CN108654869A - 涂覆装置和涂覆方法 - Google Patents
涂覆装置和涂覆方法 Download PDFInfo
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Abstract
本发明公开了涂覆装置和涂覆方法。涂覆装置包括:室;支撑件,其位于在室的内部空间中并且构造为支撑待涂覆的基板;喷射喷嘴,其构造为朝向支撑件喷射涂覆材料;以及电场形成单元,其构造为在涂覆材料的移动路径中形成磁场以提供用于涂覆材料的动能。
Description
技术领域
这里描述的发明构思的实施方式涉及涂覆装置和涂覆方法。
背景技术
可以涂覆基板以改进和改变物理和化学特性。涂覆方法包括沉积,比如PVD或CVD、喷射、与气溶胶沉积。
在气溶胶沉积中,以预设压力朝向基板喷射处于气溶胶状态的涂覆材料。涂覆材料因喷射速度而具有动能。在与基板的碰撞期间,涂覆材料的动能转化为热能。热能使涂覆材料熔化并且该涂覆材料涂覆在基板上。在气溶胶沉积中,因涂覆材料的动能以及通过将动能转化为热能获得的热量的程度而使得可用涂覆材料的粒子大小受到限制。
发明内容
发明构思的实施方式提供了可以通过其有效地涂覆基板的涂覆装置和涂覆方法。
根据发明构思的方面,提供了涂覆装置,包括:室;支撑件,其位于室的内部空间中并且构造为支撑待涂覆的基板;喷射喷嘴,其构造为朝向支撑件喷射涂覆材料;以及电场形成单元,其构造为在涂覆材料的移动路径中形成电场以提供用于涂覆材料的动能。
电场形成单元可以包括:电极构件,其位于支撑件与喷射喷嘴之间;以及电源,其构造为在位于所述支撑件处的所述基板与所述电极构件之间施加电压。
电极构件可以具有涂覆材料穿过的。
电极构件可以具有网状物形状。
基板可以连接到电源并且电极构件接地。
电源可以是直流电源。
支撑件可以位于室的上壁上,并且电极构件可以位于室的内部空间的下部处。
室可以具有用于排放它的内部空间的排放孔。
电场形成单元还可以包括连接线,如果基板位于支撑件处,则该连接线将基板连接到电源以施加电压。
电场形成单元还可以包括位于支撑件内部并且电连接到电源的辅助电极构件。
涂覆装置还可以包括磁场形成单元,该磁场形成单元构造为在涂覆材料的移动路径中形成磁场。
磁场形成单元可以位于涂覆材料的移动路径的侧部。
磁场形成单元可以包括相对于涂覆材料的移动路径位于相对侧上的第一磁体和第二磁体。
喷射喷嘴可以喷射以气溶胶状态的涂覆材料。
根据发明构思的另一个方面,提供了用于涂覆基板的方法,该方法包括:利用喷射喷嘴喷射涂覆材料;使涂覆材料离子化;以及通过电场朝向所述基板引导所述离子化的涂覆材料,以迫使所述涂覆材料与所述基板碰撞。
涂覆材料可以在穿过相对于涂覆材料的喷射方向位于喷射喷嘴前方的电极构件时通过由电极构件提供的离子而被离子化。
电极构件可以包括孔,涂覆材料可以跨越电极构件通过孔朝向基板移动,并且在基板与电极构件之间形成电场。
当朝向基板引导涂覆材料时,可以在涂覆材料的移动路径中形成磁场。
附图说明
通过参照以下附图的下面的描述,以上和其它目的和特征将变得显而易见,其中除非另外具体指明,否则贯穿各个附图相同附图标记表示相同部件,并且在附图中:
图1是示出根据本发明构思的实施方式的涂覆装置的视图;
图2是电极构件的放大视图;
图3是示出其中执行涂覆的状态的视图;
图4是示出由电场形成单元形成的护层的视图;
图5是示出其中护层的状态被调节的状态的视图;
图6是示出根据本发明构思的另一个实施方式的涂覆装置的视图;以及
图7是示出根据本发明构思的另一个实施方式的涂覆装置的视图。
具体实施方式
在下文中,将参照附图更加详细地描述本发明构思的示例性实施方式。可以以各种形式修改本发明构思的实施方式,并且本发明构思的范围不应理解为限于以下实施方式。提供本发明构思的实施方式以便为本领域中的技术人员更完整地描述本发明构思。因此,附图的部件的形状被夸大以突出它的更清楚的描述。
图1是示出根据本发明构思的实施方式的涂覆装置的视图。
参照图1,涂覆装置10包括室100、支撑件120、喷射喷嘴130、电场形成单元140和150、以及磁场形成单元160。
室100提供了具有预设体积并且在其中执行涂覆的空间。排放孔110形成在室100的一个侧面上。排放孔110连接到排放管线111,并且通过施加到排放管线111的负压排放内部空间。排放孔110可以形成在室100的支撑件120位于其上的表面上。
支撑件120位于室100的内部并且支撑在其上执行涂覆的基板m(参见图3)。作为实例,支撑件120可以位于室100的上壁上,并且基板m可以被吸附在支撑件120的底面上。
喷射喷嘴130将涂覆材料喷射到内部空间中。作为实例,喷射喷嘴130可以位于室100的内部空间中,并且喷射喷嘴130的端部可以定位为与室100的内部空间连通,并且从喷射喷嘴130喷射的涂覆材料可以供给到室100的内部空间中。喷射喷嘴130可以喷射以气溶胶状态的涂覆材料。喷射喷嘴130可以以预设压力喷射涂覆材料。涂覆材料可以是陶瓷。喷射的涂覆材料的粒子直径的范围可以从几微米到几纳米。喷射喷嘴130可以位于面向支撑件120的方向上,并且朝向支撑件120喷射涂覆材料。如果支撑件120位于室100的上壁上,则喷射喷嘴130可以位于室100的下部处并且可以从下侧向上侧喷射涂覆材料。
图2是电极构件的放大视图。
参照图1和图2,电场形成单元140和150在涂覆材料的移动路径中形成电场,并且为涂覆材料提供动能。电场形成单元140和150包括电极构件140和电源150。
电极构件140可以位于支撑件120与喷射喷嘴130之间。作为实例,电极构件140可以沿涂覆材料的移动方向与喷射喷嘴130的端部以预设距离分隔开。从喷射喷嘴130喷射的涂覆材料移动穿过电极构件140。电极构件140包括提供喷射喷嘴130的移动路径的孔。作为实例,电极构件140可以以网状物的形式提供。电极构件140由诸如金属的导电材料形成。电极构件140可以通过固定单元141固定到室100。
电源150在电极构件140与基板m之间形成电势。具体地说,电源150可以电连接到电极构件140和基板m。具体地说,电源150的一侧可以通过电线连接到电极构件140,并且电源150的相对侧可以通过电线连接到支撑件120的上表面。因此,如果基板m位于支撑件120处,则由电源150将电压施加到基板m和电极构件140。电源150设置为直流电源150,使得它的正极可以连接到基板m并且它的负极可以连接到电极构件140。此外,电源150的一侧与电极构件140可以以接地方式相互连接。
磁场形成单元160在涂覆材料的移动路径中形成磁场。磁场形成单元160包括第一磁体161和第二磁体162。磁场形成单元160位于涂覆材料的移动路径的侧部。当支撑件120位于室100的上壁上并且喷射喷嘴130位于室100的下部处时,第一磁体161和第二磁体162可以位于室100的侧壁上。第一磁体161和第二磁体162可以相对于涂覆材料的移动路径彼此面向。第一磁体161与第二磁体162的面向表面可以具有不同极性。第一磁体161、第二磁体162、或者第一磁体161和第二磁体162可以是磁通量密度可以被调节的磁体。为了可以贯穿涂覆材料的移动路径形成磁场,基板m可以位于第一磁体161的上部与第二磁体162的上部之间,并且电极构件140可以位于第一磁体161的下部与第二磁体162的下部之间。
图3是示出执行涂覆的状态的视图。
参照图3,从喷射喷嘴130喷射的涂覆材料与位于支撑件120处的基板m碰撞。以气溶胶状态以预设压力喷射的涂覆材料具有动能,并且涂覆材料涂覆在基板m上,同时在与基板m碰撞时动能转换为热能。当执行涂覆时,通过排放孔110进行排放。排放孔110可以设置在沿面向喷射喷嘴130并且支撑件120位于其中的方向上,并且因排放引起的负压可以向涂覆材料另外地提供动能。
当穿过电极构件140时,涂覆材料可以带有阴离子电荷。作为实例,涂覆材料可以是容易接收电子的材料,比如氧化物或氮化物。因此,涂覆材料可以在通过电极构件140的孔向基板m移动的同时,从电极构件140接收电子以带有阴离子电荷。此外,带电的涂覆材料可以在移动之后与基板m碰撞,而其动能通过形成在电极构件140与基板m之间的电场被调节。如果电源150设置为直流电源150,则带电的涂覆材料的动能因电场而增加,并且当涂覆材料与基板m碰撞时,涂覆质量可以随融合程度的增加而改进。
根据本发明构思的实施方式,由于通过电场调节涂覆材料的移动状态来控制涂覆材料的涂覆过程,因此可以改善涂覆质量。
此外,根据本发明构思的实施方式,由于通过电场调节涂覆材料的移动状态,因此可以使用具有宽范围的粒子大小的涂覆材料以用于涂覆。
图4是示出由电场形成单元形成的护层的视图。图5是示出其中护层的状态被调节的状态的视图。
参照图4和图5,可以通过电场形成单元140和150在室100的内部来激发等离子体。如果等离子体被激发,那么就在电极构件140和基板m周围形成护层s。
由于涂覆材料在穿过电极构件140时带电,因此涂覆材料的迁移率在护层s中增加。可以通过由磁场形成单元160提供的磁场调节护层s的厚度。因此,当将涂覆材料喷射到待涂覆的基板m时,涂覆材料与基板m碰撞时的涂覆材料的动能可以通过调节由磁场形成单元160形成的磁通量来调节,从而对护层s进行调节。
根据本发明构思的实施方式,由于通过调节护层s来调节涂覆材料的移动状态从而控制涂覆材料的涂覆过程,因此可以改善涂覆质量。
此外,根据本发明构思的实施方式,由于通过护层s调节涂覆材料的移动状态,因此可以使用具有宽范围的粒子大小的涂覆材料以用于涂覆。
图6是示出根据本发明构思的另一个实施方式的涂覆装置的视图。
参照图6,涂覆装置11包括室200、支撑件220、喷射喷嘴230、电场形成单元240和250、以及磁场形成单元260。
电场形成单元221、240和250包括电极构件240、辅助电极构件221、以及电源250。
辅助电极构件221设置在支撑件220内部。辅助电极构件221可以定位为邻近基板m位于其上的表面。辅助电极构件221可以以与图1的涂覆装置10的方式类似的方式连接到电源250。因此,可以通过电极构件240与辅助电极构件221之间的电势在基板m与电极构件240之间形成电场。此外,可以通过电极构件240与辅助电极构件221之间的电势在基板m与电极构件240之间激发等离子体。
由于除了辅助电极构件221以外,磁场形成单元260,包括室200、支撑件220、喷射喷嘴230、电极构件240、电源250、与第一磁体261和第二磁体262的构造和操作与图1的涂覆装置10相同或类似,因此将省略其重复描述。
图7是示出根据本发明构思的另一个实施方式的涂覆装置的视图。
参照图7,涂覆装置12包括室300、支撑件320、喷射喷嘴330、电场形成单元340、350和351以及磁场形成单元360。
电场形成单元340、350和351包括电极构件340、连接杆351和电源350。
连接杆351通过电线连接到电源350。可以提供连接杆351且其同时固定到室300。连接杆351设置为使得如果基板m位于支撑件320处,则连接杆351的端部与基板m接触。连接杆351可以是导体,或者可以在其内包括电线。因此,与连接杆351接触的基板m电连接到电源350。
由于除了连接杆351以外,磁场形成单元360,包括室300、支撑件320、喷射喷嘴330、电极构件340、电源350、与第一磁体261和第二磁体262的构造和操作与图1的涂覆装置10相同或类似,因此将省略其重复描述。
根据本发明构思的实施方式,可以提供可以有效地涂覆基板的涂覆装置和涂覆方法。
上面的描述示例了本发明构思。此外,上述内容描述了本发明构思的示例性实施方式,并且,本发明构思可以用于各种其它组合、改变与环境中。也就是说,可以在不偏离说明书中公开的本发明构思的范围、书面公开的等效范围和/或本领域技术人员的技术或知识范围的情况下修改和修正本发明构思。书写的实施方式描述了用于实施本发明构思的技术精神的最佳状态,并且可以对具体应用领域和本发明构思的目的作出要求的各种改变。因此,本发明构思的详细描述不意图限定公开实施方式状态中的发明构思。此外,应该理解的是所附权利要求包括其它实施方式。
Claims (18)
1.一种涂覆装置,包括:
室;
支撑件,其位于所述室的内部空间中并且构造为支撑待涂覆的基板;
喷射喷嘴,其构造为朝向所述支撑件的方向喷射涂覆材料;以及
电场形成单元,其构造为在所述涂覆材料的移动路径中形成电场以为所述涂覆材料提供动能。
2.根据权利要求1所述的涂覆装置,其中所述电场形成单元包括:
电极构件,其位于所述支撑件与所述喷射喷嘴之间;以及
电源,其构造为向位于所述支撑件处的所述基板和所述电极构件施加电压。
3.根据权利要求2所述的涂覆装置,其中所述电极构件具有所述涂覆材料穿过的孔。
4.根据权利要求2所述的涂覆装置,其中所述电极构件以网状物形状设置。
5.根据权利要求2所述的涂覆装置,其中所述基板连接到所述电源,并且所述电极构件接地。
6.根据权利要求2所述的涂覆装置,其中所述电源是直流电源。
7.根据权利要求2所述的涂覆装置,其中所述支撑件位于所述室的上壁上,并且所述电极构件位于所述室的内部空间的下部处。
8.根据权利要求1所述的涂覆装置,其中所述室具有用于排放所述室的内部空间的排放孔。
9.根据权利要求2所述的涂覆装置,其中所述电场形成单元还包括:
连接线,如果所述基板位于所述支撑件处,则所述连接线将所述基板连接到所述电源以施加电压。
10.根据权利要求2所述的涂覆装置,其中所述电场形成单元还包括:
辅助电极构件,其位于所述支撑件内部并且电连接到所述电源。
11.根据权利要求1所述的涂覆装置,还包括:
磁场形成单元,其构造为在所述涂覆材料的移动路径中形成磁场。
12.根据权利要求11所述的涂覆装置,其中所述磁场形成单元位于所述涂覆材料的移动路径的侧部。
13.根据权利要求11或12所述的涂覆装置,其中所述磁场形成单元包括:
第一磁体和第二磁体,所述第一磁体和第二磁体相对于所述涂覆材料的移动路径位于相对侧上。
14.根据权利要求1所述的涂覆装置,其中所述喷射喷嘴喷射以气溶胶状态的涂覆材料。
15.一种用于涂覆基板的方法,该方法包括:
利用喷射喷嘴喷射涂覆材料;
使所述涂覆材料离子化;以及
通过电场朝向所述基板引导离子化的涂覆材料以迫使所述涂覆材料与所述基板碰撞。
16.根据权利要求15所述的方法,其中所述涂覆材料在穿过相对于所述涂覆材料的喷射方向位于所述喷射喷嘴前方的电极构件时通过由所述电极构件提供的离子而被离子化。
17.根据权利要求16所述的方法,其中所述电极构件包括孔,
其中所述涂覆材料跨越所述电极构件通过所述孔朝向所述基板移动,并且
其中在所述基板与所述电极构件之间形成电场。
18.根据权利要求15所述的方法,其中,当朝向所述基板引导所述涂覆材料时,在所述涂覆材料的移动路径中形成磁场。
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