CN1996132A - Multi-layered anisotropic conductive film - Google Patents
Multi-layered anisotropic conductive film Download PDFInfo
- Publication number
- CN1996132A CN1996132A CNA2006101720734A CN200610172073A CN1996132A CN 1996132 A CN1996132 A CN 1996132A CN A2006101720734 A CNA2006101720734 A CN A2006101720734A CN 200610172073 A CN200610172073 A CN 200610172073A CN 1996132 A CN1996132 A CN 1996132A
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- CN
- China
- Prior art keywords
- conductive film
- anisotropic conductive
- conductive
- insulating binder
- conductive bonding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- E—FIXED CONSTRUCTIONS
- E03—WATER SUPPLY; SEWERAGE
- E03F—SEWERS; CESSPOOLS
- E03F5/00—Sewerage structures
- E03F5/02—Manhole shafts or other inspection chambers; Snow-filling openings; accessories
- E03F5/021—Connection of sewer pipes to manhole shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Hydrology & Water Resources (AREA)
- Public Health (AREA)
- Water Supply & Treatment (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
Abstract
The present invention discloses a multilayered anisotropic electroconductive film, including a non-conductive bonding layer composing of first insulation bond; a conductive bonding layer cascading on a surface of the non-conductive bonding layer, and conductive grains thereinto is scattered in the second bond, the second insulation bond has relatively higher solidify velocity than the first insulation bond; and a separation film attached to surface of the non-conductive bonding layer relative to the surface contacting with the conductive bonding layer. For the solidify velocity is improved, the multilayered anisotropic electroconductive film prevents the damage of electrode of part to be connected by heat, and press condition of the conductive grains is improved.
Description
Technical field
The present invention relates to a kind of anisotropic conductive film (ACF), relate more specifically to a kind of multilayer ACF, it has the different a plurality of insulation courses of solidification rate (curing rate) to connect parts to be connected, and described parts have electrode respect to one another.
Background technology
Usually, because parts to be connected are made by special material or signal routing spacing (pitch) is meticulous, so when parts can't interconnect by welding, anisotropic conductive film (ACF) was with connecting material.
This anisotropic conductive film is usually as the connection material of packing LCD panel, PCB (printed circuit board (PCB)), driver IC circuit etc.
As an example, a plurality of driver IC is installed on the LCD module with drive TFT (thin film transistor (TFT)) pattern.Utilize following mode mounting driver IC: COG (glass top chip) installation method, be used for driver IC is installed in the gate regions (gate region) and the data field of LCD panel, and need not any additional structure; And TAB (belt engages automatically) installation method, be used for TCP (belt carrier package) by being mounted with driver IC, driver IC is installed in indirectly the gate regions and the data field of LCD panel.
But, because the electrode of driver IC element and the electrode of LCD panel are formed with fine pitch, so, be difficult to apply welding etc. though can use any installation method.Owing to this reason, anisotropic conductive film is generally used for being electrically connected in the process of electrode of the electrode of driver IC and panel.
With reference to Fig. 1, conventional anisotropic-electroconductive film 30 is formed and makes conductive particle 50 be dispersed in the insulating binder 40, and its by hot pressing between parts to be connected 10,20.Then, as shown in Figure 2, conductive particle 50 makes electrode 11,21 be electrically connected to each other between electrode 11,21 respect to one another, keeps insulation then between adjacent electrode.That is to say, on the x-y plane, keep insulation owing to anisotropic conductive film 30, and keep electric conductivity along the z direction of principal axis.
When connecting parts to be connected, multi-layered anisotropic conductive film is as a scheme that improves connection reliability, and wherein said parts to be connected have a plurality of electrodes that are formed with fine pitch.This multi-layered anisotropic conductive film comprises conductive adhesive and the nonconductive adhesive layer that contains conductive particle.At this moment, the layer that contains conductive particle has the viscosity higher than nonconductive adhesive layer, and the fusing point that perhaps contains the layer of conductive particle is lowered.
But said method slows down solidification rate, and therefore parts (for example IC chip) to be connected may be damaged by heat, and perhaps the processing time is delayed.
In order to address these problems, a kind of anisotropic conductive film with solidification rate of raising has been proposed.This anisotropic conductive film has advantageously shortened the processing time, but before conductive particle is pushed fully by the fine electrode of parts to be connected, resin since quick solidification rate be cured, thereby caused the connection of low-quality.
Summary of the invention
The present invention is intended to solve prior art problems, therefore the object of the present invention is to provide a kind of multi-layered anisotropic conductive film, when it has the parts to be connected of fine electrode in connection, can prevent parts to be connected owing to heat is damaged, and can improve the reliability of connection by improved solidification rate is provided.
To achieve these goals, the invention provides a kind of multi-layered anisotropic conductive film, it comprises: non-conductive bonding coat, and it is made of first insulating binder; Conductive adhesive, it is layered on the surface of this non-conductive bonding coat, and wherein conductive particle is dispersed in second insulating binder, and this second insulating binder has comparatively faster solidification rate than this first insulating binder; And diffusion barrier, it is attached to the surface of this non-conductive bonding coat, with respect to the surface that contacts with this conductive adhesive.
Preferably, first insulating binder is a thermoset resin, and second insulating binder is a thermoplastic resin.
Description of drawings
With reference to the explanation of accompanying drawing for embodiment, other purpose of the present invention and scheme will be more apparent by following, in the accompanying drawings:
Fig. 1 is the sectional view that the common anisotropic conductive film between parts to be connected is shown;
Fig. 2 illustrates the sectional view that utilizes common anisotropic conductive film to connect parts to be connected;
Fig. 3 illustrates the sectional view of multi-layered anisotropic conductive film according to the preferred embodiment of the invention;
Fig. 4 illustrates utilization connects parts to be connected according to the multi-layered anisotropic conductive film of the embodiment of the invention sectional view; And
Fig. 5 illustrates utilization connects parts to be connected according to the individual layer anisotropic conductive film of prior art sectional view.
Embodiment
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.Before explanation, be to be understood that: the term that uses in instructions and the claims should not be construed as and is subject to usually and dictionary meanings, and the principle that should suitably define term according to allowing to invent artificial best interpretations, based on explaining with corresponding implication of technical scheme of the present invention and notion.Therefore, the explanation of Ti Chuing here only is for the purpose of illustration a preferred embodiment only, and not in order to the restriction scope of invention, thereby only should be appreciated that otherwise break away from the spirit and scope of the present invention, can carry out other equivalence and retrofits it.
Fig. 3 schematically shows the sectional view of multi-layered anisotropic conductive film according to the preferred embodiment of the invention.
With reference to Fig. 3, multi-layered anisotropic conductive film according to the present invention comprises non-conductive bonding coat 100, conductive adhesive 200 and diffusion barrier 300.
Non-conductive bonding coat 100 is made by first insulating binder 110 that does not have electric conductivity, and adheres to securely and fixing parts (not shown) to be connected.In addition, keep insulation on the x-y plane that non-conductive bonding coat 100 mainly plays a part at multi-layered anisotropic conductive film.
Non-conductive bonding coat 100 comprises first insulating binder 110 and is used to solidify the hardening agent (not shown) of first insulating binder 110.Here, first insulating binder 110 is preferably thermoset resin.Thermoset resin be by to molecular weight be 1000 or littler resin material apply heat or the hardening agent that its interpolation is used to solidify made.
For example, thermoset resin can adopt macromolecule epoxy resin or liquid-state epoxy resin.Epoxy resin demonstrates good thermal resistance and good electrical insulation characteristics, and its characteristic is according to the hardening agent of its mixing is greatly changed.Especially, epoxy resin is used as the bonding agent of electric or electronic unit usually because of its adhesion characteristics.But, the invention is not restricted to this, can use various remodeling within the scope of the invention.For example, can use phenolics, Lauxite or melamine resin.
The thickness of the non-conductive bonding coat 100 that is made of first insulating binder 110 is preferably 10 to 30 μ m.
The conductive particle 220 that conductive adhesive 200 comprises second insulating binder 210, is used for solidifying the hardening agent (not shown) of second insulating binder 210 and is dispersed in second insulating binder 210.At this moment, second insulating binder 210 has comparatively faster solidification rate than first insulating binder 110.
Second insulating binder 210 plays the effect of on the x-y plane adjacent conductive particle 220 being kept apart mutually.Therefore, it prevents that in having the substrate of forming fine wiring adjacent conductive particle 220 is in contact with one another, thereby prevents the electrical connection on the x-y plane.Here, second insulating binder, 210 preferred thermoplastic resin, for example acryl resins of adopting.But, the invention is not restricted to this, can use various remodeling within the scope of the invention.For example, polymer resin be can use, tygon, polypropylene, vestolit or their potpourri comprised.
Thermoplastic resin is softened and demonstrates plasticity when heating, so it can be shaped as different shape.Thereby, when connecting parts to be connected, preferably, conductive particle between electrode, pressurized then.In this embodiment, acryl resin is as second insulating binder 210.Acryl resin is a kind of thermoplastic resin, and it demonstrates to liken to and is the epoxy resin of thermoset resin solidification rate faster.That is to say that the conductive adhesive that is made of acryl resin 200 is cured quickly than the non-conductive bonding coat 100 that is made of epoxy resin.Therefore, the heat that applied is passed to solidification rate conductive adhesive 200 faster from the slower non-conductive bonding coat 100 of solidification rate in the process of compression parts to be connected, so that non-conductive bonding coat 100 is in conductive particle 220 abundant full solidification after the pressurized in conductive adhesive 200.
Conductive particle 220 intersperses among second insulating binder 210, is in the acryl resin, to be electrically connected the electrode of parts to be connected.For this reason, conductive particle 220 is made by at least a metal that is selected from gold, silver, iron, copper, nickel or their potpourri.In order to connect the electrode with fine pitch, the diameter of conductive particle 220 is preferably 1 to 15 μ m.But, the invention is not restricted to these numerical value, and they can differently change according to the characteristic of parts to be connected.
The thickness of the conductive adhesive 200 that is made of second insulating binder 210 is preferably 5 to 25 μ m.
Diffusion barrier 300 is attached to the surface of non-conductive bonding coat 100, and this surface is with respect to the surface in contact of non-conductive bonding coat 100 with conductive adhesive 200.Diffusion barrier 300 is used for stably keeping this anisotropic conductive film in anisotropic conductive film as before the link.Diffusion barrier 300 adopts usually and is processed into the PET film with separation function.
Below, will utilizing more specifically, experiment embodiment illustrates in greater detail the present invention.But, the invention is not restricted to this experiment embodiment, in the claims restricted portion, can implement various embodiment.
Experiment embodiment
As shown in Figure 4, the non-conductive bonding coat 100 that is made of epoxy resin and to be made into thickness by the latent curing agent that the epoxy compound that imidazoles (imidazole) is derived constitutes be 12 μ m, conducting particles 220 are dispersed in conductive adhesive 200 in the acryl resin and peroxide firming agent, and to be made into thickness be 13 μ m.Then, utilize non-conductive bonding coat 100 of rubber rollers roll extrusion and conductive adhesive 200, to make multi-layered anisotropic conductive film 1, it is two-layer to have superposeed in this multi-layered anisotropic conductive film 1.Thereafter, multi-layered anisotropic conductive film 1 between parts 400,500 to be connected, then, by the pressure that applies 3MPa at 180 ℃, 7 seconds of this multi-layered anisotropic conductive film 1 pressurized.
Comparative example
As shown in Figure 5, it is 25 μ m that individual layer anisotropic conductive film 2 is made into thickness, and wherein conductive particle 620 is dispersed in radiation (radical) cured resin 610.Then, individual layer anisotropic conductive film 2 between parts 400,500 to be connected, then, by the pressure that applies 3MPa at 180 ℃, 7 seconds of this individual layer anisotropic conductive film 2 pressurizeds.
For each sample of making according to experiment embodiment and comparative example, measure the oppression state (pressing state) and the connection reliability of conductive particle.
1, the oppression state of conductive particle
For multilayer or individual layer anisotropic conductive film 1,2 between and be stressed upon sample between the parts 400,500 to be connected, utilize the optical microscopy of 300 to 1000 enlargement ratios, measure the compressing characteristic that remains on the conductive particle 220,620 in each protuberance (bump).
2, connection reliability
Utilize multimeter to measure connection resistance between the electrode 410,510 of the parts to be connected 400,500 that adhere to multilayer or individual layer anisotropic conductive film 1,2.At this moment, be 1 Ω or littler if connect resistance, then be defined as " the good connection "; Surpass 1 Ω if connect resistance, then be defined as " bad connection ".
Below table 1 shown the measurement result of the connection resistance between the electrode of the oppression state of conductive particle and parts to be connected, it is according to experiment embodiment and comparative example observation.
Table 1
| Compressing time | The oppression state of conductive particle | Connect resistance | |
| Experiment embodiment | 7 seconds | Well | The good connection |
| Comparative example | 7 seconds | Bad | Bad connection |
See Table 1, for experiment embodiment, owing to used a plurality of layers that constitute by two kinds of different resins of solidification rate, so during heat is pushed process, heat is delivered to the resin bed of solidification rate relatively soon from the resin bed of low relatively solidification rate, and between the abundant pressurized (seeing (c) part of Fig. 4) before the resin bed full solidification of low solidification rate of the conductive particle between the electrode of parts to be connected.Therefore, the connection resistance between the electrode is also low.
Simultaneously, for the comparative example of the resin bed that has only formed fast solidification rate, resin bed is in full solidification before the conductive particle pressurized between the electrode of parts to be connected, thereby caused the gap (seeing (c) part of Fig. 5) between electrode and the conductive particle.Therefore, connect the resistance height.
Accordingly, it should be understood that the multi-layered anisotropic conductive film that is made of the different resin bed of solidification rate is more more effective than the anisotropic conductive film that only is made of the resin bed of fast solidification rate for the oppression state that improves conductive particle.
As mentioned above, describe the present invention in detail with reference to accompanying drawing.But, should be appreciated that only to provide detailed description of the present invention and specific embodiment for example, and not in order to limit the scope of the invention; Because by this detailed description, various variations in the spirit and scope of the present invention and remodeling all will become apparent for those skilled in the art, therefore it should be understood that other equivalence and remodeling in the spirit and scope of the present invention will become apparent for those skilled in the art by this detailed description.
Industrial applicibility
According to the present invention, utilize the different resin bed of solidification rate to prepare multi-layered anisotropic conductive film, therefore the conductive particle between the electrode of parts to be connected can be with the abundant pressurized of effective mode, and the resin bed of relatively low solidification rate solidifies fully simultaneously.
In addition, owing to comprised the resin bed of relatively very fast solidification rate, thus can prevent that electrode from being damaged by heat, and can shorten the processing time.
Claims (4)
1, a kind of multi-layered anisotropic conductive film comprises:
Non-conductive bonding coat, it is made of first insulating binder;
Conductive adhesive, it is layered on the surface of this non-conductive bonding coat, and wherein conductive particle is dispersed in second insulating binder, and described second insulating binder has comparatively faster solidification rate than described first insulating binder; And
Diffusion barrier, it is attached to the surperficial facing surfaces that contacts with described conductive adhesive of described non-conductive bonding coat.
2, multi-layered anisotropic conductive film as claimed in claim 1, wherein said first insulating binder is a thermoset resin.
3, multi-layered anisotropic conductive film as claimed in claim 1, wherein said second insulating binder is a thermoplastic resin.
4, as each described multi-layered anisotropic conductive film in the claim 1 to 3, wherein said conductive particle is selected from gold, silver, iron, copper, nickel and their potpourri.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060001021A KR100713333B1 (en) | 2006-01-04 | 2006-01-04 | Multi-layered anisotropic conductive film |
| KR1020060001021 | 2006-01-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1996132A true CN1996132A (en) | 2007-07-11 |
| CN100507683C CN100507683C (en) | 2009-07-01 |
Family
ID=38251262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101720734A Expired - Fee Related CN100507683C (en) | 2006-01-04 | 2006-12-29 | Multi-layered anisotropic conductive film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4513024B2 (en) |
| KR (1) | KR100713333B1 (en) |
| CN (1) | CN100507683C (en) |
| TW (1) | TW200727438A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101877335B (en) * | 2009-04-30 | 2012-07-25 | 玮锋科技股份有限公司 | Gradient type anisotropic conductive film and manufacturing method thereof |
| CN102650763A (en) * | 2011-08-26 | 2012-08-29 | 北京京东方光电科技有限公司 | Liquid crystal display and manufacturing method thereof and monitor |
| CN103069656A (en) * | 2011-04-06 | 2013-04-24 | 迪睿合电子材料有限公司 | Anisotropic conductive film, method for producing connected body, and connected body |
| CN103122221A (en) * | 2011-11-18 | 2013-05-29 | 第一毛织株式会社 | Anisotropic conductive film with easy pre-bonding process |
| CN109799660A (en) * | 2019-03-20 | 2019-05-24 | 武汉华星光电技术有限公司 | Liquid crystal display device |
| CN110168357A (en) * | 2017-01-11 | 2019-08-23 | Lg电子株式会社 | Sensor |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101193757B1 (en) * | 2007-09-20 | 2012-10-23 | 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 | Anisotropic conductive film, method for producing the same, and joined structure using the same |
| JP5200744B2 (en) * | 2008-08-01 | 2013-06-05 | 住友電気工業株式会社 | Adhesive and electrode connection method using the same |
| JP5558140B2 (en) | 2009-06-10 | 2014-07-23 | デクセリアルズ株式会社 | Insulating resin film, joined body using the same, and manufacturing method thereof |
| JP5567893B2 (en) * | 2010-04-28 | 2014-08-06 | デクセリアルズ株式会社 | Connection method and connection device |
| JP5695881B2 (en) * | 2010-10-28 | 2015-04-08 | デクセリアルズ株式会社 | Electronic component connection method and connection structure |
| KR101351617B1 (en) | 2010-12-23 | 2014-01-15 | 제일모직주식회사 | Anisotropic conductive film |
| CN105940560B (en) * | 2014-02-04 | 2020-06-12 | 迪睿合株式会社 | Anisotropic conductive film and method for producing same |
| JP7013649B2 (en) * | 2017-01-27 | 2022-02-01 | 昭和電工マテリアルズ株式会社 | Adhesive composition, film-like adhesive, connection structure and its manufacturing method |
| JP7185252B2 (en) * | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | Method for producing connection structure |
| JPWO2023095917A1 (en) * | 2021-11-29 | 2023-06-01 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS61195179A (en) * | 1985-02-25 | 1986-08-29 | Matsushita Electric Ind Co Ltd | Anisotropically conductive adhesive sheet |
| JPS63310581A (en) * | 1987-06-12 | 1988-12-19 | Canon Inc | Film body for electric connection |
| JPH03107888A (en) * | 1989-09-21 | 1991-05-08 | Sharp Corp | Connecting structure for circuit board |
| JPH04366630A (en) * | 1991-06-13 | 1992-12-18 | Sharp Corp | Anisotropic conductive adhesive tape |
| JPH06103819A (en) * | 1992-09-21 | 1994-04-15 | Hitachi Chem Co Ltd | Anisotropic conductive adhesive film |
| JPH06139824A (en) * | 1992-10-27 | 1994-05-20 | Oki Electric Ind Co Ltd | Anisotropic conducting film |
| JP4032439B2 (en) * | 1996-05-23 | 2008-01-16 | 日立化成工業株式会社 | Connection member, electrode connection structure and connection method using the connection member |
| KR19990048959A (en) * | 1997-12-11 | 1999-07-05 | 김영환 | Liquid crystal panel |
| JP3995942B2 (en) * | 2002-01-29 | 2007-10-24 | 旭化成株式会社 | Method for producing conductive adhesive sheet having anisotropy |
-
2006
- 2006-01-04 KR KR1020060001021A patent/KR100713333B1/en not_active IP Right Cessation
- 2006-10-06 JP JP2006274849A patent/JP4513024B2/en not_active Expired - Fee Related
- 2006-12-04 TW TW095144901A patent/TW200727438A/en unknown
- 2006-12-29 CN CNB2006101720734A patent/CN100507683C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101877335B (en) * | 2009-04-30 | 2012-07-25 | 玮锋科技股份有限公司 | Gradient type anisotropic conductive film and manufacturing method thereof |
| CN103069656A (en) * | 2011-04-06 | 2013-04-24 | 迪睿合电子材料有限公司 | Anisotropic conductive film, method for producing connected body, and connected body |
| CN103069656B (en) * | 2011-04-06 | 2015-09-02 | 迪睿合电子材料有限公司 | The manufacture method of anisotropic conductive film, conjugant and conjugant |
| CN102650763A (en) * | 2011-08-26 | 2012-08-29 | 北京京东方光电科技有限公司 | Liquid crystal display and manufacturing method thereof and monitor |
| CN102650763B (en) * | 2011-08-26 | 2015-01-07 | 北京京东方光电科技有限公司 | Liquid crystal display and manufacturing method thereof and monitor |
| CN103122221A (en) * | 2011-11-18 | 2013-05-29 | 第一毛织株式会社 | Anisotropic conductive film with easy pre-bonding process |
| CN103122221B (en) * | 2011-11-18 | 2015-11-11 | 第一毛织株式会社 | There is anisotropic conductive film and the semiconductor device of the pre-bonded processibility of improvement |
| CN110168357A (en) * | 2017-01-11 | 2019-08-23 | Lg电子株式会社 | Sensor |
| CN110168357B (en) * | 2017-01-11 | 2022-07-08 | Lg电子株式会社 | Sensor with a sensor element |
| CN109799660A (en) * | 2019-03-20 | 2019-05-24 | 武汉华星光电技术有限公司 | Liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100713333B1 (en) | 2007-05-04 |
| JP4513024B2 (en) | 2010-07-28 |
| JP2007182062A (en) | 2007-07-19 |
| TW200727438A (en) | 2007-07-16 |
| CN100507683C (en) | 2009-07-01 |
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