CN108629926A - A kind of anti-detection implementation method of magnetic head - Google Patents
A kind of anti-detection implementation method of magnetic head Download PDFInfo
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- CN108629926A CN108629926A CN201810443834.8A CN201810443834A CN108629926A CN 108629926 A CN108629926 A CN 108629926A CN 201810443834 A CN201810443834 A CN 201810443834A CN 108629926 A CN108629926 A CN 108629926A
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- magnetic head
- head
- silicon rubber
- implementation method
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07G—REGISTERING THE RECEIPT OF CASH, VALUABLES, OR TOKENS
- G07G1/00—Cash registers
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07G—REGISTERING THE RECEIPT OF CASH, VALUABLES, OR TOKENS
- G07G1/00—Cash registers
- G07G1/12—Cash registers electronically operated
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- General Physics & Mathematics (AREA)
- Magnetic Heads (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
The invention discloses a kind of anti-detection implementation methods of magnetic head, are related to POS machine magnetic head security protection technology field.This method, using quantitative one pack system, the silicon rubber of Low Temperature Thermal rapid curing type replaces the AB glue used in the prior art, on the basis of ensureing sealing effect having the same, since silicon rubber is without the live mixed preparing before carrying out use, so, operating process is simpler, and, silicon rubber does not require usage time, in addition, can solidification can be realized in very short time at a lower temperature, therefore, greatly reduce technological requirement, shorten working hour, to greatly reduce the cost that technique is realized in the anti-detection of magnetic head, compared with the cost for using AB glue in the prior art, cost reduction up to 10% 15%.In addition, obtained magnetic head has better ageing-resistant effect, can use 7 years as long as will not be affected, and have fabulous ageing-resistant performance.
Description
Technical field
The present invention relates to POS machine magnetic head security protection technology field more particularly to a kind of anti-detection implementation methods of magnetic head.
Background technology
After conventional magnetic head is welded with PCBA decoding decks, need to be sealed the decoding chip plate in magnetic head, from
And ensures the collected information of magnetic head and do not detected by extraneous attack.
Currently, during being sealed to the decoding chip plate in magnetic head, the sealing material used is generally epoxy resin
4 are pressed with AB glue:1 ratio is mixed and is stirred with obtaining after uniformly, since the sealing material is being stirred with can gradually generate heat after uniformly
Mobility is deteriorated, so need to have used in 2 hours, otherwise can due to sealing material does not flow and the problem of can not use；
In addition, the sealing material is long from the filling time for being accomplished to solidification, under hot conditions, 8 hours are needed, is up under normal temperature condition
48 hours, so, the decoding chip plate in magnetic head is sealed using above-mentioned sealing material, not only the manufacture work of sealing material
Sequence is complicated, and height is required to usage time, moreover, the time needed when solidification after filling is long, low production efficiency.
Invention content
The purpose of the present invention is to provide a kind of anti-detection implementation method of magnetic head, to solve it is existing in the prior art before
State problem.
To achieve the goals above, the technical solution adopted by the present invention is as follows：
A kind of anti-detection implementation method of magnetic head, includes the following steps：
S1 carries out patch to magnetic head pcb board, obtains patch magnetic head pcb board；
The patch magnetic head pcb board is welded with PCB decoding decks, obtains head stack by S2；
S3 carries out functional test to the head stack；
S4, by the canned magnetic head chamber to the head stack of the silicon rubber of quantitative one pack system, Low Temperature Thermal rapid curing type
In vivo, filling silicon rubber head stack is obtained；
S5 keeps the filling silicon rubber head stack 20 minutes under the conditions of 120 degree so that silicon rubber solidifies.
Preferably, FPC soft boards were fixed on specifically, made jig using the material of glass-fiber-plate or compound stone by S1
On jig, patch is carried out to decoding chip and peripheral circuit by SMT to FPC soft arranging wires.
Preferably, magnetic head specifically, be placed by defined direction on welding fixture, after then mounting by S2 first
Hole on FPC plates is aligned with magnetic head contact pin, and by flattening, is welded by electric soldering iron, and 7 points of welding, welding temperature are amounted to
350 degree of degree, duration 2-3 second ensure to weld complete Wuxi point and/or rosin joint situation.
Preferably, S3 is specifically, be installed to the head stack after welding on head test jig, to the POS on jig
Machine powers on booting, enters head test interface, continuously forward and reverse to swipe the card 5 times, and it is that test passes through that prompt success rate, which is 100%,.
Preferably, S4 is specifically, will be in the canned magnetic head cavity to the head stack of silicon rubber using dispenser.
Preferably, in S4, the amount of the silicon rubber in the canned magnetic head cavity to the head stack is 0.3ml：
Preferably, S5 is placed into the high-temperature cabinet that temperature is 120 degree specifically, by the head stack after dispensing, keeps 20
It is taken out after minute, obtains complete head stack.
The beneficial effects of the invention are as follows：The anti-detection implementation method of magnetic head provided in an embodiment of the present invention, using quantitative single group
Divide, the AB glue that the replacement of the silicon rubber of Low Temperature Thermal rapid curing type uses in the prior art, is ensureing sealing effect having the same
On the basis of fruit, since silicon rubber is without the live mixed preparing before carrying out use, so, operating process is simpler, moreover,
Silicon rubber does not require usage time, furthermore it is possible at a lower temperature solidification can be realized in the very short time, because
This, greatly reduces technological requirement, shortens working hour, to greatly reduce the cost that technique is realized in the anti-detection of magnetic head,
Compared with the cost for using AB glue in the prior art, cost reduction up to 10%-15%.Further, since the silicon rubber used
With moisture-proof, ageing-resistant, electrical isolation, the characteristics such as solidification is fast, is not easy to melt after solidification, so, obtained magnetic head has better
Ageing-resistant effect, can use 7 years as long as will not be affected.
Description of the drawings
Fig. 1 is the anti-detection implementation method flow diagram of magnetic head provided in an embodiment of the present invention.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with attached drawing, to the present invention into
Row is further described.It should be appreciated that the specific embodiments described herein are only used to explain the present invention, it is not used to
Limit the present invention.
As shown in Figure 1, an embodiment of the present invention provides a kind of anti-detection implementation method of magnetic head, include the following steps：
S1 carries out patch to magnetic head pcb board, obtains patch magnetic head pcb board；
The patch magnetic head pcb board is welded with PCB decoding decks, obtains head stack by S2；
S3 carries out functional test to the head stack；
S4, by the canned magnetic head chamber to the head stack of the silicon rubber of quantitative one pack system, Low Temperature Thermal rapid curing type
In vivo, filling silicon rubber head stack is obtained；
S5 keeps the filling silicon rubber head stack 20 minutes under the conditions of 120 degree so that silicon rubber solidifies.
In the present embodiment, silicon rubber is commercially manufacturer：The limited public affairs of the permanent big new material science and technology in Guangdong
Department, model：704RTV silicon rubber has the characteristics such as moisture-proof, ageing-resistant, electrical isolation, solidification be fast, is not easy to melt after solidification.
Wherein, FPC soft boards were fixed on and controlled specifically, made jig using the material of glass-fiber-plate or compound stone by S1
On tool, patch is carried out to decoding chip and peripheral circuit by SMT to FPC soft arranging wires.
Soft FPC winding displacements can not directly go up chip mounter patch due to too soft as hardboard PCB, need soft board being placed into and adopt
It being crossed on furnace tool and being fixed with what glass-fiber-plate or synthesis stone were held, then snapped into furnace tool is crossed on the guide rail of chip mounter, crossing stove
It is 260 degree that jig, which needed Reflow Soldering, temperature, and duration 50-90 second is differed, therefore material needs high temperature resistant indeformable.It is this
Technique can achieve the effect that patch is efficient as hard pcb board patch, and device welding is reliable, is not in the feelings such as to shift, set up a monument
Condition.
S2, then will be after attachment on FPC plates specifically, be first placed into magnetic head on welding fixture by defined direction
Hole is aligned with magnetic head contact pin, and by flattening, is welded by electric soldering iron, and 7 points of welding are amounted to, and 350 degree of welding temperature is held
Continuous time 2-3 second ensures to weld complete Wuxi point and/or rosin joint situation.
Since magnetic head face is cambered surface, injustice is caused to be unfavorable for welding, therefore it is solid to need making jig that magnetic head is put into jig
It is fixed, at the same FPC soft boards be laid flat after welded again, ensure speed of welding and quality.
S3 is specifically, be installed to the head stack after welding on head test jig, to being established by cable in the POS machine on jig
Machine enters head test interface, continuously forward and reverse to swipe the card 5 times, and it is that test passes through that prompt success rate, which is 100%,.
Although IQC can be inspected by random samples after having full inspection, factory to receive goods before magnetic head supplier manufacture, it can ensure magnetic head before welding
It is non-defective unit, but due to failure welding or solution when in welding, overlong time can lead to head failure either FPC plates are in patch
Chip itself is bad can lead to head stack functional fault for code.It is tested by this jig, it is ensured that the magnetic head before encapsulating
Component is non-defective unit, if just being found after encapsulating bad, inventory disposal will be led at this time by tearing open again, because encapsulating purpose is exactly anti-
It is only easy to that detection can be dismantled, this measure can certainly will lead to a large amount of material loss, increase cost.
S4 is specifically, will be in the canned magnetic head cavity to the head stack of silicon rubber using dispenser.
Traditional method is to go dispensing by hand, uneven but due to the glue amount disunity of manual control, and inefficiency,
Therefore dispensing is carried out by the way of dispenser, artificial lift's efficiency is substituted, homogeneity of product is improved, reduces the waste of material.
In S4, the amount of the silicon rubber in the canned magnetic head cavity to the head stack is：0.3ml
Encapsulating is quantified using dispenser, improves homogeneity of product, 0.3ml is just by the filling full minimum of cavity.
S5 is placed into the high-temperature cabinet that temperature is 120 degree, keeps after twenty minutes specifically, by the head stack after dispensing
It takes out, obtains complete head stack.
Such mode can quickly solidify, and reduce the production stand-by period, this accessory can not have in advance with pipelining
Head stack is produced.
Specific embodiment
Patch first is carried out according to BOM inventories to magnetic head FPC plates, the material of glass-fiber-plate or compound stone need to be used to make when patch
Jig of crossing fix FTC soft boards, Reflow Soldering is crossed after patch, 260 degree of furnace temperature is entire to spend 60 seconds stove time, after stove by AOI into
Performing check by rosin joint, dry joint, short circuit, is set up a monument, the bad detection such as Short Item.
Decoding chip boards half-finished product is obtained after patch, is then welded magnetic head and PCB decoding decks by welding fixture,
Electric soldering iron temperature setting is 350 degree, amounts to 7 points of welding, each 2-3 seconds a length of when spot welding, after the completion of welding, with board-washing water
Weld is cleaned, head stack is finally obtained.
Functional test is carried out to head stack using magnetic head function test fixture, the head stack after welding is installed to magnetic
On head measurement jig, booting is powered on to the POS machine on jig, enters head test interface, it is continuously forward and reverse to swipe the card 5 times, it carries
It is 100% to pass through to be shown as power.
The head stack passed through to test with dispenser carries out encapsulating 0.3ml.
It is kept for 20 minutes under the conditions of the head stack after encapsulating is put into 120 degree again so that silicon rubber solidifies.
Finally the head stack after encapsulating is installed in POS machine.
This scheme carries out simulation test after supersolidification, to total sealing effect, ageing-resistant etc., can reach and A/B glue
Identical effect, and entire production cost has the range of decrease of 10-15%, has greatly saved cost.
Comparative example 1
It is filling using common A/B glue progress, 4 are pressed before filling the container：1 ratio mixing (room temperature), stir companion makes for 5-10 minutes
Uniformly mixing is abundant for it, then carries out dispensing with dispenser, and glue amount 0.3ml places room temperature after the completion of filling and coagulated after lower 48 hours
Gu.Leakproofness and resistance to ag(e)ing can reach expected results, and color is black after A/B gellings are solid, can't see magnetic head internal structure
It can reach requirement.The production cost of such scheme head stack is 3 yuan/pcs
Comparative example 2
It is filling using the progress of common 502 glue, carry out dispensing (room temperature), glue amount 0.3ml, after the completion of filling with dispenser
25 degree of room temperature is placed, solidification in 10-25 seconds.Leakproofness and resistance to ag(e)ing can reach expected results, but 502 glue are white saturating
It is bright, it can be seen that magnetic head internal structure does not meet safety requirements, and the production cost of head stack is 2.8 yuan/pcs.
Comparative example 3
It is carried out using hot melt adhesive filling, dispensing (temperature be 280 degree) is carried out with dispenser machine, glue amount 0.3ml is filled
At being solidified in 25 degree, 10 minutes of rear placement room temperature.This hot melt adhesive leakproofness can achieve the desired results, but hot melt adhesive resistance to ag(e)ing
It is very poor to be easy for sticking up, while hot melt adhesive is white clear, it can be seen that magnetic head internal structure does not meet safety requirements, magnetic
The production cost of head assembly is 2.5 yuan/pcs.
Comparative example 4
It is filling using the progress of Kraft spy's silicon rubber, dispensing (need not heat) is carried out with dispenser, glue amount 0.3ml is filled
120 degree of high-temperature cabinet is placed after the completion of dress, is solidified within 20 minutes.Such single-component silicon rubber leakproofness and resistance to ag(e)ing can reach pre-
Phase effect, while hot melt adhesive is that Virgin's milk shape is opaque, can't see magnetic head internal structure and does not meet safety requirements, the life of head stack
Production cost is 2.55 yuan/pcs.
By using above-mentioned technical proposal disclosed by the invention, following beneficial effect has been obtained：The embodiment of the present invention carries
The anti-detection implementation method of magnetic head of confession replaces the prior art using the silicon rubber of quantitative one pack system, Low Temperature Thermal rapid curing type
The middle AB glue used, on the basis of ensureing sealing effect having the same, since silicon rubber is without the scene before carrying out use
Mixed preparing, so, operating process is simpler, moreover, silicon rubber does not require usage time, furthermore it is possible to relatively low
At a temperature of can realize solidification in very short time, therefore, greatly reduce technological requirement, shorten working hour, to
The cost that technique is realized in the anti-detection of magnetic head is greatly reduced, compared with the cost for using AB glue in the prior art, cost reduction
Up to 10%-15%.Further, since there is the silicon rubber used moisture-proof, ageing-resistant, electrical isolation, solidification to be not easy soon, after solidification
The characteristics such as fusing, so, obtained magnetic head has better ageing-resistant effect, and can use 7 years as long as will not be affected.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
Depending on protection scope of the present invention.
Claims (7)
1. a kind of anti-detection implementation method of magnetic head, which is characterized in that include the following steps：
S1 carries out patch to magnetic head pcb board, obtains patch magnetic head pcb board；
The patch magnetic head pcb board is welded with PCB decoding decks, obtains head stack by S2；
S3 carries out functional test to the head stack；
S4, by the canned magnetic head cavity to the head stack of the silicon rubber of quantitative one pack system, Low Temperature Thermal rapid curing type,
Obtain filling silicon rubber head stack；
S5 keeps the filling silicon rubber head stack 20 minutes under the conditions of 120 degree so that silicon rubber solidifies.
2. the anti-detection implementation method of magnetic head as described in claim 1, which is characterized in that S1 is specifically, using glass-fiber-plate or conjunction
The material of Cheng Shi made jig, and FPC soft boards were fixed on jig, to FPC soft arranging wires by SMT to decoding chip and outer
It encloses circuit and carries out patch.
3. the anti-detection implementation method of magnetic head as claimed in claim 2, which is characterized in that S2 is specifically, first by magnetic head by rule
Fixed direction is placed on welding fixture, is then aligned in the hole after attachment on FPC plates with magnetic head contact pin, and by flattening, is led to
It crosses electric soldering iron to be welded, amounts to 7 points of welding, 350 degree of welding temperature, duration 2-3 second ensures to weld complete Wuxi point
And/or rosin joint situation.
4. the anti-detection implementation method of magnetic head as claimed in claim 3, which is characterized in that S3 is specifically, the magnetic head after welding
Component is installed on head test jig, is powered on booting to the POS machine on jig, is entered head test interface, continuous positive and negative
To swiping the card 5 times, it is that test passes through that prompt success rate, which is 100%,.
5. the anti-detection implementation method of magnetic head as claimed in claim 4, which is characterized in that S4 is specifically, using dispenser by silicon
Vulcanizer is attached in the magnetic head cavity of the head stack.
6. the anti-detection implementation method of magnetic head as claimed in claim 5, which is characterized in that canned to arrive the head stack in S4
Magnetic head cavity in silicon rubber amount be 0.3ml.
7. the anti-detection implementation method of magnetic head as claimed in claim 6, which is characterized in that S5 is specifically, by the magnetic head after dispensing
Component is placed into the high-temperature cabinet that temperature is 120 degree, and holding is taken out after twenty minutes, obtains complete head stack.
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| CN201810443834.8A CN108629926B (en) | 2018-05-10 | 2018-05-10 | Magnetic head anti-detection implementation method |
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| CN201810443834.8A CN108629926B (en) | 2018-05-10 | 2018-05-10 | Magnetic head anti-detection implementation method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032105A (en) * | 1983-08-02 | 1985-02-19 | Canon Electronics Inc | Magnetic head |
| CN203232511U (en) * | 2013-04-25 | 2013-10-09 | 福建联迪商用设备有限公司 | Magnetic head waterproof and dustproof structure of POS machine |
| CN204029069U (en) * | 2014-08-21 | 2014-12-17 | 青岛海信智能商用系统有限公司 | Magnetic head, module of swiping the card and payment devices |
| CN204029372U (en) * | 2014-04-10 | 2014-12-17 | 太阳神(珠海)电子有限公司 | A kind of Novel information protection head stack and magnetic reader thereof |
| CN204946021U (en) * | 2015-09-21 | 2016-01-06 | 艾体威尔电子技术(北京)有限公司 | A kind of pos machine magnetic head signal protective device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102663852A (en) * | 2012-04-27 | 2012-09-12 | 福建联迪商用设备有限公司 | Magnetic head protecting mechanism and point-of-sale (POS) machine with same |
| CN206039744U (en) * | 2016-08-23 | 2017-03-22 | 深圳市新国都支付技术有限公司 | Magnetic head coil signal protection system, take POS machine of magnetic head coil signal protection system |
-
2018
- 2018-05-10 CN CN201810443834.8A patent/CN108629926B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032105A (en) * | 1983-08-02 | 1985-02-19 | Canon Electronics Inc | Magnetic head |
| CN203232511U (en) * | 2013-04-25 | 2013-10-09 | 福建联迪商用设备有限公司 | Magnetic head waterproof and dustproof structure of POS machine |
| CN204029372U (en) * | 2014-04-10 | 2014-12-17 | 太阳神(珠海)电子有限公司 | A kind of Novel information protection head stack and magnetic reader thereof |
| CN204029069U (en) * | 2014-08-21 | 2014-12-17 | 青岛海信智能商用系统有限公司 | Magnetic head, module of swiping the card and payment devices |
| CN204946021U (en) * | 2015-09-21 | 2016-01-06 | 艾体威尔电子技术(北京)有限公司 | A kind of pos machine magnetic head signal protective device |
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| CN108629926B (en) | 2020-09-22 |
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