CN109799660A - Liquid crystal display device - Google Patents
Liquid crystal display device Download PDFInfo
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- CN109799660A CN109799660A CN201910212470.7A CN201910212470A CN109799660A CN 109799660 A CN109799660 A CN 109799660A CN 201910212470 A CN201910212470 A CN 201910212470A CN 109799660 A CN109799660 A CN 109799660A
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- pad
- liquid crystal
- crystal display
- glue
- line
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Abstract
The present invention provides a kind of liquid crystal display devices, the liquid crystal display device includes liquid crystal display panel, be connected the first flexible circuit board with the liquid crystal display panel, the backlight of backlight is provided for the liquid crystal display panel, the second flexible circuit board being connected with the backlight, and conducting resinl, first flexible circuit board includes the first pad, second flexible circuit board includes the second pad, first pad described in the conducting resinl electrical communication and second pad, the conducting resinl includes the first glue-line containing conducting particles and the second glue-line without containing conducting particles, first glue-line is towards first pad, second glue-line is towards second pad, second pad penetrates second glue-line, and it is electrically connected by the conducting particles in first glue-line with first pad.Liquid crystal display device provided by the invention, pad Joining Technology is simple, and connection quality is good.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of liquid crystal display devices.
Background technique
Display device is always the important component of various terminal equipment (such as mobile phone, computer), wherein liquid crystal display
Low energy consumption because of it for device, radiationless, display effect is good and the advantages such as frivolous, play an important role in field of display devices.
Liquid crystal display device provides white light using backlight, and is obtained by the light image-forming principle of liquid crystal display panel abundant more
Color display picture.Backlight provides power supply by external flexible circuit board for it, it is therefore desirable to by backlight and flexible electrical
Road plate is electrically connected, and the prior art is will be the pad and flexible circuit board of backlight using the method for thermal weld (such as soldering)
Together, but this method can generate higher welding temperature to pad solder, make to the pad and circuit board of welding areas adjacent
At thermal damage, such as generate protrusion or contraction bad phenomenon.In addition, the residue (such as welding slag) generated after welding also will affect
The electric connection effect of backlight and flexible circuit board, seriously affects product quality, causes yield lower.
Summary of the invention
In order to solve above-mentioned deficiency in the prior art, the present invention is intended to provide a kind of liquid crystal display device, passes through optimization
The connection type of backlight and flexible circuit board improves product yield, Improving The Quality of Products.
To achieve the goals above, the present invention provides a kind of liquid crystal display devices, comprising:
Liquid crystal display panel；
First flexible circuit board is electrically connected with the liquid crystal display panel, and the flexible circuit board includes the first pad；
Backlight, is set to the liquid crystal display panel back side, provides backlight for the liquid crystal display panel；
Second flexible circuit board is electrically connected with the backlight, and second flexible circuit board includes the second pad；With
And
Conducting resinl is pasted between first pad and second pad, makes first pad and described second
Pad electrically conducts；
The conducting resinl includes the first glue-line and the second glue-line, and first glue-line is towards first pad, and described the
For two glue-lines towards second pad, first glue-line includes conducting particles, and second glue-line does not include conducting particles, institute
It states the second pad and penetrates second glue-line, and electrically connected by the conducting particles in first glue-line with first pad
It connects.
An embodiment according to the present invention, the conducting resinl with a thickness of 50~200 microns.
An embodiment according to the present invention, the conducting resinl with a thickness of 100 microns.
An embodiment according to the present invention, the thickness of first glue-line are 1~3 times of the thickness of second glue-line.
An embodiment according to the present invention, the thickness of first glue-line are 2 times of the thickness of second glue-line.
An embodiment according to the present invention, the conducting particles includes the insulating layer and internal conductive particle of outer layer, described
After conducting particles is squeezed, the conductive particle can protrude the insulating layer.
An embodiment according to the present invention, the material of the conductive particle include one of iron, cobalt and nickel or a variety of.
An embodiment according to the present invention, the material of the insulating layer are insulating resin.
An embodiment according to the present invention, the conducting particles are ball-type or spheroid shape particle.
An embodiment according to the present invention, by first pad, second pad and institute by the way of pressure pressing
State conducting resinl pressing.
The beneficial effects of the present invention are: the first pad and the second pad are electrically connected by the present invention using conducting resinl, protecting
While card electrically conducts, when avoiding using thermal weld the first pad of connection and the second pad, structure near the pad of appearance
Protrusion, contraction etc. are bad, simplify Joining Technology, improve the yield of product；In addition, the present invention is used with double-layer structure
Conducting resinl can prevent the conducting particles in conducting resinl to be exposed to air after completing the connection of the first pad and the second pad
In, and then avoid the conducting resinl because caused by conducting particles is corroded in air and fail.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the main view of liquid crystal display device provided in an embodiment of the present invention；
Fig. 2 is conductive adhesive structure schematic diagram provided in an embodiment of the present invention；
Fig. 3 is pad attachment structure schematic diagram provided in an embodiment of the present invention；
Fig. 4 is pad provided in an embodiment of the present invention and the structural schematic diagram before conducting resinl pressing；
Fig. 5 A is the structural schematic diagram before conducting particles provided in an embodiment of the present invention is squeezed；
Fig. 5 B is the structural schematic diagram after conducting particles provided in an embodiment of the present invention is squeezed；
Fig. 6 is the bottom view of liquid crystal display device shown in FIG. 1.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The embodiment of the present invention provides a kind of liquid crystal display device, including liquid crystal display panel, the first flexible circuit board, backlight,
Second flexible circuit board and conducting resinl, first flexible circuit board pass through the conducting resinl and second flexible circuit
Plate is bonded and electrically conducts, and avoids and connects first flexible circuit board and second flexible electrical using the method for thermal weld
The thermal damage's phenomenon generated when the plate of road, such as flexible circuit board are heated protrusion or contraction；In addition, liquid provided in an embodiment of the present invention
Crystal device, used conducting resinl have double-layer structure, after completing to the connection of flexible circuit board, due to being located at outer layer
Conducting resinl do not contain conducting particles, the conducting particles in inner layer conductive glue can be prevented to be exposed in air, and then avoid
Conducting resinl fails because caused by conducting particles is corroded in air.
The liquid crystal display device that embodiment that the invention will now be described in detail with reference to the accompanying drawings provides:
As shown in Figure 1, being the main view of liquid crystal display device provided in an embodiment of the present invention, the liquid crystal display device packet
It includes: liquid crystal display panel 11, the first flexible circuit board 12, backlight 13, the second flexible circuit board 14 and conducting resinl 15；Described
One flexible circuit board 12 is electrically connected with the liquid crystal display panel 11, and first flexible circuit board 12 includes the first pad 121；Institute
The back side that backlight 13 is set to the liquid crystal display panel 11 is stated, and provides backlight for the liquid crystal display panel 11；It is described
Second flexible circuit board 14 is electrically connected with the backlight 13, and the backlight 13 is obtained by second flexible circuit board 14
Take electric energy to shine, second flexible circuit board 14 includes the second pad 141；The conducting resinl 15 is pasted on first weldering
Between disk 121 and second pad 141, first pad 121 is connected with second pad 141 by the conducting resinl 15
It connects and keeps electrically conducting.The embodiment of the present invention makes first pad 121 and 141 electricity of the second pad using conducting resinl 15
Property connection, relative to being attached using the method for thermal weld to pad, connection behaviour is can be completed in the present invention under normal temperature conditions
Make, thermal damage, and simple process will not be generated to structure near pad, it is easy to accomplish.
Specifically, as shown in Fig. 2, being the structural schematic diagram of conducting resinl 15 provided in an embodiment of the present invention, the conducting resinl
15 include the first glue-line 151 and the second glue-line 152, and first glue-line 151 includes conducting particles 153, second glue-line 152
Not comprising conducting particles.
As shown in figure 3, being pad attachment structure schematic diagram provided in an embodiment of the present invention；First glue-line 151 is close
First pad 121, first pad 121 are embedded in first glue-line 151；Second glue-line 152 is close to described
Second pad 141, second pad 141 is embedded in and prominent second glue-line 152；First pad 121 and described the
Two pads 141 keep being electrically connected by the conducting particles 153 in second glue-line 151.
As shown in figure 4, first pad 121 and second pad 141 are pressed together on by the way of pressure pressing
Together, specifically, after the alignment of first pad 121, the conducting resinl 15 and second pad 141 is placed, described
The one side that first pad 121 and second pad 141 deviate from the conducting resinl 15 applies pressure simultaneously, makes first pad
121 and second pad 141 be embedded in the conducting resinl 15, first pad 121 is with second pad 141 described
It is fixedly connected under the bonding effect of conducting resinl 15, and is electrically connected by the conducting particles 153 in the conducting resinl 15, most
End form is at structure as shown in Figure 3.
In embodiments of the present invention, as shown in Figure 3 and Figure 6, wherein Fig. 6 is looking up for liquid crystal display device shown in FIG. 1
Figure, 12 size of the first flexible circuit board is larger, and first pad 121 occupies one of first flexible circuit board 12
Subregion；Second flexible circuit board, 14 size is smaller, prominent second flexible circuit board 14 of second pad 141；
When connecting first pad 121 and second pad 141 using the conducting resinl 15, in order to guarantee connection sufficiently, meeting
The conducting resinl 15 is sized to the size greater than second pad 141.Therefore, in second pad 141
Side has the part exposure of conducting resinl 15 in air；The conducting resinl 15 provided in an embodiment of the present invention, close to institute
Stating 141 side of the second pad has the second glue-line 152 not comprising conducting particles, can prevent the conduction in the conducting resinl 15
Particle 153 is exposed in air；If conducting particles is directly exposed in air, electrochemical corrosion can occur with air, cause to lead
Electric glue blistering, reduces the conductive capability of conducting resinl, therefore, the conducting resinl 15 that the embodiment of the present invention uses can be to avoid above-mentioned wind
Danger.
Specifically, the conducting resinl 15 with a thickness of 50~200 microns, it is preferable that the conducting resinl 15 with a thickness of 100
Micron.
Specifically, the thickness of first glue-line 151 is 1~3 times of 152 thickness of the second glue-line, it is preferable that described
The thickness of first glue-line 151 is 2 times of 152 thickness of the second glue-line.
As fig. 5 a and fig. 5b, the knot before and after being squeezed for the conducting particles in conducting resinl provided in an embodiment of the present invention
Structure schematic diagram, the conducting particles 153 includes the insulating layer 1531 and internal conductive particle 1532 of outer layer, specifically, described
The material of insulating layer 1531 is insulating resin, and the material of the conductive particle 1532 is one of iron, cobalt and nickel or a variety of,
The hardness of the conductive particle 1532 is greater than the hardness of the insulating layer 1531.The conducting particles 153 is before being squeezed, institute
The fully wrapped around conductive particle 1532 of insulating layer 1531 is stated, therefore the conducting particles 153 before extruding does not play conductive work
With；The conducting particles 153 is after being squeezed, because the hardness of the conductive particle 1532 is greater than the insulating layer 1531
Hardness, so in upper and lower pressed end, the prominent insulating layer 1531 of the conductive particle 1532, to play electric action；
The conducting particles 153 not being squeezed, because the conductive particle 1532 is wrapped up by the insulating layer 1531 without playing
Electric action.
As shown in fig. 6, being the bottom view of liquid crystal display device shown in FIG. 1.First flexible circuit board 12 also wraps
Element region 122 is included, the element region 122 is the processing of circuit unit on first flexible circuit board；First flexible electrical
Road plate 12 connects the liquid crystal display panel 11 by cabling 123, and first flexible circuit board 12 connects electricity by jag 124
Source；It is supplied to the electric energy of the liquid crystal display device through the jag 124, after the element region 122 processing, passes through respectively
Second flexible circuit board 14 and the cabling 123 are assigned to the backlight 13 and the liquid crystal display panel 11.
In conclusion liquid crystal display device provided in an embodiment of the present invention, by conducting resinl by first pad and institute
The electric connection of the second pad is stated, while guaranteeing to electrically conduct, is avoided when being attached using the method for thermal weld to it,
The pad of appearance structural protrusions, contraction nearby etc. is bad, and simplifies Joining Technology, improves product yield；In addition, this hair
Bright embodiment uses the conducting resinl with double-layer structure, can be with after completing first pad and connecting with second pad
It prevents the conducting particles in conducting resinl to be exposed in air, and then avoids because caused by conducting particles is corroded in air
The risk of conducting resinl failure.
It should be noted that, although the present invention is disclosed above with specific embodiment, but above-described embodiment is not to limit
The present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, thus protection scope of the present invention be subject to claim define hair range.
Claims (10)
1. a kind of liquid crystal display device characterized by comprising
Liquid crystal display panel；
First flexible circuit board is electrically connected with the liquid crystal display panel, and first flexible circuit board includes the first pad；
Backlight, is set to the liquid crystal display panel back side, provides backlight for the liquid crystal display panel；
Second flexible circuit board is electrically connected with the backlight, and second flexible circuit board includes the second pad；And
Conducting resinl is pasted between first pad and second pad, makes first pad and second pad
It electrically conducts；
The conducting resinl includes the first glue-line and the second glue-line, and first glue-line is towards first pad, second glue
For layer towards second pad, first glue-line includes conducting particles, and second glue-line does not include conducting particles, and described the
Two pads penetrate second glue-line, and are electrically connected by the conducting particles in first glue-line with first pad.
2. liquid crystal display device according to claim 1, which is characterized in that the conducting resinl it is micro- with a thickness of 50~200
Rice.
3. liquid crystal display device according to claim 2, which is characterized in that the conducting resinl with a thickness of 100 microns.
4. liquid crystal display device according to claim 1, which is characterized in that the thickness of first glue-line is described second
1~3 times of the thickness of glue-line.
5. liquid crystal display device according to claim 1, which is characterized in that the thickness of first glue-line is described second
2 times of the thickness of glue-line.
6. liquid crystal display device according to claim 1, which is characterized in that the conducting particles includes the insulating layer of outer layer
With internal conductive particle, after the conducting particles is squeezed, the conductive particle can protrude the insulating layer.
7. liquid crystal display device according to claim 6, which is characterized in that the material of the conductive particle include iron, cobalt,
With one of nickel or a variety of.
8. liquid crystal display device according to claim 6, which is characterized in that the material of the insulating layer is insulating resin.
9. liquid crystal display device according to claim 1, which is characterized in that the conducting particles is ball-type or spheroid shape grain
Son.
10. liquid crystal display device according to claim 1, which is characterized in that by described the by the way of pressure pressing
One pad, second pad and the conducting resinl press.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910212470.7A CN109799660A (en) | 2019-03-20 | 2019-03-20 | Liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910212470.7A CN109799660A (en) | 2019-03-20 | 2019-03-20 | Liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109799660A true CN109799660A (en) | 2019-05-24 |
Family
ID=66563829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910212470.7A Pending CN109799660A (en) | 2019-03-20 | 2019-03-20 | Liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109799660A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110938382A (en) * | 2019-11-25 | 2020-03-31 | 维沃移动通信有限公司 | Conductive adhesive film, display module and electronic equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0400953A2 (en) * | 1989-05-31 | 1990-12-05 | Seiko Epson Corporation | Input device |
| JPH10321758A (en) * | 1997-05-23 | 1998-12-04 | Nec Kansai Ltd | Semiconductor device |
| CN2750339Y (en) * | 2004-04-06 | 2006-01-04 | 广辉电子股份有限公司 | Conducting resin material with laminated structure |
| CN1996132A (en) * | 2006-01-04 | 2007-07-11 | Ls电线有限公司 | Multi-layered anisotropic conductive film |
| CN102789074A (en) * | 2011-05-16 | 2012-11-21 | Nlt科技股份有限公司 | Connecting structure and a display device with said connecting structure |
| CN103903683A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Anisotropic conductive film and preparation method thereof |
| CN105118384A (en) * | 2015-09-28 | 2015-12-02 | 武汉华星光电技术有限公司 | Display device and display panel thereof |
| US9653425B2 (en) * | 2015-08-26 | 2017-05-16 | Apple Inc. | Anisotropic conductive film structures |
| CN107342117A (en) * | 2017-07-18 | 2017-11-10 | 深圳市华星光电技术有限公司 | Anisotropic conductive film and preparation method thereof |
-
2019
- 2019-03-20 CN CN201910212470.7A patent/CN109799660A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0400953A2 (en) * | 1989-05-31 | 1990-12-05 | Seiko Epson Corporation | Input device |
| JPH10321758A (en) * | 1997-05-23 | 1998-12-04 | Nec Kansai Ltd | Semiconductor device |
| CN2750339Y (en) * | 2004-04-06 | 2006-01-04 | 广辉电子股份有限公司 | Conducting resin material with laminated structure |
| CN1996132A (en) * | 2006-01-04 | 2007-07-11 | Ls电线有限公司 | Multi-layered anisotropic conductive film |
| CN102789074A (en) * | 2011-05-16 | 2012-11-21 | Nlt科技股份有限公司 | Connecting structure and a display device with said connecting structure |
| CN103903683A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Anisotropic conductive film and preparation method thereof |
| US9653425B2 (en) * | 2015-08-26 | 2017-05-16 | Apple Inc. | Anisotropic conductive film structures |
| CN105118384A (en) * | 2015-09-28 | 2015-12-02 | 武汉华星光电技术有限公司 | Display device and display panel thereof |
| CN107342117A (en) * | 2017-07-18 | 2017-11-10 | 深圳市华星光电技术有限公司 | Anisotropic conductive film and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110938382A (en) * | 2019-11-25 | 2020-03-31 | 维沃移动通信有限公司 | Conductive adhesive film, display module and electronic equipment |
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Application publication date: 20190524 |