CN108630603A - 加工方法 - Google Patents

加工方法 Download PDF

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Publication number
CN108630603A
CN108630603A CN201810224062.9A CN201810224062A CN108630603A CN 108630603 A CN108630603 A CN 108630603A CN 201810224062 A CN201810224062 A CN 201810224062A CN 108630603 A CN108630603 A CN 108630603A
Authority
CN
China
Prior art keywords
machined object
slot
film
pressure water
high pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810224062.9A
Other languages
English (en)
Chinese (zh)
Inventor
田渕智隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN108630603A publication Critical patent/CN108630603A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Dicing (AREA)
CN201810224062.9A 2017-03-23 2018-03-19 加工方法 Pending CN108630603A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-057445 2017-03-23
JP2017057445A JP2018160577A (ja) 2017-03-23 2017-03-23 加工方法

Publications (1)

Publication Number Publication Date
CN108630603A true CN108630603A (zh) 2018-10-09

Family

ID=63706320

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810224062.9A Pending CN108630603A (zh) 2017-03-23 2018-03-19 加工方法

Country Status (4)

Country Link
JP (1) JP2018160577A (ko)
KR (1) KR20180108473A (ko)
CN (1) CN108630603A (ko)
TW (1) TW201835991A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109264130A (zh) * 2018-10-29 2019-01-25 深圳市晶盛自动化设备有限公司 一种全自动玻璃瓶烤花脱膜机

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7242268B2 (ja) * 2018-11-30 2023-03-20 株式会社ディスコ ダイシング装置
JP7317507B2 (ja) * 2019-01-07 2023-07-31 株式会社ディスコ ウォータージェット加工装置及びウォータージェット加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104781939A (zh) * 2012-11-23 2015-07-15 奥斯兰姆奥普托半导体有限责任公司 用于将复合体分割成半导体芯片的方法和半导体芯片
JP2016134433A (ja) * 2015-01-16 2016-07-25 株式会社東芝 ダイシング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104781939A (zh) * 2012-11-23 2015-07-15 奥斯兰姆奥普托半导体有限责任公司 用于将复合体分割成半导体芯片的方法和半导体芯片
JP2016134433A (ja) * 2015-01-16 2016-07-25 株式会社東芝 ダイシング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109264130A (zh) * 2018-10-29 2019-01-25 深圳市晶盛自动化设备有限公司 一种全自动玻璃瓶烤花脱膜机

Also Published As

Publication number Publication date
TW201835991A (zh) 2018-10-01
KR20180108473A (ko) 2018-10-04
JP2018160577A (ja) 2018-10-11

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Legal Events

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SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20181009