojunction cell, and preparation method and application of plating solution additive and plating solution |
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| US7931988B2 (en) * | 2007-10-05 | 2011-04-26 | Powergenix Systems, Inc. | Tin and tin-zinc plated substrates to improve Ni-Zn cell performance |
| CN101922026B (en) * | 2010-08-18 | 2012-02-01 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| JP5033979B1 (en) * | 2011-09-29 | 2012-09-26 | ユケン工業株式会社 | Acidic aqueous composition for plating comprising tin |
| CN107723758A (en) * | 2016-08-12 | 2018-02-23 | 惠州大亚湾金盛科技有限公司 | A kind of tin plating additive |
| CN109609980A (en) * | 2018-12-11 | 2019-04-12 | 湖北工程学院 | The method of acid tin plating liquid and preparation method thereof and copper-based material surface tinning |
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