CN108441903A - A kind of standard aluminium wire plating solution formula - Google Patents
A kind of standard aluminium wire plating solution formula Download PDFInfo
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- CN108441903A CN108441903A CN201810658986.XA CN201810658986A CN108441903A CN 108441903 A CN108441903 A CN 108441903A CN 201810658986 A CN201810658986 A CN 201810658986A CN 108441903 A CN108441903 A CN 108441903A
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- Prior art keywords
- plating solution
- chloride
- additive
- aluminium wire
- standard aluminium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The present invention relates to a kind of standard aluminium wire plating solution formulas, it is characterised in that：The pH of the plating solution is 5.0, including 20 36g of aluminium chloride, 20 46g of alundum (Al2O3), 12 16g of sodium chloride, 15 18g of boric acid, 50 64g of magnesium carbonate, 12 16g of methyl methacrylate, 7 12g of potassium carbonate, 3 11g of zinc chloride, 2 5g of copper chloride, 30 40g of stannous sulfate；0.5 2g of additive bismuth oxide；0.5 2g of additive nonionic surface active agent；5 8g of stabilizer hydroquinone；300 500g of 2 4g of brightener gelatin and deionized water.Electroplate liquid formulation provided by the invention is simple and environmentally-friendly, stability is good, and electroplating technology is easily controllable, and the coating being electroplated out is uniformly, fine and close, binding force is good, is widely used in terms of welding.Plating solution not will produce bubble in electroplating process, and plating solution be always maintained at it is limpid.
Description
Technical field
The present invention relates to standard component field of electroplating more particularly to a kind of standard aluminium wire plating solution formulas.
Background technology
In recent years, the high speed development of electronics industry makes requirement of the people to solderable coating higher and higher.Due to tin
Solderability is preferable, and the use of lead is restricted, so people have done and largely ground to plating tin coating and plating tin alloy coat
Study carefully.
There are many technique tin plating at present, are divided into two large divisions：Alkaline system is tin plating and acid system is tin plating.Alkaline system plates
Tin have disadvantages that as：Deposition velocity is slower, and cathode efficiency is relatively low, evolving hydrogen reaction can be caused tight when alkali concentration is excessively high
Weight, also have an impact to tin anode etc..Acid system is tin plating general to have that sulfate system is tin plating, fluoboric acid system is tin plating, methyl
Sulfonic acid system is tin plating.Acid system is tin plating also all to be considered high current efficiency, the stability of plating solution, plating solution and has mostly
The problems such as covering power and covering power, pollution of the plating solution to environment, the period of plating solution, processing cost of electroplating effluent etc., and
Various additives will be added into plating solution by solving these problems, and some additives will cause shadow to the solderability of coating
It rings.Need to use the standard aluminium wire with good solderable coating in some welding in photovoltaic industry at present, and prior art
In it is few standard aluminium wire power on it is tin plating can reach that coating is uniform, and surface is smooth, binding force is high and the good electricity of welding performance
Plating solution.
Invention content
The technical problem to be solved in the present invention is to provide a kind of standard aluminium wire plating solution formulas, can solve general standard
For aluminium wire in plating, general electroplate liquid can not ensure that coating is uniform and can have good welding performance.
In order to solve the above technical problems, the technical scheme is that：A kind of standard aluminium wire plating solution formula, innovative point
It is：The pH of the plating solution is 5.0, including aluminium chloride 20-36g, alundum (Al2O3) 20-46g, sodium chloride 12-16g, boric acid
15-18g, magnesium carbonate 50-64g, methyl methacrylate 12-16g, potassium carbonate 7-12g, zinc chloride 3-11g, copper chloride
2-5g, stannous sulfate 30-40g；0 .5-2g of additive bismuth oxide；0 .5-2g of additive nonionic surface active agent；Surely
Determine agent hydroquinone 5-8g；Brightener gelatin 2-4g and deionized water 300-500g.
Further, the additive nonionic surface active agent is polyoxyethylene（EO15）Lauryl alcohol and OP emulsifiers
In any one or two kinds of mixtures with arbitrary ratio.
The advantage of the invention is that：
1）Electroplate liquid formulation provided by the invention is simple and environmentally-friendly, stability is good, and electroplating technology is easily controllable, and the coating being electroplated out is equal
It is even, fine and close, binding force is good, be widely used in terms of welding.Plating solution not will produce bubble in electroplating process, and plating solution is protected always
It holds limpid.
Specific implementation mode
The following examples can make professional and technical personnel that the present invention be more fully understood, but therefore not send out this
It is bright to be limited among the embodiment described range.
Embodiment 1：
The pH of a kind of standard aluminium wire plating solution formula, the plating solution is 5.0, including aluminium chloride 20g, alundum (Al2O3) 20g, chlorine
Change sodium 12g, boric acid 15g, magnesium carbonate 50g, methyl methacrylate 12g, potassium carbonate 7g, zinc chloride 3g, copper chloride
2g, stannous sulfate 30g；0 .5g of additive bismuth oxide；0 .5g of additive nonionic surface active agent；Stabilizer is to benzene
Diphenol 5g；Brightener gelatin 2g and deionized water 300g.
Additive nonionic surface active agent is polyoxyethylene（EO15）Any one in lauryl alcohol and OP emulsifiers
Or two kinds of mixtures with arbitrary ratio.
Embodiment 2：
The pH of a kind of standard aluminium wire plating solution formula, the plating solution is 5.0, including aluminium chloride 28g, alundum (Al2O3) 33g, chlorine
Change sodium 14g, boric acid 16.5g, magnesium carbonate 57g, methyl methacrylate 14g, potassium carbonate 9.5g, zinc chloride 7g, chlorination
Copper 3.5g, stannous sulfate 3.5g；Additive bismuth oxide 1.25g；Additive nonionic surface active agent 1.25g；Stablize
Agent hydroquinone 6.5g；Brightener gelatin 3g and deionized water 400g.
Additive nonionic surface active agent is polyoxyethylene（EO15）Any one in lauryl alcohol and OP emulsifiers
Or two kinds of mixtures with arbitrary ratio.
Embodiment 3：
The pH of a kind of standard aluminium wire plating solution formula, the plating solution is 5.0, including aluminium chloride 36g, alundum (Al2O3) 46g, chlorine
Change sodium 16g, boric acid 18g, magnesium carbonate 64g, methyl methacrylate 16g, potassium carbonate 12g, zinc chloride 11g, copper chloride
5g, stannous sulfate 40g；Additive bismuth oxide 2g；Additive nonionic surface active agent 2g；Stabilizer hydroquinone 8g；
Brightener gelatin 4g and deionized water 500g.
Additive nonionic surface active agent is polyoxyethylene（EO15）Any one in lauryl alcohol and OP emulsifiers
Or two kinds of mixtures with arbitrary ratio.
It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, above-described embodiment and explanation
Merely illustrating the principles of the invention described in book, without departing from the spirit and scope of the present invention, the present invention also has
Various changes and modifications, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention
It is defined by the appending claims and its equivalent thereof.
Claims (2)
1. a kind of standard aluminium wire plating solution formula, it is characterised in that：The pH of the plating solution is 5.0, including aluminium chloride 20-36g,
Alundum (Al2O3) 20-46g, sodium chloride 12-16g, boric acid 15-18g, magnesium carbonate 50-64g, methyl methacrylate 12-
16g, potassium carbonate 7-12g, zinc chloride 3-11g, copper chloride 2-5g, stannous sulfate 30-40g；0 .5- of additive bismuth oxide
2g；0 .5-2g of additive nonionic surface active agent；Stabilizer hydroquinone 5-8g；Brightener gelatin 2-4g and deionization
Water 300-500g.
2. a kind of standard aluminium wire plating solution formula according to claim 1, it is characterised in that：The additive nonionic
Surfactant is polyoxyethylene（EO15）Any one in lauryl alcohol and OP emulsifiers or two kinds of mixtures with arbitrary ratio.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658986.XA CN108441903A (en) | 2018-06-25 | 2018-06-25 | A kind of standard aluminium wire plating solution formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658986.XA CN108441903A (en) | 2018-06-25 | 2018-06-25 | A kind of standard aluminium wire plating solution formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108441903A true CN108441903A (en) | 2018-08-24 |
Family
ID=63207248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810658986.XA Withdrawn CN108441903A (en) | 2018-06-25 | 2018-06-25 | A kind of standard aluminium wire plating solution formula |
Country Status (1)
| Country | Link |
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| CN (1) | CN108441903A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110846694A (en) * | 2019-12-31 | 2020-02-28 | 天长市飞龙金属制品有限公司 | Zinc plating solution |
-
2018
- 2018-06-25 CN CN201810658986.XA patent/CN108441903A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110846694A (en) * | 2019-12-31 | 2020-02-28 | 天长市飞龙金属制品有限公司 | Zinc plating solution |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180824 |