CN108668429A - Straight-through two-sided copper base of heat dissipation of one kind and preparation method thereof - Google Patents
Straight-through two-sided copper base of heat dissipation of one kind and preparation method thereof Download PDFInfo
- Publication number
- CN108668429A CN108668429A CN201810523252.0A CN201810523252A CN108668429A CN 108668429 A CN108668429 A CN 108668429A CN 201810523252 A CN201810523252 A CN 201810523252A CN 108668429 A CN108668429 A CN 108668429A
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- Prior art keywords
- heat dissipation
- copper base
- straight
- base material
- sided
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention discloses a kind of straight-through two-sided copper base and preparation method thereof that radiates, including Copper base material ontology, the top and bottom of the Copper base material ontology are equipped with radiator structure；The radiator structure includes being opened in the two-sided line slot of the Copper base material ontology, and the Copper base material ontology is divided into the first heat dissipation plate and the second heat dissipation plate by the line slot.Use core radiator structure of the fine copper base material as circuit board, have the characteristics that rapid heat dissipation, thermal coefficient 380W/m.k, have the characteristics that thermal capacitance accumulate it is high, can effective divergent light source heat.
Description
Technical field
The invention belongs to the technical fields of copper base, more particularly, to the two-sided copper base of the straight-through heat dissipation of one kind and its making side
Method.
Background technology
Application of the LED light source in headlight for vehicles field is more and more, is based primarily upon LED light product-derived with following notable
The characteristics of
One：Long lifespan is general up to tens of thousands of or even 100,000 hours.It will even not have to replace lamps and lanterns in entire automobile service life.
Two：High efficiency, low energy consumption.The energy consumption of LED light is the 1/20 of halogen lamp.Three：Light quality is high, belong to environment-friendly products substantially without
Radiation, " green " light source.Four：The structure of LED light source is simple, internal carrier structure, and surrounding is sealed with transparent epoxy resin, resists
Shock stability is good.Five：Light non-delay, bright light fast response time（Nanosecond）.Six：It is applicable in low voltage operating, LED only needs direct current
Voltage 12V can be lighted, and no longer worry the voltage of xenon more than 20,000.Seven：LED occupancy is small, and designer can be random
Lamps and lanterns pattern is converted, enables vehicle configuration diversified.
The universal difficulty of LED automobile headlamp at present, mainly since thermal diffusivity is bad, radiating treatment is not taken pains light decay.Shadow
Ring car light service life.When if necessary to higher light efficiency and more high integration vehicle lamp light source, heat dissipation problem is more prominent, this
Patent provides a kind of car light substrate scheme of the double-side of higher power, while using the composite construction of straight-through heat dissipation,
The effective solution high integration of LED car lamp light source and high heat dissipation characteristics demand.
Invention content
The present invention is to solve technical problem present in above-mentioned background technology, provide a kind of two-sided copper base of straight-through heat dissipation and
Its production method.
The present invention uses following technical scheme：The straight-through two-sided copper base of heat dissipation of one kind, including Copper base material ontology, it is described copper-based
The top and bottom of material ontology are equipped with radiator structure；The radiator structure includes being opened in the two-sided line of the Copper base material ontology
The Copper base material ontology is divided into the first heat dissipation plate and the second heat dissipation plate by road slot, the line slot.
Further, conductive circuit layer is embedded in the line slot, the wire circuit can be complete with the line slot
Agree with.
Further, first heat dissipation plate is close close to the side of wire line layer, conductive circuit layer, the second heat dissipation plate
The side of wire line layer is coated with solder mask layer.
Further, the region of solder mask layer is not coated with as heat dissipation on first heat dissipation plate and second heat dissipation plate
Area.
Further, the top and bottom of the Copper base material ontology are equipped with two groups of heat dissipation bonding pads and positive and negative anodes pad.
Further, it is coated with insulation between the solder mask layer and the first heat dissipation plate, conductive circuit layer, the second heat dissipation plate
Layer.
Further, two groups of heat dissipation bonding pads are located on the first heat dissipation plate and the second heat dissipation plate, and and conductor wire
Road floor electrical connection；The positive and negative anodes pad is located in line slot, and is electrically connected with conductive circuit layer.
Further, the production method of the straight-through two-sided copper base of heat dissipation includes the following steps：
Step 1：It is prepared by conductive circuit layer；
Step 2：The preparation of first radiating area and the second radiating area；
Step 3：Secondary false patch, by the vacancy section of conductive circuit layer and chimeric, the tow sides of Copper base material ontology protruding figure contraposition
It aligns simultaneously after being fitted into using the preliminary hot pressing fitting of hot pressing rubber roller；
Step 4：Plate-laying；
Step 5：Pressing；
Step 6：Secondary brill datum hole；
Step 7：Copper base double-sided resistance welding makes；
Step 8：Numerical control drilling-milling shape is formed complete two-sided straight using the mounting hole and contour structures of numerical control machinofacture
Logical heat dissipation copper base；
Step 9：Test verification, using special on off test machine and test needle bed, the break-make feelings of detection copper base two sides circuit
Condition；
Step 10：Pack shipment.
Beneficial effects of the present invention：Core radiator structure of the fine copper base material as circuit board is used, there is heat dissipation
Fast feature, thermal coefficient 380W/m.k, have the characteristics that thermal capacitance accumulate it is high, can effective divergent light source heat；The substrate uses
Multilayered structure presses, and heat dissipation bonding pad of the Copper base material ontology as LED light source forms the through type radiator structure of LED light source, most
The heat dissipation channel for optimizing LED light source of limits；The exposed heat dissipation area of base material is increased, the heat dissipation of monolith substrate is effectively improved
Efficiency.
Description of the drawings
Fig. 1 is the cross-sectional view of the two-sided copper base of the present invention；
It is respectively labeled as in Fig. 1：1 Copper base material ontology, 2 line slots, 3 first heat dissipation plates, 4 second heat dissipation plates, 5 conductive circuit layers, 6
Solder mask layer, 7 radiating areas, 8 heat dissipation bonding pads, 9 positive and negative anodes pads.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term "upper", "lower", "front", "rear", "left", "right", "top",
The orientation or positional relationship of the instructions such as "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, merely to just
In the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation, with
Specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Referring to Fig. 1, the present invention provides a kind of technical solution：The straight-through two-sided copper base of heat dissipation of one kind, including Copper base material sheet
The overall thickness of body 1, Copper base material ontology 1 is 2.0mm, and the top and bottom of the Copper base material ontology 1 are equipped with radiator structure；It is described
Radiator structure includes being opened in the two-sided line slot 2 of the Copper base material ontology 1, and 2 thickness of the line slot is 0.15mm, the line
The Copper base material ontology 1 is divided into the first heat dissipation plate 3 and the second heat dissipation plate 4 by road slot 2.It is embedded with conductor wire in the line slot 2
Road floor 5, the wire circuit layer 5 can completely agree with the line slot 2.Conductive circuit layer 5 uses the list of 0.15mm thickness
Circuit articulamentum of the face FR-4 wiring boards as light source.
The integrated morphology of the two groups of light sources in substrate two sides is realized, its power of the light source module group of same structure volume and light efficiency are equal
It is doubled.
First heat dissipation plate 3 is close to the side of wire line layer, conductive circuit layer 5, the second heat dissipation plate 4 close to wire
The side of road floor 5 is coated with solder mask floor 6, and solder mask layer is not coated on first heat dissipation plate 3 and second heat dissipation plate 4
6 region is radiating area 7.It is coated between 6 and first heat dissipation plate 3 of the solder mask layer, conductive circuit layer 5, the second heat dissipation plate 4
Insulating layer.Copper base material heat dissipation plate is devised, the exposed heat dissipation area of base material is increased, effectively improves the radiating efficiency of monolith substrate.
The top and bottom of the Copper base material ontology 1 are equipped with two groups of heat dissipation bonding pads 8 and positive and negative anodes pad 9.Described two groups
Heat dissipation bonding pad 8 is located on the first heat dissipation plate 3 and the second heat dissipation plate 4, and is electrically connected with conductive circuit layer 5；The positive and negative anodes
Pad 9 is located in line slot 2, and is electrically connected with conductive circuit layer 5.
One, basic structure
Its design feature is：Three-layer composite structure structure is total to by intermediate base copper, top layer conductive line layer, bottom conductive circuit layer
At the protection for covering solder mask formation conducting wire wherein above top layer and wiring underlayer layer is formed simultaneously conductive welding disk, shape
At exposed Copper base material heat dissipation plate, convenient for the welding of the patch of LED lamp bead and other components and the heat dissipation of integrated light source module.
Two, production process：
Step 1：Prepared by FR-4 conductive circuit layers, wherein top layer is identical with bottom preparation method：
The conductive pattern for the connection of LED lamp bead circuit is made in single side FR-4 copper-clad plates, while in specific LED heatsink weldings
The heat dissipation plate position of disk and Copper base material ontology makes hollow out figure, coincide for corresponding with the protruding figure of Copper base material.
Process description：
(a) sawing sheet：With electronic shearing machine by whole single-side coated copper plate plate cut into production need dimensions, thickness 0.15mm,
Copper thickness 18-35um；
(b) brush board：Using single side brush plate machine, the oxide layer throwing on copper-clad plate surface is brushed off, convenient for the attached of follow-up wire mark wet film
Put forth effort.Brush roll mesh number：500 mesh；
(c) wet film is printed：With the method for silk-screen printing, one layer of photosensitive wet film is uniformly coated on the copper foil of copper-clad plate surface；
(d) preliminary drying：The copper-clad plate placement of printed wet film is toasted in an oven, vapors away the solvent in wet film, operating condition：75
+/- 5 degree；Time：20-30 minutes；
(e) it exposes：The circuit egative film that advance light has been painted is covered in the copper-clad plate of printed wet film, ultraviolet using 8KW
Exposure machine exposes so that the line pattern on egative film is transferred in copper-clad plate.
(f) develop：Copper-clad plate after exposure is developed by developing machine, and copper foil surface needs the part wet film for etching removal will
Developed liquid washes, and the copper foil retained is needed still to be covered by wet film.Process conditions：Developer solution：1%-3% natrium carbonicum calcinatums；
Temperature：28-32 degree；Time：1-2 minutes.Spray pressure：1-5Kg/cm2.
(g) it examines：Detect the integrality of line pattern；
(h) it etches：It will not eroded by the layers of copper that wet film covers using acid copper chloride etching liquid, retain the circuit of needs
Copper foil, process conditions, as shown in table 1：
Table 1 is the process conditions of etching：
| Copper content | 140-180 g/l |
| Acid amount | 2-3 N |
| Oxidation-reduction potential | 450-550 mv |
| Temperature | 49-54oC |
(i) striping：The circuit surface wet film after etching is removed totally with the sodium hydroxide solution of 3%-5%, is convenient for following process；
(j) brush board：Using single side brush plate machine, the oxide layer throwing on circuit base plate surface is brushed off, convenient for the attached of follow-up fitting glued membrane
Put forth effort.Brush roll mesh number：500 mesh；
(k) pressing glued membrane vacation patch：A kind of rubber roller heat pressing process is used, will be gone on glued membrane green tack to line layer.Vacation patch work
Skill is as follows：Pressure 1-4Kg/cm2；Temperature 80-120 degree；
(l) datum hole is bored：Location hole, aperture 2.0mm are bored after identifying circuit location hole figure using full-automatic image puncher；
(m) milling vacancy section：It is positioned using the location hole being drilled, the specific region CNC milling machine on FR-4 conducting wire substrates
On process pressing after need Copper base material exposed pad, heat dissipation plate figure；
(n) glued membrane precuring：The circuit base plate placement that milling is got well to interior die cavity is toasted in an oven, temperature 60-80 degree, time 20-
40 minutes；
Step 2：The preparation of first radiating area and the second radiating area
Lead to the copper layer thickness 0.15mm that overetched mode removes specific region in the tow sides of heat dissipation Copper base material so that region
Figure in addition forms the structure of opposite protrusion 0.15mm, and protruding figure and the figure of FR-4 conductive circuit layer hollow outs are completely right
It should coincide
Process description：
(o) sawing sheet：Whole copper coin plate is cut into the dimensions that production needs, copper coin model with electronic shearing machine：T2；Thickness：
2.0mm；
(p) brush board：Using single side brush plate machine, the oxide layer throwing on copper coin surface is brushed off, the attachment of follow-up wire mark wet film is convenient for
Power.Brush roll mesh number：500 mesh；
(q) wet film is printed：With the method for silk-screen printing, one layer of photosensitive wet film is uniformly coated on the two sides of copper coin；
(r) preliminary drying：The copper coin placement of printed wet film is toasted in an oven, vapors away the solvent in wet film, operating condition：75
+/- 5 degree of time 20-30 minute；
(s) it exposes：Top line egative film and wiring underlayer egative film that advance light has been painted are covered in the copper coin of printed wet film
Tow sides are exposed so that the line pattern on egative film is transferred on copper coin using the two-sided ultraviolet exposure machines of 8KW；
(t) develop：Copper coin after exposure develops by developing machine, and copper coin surface needs the part wet film for etching removal to be developed
Liquid washes, and the copper retained is needed still to be covered by wet film.Process conditions：Developer solution 1%-3% natrium carbonicum calcinatums；Temperature 28-32
Degree；Time 1-2 minute.Spray pressure：1-5Kg/cm2；
(u) it examines：Detection copper coin two sides needs the integrality of protruding figure；
(v) it etches：It will not eroded by the layers of copper that wet film covers using acid copper chloride etching liquid, retain the layers of copper of needs,
It is 0.15mm to need the copper layer thickness etched away, by general etching solution condition, needs the etching period to be in 4 meters of etching storehouse
4-6 minutes, the product after etching measured the difference in height of etched figure and non-etched figure using altimeter, and control parameter is
0.15mm+/-0.02mm；
(w) striping：The copper protruding plate surface wet film after etching is removed totally with the sodium hydroxide solution of 3%-5%, is added convenient for follow-up
Work；
(x) brush board：Using single side brush plate machine, the oxide layer throwing on copper coin surface is brushed off, convenient for follow-up pressing FR-4 conducting wires
The adhesive force of layer.Brush roll mesh number：500 mesh；
Step 3：Secondary false patch, by the vacancy section of FR-4 conductive circuit layers and the contraposition of Copper base material protruding figure it is embedding and, tow sides
It aligns embedding and is bonded afterwards using the preliminary hot pressing of hot pressing rubber roller simultaneously.It avoids subsequently pressing during typesetting and offset phenomena occurs.
Step 4：Plate-laying：The arrangement overlapping in certain sequence such as copper coin, release film, rubber cushion, steel plate will be pressed.
Step 5：Pressing：
First stage：Preload pressure 6-12Kg/cm2；Temperature 0-175 degree is persistently overheating；
Second stage：Precompressed heat preservation pressure 6-12Kg/cm2；Temperature 175+/- 5 is spent；Time 10-40 minute；
Phase III：Total head pressure 30-50Kg/cm2；Temperature 175+/- 5 is spent；Time 90-120 minute；
Fourth stage：Pressurize cooling pressure 30-50Kg/cm2；Temperature 175-50 degree continued downs；After temperature is less than 50 degree, unload
Except pressure takes out plate.
Step 6：Secondary brill datum hole
Location hole, aperture 2.0mm are bored after identifying circuit location hole figure using full-automatic image puncher.
Step 7：Copper base double-sided resistance welding makes
Solder mask is made pressing integral copper base two sides, is used for the protection of conducting wire, and form LED heat dissipation bonding pad figures
Shape and Copper base material heat dissipation plate figure.
Flow：
（a）Brush board：Using single side brush plate machine, the oxide layer throwing of copper base two sides line layer is brushed off, follow-up wire mark welding resistance is convenient for
The adhesive force of white oil.Brush roll mesh number：500 mesh；
（b）Print welding resistance white oil：With the method for silk-screen printing, in the copper base tow sides for completing circuit, uniformly one layer of coating is photosensitive
Welding resistance white oil.Solder mask model：Big storehouse rattan field LE-600；
（c）Preliminary drying：The copper base placement of printed welding resistance white oil is toasted in an oven, the solvent in white oil is vapored away, operates
Condition：75+/- 5 spends time 20-30 minute；
（d）Exposure：The top layer welding resistance egative film and bottom welding resistance egative film that advance light has been painted are respectively overlay in printed white oil
Copper base tow sides, utilize the exposure of two-sided 8KW ultraviolet exposure machines so that welding resistance pattern transfer on egative film to copper base
On；
（e）Development：Copper base after exposure develops by developing machine, and the welding resistance white oil on LED pads and Copper base material heat dissipation plate will
Developed liquid washes, and the copper foil of other most of line layers is still covered by white oil.Process conditions：Developer solution 1%-3% is anhydrous
Sodium carbonate；Temperature 28-32 degree；Time 1-2 minute.Spray pressure：1-5Kg/cm2；
（f）After cure：Copper base after development, which is positioned in baking oven, to be toasted, and welding resistance white oil is thoroughly cured, when 150 degree of temperature
Between 60 minutes；
（g）Chemical nickel gold：ROHM AND HAAS Pallamerse TM SMT2000 chemical nickel gold systems are used, in exposed pads
One laminated gold plate of coating surface.Convenient for welding component and prevent copper during heat dissipation plate layers of copper surface long term applied at elevated temperature
Face aoxidizes.
Step 8：Numerical control drilling-milling shape is formed complete double using the mounting hole and contour structures of numerical control machinofacture
The straight-through heat dissipation copper base in face.
Step 9：Test verification, using special on off test machine and test needle bed, the break-make of detection copper base two sides circuit
Situation, using the rich letter BZX-600E test machines of crowd.
Step 10：Pack shipment.
Claims (8)
1. the straight-through two-sided copper base of heat dissipation of one kind, which is characterized in that including Copper base material ontology, the top surface of the Copper base material ontology and
Bottom surface is equipped with radiator structure；The radiator structure includes being opened in the two-sided line slot of the Copper base material ontology, the circuit
The Copper base material ontology is divided into the first heat dissipation plate and the second heat dissipation plate by slot.
2. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that be embedded with and lead in the line slot
Electric line layer, the wire circuit can completely agree with the line slot.
3. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that first heat dissipation plate is close
The side of wire line layer, conductive circuit layer, the second heat dissipation plate are coated with solder mask layer close to the side of wire line layer.
4. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that first heat dissipation plate and institute
It is radiating area to state and be not coated with the region of solder mask layer on the second heat dissipation plate.
5. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that the top of the Copper base material ontology
Face and bottom surface are equipped with two groups of heat dissipation bonding pads and positive and negative anodes pad.
6. a kind of straight-through two-sided copper base of heat dissipation according to claim 3, which is characterized in that the solder mask layer and the
It is coated with insulating layer between one heat dissipation plate, conductive circuit layer, the second heat dissipation plate.
7. a kind of straight-through two-sided copper base of heat dissipation according to claim 5, which is characterized in that two groups of heat dissipation bonding pads point
Wei Yu not be on the first heat dissipation plate and the second heat dissipation plate, and be electrically connected with conductive circuit layer；The positive and negative anodes pad is located at line slot
In, and be electrically connected with conductive circuit layer.
8. the straight-through two-sided copper base of heat dissipation of one kind according to any one of claim 1-7, which is characterized in that described straight-through
The production method of two-sided copper base of radiating includes the following steps：
Step 1：It is prepared by conductive circuit layer；
Step 2：The preparation of first radiating area and the second radiating area；
Step 3：Secondary false patch, by the vacancy section of conductive circuit layer and chimeric, the tow sides of Copper base material ontology protruding figure contraposition
It aligns simultaneously after being fitted into using the preliminary hot pressing fitting of hot pressing rubber roller；
Step 4：Plate-laying；
Step 5：Pressing；
Step 6：Secondary brill datum hole；
Step 7：Copper base double-sided resistance welding makes；
Step 8：Numerical control drilling-milling shape is formed complete two-sided straight using the mounting hole and contour structures of numerical control machinofacture
Logical heat dissipation copper base；
Step 9：Test verification, using special on off test machine and test needle bed, the break-make feelings of detection copper base two sides circuit
Condition；
Step 10：Pack shipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810523252.0A CN108668429A (en) | 2018-05-28 | 2018-05-28 | Straight-through two-sided copper base of heat dissipation of one kind and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810523252.0A CN108668429A (en) | 2018-05-28 | 2018-05-28 | Straight-through two-sided copper base of heat dissipation of one kind and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108668429A true CN108668429A (en) | 2018-10-16 |
Family
ID=63777795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810523252.0A Withdrawn CN108668429A (en) | 2018-05-28 | 2018-05-28 | Straight-through two-sided copper base of heat dissipation of one kind and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108668429A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864040A (en) * | 2020-09-23 | 2020-10-30 | 歌尔股份有限公司 | Metal substrate and heating element |
-
2018
- 2018-05-28 CN CN201810523252.0A patent/CN108668429A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864040A (en) * | 2020-09-23 | 2020-10-30 | 歌尔股份有限公司 | Metal substrate and heating element |
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Application publication date: 20181016 |
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