CN104087984A - Tinning electrolyte of tinned copper wire for electronic component lead wires - Google Patents
Tinning electrolyte of tinned copper wire for electronic component lead wires Download PDFInfo
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- CN104087984A CN104087984A CN201410271286.7A CN201410271286A CN104087984A CN 104087984 A CN104087984 A CN 104087984A CN 201410271286 A CN201410271286 A CN 201410271286A CN 104087984 A CN104087984 A CN 104087984A
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Abstract
The invention relates to the technical field of electronic component lead wires, and especially relates to a tinning electrolyte of a tinned copper wire for electronic component lead wires. The tinning electrolyte comprises the following raw materials with the content: 70-200mL/L of methanesulfonic acid, 60-110g/L of tin methanesulfonate, 30-70mL of /L of a methanesulfonate, 1-2mL of /L of an antifoaming agent, 30-60mL of /L of a fluoroborate, 0.5-2g/L of a rare earth additive, 1-5g/L of gelatin, 0.5-2g/L of an anti-oxidant and the balance deionized water. According to the tinning electrolyte, contained methanesulfonic acid is capable of effectively maintaining the stability of Sn<2+>, and the added methanesulfonates are capable of refining crystallization of a tin coating, enlarging the bright current density range and effectively improving the conductivity and the stability of the tinning solution. The tinning electrolyte is low in cost, the added rear earth additive helps to substantially improve the dispersion capability of the tinning solution, and rear earth elements have certain effect of inhibiting hydrogen evolution reaction and are capable of improving the current density of the tinning solution.
Description
Technical field
The present invention relates to electronic component down-lead technical field, refer more particularly to electronic component down-lead tinned wird tin plating electrolyte.
Background technology
Aspect electronic component down-lead, done further investigation abroad.Recent year has also been done a large amount of work, and has obtained important achievement.The Ministry of Electronics Industry has worked out the ministerial standard of tinned wird and tin-coated steel steel clad wire at the bottom of nineteen eighty-two.Components and parts produce and use procedure in, lead-in wire will stand to wet, heat, bending and stretching.Therefore, material must have good thermotolerance, erosion resistance and certain mechanical property.In wire production, must prevent that copper cash is subject to the erosion of chlorine in atmosphere, ammonia, sulfurous gas etc.; Must keep the clean light in surface, can with serving mortise.The quality of copper wire tin-plating liquid directly determines the quality of tin coating.
Chinese patent 201210534468.X discloses a kind of tin plating electrolyte, it is characterized in that, comprise following component: stannous methanesulfonate 60-90g/L, stannous sulfate 10-30g/L, p-cresol sulfonic acid 110-140mg/L, sulphosalicylic acid 60-120mg/L, ortho phosphorous acid 30-50g/L, 2, 2-bis-sulphur two pyridine 45-70mg/L, oxine 15-25mg/L, catechol 20-30mg/L, 2, 2-dihydroxyl diethyl thioether 10-15g/L, brocide 5-10mg/L, dodecyl phenol polyethenoxy ether 8-12g/L, ethylene glycol 5-10g/L, benzylidene acetophenone 4-8g/L, Sodium hexametaphosphate 99 5-10g/L, sodium lauryl sulphate 4-8g/L, all the other are deionized water.This invention, by improving electrolyte prescription, can effectively suppress Sn in electrolytic process
2+change into Sn
4+, the stability of raising plating solution; Also increase the covering power of electrolytic solution simultaneously, improved luminance brightness, corrosion resisting property and the welding property of tin coating.But this invention cost compare is high, raw materials used more complicated, between can produce side reaction, electrolytic tinning is produced to detrimentally affect, and this electrolytic tinning liquid unstable properties, just can not re-use after using several times, cause waste.
Summary of the invention
It is low that technical problem to be solved by this invention is to provide a kind of cost, the rational electronic component down-lead tinned wird tin plating electrolyte of filling a prescription.
For solving the problems of the technologies described above, the present invention by the following technical solutions:
A kind of electronic component down-lead tinned wird tin plating electrolyte, it is characterized in that, the raw material that comprises following content: methylsulphonic acid 70-200mL/L, stannous methanesulfonate 60-110g/L, metilsulfate 30-70mL/L, defoamer 1-2mL/L, fluoroborate 30-60mL/L, rare earth addition 0.5-2g/L, gelatin 1-5g/L, antioxidant 0.5-2g/L, surplus is deionized water.
Preferably, described electronic component down-lead comprises the raw material of following content with tinned wird tin plating electrolyte: methylsulphonic acid 70-180mL/L, stannous methanesulfonate 60-100g/L, metilsulfate 30-60mL/L, defoamer 1-2mL/L, fluoroborate 30-50mL/L, rare earth addition 0.5-1.5g/L, gelatin 1-3g/L, antioxidant 1-2g/L, surplus is deionized water.
Preferably, described electronic component down-lead comprises the raw material of following content with tinned wird tin plating electrolyte: methylsulphonic acid 180-200mL/L, stannous methanesulfonate 100-110g/L, metilsulfate 50-70mL/L, defoamer 1-2mL/L, fluoroborate 45-60mL/L, rare earth addition 0.5-1.5g/L, gelatin 1-3g/L, antioxidant 1-2g/L, surplus is deionized water.
Preferably, the rare earth metal of described rare earth addition is lanthanum, with the form of carboxylate salt, exists.
Preferably, described electronic component down-lead also comprises lead (II) ion 0.5-2g/L with tinned wird tin plating electrolyte.
Making method of the present invention: the deionized water of calculated amount is added to agitator, again methylsulphonic acid, stannous methanesulfonate, metilsulfate are added after agitator by calculated amount, after stirring, add successively while stirring the fluoroborate of calculated amount, rare earth addition, gelatin, antioxidant and lead (II) ion, stir, regulate pH 5.0-5.1.
Use the present invention to carry out when zinc-plated, current density is controlled at 5-30A/dm
2,zinc-plated temperature is controlled at 40-50 ℃.
The present invention compared with prior art, has the following advantages: the present invention contains methylsulphonic acid, can effectively maintain the stable of Sn2+, be added with metilsulfate, can make tin coating crystallization refinement, expand bright current density range, effectively improve conductive capability and the stability of plating solution; Cost of the present invention is low, is added with rare earth addition, has significantly improved the dispersive ability of tin plating electrolyte, and rare earth element has certain inhibition evolving hydrogen reaction effect, can improve the current density of nickel-plating liquid.
Embodiment
Below in conjunction with embodiment, technical scheme of the present invention is further described in detail.
Embodiment mono-:
Electronic component down-lead tinned wird tin plating electrolyte, the raw material that comprises following content: methylsulphonic acid 200mL/L, stannous methanesulfonate 110g/L, metilsulfate 70mL/L, defoamer 2mL/L, fluoroborate 60mL/L, rare earth addition 2g/L, gelatin 5g/L, antioxidant 2g/L, plumbous (II) ion 2g/L, surplus is deionized water.The rare earth metal of rare earth addition is lanthanum, with the form of carboxylate salt, exists.
Making method of the present invention: the deionized water of calculated amount is added to agitator, again methylsulphonic acid, stannous methanesulfonate, metilsulfate are added after agitator by calculated amount, after stirring, add successively while stirring the fluoroborate of calculated amount, rare earth addition, gelatin, antioxidant and lead (II) ion, stir, regulate pH 5.1.
Use the present invention to carry out when zinc-plated, current density is controlled at 30A/dm
2,zinc-plated temperature is controlled at 50 ℃.
Embodiment bis-:
Electronic component down-lead tinned wird tin plating electrolyte, the raw material that comprises following content: methylsulphonic acid 180mL/L, stannous methanesulfonate 100g/L, metilsulfate 50mL/L, defoamer 1mL/L, fluoroborate 45mL/L, rare earth addition 1.5g/L, gelatin 3g/L, antioxidant 1g/L, plumbous (II) ion 1.5g/L, surplus is deionized water.The rare earth metal of rare earth addition is lanthanum, with the form of carboxylate salt, exists.
Making method of the present invention: the deionized water of calculated amount is added to agitator, again methylsulphonic acid, stannous methanesulfonate, metilsulfate are added after agitator by calculated amount, after stirring, add successively while stirring the fluoroborate of calculated amount, rare earth addition, gelatin, antioxidant and lead (II) ion, stir, regulate pH 5.0.
Use the present invention to carry out when zinc-plated, current density is controlled at 5A/dm
2,zinc-plated temperature is controlled at 40 ℃.
Embodiment tri-:
Electronic component down-lead tinned wird tin plating electrolyte, the raw material that comprises following content: methylsulphonic acid 150mL/L, stannous methanesulfonate 80g/L, metilsulfate 40mL/L, defoamer 1.5mL/L, fluoroborate 50mL/L, rare earth addition 1g/L, gelatin 2g/L, antioxidant 1.5g/L, plumbous (II) ion 1g/L, surplus is deionized water.The rare earth metal of rare earth addition is lanthanum, with the form of carboxylate salt, exists.
Making method of the present invention: the deionized water of calculated amount is added to agitator, again methylsulphonic acid, stannous methanesulfonate, metilsulfate are added after agitator by calculated amount, after stirring, add successively while stirring the fluoroborate of calculated amount, rare earth addition, gelatin, antioxidant and lead (II) ion, stir, regulate pH 5.1.
Use the present invention to carry out when zinc-plated, current density is controlled at 20A/dm
2,zinc-plated temperature is controlled at 45 ℃.
Embodiment tetra-:
Electronic component down-lead tinned wird tin plating electrolyte, the raw material that comprises following content: methylsulphonic acid 100mL/L, stannous methanesulfonate 70g/L, metilsulfate 60mL/L, defoamer 1.8mL/L, fluoroborate 40mL/L, rare earth addition 1.8g/L, gelatin 4g/L, antioxidant 1.8g/L, plumbous (II) ion 1.8g/L, surplus is deionized water.The rare earth metal of rare earth addition is lanthanum, with the form of carboxylate salt, exists.
Making method of the present invention: the deionized water of calculated amount is added to agitator, again methylsulphonic acid, stannous methanesulfonate, metilsulfate are added after agitator by calculated amount, after stirring, add successively while stirring the fluoroborate of calculated amount, rare earth addition, gelatin, antioxidant and lead (II) ion, stir, regulate pH 5.1.
Use the present invention to carry out when zinc-plated, current density is controlled at 10A/dm
2,zinc-plated temperature is controlled at 42 ℃.
Embodiment five:
Electronic component down-lead tinned wird tin plating electrolyte, the raw material that comprises following content: methylsulphonic acid 70mL/L, stannous methanesulfonate 60g/L, metilsulfate 30mL/L, defoamer 1mL/L, fluoroborate 30mL/L, rare earth addition 0.5g/L, gelatin 1g/L, antioxidant 0.5g/L, plumbous (II) ion 0.5g/L, surplus is deionized water.The rare earth metal of rare earth addition is lanthanum, with the form of carboxylate salt, exists.
Making method of the present invention: the deionized water of calculated amount is added to agitator, again methylsulphonic acid, stannous methanesulfonate, metilsulfate are added after agitator by calculated amount, after stirring, add successively while stirring the fluoroborate of calculated amount, rare earth addition, gelatin, antioxidant and lead (II) ion, stir, regulate pH 5.0.
Use the present invention to carry out when zinc-plated, current density is controlled at 5A/dm
2,zinc-plated temperature is controlled at 48 ℃.
The present invention contains methylsulphonic acid, can effectively maintain the stable of Sn2+, is added with metilsulfate, can make tin coating crystallization refinement, expands bright current density range, effectively improves conductive capability and the stability of plating solution; Cost of the present invention is low, is added with rare earth addition, has significantly improved the dispersive ability of tin plating electrolyte, and rare earth element has certain inhibition evolving hydrogen reaction effect, can improve the current density of nickel-plating liquid.
It should be noted last that, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can modify or be equal to replacement technical scheme of the present invention, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of claim scope of the present invention.
Claims (5)
1. an electronic component down-lead tinned wird tin plating electrolyte, it is characterized in that, the raw material that comprises following content: methylsulphonic acid 70-200mL/L, stannous methanesulfonate 60-110g/L, metilsulfate 30-70mL/L, defoamer 1-2mL/L, fluoroborate 30-60mL/L, rare earth addition 0.5-2g/L, gelatin 1-5g/L, antioxidant 0.5-2g/L, surplus is deionized water.
2. electronic component down-lead according to claim 1 tinned wird tin plating electrolyte, it is characterized in that, the raw material that comprises following content: methylsulphonic acid 70-180mL/L, stannous methanesulfonate 60-100g/L, metilsulfate 30-60mL/L, defoamer 1-2mL/L, fluoroborate 30-50mL/L, rare earth addition 0.5-1.5g/L, gelatin 1-3g/L, antioxidant 1-2g/L, surplus is deionized water.
3. electronic component down-lead according to claim 1 tinned wird tin plating electrolyte, it is characterized in that, the raw material that comprises following content: methylsulphonic acid 180-200mL/L, stannous methanesulfonate 100-110g/L, metilsulfate 50-70mL/L, defoamer 1-2mL/L, fluoroborate 45-60mL/L, rare earth addition 0.5-1.5g/L, gelatin 1-3g/L, antioxidant 1-2g/L, surplus is deionized water.
4. electronic component down-lead according to claim 1 tinned wird tin plating electrolyte, is characterized in that, the rare earth metal of described rare earth addition is lanthanum, with the form of carboxylate salt, exists.
5. electronic component down-lead according to claim 1 tinned wird tin plating electrolyte, is characterized in that, also comprises lead (II) ion 0.5-2g/L.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410271286.7A CN104087984A (en) | 2014-06-17 | 2014-06-17 | Tinning electrolyte of tinned copper wire for electronic component lead wires |
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| CN201410271286.7A CN104087984A (en) | 2014-06-17 | 2014-06-17 | Tinning electrolyte of tinned copper wire for electronic component lead wires |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104988544A (en) * | 2015-06-26 | 2015-10-21 | 吕小方 | Electrolytic tinning annexing agent |
| CN105821452A (en) * | 2016-05-19 | 2016-08-03 | 江苏兴达钢帘线股份有限公司 | Plating solution formula for electroplating pure tin on copper wire and electroplating method |
| CN108103540A (en) * | 2018-01-24 | 2018-06-01 | 永星化工(上海)有限公司 | Tin alloy electric plating liquid |
| CN113652719A (en) * | 2021-08-13 | 2021-11-16 | 广西隆林利通线缆科技有限公司 | Electroplating solution for tinning copper wire and method for electroplating tin on copper wire |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4545870A (en) * | 1984-08-27 | 1985-10-08 | Columbia Chemical Corporation | Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin |
| JP3662577B1 (en) * | 2004-10-21 | 2005-06-22 | Ｆｃｍ株式会社 | Method for forming Sn-Ag-Cu ternary alloy thin film |
| CN1837413A (en) * | 2005-03-24 | 2006-09-27 | 广东风华高新科技集团有限公司 | Composition for plating pure tin and electronic component employing the same |
| CN102162110A (en) * | 2011-01-31 | 2011-08-24 | 张家港市新港星科技有限公司 | Methyl sulfonate tinning electrolyte and tinning method of steel strip or steel plate |
| CN103060858A (en) * | 2012-12-12 | 2013-04-24 | 郎溪县金科金属有限公司 | Tin plating electrolyte |
-
2014
- 2014-06-17 CN CN201410271286.7A patent/CN104087984A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4545870A (en) * | 1984-08-27 | 1985-10-08 | Columbia Chemical Corporation | Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin |
| JP3662577B1 (en) * | 2004-10-21 | 2005-06-22 | Ｆｃｍ株式会社 | Method for forming Sn-Ag-Cu ternary alloy thin film |
| CN1837413A (en) * | 2005-03-24 | 2006-09-27 | 广东风华高新科技集团有限公司 | Composition for plating pure tin and electronic component employing the same |
| CN102162110A (en) * | 2011-01-31 | 2011-08-24 | 张家港市新港星科技有限公司 | Methyl sulfonate tinning electrolyte and tinning method of steel strip or steel plate |
| CN103060858A (en) * | 2012-12-12 | 2013-04-24 | 郎溪县金科金属有限公司 | Tin plating electrolyte |
Non-Patent Citations (2)
| Title |
|---|
| 叶晓燕等: "甲基磺酸盐电镀锡工艺及镀液性能", 《腐蚀与防护》, vol. 28, no. 8, 31 August 2007 (2007-08-31), pages 422 - 424 * |
| 胡立新等: "甲基磺酸镀锡添加剂的研究", 《电镀与环保》, vol. 31, no. 1, 31 January 2011 (2011-01-31), pages 11 - 14 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104988544A (en) * | 2015-06-26 | 2015-10-21 | 吕小方 | Electrolytic tinning annexing agent |
| CN105821452A (en) * | 2016-05-19 | 2016-08-03 | 江苏兴达钢帘线股份有限公司 | Plating solution formula for electroplating pure tin on copper wire and electroplating method |
| CN105821452B (en) * | 2016-05-19 | 2018-08-03 | 江苏兴达钢帘线股份有限公司 | A kind of plating solution and electro-plating method of the Tin plating on copper wire |
| CN108103540A (en) * | 2018-01-24 | 2018-06-01 | 永星化工(上海)有限公司 | Tin alloy electric plating liquid |
| CN108103540B (en) * | 2018-01-24 | 2020-01-07 | 永星化工(上海)有限公司 | Tin alloy electroplating solution |
| CN113652719A (en) * | 2021-08-13 | 2021-11-16 | 广西隆林利通线缆科技有限公司 | Electroplating solution for tinning copper wire and method for electroplating tin on copper wire |
| CN113652719B (en) * | 2021-08-13 | 2024-01-19 | 广西隆林利通线缆科技有限公司 | Electroplating solution for copper wire tinning and copper wire tinning method |
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