CN1273286C - Conductive rubber material with laminated structure - Google Patents
Conductive rubber material with laminated structure Download PDFInfo
- Publication number
- CN1273286C CN1273286C CN 200410033527 CN200410033527A CN1273286C CN 1273286 C CN1273286 C CN 1273286C CN 200410033527 CN200410033527 CN 200410033527 CN 200410033527 A CN200410033527 A CN 200410033527A CN 1273286 C CN1273286 C CN 1273286C
- Authority
- CN
- China
- Prior art keywords
- conducting
- layer structure
- conducting particles
- conducting resinl
- glue material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims abstract description 136
- 239000002245 particle Substances 0.000 claims abstract description 107
- 239000003292 glue Substances 0.000 claims description 64
- 229920002521 macromolecule Polymers 0.000 claims description 41
- 238000009826 distribution Methods 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000004634 thermosetting polymer Substances 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 2
- 229910021386 carbon form Inorganic materials 0.000 claims 2
- 239000004033 plastic Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000011521 glass Substances 0.000 abstract description 16
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 57
- 239000000758 substrate Substances 0.000 description 13
- 238000003825 pressing Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 229920000914 Metallic fiber Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The present invention provides a laminated electrically conducting rubber material. Electrically conducting particles are distributed onto the surfaces of a laminated high molecular rubber material so that the connecting impedance of a terminal is reduced after a drive assembly and the terminal on a glass base board are pressed and connected for realizing a gluing purpose with a superfine interval.
Description
Technical field
The present invention relates to a kind of conducting resinl material of layer structure; Relate in particular to a kind of at the sheet macromolecule glue material surface distribution stratiform conducting resinl material that conducting particles constituted.
Background technology
The general conductive material of conductive particle (spherical particle) that adopts of the then part of the face glass of conventional liquid crystal and driven unit is as conducting, shown in Figure 1A to 1C, its way is after coating above the terminal 2 of LCD glass substrate 1 or attaching anisotropy conductive material 3, metal terminal 5 on the driven unit 4 engages with terminal 2 contrapositions on the LCD glass substrate 1 again, finishes conducting.Above-mentioned conduct generally to produce in Z-direction conduct but insulate in the X-Y plane direction.
The general conductive material spherical conducting particles 31 of uniformly dispersing in thermoplasticity or thermosetting polymer glue material 3 that is used for above-mentioned purpose, shown in Fig. 2 A, and, must apply extra electric field and magnetic field so that realize the even dispersion of conducting particles 31 in macromolecule glue material 3 in order to make conducting particles 31 be dispersed evenly in the macromolecule glue material 3 and to avoid these conducting particles 31 to reunite.Relatively, in order to reach higher accuracy, need the equipment of control accuracy and will increase manufacturing cost.
Moreover, behind the terminal 5 that uses these anisotropy conductive materials in order to terminal on the glass substrate 1 of adhering liquid crystal display 2 and driven unit 4, will produce by these conducting particles 31 between terminal and conduct (Z-direction conducts), shown in Fig. 2 B.But the conducting particles 31 that is dispersed in the spacing (pitch) of terminal and terminal may will cause short circuit (conducting of the X-Y direction that causes not expected) because of extruding makes 31 of conducting particles produce to contact, shown in the part that Fig. 2 B is labeled as A.
Along with the resolution of flat-panel screens requires more and more high and to dimensional requirement more and more hour, the engaging spacing (pitch) and will require more and more for a short time of the terminal 2 on the terminal 5 of driven unit 4 and the glass substrate 1 then, the impedance that continues after terminal engages simultaneously also can be followed area with terminal and diminish and improve.And traditional conducting resinl material is in order to satisfy the requirement of fine pitch, when spacing more and more hour, relatively the size of conducting particles also can reduce.The conducting particles size decreases will be except improving cost of manufacture and increasing the difficulty of particle manufacturing, and the surface roughness of terminal also can limit the development of particle size.When particle size changes less than the terminal surfaces roughness, will cause the bad problem that conducts.After the density of conducting particles 31 increases,, can't satisfy the demand of fine pitch adhesion again though the impedance that continues can reduce.Therefore be subject to above-mentioned factor, traditional conducting resinl material all is applied to spacing greater than in 50 microns the application.
In view of the above, need provide a kind of conducting resinl material, this conducting resinl material can overcome above-mentioned disappearance and be fit to be applied to the LCD terminal and engages with little spacing between the driven unit terminal.
Summary of the invention
Main purpose of the present invention provides a kind of conducting resinl material of layer structure, is scattered the layer high molecule glue material of conducting particles by the surface and forms, and can reduce the conducting particles density of unit are, and meet the requirement that little spacing engages.
Another object of the present invention provides a kind of conducting resinl material of layer structure, on macromolecule glue material surface, scatter conducting particles, can be easy to control the lip-deep conducting particles distribution density of macromolecule glue material, need not extra electric field and magnetic field and control the distribution of particles uniformity, can save manufacturing cost.
For reaching above-mentioned purpose, the invention provides a kind of conducting resinl material of layer structure, engaging between the terminal that can be used for driven unit and the terminal of glass substrate.The conducting resinl material of layer structure of the present invention is made of the macromolecule glue material that is scattered with conducting particles on its two surface of one deck at least, and wherein said conducting particles is random distribution in the lip-deep distribution of this macromolecule glue material.The present invention is owing to utilize the surface of stratiform macromolecule glue material to scatter conducting particles, therefore the unit are conducting particles density on each floor height molecular glue material surface can reduce, and utilize the macromolecule glue material to isolate each other between contained conducting particles in the other parts conducting resinl material beyond terminal engages, therefore can avoid producing the circuit defect that terminal is caused because of contact between conducting particles in the other parts macromolecule glue material beyond engaging.Moreover, therefore because of unit are conducting particles density reduces, can reduce engaging spacing (pitch), make the conducting resinl material of layer structure of the present invention can be applicable to the field of liquid crystal of ultra tiny joint spacing.
Description of drawings
Below by most preferred embodiment and accompanying drawing the utility model is elaborated, in the accompanying drawing:
Figure 1A to 1C shows each flow process schematic cross-section that tradition utilizes the conducting resinl material that glass substrate is engaged with the terminal of driven unit;
Fig. 2 A to 2B shows that the conventional conductive glue material that is distributed in the conducting resinl material with conductive particle carries out each flow process schematic cross-section that glass substrate engages with the terminal of driven unit;
Fig. 3 A to 3B figure shows that one first specific embodiment with the conducting resinl material of layer structure of the present invention carries out each flow process schematic cross-section that terminal engages;
Fig. 3 C figure is the vertical view of Fig. 3 B; And
Fig. 4 A to 4B shows that one second specific embodiment with the conducting resinl material of layer structure of the present invention carries out each flow process schematic cross-section that terminal engages; And
Fig. 4 C is the vertical view of Fig. 4 B of the present invention.
The Reference numeral of main element:
1 glass substrate, 2,5 terminals
3 conducting resinl materials, 31 conducting particles
32 sheet macromolecule glue materials, 4 driven units
The specific embodiment
The invention provides a kind of conducting resinl material of layer structure, be on macromolecule glue material surface, for example thermoplasticity or thermosetting polymer glue material surface, scatter conducting particles, thereby when be used for terminal on driving element and the glass substrate pressing continue after, the impedance that continues that terminal engages can reduce, and can ultra tiny spacing realize the purpose of adhesion.
According to the conducting resinl material of layer structure of the present invention, particularly, on thermoplasticity or thermosetting polymer sheet glue material two surfaces, scatter conducting particles, and can control easily the lip-deep conducting particles distribution density of glue material with and dispersed homogeneous degree.And because conducting particles is distributed on glue material two surfaces, therefore compared to tradition conducting particles is distributed in conducting resinl material in the macromolecule glue material, conducting particles number (conducting particles density) in the single lip-deep unit are of the conducting resinl material of layer structure of the present invention can reduce, but after pressing joint, the conducting particles number that makes the abutting end subarea because of the pressing between two surfaces is that the glue material two surperficial populations of scattering that go up are summed up, and can reach and the purpose that conducts of utilizing the desire realization of conventional conductive glue material institute.
In addition, because in the conducting resinl material of layer structure of the present invention, the conducting particles density of unit are reduce and the other parts conducting resinl material beyond terminal engages in utilize the macromolecule glue material to isolate each other between contained conducting particles, therefore can avoid producing the circuit defect that is caused because of contact between the conducting particles of A part shown in Fig. 2 B.
The conducting resinl material of layer structure of the present invention can be single layer structure also can be sandwich construction.When the conducting resinl material becomes sandwich construction, conducting particles can be scattered on each layer body structure surface, can further reduce the conducting particles number (that is conducting particles density) of unit are, the terminal of driven unit and the terminal on the glass substrate will be diminished apart from (pitch) between the two.If the layer structure number of plies is many more, under the identical situation of the conducting particles number of unit volume, the unit are conducting particles number of each individual layer will be more little, relatively can reduce above-mentioned spacing more.Relation between the described spacing and the layer structure number of plies can be represented by following formula:
P＝T+S
A＝S/(2n-1)+T
n＝Th/(2*B)
P=spacing (pitch) wherein;
T=terminal (lead) width (lead wide);
Interval between S=terminal and terminal (space);
A=processing procedure ability (Ability of production);
The n=layer structure number of plies (number of lamination layers);
Th=conducting resinl material thickness (thickness of conductive material); And
B=conducting particles diameter (diameter of conductive particle).
Conducting resinl material according to layer structure of the present invention, though the layer structure number is many more, can make pitch smaller, but because the gap between glass substrate and driven unit is certain, therefore heterogeneous more each layer thickness over the ground of the number of plies is also more little, then will make the insulation impedance deficiency between layer and the layer, the probability that relatively is short-circuited also will raise.The conducting resinl material number of plies of layer structure of the present invention is preferably 1 to 20 layer in view of the above, with 1 to 10 layer better, with 1 to 5 layer of the best.
When the conducting resinl material of layer structure of the present invention uses layer structure more than 2 layers, only need mutually at layer and layer that the dispersed electro-conductive particle get final product at least one laminar surface on the interface of lamination (lamination).
In addition, in the conducting resinl material of layer structure of the present invention, conducting particles can be random distribution in the distribution on glue material surface, need not its orientation of special provision.Above-mentioned random distribution will more can realize the more purpose of minuteness space adhesion.
Owing to can further reduce the unit are density of conducting particles in the conducting resinl material, and can be applicable to even be lower than the field of liquid crystal of the ultra tiny joint spacing of 25 micron pitch according to the conducting resinl material of layer structure of the present invention.
Used conducting particles can use the anti-metal material of low resistance in the conducting resinl material of layer structure of the present invention, can use to comprise for example materials such as gold, silver, copper, aluminium, nickel, stainless steel, also can use materials such as carbon.The shape of these conducting particles can be Any shape, comprises sphere, circle, ellipse, flat, sheet, shaft-like, fibrous even can be irregular.
Compared to the conducting particles of other kinds shape, when being shaped as of conducting particles is fibrous or shaft-like, because through pressing the back of continuing to be linear contact, so the impedance that continues is lower and preferable.
When desiring the mat metal and form fibrous conducting particles, can adopt the conventional art shape that earlier metal laminated, re-use cutting technology and be processed into thread; Maybe can adopt high-pressure steam to send the fine liquid slag that is generated of system forth, make the molten state spray silk technology of metallic fiber or as metallic fiber forming technique (referring to USP 6074752) that Bekaert proposed or TaiWan, China patent announcement number 511406 described metallic fibers are made technology or with how meter fibre technology etc. makes.
The size of these conducting particles can several microns or even the scope of rice how, its length-width ratio (width/length) can be between 0.2 to 1.When length-width ratio less than 0.2 the time, will make the diameter of conducting particles change less than electrode surface roughness, will cause then bad, effectively conducting of signal.And when length-width ratio equals 1, conducting particles is spherical, it is on being dispersed in the macromolecule glue material time, may and then move because softening macromolecule glue material flows, and cause conducting particles problem of uneven distribution on the terminal surface, but the problems referred to above can be avoided because the macromolecule glue material itself has a little adherence.With regard to satisfying minuteness space and Low ESR simultaneously, the conducting resinl material of layer structure of the present invention is good to use length-width ratio to be not equal to 1 anisotropy conducting particles, and is especially better with the conducting particles that uses fibrous particle; Even because be fibrous conducting particles in that the macromolecule glue material is softening when flowing, also only can cause torsional deformation and unlikely loss causes the problems such as conducting particles deficiency of terminal surface.
In addition, the conducting resinl material of layer structure of the present invention is used between terminal on the liquid crystal glass base and driven unit terminal when bonding, after pressing joint, electric continuation method therebetween is wire adhesion and can reduce the impedance that continues, and be linear proportional relation between spacing and particle density because of continuing, therefore in the conducting resinl material of layer structure of the present invention the conductive particle number (unit are density) of unit are can be conventional conductive glue material 1/5 to below 1/2, and can reach finer spacing demand.
The present invention will more explain detailedly so that following preferred embodiment cooperation is graphic.
Fig. 3 A-3C is one first embodiment of the conducting resinl material of layer structure of the present invention.As shown in Figure 3A, the conducting resinl material 3 of layer structure of the present invention is made of conducting particles 31 and sheet macromolecule glue material 32, and wherein conducting particles 31 is shaped as fibrous.Conducting particles 31 is dispersed on two surfaces of sheet macromolecule glue material 32.Subsequently with on the conducting resinl material 3 of the layer structure of the present invention glass substrate 1 with terminal 2 placed on it, then give pressing in the mode of terminal and terminal contraposition with the driven unit 4 that has terminal 5 on it.The conducting particles 31 that is clipped in after the pressing between two-terminal will produce electrical connection (the axial electrical connection of Z-) because pressing and upper and lower terminal 5 and 2 formation contacts, and the conducting particles in the conducting resinl material 3 of the layer structure in the zone beyond two- terminal 5 and 2 engages, then because the separation of macromolecule glue material 32, and do not produce any electrical connection (that is the X-Y direction of principal axis does not produce electrical connection), shown in Fig. 3 B.
Fig. 3 C is the vertical view of Fig. 3 B.Can find out the distribution situation of conducting particles 31 in the conducting resinl material 3 of layer structure of the present invention by Fig. 3 C.The number of conducting particles 31 promptly equals to be scattered in 32 liang of lip-deep sums of sheet macromolecule glue material.In view of the above, desiring to reach under the conducting particles density of conventional conductive glue material institute desire realization, according to the conducting resinl material 3 of layer structure of the present invention, because the zones beyond two- terminal 5 and 2 engages, can less unit are Density Distribution conducting particles 31, therefore can reach the purpose of minuteness space.And because fibrous particle linear continuing after pressing joint, thereby can reach low-impedance purpose.
Fig. 4 A-4C is one second embodiment of the conducting resinl material of layer structure of the present invention.Shown in Fig. 4 A, the conducting resinl material 3 of layer structure of the present invention is made of conducting particles 31 and sheet macromolecule glue material 32, and wherein conducting particles 31 is shaped as fibrous and sheet macromolecule glue material 32 is made of three layers of institute.Conducting particles 31 is dispersed on the surface of each sheet macromolecule glue material 32, and a surface of a slice glue material upward gets final product but the interface of two interlayers only need be dispersed in wherein.Subsequently with on the conducting resinl material 3 of the layer structure of the present invention glass substrate 1 with terminal 2 placed on it, then give pressing in the mode of terminal and terminal contraposition with the driven unit 4 that has terminal 5 on it.Being clipped in conducting particles 31 between two-terminal after the pressing will form because of pressing and terminal 5 up and down and 2 and contact and produce electrical connection (the axial electrical connection of Z-), and the conducting particles in the conducting resinl material 3 of the layer structure in the zone beyond two-terminal engages, then do not produce any electrical connection (that is the X-Y direction of principal axis does not produce electrical connection), shown in Fig. 4 B because of the separation of macromolecule glue material 32.
Fig. 4 C is the vertical view of Fig. 4 B.Can find out the distribution situation of conducting particles 31 in the conducting resinl material 3 of layer structure of the present invention by Fig. 4 C.The number of conducting particles 31 promptly equals to be scattered in these sheet macromolecule glue material 32 each lip-deep sums.And because this specific embodiment utilizes layer high molecule glue material, in view of the above, desiring to reach under the conducting particles density of conventional conductive glue material institute desire realization, conducting resinl material 3 according to layer structure of the present invention, can be on each surface than the conducting resinl material of single layer structure shown in Figure 3 littler area density distribution conducting particles 31, and, therefore can further reach the more purpose of minuteness space because the zone beyond two- terminal 2 and 5 engages does not produce electrical connection.
Therefore be scattered in conducting resinl material in the macromolecule glue material compared to traditional conducting particles, the conducting resinl material of layer structure of the present invention is because conducting particles is layered distribution, for example, conducting particles is allocated on two surfaces of stratiform macromolecule glue material, and can reduce the conducting particles number of unit are, and owing to be distributed on the stratiform macromolecule glue material surface, more can be easy to control the conducting particles distribution density on the glue material, do not need to be scattered in as the conventional conductive glue material in the macromolecule glue material distribution consistency degree that must the outer mode that adds electromagnetic field control conducting particles, therefore more can save cost of manufacture as conducting particles.
Moreover, the conducting resinl material of foundation layer structure of the present invention is owing to utilize the surface of stratiform macromolecule glue material to scatter conducting particles, therefore the conducting particles density of unit are reduces, and isolate by the macromolecule glue material each other between contained conducting particles in the other parts conducting resinl material beyond terminal engages, therefore can avoid producing the circuit defect that terminal is caused because of contact between conducting particles in the other parts macromolecule glue material beyond engaging.And, therefore can reduce engaging spacing (pitch) because of the conducting particles area density reduces.
The present invention is by above-mentioned specific embodiment detailed description in addition, but described specific embodiment is only in order to explanation the present invention and not in order to limit the scope of the invention, therefore in without departing from the spirit or scope of the invention, know this skill person and can do other change, correction or modification to the present invention according to aforementioned announcement of the present invention.Described change, correction and modification all belong to scope of the present invention.
Claims (12)
1, a kind of conducting resinl material of layer structure is made of the macromolecule glue material that is scattered with conducting particles on its two surface of one deck at least, and wherein said conducting particles is random distribution in the lip-deep distribution of this macromolecule glue material.
2, the conducting resinl material of layer structure as claimed in claim 1, wherein said macromolecule glue material are thermal plastic high polymer glue material.
3, the conducting resinl material of layer structure as claimed in claim 1, wherein said macromolecule glue material are thermosetting polymer glue material.
4, the conducting resinl material of layer structure as claimed in claim 1, wherein said conducting resinl material is made of layer high molecule glue material, and the described conducting particles of dispersion on the layer of surface at least therein on the interface of the mutual lamination that constitutes of the layer in the described macromolecule glue material and layer.
5, the conducting resinl material of layer structure as claimed in claim 4, wherein said macromolecule glue material are thermal plastic high polymer glue material.
6, the conducting resinl material of layer structure as claimed in claim 4, wherein said macromolecule glue material are thermosetting polymer glue material.
7, the conducting resinl material of layer structure as claimed in claim 1, wherein said conducting particles is made of the conductive material that is selected from the group that gold, silver, copper, aluminium, nickel, stainless steel and carbon forms.
8, the conducting resinl material of layer structure as claimed in claim 4, wherein said conducting particles is made of the conductive material that is selected from the group that gold, silver, copper, aluminium, nickel, stainless steel and carbon forms.
9, the conducting resinl material of layer structure as claimed in claim 1, is that width/length is between 0.2 to 1 at the length-width ratio of wherein said conducting particles.
10, the conducting resinl material of layer structure as claimed in claim 4, is that width/length is between 0.2 to 1 at the length-width ratio of wherein said conducting particles.
11, the conducting resinl material of layer structure as claimed in claim 1, wherein said conducting particles is spherical in shape, circular, oval, flat, sheet, shaft-like, fibrous or irregular.
12, the conducting resinl material of layer structure as claimed in claim 4, wherein said conducting particles is spherical in shape, circular, oval, flat, sheet, shaft-like, fibrous or irregular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410033527 CN1273286C (en) | 2004-04-06 | 2004-04-06 | Conductive rubber material with laminated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410033527 CN1273286C (en) | 2004-04-06 | 2004-04-06 | Conductive rubber material with laminated structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1680093A CN1680093A (en) | 2005-10-12 |
| CN1273286C true CN1273286C (en) | 2006-09-06 |
Family
ID=35067045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410033527 Expired - Fee Related CN1273286C (en) | 2004-04-06 | 2004-04-06 | Conductive rubber material with laminated structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1273286C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110444110B (en) * | 2019-08-14 | 2021-06-29 | 云谷（固安）科技有限公司 | Electronic component and display device |
-
2004
- 2004-04-06 CN CN 200410033527 patent/CN1273286C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1680093A (en) | 2005-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101042869B1 (en) | Methods of producing anisotropic conductive adhesive film and connection | |
| CN103838440B (en) | Touch screen | |
| CN103666315A (en) | Conductive paste for external electrode, multilayer ceramic electronic component manufactured by using the same and manufacturing method thereof | |
| CN110473655B (en) | Transparent conductive film and preparation method thereof | |
| JP2015197299A (en) | Pressure sensitive element, manufacturing method thereof, touch panel including pressure sensitive element and manufacturing method thereof | |
| KR101271814B1 (en) | Conductive particle | |
| JP2015197300A (en) | Pressure sensitive element, manufacturing method thereof, touch panel including pressure sensitive element and manufacturing method thereof | |
| JP2009010204A (en) | Light emitting device | |
| KR102018042B1 (en) | Anisotropic conductive film and connection structure | |
| CN1467552A (en) | Liquid crystal display device | |
| JP2007035573A (en) | Conductive particulate and anisotropic conductive material | |
| CN110137239A (en) | Flexible base board, preparation method, display panel and display device | |
| CN1273286C (en) | Conductive rubber material with laminated structure | |
| KR20070005100A (en) | Conductive particle having a density-gradient in the complex plating layer and preparation of the same and conductive adhesives using the same | |
| CN2750339Y (en) | Conducting resin material with laminated structure | |
| TW202001932A (en) | Electric conductive material and method of manufacturing for bonding body | |
| WO2020258871A1 (en) | Touch control structure, organic light emitting diode, and display device comprising same | |
| CN209328538U (en) | Anisotropic conductive film structure | |
| CN1310835A (en) | Electrical connection structure and flat display device | |
| CN109628002B (en) | Anisotropic conductive adhesive tape and manufacturing method thereof | |
| CN1155770A (en) | Low-resistance interconnector and method for preparation thereof | |
| TW200523950A (en) | Conductive material with a laminated structure | |
| CN2891234Y (en) | Surface adhered chip resistor | |
| JP4347974B2 (en) | Method for producing conductive fine particles, anisotropic conductive adhesive, and conductive connection structure | |
| EP1777066B1 (en) | A laminated electrically conductive polymer structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: YOUDA PHOTOELECTRIC CO., LTD. Free format text: FORMER NAME OR ADDRESS: GUANGHUI ELECTRONIC CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: Hsinchu, Taiwan, China Patentee after: AU OPTRONICS Corp. Address before: Taiwan, China Patentee before: QUANTA DISPLAY INCORPORATION |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060906 |