CN2750339Y - Conducting resin material with laminated structure - Google Patents
Conducting resin material with laminated structure Download PDFInfo
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- CN2750339Y CN2750339Y CN 200420036455 CN200420036455U CN2750339Y CN 2750339 Y CN2750339 Y CN 2750339Y CN 200420036455 CN200420036455 CN 200420036455 CN 200420036455 U CN200420036455 U CN 200420036455U CN 2750339 Y CN2750339 Y CN 2750339Y
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- layer structure
- conducting
- conducting particles
- conducting resinl
- particles
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Abstract
The utility model provides conducting resin materials with a laminated structure. The surface of sheet-shaped high molecular resin materials is spread with conducting particles. After driving components and the terminals on a glass substrate are driven to press and connect, succession impedance of terminal engagement can be reduced. Thereby, the utility model can realize the purpose of super micro-fine space adhesion.
Description
Technical field
The utility model relates to a kind of conducting resinl material of layer structure; Relate in particular to a kind of at the sheet macromolecule glue material surface distribution stratiform conducting resinl material that conducting particles constituted.
Background technology
The general conductive material of conductive particle (spherical particle) that adopts of the then part of the face glass of conventional liquid crystal and driven unit is as conducting, shown in Figure 1A to 1C, its way is after coating above the terminal 2 of LCD glass substrate 1 or attaching anisotropy conductive material 3, metal terminal 5 on the driven unit 4 engages with terminal 2 contrapositions on the LCD glass substrate 1 again, finishes conducting.Above-mentioned conduct generally to produce in Z-direction conduct but insulate in the X-Y plane direction.
The general conductive material spherical conducting particles 31 of uniformly dispersing in thermoplasticity or thermosetting polymer glue material 3 that is used for above-mentioned purpose, shown in Fig. 2 A, and, must apply extra electric field and magnetic field so that realize the even dispersion of conducting particles 31 in macromolecule glue material 3 in order to make conducting particles 31 be dispersed evenly in the macromolecule glue material 3 and to avoid these conducting particless 31 to reunite.Relatively, in order to reach higher accuracy, need the equipment of control accuracy and will increase manufacturing cost.
Moreover, behind the terminal 5 that uses these anisotropy conductive materials in order to terminal on the glass substrate 1 of adhering liquid crystal display 2 and driven unit 4, will produce by these conducting particless 31 between terminal and conduct (Z-direction conducts), shown in Fig. 2 B.But the conducting particles 31 that is dispersed in the spacing (pitch) of terminal and terminal may will cause short circuit (conducting of the X-Y direction that causes not expected) because of extruding makes 31 of conducting particless produce to contact, shown in the part that Fig. 2 B is labeled as A.
More and more high and more and more hour along with the resolution requirement of flat-panel screens to dimensional requirement, the engaging spacing (pitch) and will require more and more for a short time of the terminal 2 on the terminal 5 of driven unit 4 and the glass substrate 1 then, the impedance that continues after terminal engages simultaneously also can be followed area with terminal and diminish and improve.And traditional conducting resinl material is in order to satisfy the requirement of fine pitch, when spacing more and more hour, relatively the size of conducting particles also can reduce.The conducting particles size decreases will be except improving cost of manufacture and increasing the difficulty of particle manufacturing, and the surfaceness of terminal also can limit the development of particle size.When particle size changes less than the terminal surfaces roughness, will cause the bad problem that conducts.After the density of conducting particles 31 increases,, can't satisfy the demand of fine pitch adhesion again though the impedance that continues can reduce.Therefore be subject to above-mentioned factor, traditional conducting resinl material all is applied to spacing greater than in 50 microns the application.
In view of the above, need provide a kind of conducting resinl material, this conducting resinl material can overcome above-mentioned disappearance and be fit to be applied to the LCD terminal and engages with little spacing between the driven unit terminal.
Summary of the invention
Fundamental purpose of the present utility model provides a kind of conducting resinl material of layer structure, is scattered the layer high molecule glue material of conducting particles by the surface and forms, and can reduce the conducting particles density of unit area, and meet the requirement that little spacing engages.
Another purpose of the present utility model provides a kind of conducting resinl material of layer structure, on macromolecule glue material surface, scatter conducting particles, can be easy to control the lip-deep conducting particles distribution density of macromolecule glue material, need not extra electric field and magnetic field and control the distribution of particles uniformity coefficient, can save manufacturing cost.
For reaching above-mentioned purpose, the utility model provides a kind of conducting resinl material of layer structure, engaging between the terminal that can be used for driven unit and the terminal of glass substrate.The conducting resinl material of layer structure of the present utility model is made of the macromolecule glue material that is scattered with conducting particles on its surface of one deck at least.The utility model is owing to utilize the surface of stratiform macromolecule glue material to scatter conducting particles, therefore the unit area conducting particles density on each floor height molecular glue material surface can reduce, and utilize the macromolecule glue material to isolate each other between contained conducting particles in the other parts conducting resinl material beyond terminal engages, therefore can avoid producing the circuit defect that terminal is caused because of contact between conducting particles in the other parts macromolecule glue material beyond engaging.Moreover, therefore because of unit area conducting particles density reduces, can reduce engaging spacing (pitch), make the conducting resinl material of the utility model layer structure can be applicable to the field of liquid crystal of ultra tiny joint spacing.
Description of drawings
Below by most preferred embodiment and accompanying drawing the utility model is elaborated, in the accompanying drawing:
Figure 1A to 1C shows each flow process schematic cross-section that tradition utilizes the conducting resinl material that glass substrate is engaged with the terminal of driven unit;
Fig. 2 A to 2B shows that the conventional conductive glue material that is distributed in the conducting resinl material with conductive particle carries out each flow process schematic cross-section that glass substrate engages with the terminal of driven unit;
Fig. 3 A to 3B shows that one first specific embodiment with the conducting resinl material of the utility model layer structure carries out each flow process schematic cross-section that terminal engages;
Fig. 3 C is the vertical view of Fig. 3 B; And
Fig. 4 A to 4B shows that one second specific embodiment with the conducting resinl material of the utility model layer structure carries out each flow process schematic cross-section that terminal engages; And
Fig. 4 C is the vertical view of the utility model Fig. 4 B.
The Reference numeral of main element:
1 glass substrate, 2,5 terminals
3 conducting resinl materials, 31 conducting particless
32 sheet macromolecule glue materials, 4 driven units
Embodiment
The utility model provides a kind of conducting resinl material of layer structure, be on macromolecule glue material surface, for example thermoplasticity or thermosetting polymer glue material surface, scatter conducting particles, thereby when be used for terminal on driven unit and the glass substrate pressing continue after, the impedance that continues that terminal engages can reduce, and can ultra tiny spacing realize the purpose of adhesion.
According to the conducting resinl material of layer structure of the present utility model, particularly, on thermoplasticity or thermosetting polymer sheet glue material two surfaces, scatter conducting particles, and can control easily the lip-deep conducting particles distribution density of glue material with and dispersed homogeneous degree.And because conducting particles is distributed on glue material two surfaces, therefore compared to tradition conducting particles is distributed in conducting resinl material in the macromolecule glue material, conducting particles number (conducting particles density) in the single lip-deep unit area of the conducting resinl material of the utility model layer structure can reduce, but after pressing joint, the conducting particles number that makes the abutting end subarea because of the pressing between two surfaces is that the population summation of scattering is gone up on glue material two surfaces, and can reach and the purpose that conducts of utilizing the desire realization of conventional conductive glue material institute.
In addition, because in the conducting resinl material of layer structure of the present utility model, utilize the macromolecule glue material to isolate each other between contained conducting particles in the conducting particles density minimizing of unit area and the other parts conducting resinl material beyond terminal engages, therefore can avoid producing the circuit defect that shown in Fig. 2 B, is caused because of contact between A conducting particles partly.
The conducting resinl material of layer structure of the present utility model can be single layer structure also can be sandwich construction.When the conducting resinl material becomes sandwich construction, conducting particles can be scattered on each layer body structure surface, can further reduce the conducting particles number (that is conducting particles density) of unit area, the terminal of driven unit and the terminal on the glass substrate will be diminished apart from (pitch) between the two.If the layer structure number of plies is many more, under the identical situation of the conducting particles number of unit volume, the unit area conducting particles number of each individual layer will be more little, relatively can reduce described spacing more.Relation between the described spacing and the layer structure number of plies can following formulate:
P=T+S
A=S/(2n-1)+T
n=Th/(2*B)
P=spacing (pitch) wherein;
T=terminal (lead) width (lead wide);
Interval between S=terminal and terminal (space);
A=processing procedure ability (Ability of production);
The n=layer structure number of plies (number of lamination layers);
Th=conducting resinl material thickness (thickness of conductive material); And
B=conducting particles diameter (diameter of conductive particle).
Conducting resinl material according to layer structure of the present utility model, though the layer structure number is many more, can make pitch smaller, but because the gap between glass substrate and driven unit is certain, therefore heterogeneous more each layer thickness over the ground of the number of plies is also more little, then will make the insulation impedance deficiency between layer and the layer, the probability that relatively is short-circuited also will raise.The conducting resinl material number of plies of layer structure of the present utility model is preferably 1 to 20 layer in view of the above, with 1 to 10 layer better, with 1 to 5 layer of the best.
When the conducting resinl material of layer structure of the present utility model uses layer structure more than 2 layers, only need mutually at layer and layer that the dispersed electro-conductive particle get final product at least one laminar surface on the interface of lamination (lamination).
In addition, in the conducting resinl material of layer structure of the present utility model, conducting particles can be stochastic distribution in the distribution on glue material surface, need not its orientation of special provision.Above-mentioned stochastic distribution will more can realize the more purpose of minuteness space adhesion.
Owing to can further reduce the unit area density of conducting particles in the conducting resinl material, and can be applicable to even be lower than the field of liquid crystal of the ultra tiny joint spacing of 25 micron pitch according to the conducting resinl material of layer structure of the present utility model.
Used conducting particles can use the anti-metal material of low resistance in the conducting resinl material of layer structure of the present utility model, can use to comprise for example materials such as gold, silver, copper, aluminium, nickel, stainless steel, also can use materials such as carbon.The shape of described conducting particles can be Any shape, comprises sphere, circle, ellipse, flat, sheet, shaft-like, fibrous even can be irregular.
Compared to the conducting particles of other kind shape, when being shaped as of conducting particles is fibrous or shaft-like, because through pressing the back of continuing to be linear contact, so the impedance that continues is lower and preferable.
When desiring the mat metal and form fibrous conducting particles, can adopt the conventional art shape that earlier metal laminated, re-use cutting technology and be processed into thread; Maybe can adopt high-pressure steam to send the fine liquid slag that is generated of system forth, make metal fibre molten state spray silk technology or as metal fibre forming technique (referring to USP 6074752) that Bekaert proposed or Republic of China's patent announcement numbers 511406 as described in metal fibre make technology or with how meter fibre technology etc. makes.
The size of these conducting particless can several microns or even the scope of rice how, its length breadth ratio (width/length) can be between 0.2 to 1.When length breadth ratio less than 0.2 the time, will make the diameter of conducting particles change less than electrode surface roughness, will cause then bad, effectively conducting of signal.And when length breadth ratio equals 1, conducting particles is spherical, it is on being dispersed in the macromolecule glue material time, may and then move because softening macromolecule glue material flows, and cause conducting particles problem of uneven distribution on the terminal surface, but the problems referred to above can be avoided because the macromolecule glue material itself has a little stickability.With regard to satisfying minuteness space and Low ESR simultaneously, the conducting resinl material of layer structure of the present utility model is good to use length breadth ratio to be not equal to 1 anisotropy conducting particles, and is especially better with the conducting particles that uses fibrous particle; Even because be fibrous conducting particles in that the macromolecule glue material is softening when flowing, also only can cause torsional deformation and unlikely loss causes the problems such as conducting particles deficiency of terminal surface.
In addition, the conducting resinl material of layer structure of the present utility model is used between terminal on the liquid crystal glass base and driven unit terminal when bonding, after pressing joint, electric continuation method therebetween is wire adhesion and can reduce the impedance that continues, and be linear proportional relation between spacing and particle density because of continuing, therefore in the conducting resinl material of layer structure of the present utility model the conductive particle number (unit area density) of unit area can be conventional conductive glue material 1/5 to below 1/2, and can reach finer spacing demand.
The utility model will more explain detailedly so that following preferred embodiment cooperation is graphic.
Fig. 3 A-3C is one first embodiment of the conducting resinl material of the utility model layer structure.As shown in Figure 3A, the conducting resinl material 3 of layer structure of the present utility model is made of conducting particles 31 and sheet macromolecule glue material 32, and wherein conducting particles 31 is shaped as fibrous.Conducting particles 31 is dispersed on two surfaces of sheet macromolecule glue material 32.Subsequently with on the conducting resinl material 3 of the layer structure of the present utility model glass substrate 1 with terminal 2 placed on it, then give pressing in the mode of terminal and terminal contraposition with the driven unit 4 that has terminal 5 on it.The conducting particles 31 that is clipped in after the pressing between two-terminal will produce electrical connection (the axial electrical connection of Z-) because pressing and upper and lower terminal 5 and 2 formation contacts, and the conducting particles in the conducting resinl material 3 of the layer structure in the zone beyond two- terminal 5 and 2 engages, then because the separation of macromolecule glue material 32, and do not produce any electrical connection (that is the X-Y direction of principal axis does not produce electrical connection), shown in Fig. 3 B.
Fig. 3 C is the vertical view of Fig. 3 B.Can find out the distribution situation of conducting particles 31 in the conducting resinl material 3 of layer structure of the present utility model by Fig. 3 C.The number of conducting particles 31 promptly equals to be scattered in 32 liang of lip-deep sums of sheet macromolecule glue material.In view of the above, desiring to reach under the conducting particles density of conventional conductive glue material institute desire realization, conducting resinl material 3 according to layer structure of the present utility model, because the zone beyond two- terminal 5 and 2 engages, can less unit area Density Distribution conducting particles 31, therefore can reach the purpose of minuteness space.And because fibrous particle linear continuing after pressing joint, thereby can reach low-impedance purpose.
Fig. 4 A-4C is one second embodiment of the conducting resinl material of the utility model layer structure.Shown in Fig. 4 A, the conducting resinl material 3 of layer structure of the present utility model is made of conducting particles 31 and sheet macromolecule glue material 32, and wherein conducting particles 31 is shaped as fibrous and sheet macromolecule glue material 32 is made of three layers of institute.Conducting particles 31 is dispersed on the surface of each sheet macromolecule glue material 32, and a surface of a slice glue material upward gets final product but the interface of two interlayers only need be dispersed in wherein.Subsequently with on the conducting resinl material 3 of the layer structure of the present utility model glass substrate 1 with terminal 2 placed on it, then give pressing in the mode of terminal and terminal contraposition with the driven unit 4 that has terminal 5 on it.Being clipped in conducting particles 31 between two-terminal after the pressing will form because of pressing and terminal 5 up and down and 2 and contact and produce electrical connection (electrical connection of Z-direction of principal axis), and the conducting particles in the conducting resinl material 3 of the layer structure in the zone beyond two-terminal engages, then do not produce any electrical connection (that is the X-Y direction of principal axis does not produce electrical connection), shown in Fig. 4 B because of the separation of macromolecule glue material 32.
Fig. 4 C is the vertical view of Fig. 4 B.Can find out the distribution situation of conducting particles 31 in the conducting resinl material 3 of layer structure of the present utility model by Fig. 4 C.The number of conducting particles 31 promptly equals to be scattered in these sheet macromolecule glue material 32 each lip-deep sums.And because this specific embodiment utilizes layer high molecule glue material, in view of the above, desiring to reach under the conducting particles density of conventional conductive glue material institute desire realization, conducting resinl material 3 according to layer structure of the present utility model, can be on each surface than the conducting resinl material of single layer structure shown in Figure 3 littler area density distribution conducting particles 31, and, therefore can further reach the more purpose of minuteness space because the zone beyond two- terminal 2 and 5 engages does not produce electrical connection.
Therefore be scattered in conducting resinl material in the macromolecule glue material compared to traditional conducting particles, the conducting resinl material of layer structure of the present utility model is because conducting particles is layered distribution, for example, conducting particles is allocated on two surfaces of stratiform macromolecule glue material, and can reduce the conducting particles number of unit area, and owing to be distributed on the stratiform macromolecule glue material surface, more can be easy to control the conducting particles distribution density on the glue material, do not need to be scattered in as the conventional conductive glue material in the macromolecule glue material distribution consistency degree that must the outer mode that adds electromagnetic field control conducting particles, therefore more can save cost of manufacture as conducting particles.
Moreover, the conducting resinl material of foundation layer structure of the present utility model is owing to utilize the surface of stratiform macromolecule glue material to scatter conducting particles, therefore the conducting particles density of unit area reduces, and isolate by the macromolecule glue material each other between contained conducting particles in the other parts conducting resinl material beyond terminal engages, therefore can avoid producing the circuit defect that terminal is caused because of contact between conducting particles in the other parts macromolecule glue material beyond engaging.And, therefore can reduce engaging spacing (pitch) because of the conducting particles area density reduces.
The utility model is by above-mentioned specific embodiment detailed description in addition, but described specific embodiment is only in order to explanation the utility model and not in order to limit scope of the present utility model, therefore in not breaking away from spirit of the present utility model and scope, know this skill person and can do other change, correction or modification to the utility model according to stating announcement before the utility model.Described change, correction and modification all belong to scope of the present utility model.
Claims (20)
1, a kind of conducting resinl material of layer structure is characterized in that being made of the macromolecule glue material that is scattered with conducting particles on its surface of one deck at least.
2, the conducting resinl material of layer structure as claimed in claim 1 is characterized in that described macromolecule glue material is a thermal plastic high polymer glue material.
3, the conducting resinl material of layer structure as claimed in claim 1 is characterized in that described macromolecule glue material is a thermosetting polymer glue material.
4, the conducting resinl material of layer structure as claimed in claim 1, it is characterized in that described conducting resinl material is made of layer high molecule glue material, and the described conducting particles of dispersion on the layer of surface at least therein on the interface of the mutual lamination that constitutes of the layer in the described macromolecule glue material and layer.
5, the conducting resinl material of layer structure as claimed in claim 4 is characterized in that described macromolecule glue material is a thermal plastic high polymer glue material.
6, the conducting resinl material of layer structure as claimed in claim 4 is characterized in that described macromolecule glue material is a thermosetting polymer glue material.
7, the conducting resinl material of layer structure as claimed in claim 1 is characterized in that described conducting particles is stochastic distribution in the lip-deep distribution of this macromolecule glue material.
8, the conducting resinl material of layer structure as claimed in claim 4 is characterized in that described conducting particles is stochastic distribution in the lip-deep distribution of this macromolecule glue material.
9, the conducting resinl material of layer structure as claimed in claim 1 is characterized in that described conducting particles is made of the conductive material that is selected from the group that gold, silver, copper, aluminium, nickel, stainless steel and carbon forms.
10, the conducting resinl material of layer structure as claimed in claim 7 is characterized in that described conducting particles is made of the conductive material that is selected from the group that gold, silver, copper, aluminium, nickel, stainless steel and carbon forms.
11, the conducting resinl material of layer structure as claimed in claim 4 is characterized in that described conducting particles is made of the conductive material that is selected from the group that gold, silver, copper, aluminium, nickel, stainless steel and carbon forms.
12, the conducting resinl material of layer structure as claimed in claim 8 is characterized in that described conducting particles is made of the conductive material that is selected from the group that gold, silver, copper, aluminium, nickel, stainless steel and carbon forms.
13, the conducting resinl material of layer structure as claimed in claim 1, it is characterized in that described conducting particles length breadth ratio, be that width/length is between 0.2 to 1.
14, the conducting resinl material of layer structure as claimed in claim 4, it is characterized in that described conducting particles length breadth ratio, be that width/length is between 0.2 to 1.
15, the conducting resinl material of layer structure as claimed in claim 7, it is characterized in that described conducting particles length breadth ratio, be that width/length is between 0.2 to 1.
16, the conducting resinl material of layer structure as claimed in claim 8, it is characterized in that described conducting particles length breadth ratio, be that width/length is between 0.2 to 1.
17, the conducting resinl material of layer structure as claimed in claim 1 is characterized in that described conducting particles is spherical in shape, circular, oval, flat, sheet, shaft-like, fibrous or irregular.
18, the conducting resinl material of layer structure as claimed in claim 4 is characterized in that described conducting particles is spherical in shape, circular, oval, flat, sheet, shaft-like, fibrous or irregular.
19, the conducting resinl material of layer structure as claimed in claim 10 is characterized in that described conducting particles is spherical in shape, circular, oval, flat, sheet, shaft-like, fibrous or irregular.
20, the conducting resinl material of layer structure as claimed in claim 12 is characterized in that described conducting particles is spherical in shape, circular, oval, flat, sheet, shaft-like, fibrous or irregular.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200420036455 CN2750339Y (en) | 2004-04-06 | 2004-04-06 | Conducting resin material with laminated structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200420036455 CN2750339Y (en) | 2004-04-06 | 2004-04-06 | Conducting resin material with laminated structure |
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CN2750339Y true CN2750339Y (en) | 2006-01-04 |
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CN 200420036455 Expired - Fee Related CN2750339Y (en) | 2004-04-06 | 2004-04-06 | Conducting resin material with laminated structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109799660A (en) * | 2019-03-20 | 2019-05-24 | 武汉华星光电技术有限公司 | Liquid crystal display device |
-
2004
- 2004-04-06 CN CN 200420036455 patent/CN2750339Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109799660A (en) * | 2019-03-20 | 2019-05-24 | 武汉华星光电技术有限公司 | Liquid crystal display device |
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C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |