CN108629926B - Magnetic head anti-detection implementation method - Google Patents
Magnetic head anti-detection implementation method Download PDFInfo
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- CN108629926B CN108629926B CN201810443834.8A CN201810443834A CN108629926B CN 108629926 B CN108629926 B CN 108629926B CN 201810443834 A CN201810443834 A CN 201810443834A CN 108629926 B CN108629926 B CN 108629926B
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07G—REGISTERING THE RECEIPT OF CASH, VALUABLES, OR TOKENS
- G07G1/00—Cash registers
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07G—REGISTERING THE RECEIPT OF CASH, VALUABLES, OR TOKENS
- G07G1/00—Cash registers
- G07G1/12—Cash registers electronically operated
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Abstract
The invention discloses a magnetic head anti-detection implementation method, and relates to the technical field of POS machine magnetic head safety protection. The method adopts the quantitative single-component and low-temperature thermal quick-curing type silicon rubber to replace AB rubber used in the prior art, and on the basis of ensuring the same sealing effect, the silicon rubber does not need to be mixed and prepared on site before use, so the operation flow is simpler, the silicon rubber has no requirement on the use time, in addition, the solidification can be realized in a short time at a lower temperature, the process requirement is greatly reduced, the working hour is shortened, the cost of the magnetic head detection prevention realization process is greatly reduced, and compared with the cost of the AB rubber used in the prior art, the cost is reduced by 10-15 percent. In addition, the obtained magnetic head has better aging resistance, can be used for 7 years without being influenced, and has excellent aging resistance.
Description
Technical Field
The invention relates to the technical field of safety protection of a magnetic head of a POS machine, in particular to a magnetic head anti-detection implementation method.
Background
After a conventional magnetic head and a PCBA decoding board are welded, the decoding chip board in the magnetic head needs to be sealed, so that the information collected by the magnetic head is prevented from being attacked and detected from the outside.
At present, in the process of sealing a decoding chip board in a magnetic head, the used sealing material is generally obtained by mixing epoxy resin and AB glue according to the proportion of 4:1 and uniformly stirring, and the sealing material is gradually heated and has poor fluidity after being uniformly stirred, so the sealing material needs to be used up within 2 hours, otherwise, the sealing material cannot be used because the sealing material does not flow; further, since the time required for the sealing material to solidify after filling is long, 8 hours are required under high temperature conditions and up to 48 hours are required under normal temperature conditions, sealing of the decoding chip board in the magnetic head with the sealing material requires not only complicated manufacturing steps of the sealing material and a long time for use, but also a long time required for solidification after filling, and thus the production efficiency is low.
Disclosure of Invention
The invention aims to provide a method for realizing the detection prevention of a magnetic head, thereby solving the problems in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a method for realizing magnetic head anti-detection comprises the following steps:
s1, carrying out surface mounting on the magnetic head PCB to obtain a surface mounted magnetic head PCB;
s2, welding the PCB of the patch magnetic head and the PCB decoding board to obtain a magnetic head assembly;
s3, performing functional test on the magnetic head assembly;
s4, filling a quantitative single-component low-temperature heat quick-curing type silicon rubber into a magnetic head cavity of the magnetic head assembly to obtain a filled silicon rubber magnetic head assembly;
and S5, keeping the filled silicon rubber magnetic head assembly at the temperature of 120 ℃ for 20 minutes to solidify the silicon rubber.
Preferably, S1 specifically includes manufacturing a jig from a glass fiber board or a synthetic stone, fixing the FPC flexible printed circuit board to the jig, and attaching the decoding chip and the peripheral circuit to the FPC flexible flat cable by SMT.
Preferably, S2 is specifically that, first, the magnetic head is placed on the soldering jig in a specified direction, then the hole on the FPC board after mounting is aligned with the magnetic head pin, and pressed flat, soldering is performed through the electro-chromic iron, 7 points are soldered in total, the soldering temperature is 350 ℃, the duration is 2-3 seconds, and it is ensured that soldering is complete without a tin tip and/or a cold joint.
Preferably, S3 is specifically that the soldered magnetic head assembly is mounted on a magnetic head test fixture, a POS machine on the fixture is powered on to enter a magnetic head test interface, and the card is continuously swiped forward and backward for 5 times, indicating that the test is passed if the success rate is 100%.
Preferably, S4 is embodied by potting silicone rubber into a head cavity of the head assembly using a dispenser.
Preferably, in S4, the amount of silicone rubber packed into the head cavity of the head assembly is 0.3 ml:
preferably, S5 is to put the dispensed magnetic head assembly into a high temperature box with a temperature of 120 ℃, keep it for 20 minutes, and then take it out to obtain a complete magnetic head assembly.
The invention has the beneficial effects that: the method for realizing the magnetic head anti-detection provided by the embodiment of the invention adopts the quantitative single-component low-temperature thermal quick-curing type silicon rubber to replace AB glue used in the prior art, and on the basis of ensuring the same sealing effect, the silicon rubber does not need to be mixed and prepared on site before use, so the operation process is simpler, the silicon rubber has no requirement on the use time, in addition, the solidification can be realized in a short time at a lower temperature, the process requirement is greatly reduced, the working hours are shortened, and the cost of the magnetic head anti-detection realizing process is greatly reduced, and compared with the cost of using the AB glue in the prior art, the cost is reduced by 10-15%. In addition, the silicon rubber has the characteristics of moisture resistance, aging resistance, electric insulation, high solidification speed, difficulty in melting after solidification and the like, so that the obtained magnetic head has a better aging resistance effect and can be used for 7 years without being influenced.
Drawings
Fig. 1 is a schematic flow chart of a method for implementing head protection detection according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, an embodiment of the present invention provides a method for implementing head anti-detection, including the following steps:
s1, carrying out surface mounting on the magnetic head PCB to obtain a surface mounted magnetic head PCB;
s2, welding the PCB of the patch magnetic head and the PCB decoding board to obtain a magnetic head assembly;
s3, performing functional test on the magnetic head assembly;
s4, filling a quantitative single-component low-temperature heat quick-curing type silicon rubber into a magnetic head cavity of the magnetic head assembly to obtain a filled silicon rubber magnetic head assembly;
and S5, keeping the filled silicon rubber magnetic head assembly at the temperature of 120 ℃ for 20 minutes to solidify the silicon rubber.
In this example, the silicone rubber was purchased from the market, and the manufacturer: guangdong new materials science and technology limited, model: 704RTV silicon rubber has the characteristics of moisture resistance, aging resistance, electric insulation, fast solidification, difficult melting after solidification and the like.
S1 is that a jig is made of glass fiber board or synthetic stone, the FPC is fixed on the jig, and the decoding chip and the peripheral circuit are pasted by SMT.
The flexible FPC flat cable is too soft and can not be directly attached to a chip mounter like a hard board PCB, the flexible printed circuit board needs to be placed on a furnace passing jig which is held by a glass fiber board or a synthetic stone and fixed, then the furnace passing jig is clamped on a guide rail of the chip mounter, reflow soldering is needed to pass through the furnace passing jig, the temperature is 260 ℃, the duration time is 50-90 seconds, and therefore the flexible FPC flat cable is high-temperature resistant and does not deform. The process can achieve the effect of pasting the chip on the hard PCB, has high chip pasting efficiency and reliable welding of devices, and can not cause the situations of displacement, tombstoning and the like.
S2 specifically, the magnetic head is placed on a welding jig according to a specified direction, then the hole in the FPC board after mounting is aligned with the magnetic head contact pin, the FPC board is pressed to be flat, welding is carried out through the electric soldering iron, 7 points are welded in total, the welding temperature is 350 ℃, the duration is 2-3 seconds, and the condition that a tin point and/or a cold joint is/are completely welded is guaranteed.
Because the magnetic head face is the cambered surface, lead to not smooth being unfavorable for the welding, so need make the tool and put the magnetic head to the tool internal fixation, weld again after FPC soft board is set level simultaneously, guarantee welding speed and quality.
S3 specifically, the welded magnetic head assembly is installed on a magnetic head test fixture, a POS machine on the fixture is electrified and started, a magnetic head test interface is entered, the card is continuously swiped forward and backward for 5 times, and the success rate is indicated to be 100% and the test is passed.
Although the magnetic head supplier has full inspection before leaving the factory, the IQC can be subjected to spot inspection after the goods are received by the factory, and the magnetic head can be guaranteed to be a good product before welding, the magnetic head can be failed due to overlong time during welding, or an FPC board is poorly welded during surface mounting, or the functional failure of the magnetic head assembly can be caused due to the poor decoding chip. Through this tool test, can guarantee that the magnetic head subassembly is the yields before the encapsulating, if just discover badly after the encapsulating, tear open again this moment and will lead to the material to scrap, because the encapsulating purpose just prevents to unpack apart the detection very easily, this can certainly lead to a large amount of material losses, the cost is increased.
S4 concretely, silicone rubber is filled into a magnetic head cavity of the magnetic head assembly by using a glue dispenser.
The traditional method is that the point is removed to the point by hand, but because manual control's gluey volume is non-uniform, inhomogeneous, and inefficiency moreover, so adopt the mode of point gum machine to carry out the point and glue, replace artifical promotion efficiency, improve the product uniformity, reduce the waste of material.
In S4, the amount of silicone rubber packed into the head cavity of the head assembly is: 0.3ml
And the glue is quantitatively poured by adopting a glue dispenser, so that the product consistency is improved, and 0.3ml is the minimum amount just filling the cavity.
S5, specifically, placing the dispensed magnetic head assembly in a high-temperature box with the temperature of 120 ℃, keeping for 20 minutes, and taking out to obtain the complete magnetic head assembly.
The method can be used for quickly solidifying and reducing the waiting time of production, and the accessory can be operated along with the assembly line without producing the magnetic head assembly in advance.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Firstly, pasting a magnetic head FPC board according to a BOM list, fixing the FTC flexible board by adopting a jig made of a glass fiber board or a synthetic stone during pasting, performing reflow soldering after pasting, heating at 260 ℃, carrying out the whole heating for 60 seconds, inspecting through AOI after heating, and detecting defects such as insufficient soldering, false soldering, short circuit, stele erection, missing parts and the like.
And (3) obtaining a semi-finished product of the decoding chip board after mounting, welding the magnetic head and the PCB decoding board through a welding jig, setting the temperature of the electric iron to be 350 ℃, welding 7 points in total, wherein the welding time of each point is 2-3 seconds, and cleaning the welding position by using board washing water after welding is finished to finally obtain the magnetic head assembly.
And (3) performing function test on the magnetic head assembly by using the magnetic head function test fixture, mounting the welded magnetic head assembly on the magnetic head test fixture, electrifying and starting a POS machine on the fixture, entering a magnetic head test interface, continuously swiping the card in the forward and reverse directions for 5 times, and prompting that the success rate is 100% to pass.
And (5) pouring 0.3ml of glue into the magnetic head assembly passing the test by using a glue dispenser.
And then the magnetic head assembly after the glue pouring is placed at 120 ℃ for 20 minutes, so that the silicon rubber is solidified.
And finally, installing the encapsulated magnetic head assembly into a POS machine.
After solidification, simulation tests are carried out on the common sealing effect, the aging resistance and the like, the effects the same as those of the A/B adhesive can be achieved, the whole production cost is reduced by 10-15%, and the cost is greatly saved.
Comparative example 1
Filling by adopting common A/B glue, wherein the weight ratio of the A/B glue to the B/A glue is 4:1 (normal temperature), stirring for 5-10 minutes to uniformly mix, dispensing with a dispenser with the glue amount of 0.3ml, and standing at normal temperature for 48 hours after filling and then solidifying. The sealing performance and the aging resistance can reach the expected result, the color of the A/B glue is black after solidification, and the internal structure of the magnetic head can not be seen to meet the requirement. The production cost of the magnetic head component of the proposal is 3 yuan/pcs
Comparative example 2
Filling with common 502 glue, dispensing with a dispenser at normal temperature (normal temperature) to give 0.3ml of glue, standing at normal temperature of 25 deg.C after filling, and solidifying within 10-25 s. The sealing performance and the aging resistance can achieve the expected results, but the 502 glue is white and transparent, the internal structure of the magnetic head can not meet the safety requirement, and the production cost of the magnetic head component is 2.8 yuan/pcs.
Comparative example 3
Filling with hot melt adhesive, dispensing with a dispenser (temperature 280 deg.C) with a glue amount of 0.3ml, standing at normal temperature of 25 deg.C after filling, and solidifying within 10 min. The sealing performance of the hot melt adhesive can achieve the expected effect, but the aging resistance of the hot melt adhesive is very poor and the hot melt adhesive is easily tilted, meanwhile, the hot melt adhesive is white and transparent, the internal structure of the magnetic head can be seen, the safety requirement is not met, and the production cost of the magnetic head assembly is 2.5 yuan/pcs.
Comparative example 4
The Kafter silicone rubber is adopted for filling, glue dispensing is carried out by a glue dispenser (heating is not needed), the glue amount is 0.3ml, and after filling, a high-temperature box is placed at 120 ℃ for 20 minutes for solidification. The single-component silicon rubber has the advantages that the sealing property and the aging resistance can achieve the expected effect, meanwhile, the hot melt adhesive is white and milky and opaque, the internal structure of the magnetic head cannot meet the safety requirement, and the production cost of the magnetic head assembly is 2.55 yuan/pcs.
By adopting the technical scheme disclosed by the invention, the following beneficial effects are obtained: the method for realizing the magnetic head anti-detection provided by the embodiment of the invention adopts the quantitative single-component low-temperature thermal quick-curing type silicon rubber to replace AB glue used in the prior art, and on the basis of ensuring the same sealing effect, the silicon rubber does not need to be mixed and prepared on site before use, so the operation process is simpler, the silicon rubber has no requirement on the use time, in addition, the solidification can be realized in a short time at a lower temperature, the process requirement is greatly reduced, the working hours are shortened, and the cost of the magnetic head anti-detection realizing process is greatly reduced, and compared with the cost of using the AB glue in the prior art, the cost is reduced by 10-15%. In addition, the silicon rubber has the characteristics of moisture resistance, aging resistance, electric insulation, high solidification speed, difficulty in melting after solidification and the like, so that the obtained magnetic head has a better aging resistance effect and can be used for 7 years without being influenced.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and improvements can be made without departing from the principle of the present invention, and such modifications and improvements should also be considered within the scope of the present invention.
Claims (6)
1. A method for realizing magnetic head anti-detection is characterized by comprising the following steps:
s1, pasting the magnetic head PCB, manufacturing a jig by adopting a glass fiber board or a synthetic stone material, fixing the FPC on the jig, and pasting the decoding chip and the peripheral circuit on the FPC flexible flat cable by SMT; obtaining a surface mounted magnetic head PCB;
s2, welding the PCB of the patch magnetic head and the PCB decoding board to obtain a magnetic head assembly;
s3, performing functional test on the magnetic head assembly;
s4, filling a quantitative single-component low-temperature heat quick-curing type silicon rubber into a magnetic head cavity of the magnetic head assembly to obtain a filled silicon rubber magnetic head assembly;
and S5, keeping the filled silicon rubber magnetic head assembly at the temperature of 120 ℃ for 20 minutes to solidify the silicon rubber.
2. The magnetic head probing prevention realization method of claim 1, wherein S2 is implemented by first placing the magnetic head on a soldering fixture in a predetermined direction, then aligning the holes on the FPC board after mounting with the magnetic head pins, pressing the holes flat, soldering with an electro-chrome iron for a total of 7 points, at a soldering temperature of 350 ℃ for a duration of 2-3 seconds, to ensure complete soldering without tin tips and/or cold solder joints.
3. The method for implementing magnetic head anti-probing as claimed in claim 2, wherein S3 is specifically that the soldered magnetic head assembly is mounted on a magnetic head test fixture, a POS machine on the fixture is powered on, a magnetic head test interface is entered, and the card is swiped forward and backward for 5 times continuously, and the success rate is indicated as 100% passing the test.
4. The method of claim 3, wherein S4 is embodied by potting silicone rubber into a head cavity of the head assembly using a dispenser.
5. The head protection method of claim 4, wherein the amount of the silicon rubber potted in the head cavity of the head assembly is 0.3ml in S4.
6. The method of claim 5, wherein S5 is that the dispensed head assembly is placed in a high temperature box at 120 ℃ and kept for 20 minutes before being taken out to obtain a complete head assembly.
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| CN201810443834.8A CN108629926B (en) | 2018-05-10 | 2018-05-10 | Magnetic head anti-detection implementation method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102663852A (en) * | 2012-04-27 | 2012-09-12 | 福建联迪商用设备有限公司 | Magnetic head protecting mechanism and point-of-sale (POS) machine with same |
| CN203232511U (en) * | 2013-04-25 | 2013-10-09 | 福建联迪商用设备有限公司 | Magnetic head waterproof and dustproof structure of POS machine |
| CN204029069U (en) * | 2014-08-21 | 2014-12-17 | 青岛海信智能商用系统有限公司 | Magnetic head, module of swiping the card and payment devices |
| CN204946021U (en) * | 2015-09-21 | 2016-01-06 | 艾体威尔电子技术(北京)有限公司 | A kind of pos machine magnetic head signal protective device |
| CN206039744U (en) * | 2016-08-23 | 2017-03-22 | 深圳市新国都支付技术有限公司 | Magnetic head coil signal protection system, take POS machine of magnetic head coil signal protection system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032105A (en) * | 1983-08-02 | 1985-02-19 | Canon Electronics Inc | Magnetic head |
| CN204029372U (en) * | 2014-04-10 | 2014-12-17 | 太阳神(珠海)电子有限公司 | A kind of Novel information protection head stack and magnetic reader thereof |
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2018
- 2018-05-10 CN CN201810443834.8A patent/CN108629926B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102663852A (en) * | 2012-04-27 | 2012-09-12 | 福建联迪商用设备有限公司 | Magnetic head protecting mechanism and point-of-sale (POS) machine with same |
| CN203232511U (en) * | 2013-04-25 | 2013-10-09 | 福建联迪商用设备有限公司 | Magnetic head waterproof and dustproof structure of POS machine |
| CN204029069U (en) * | 2014-08-21 | 2014-12-17 | 青岛海信智能商用系统有限公司 | Magnetic head, module of swiping the card and payment devices |
| CN204946021U (en) * | 2015-09-21 | 2016-01-06 | 艾体威尔电子技术(北京)有限公司 | A kind of pos machine magnetic head signal protective device |
| CN206039744U (en) * | 2016-08-23 | 2017-03-22 | 深圳市新国都支付技术有限公司 | Magnetic head coil signal protection system, take POS machine of magnetic head coil signal protection system |
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| CN108629926A (en) | 2018-10-09 |
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