CN106449480B - Reflow tool, semiconductor packaging method, semiconductor packaging piece and air conditioner - Google Patents

Abstract

The invention provides a reflow tooling, a semiconductor packaging method, a package, and an air conditioner. The reflow tooling includes: a carrier, which is used to carry a substrate on which a wafer is attached and a lead frame, and the carrier is provided with a first connecting part The bead, the bead is provided with a second connecting part, the bead is detachably connected with the carrier through the first connecting part and the second connecting part, and the bead is used to press the lead frame on the carrier and the substrate. This solution provides a reflow tooling. When semiconductor packaging is carried out, the substrate coated with solder paste, the wafer attached, and the lead frame plated with tin are first fixed on the tooling, and then reflowed to make the tin material on the substrate re- Melt and solidify to fix the wafer and the pins of the lead frame on the substrate, so that the process of thermocompression welding of the lead frame and the substrate is omitted. In addition, during reflow, the substrate and the lead frame are fixed by tooling to ensure the accuracy of the relative position of the substrate and the lead frame, thereby ensuring the quality of the product.

Description

Reflow tooling, semiconductor packaging method, semiconductor package and air conditioner

technical field

The present invention relates to the field of semiconductor packaging, and more specifically, relates to a reflow tooling, a semiconductor packaging method, a semiconductor package manufactured by the above-mentioned semiconductor packaging method, and an air conditioner with the above-mentioned semiconductor package.

Background technique

At present, in the semiconductor packaging industry, the substrate and the lead frame are usually welded together through a thermocompression welding process. During packaging production, it is necessary to reflow the substrate with the solder paste and the wafer bonded, and then use the thermocompression welding method to seal the untinned The lead frame is welded with the reflowed substrate, and the lead frame is tinned after the product has completed the plastic packaging process technology. The packaging process is relatively cumbersome. Moreover, during the thermocompression welding process, the relative positions of the lead frame and the substrate may change, resulting in misalignment of the lead frame and the substrate, which affects the quality of the product.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art.

Therefore, the first object of the present invention is to provide a reflow tool.

The second object of the present invention is to provide a semiconductor packaging method.

The third object of the present invention is to provide a semiconductor package manufactured by the above semiconductor packaging method.

A fourth object of the present invention is to provide an air conditioner including the above-mentioned semiconductor package.

In order to achieve the above object, the embodiment of the first aspect of the present invention provides a reflow tool for semiconductor packaging, including: a carrier, the carrier is used to carry the substrate and the lead frame on which the wafer is attached, and the carrier A first connecting part is provided on the tool; a bead is provided with a second connecting part, and the bead is detachably connected to the carrier through the cooperation of the first connecting part and the second connecting part, The pressing bar is used to press the lead frame on the carrier and the substrate.

This solution provides a reflow tooling. When semiconductor packaging is performed, the substrate with the solder paste and the wafer attached is placed on the corresponding position on the carrier, and then the tin-plated lead frame is placed on the corresponding position on the carrier. Paste the pins of the lead frame on the substrate, and then assemble the bead on the carrier. At this time, the bead presses the lead frame on the carrier, and the pins of the lead frame press the substrate on the carrier, so that the The substrate and lead frame are fixed, and then the substrate and lead frame fixed on the reflow tooling are reflowed to melt and solidify the tin material on the substrate again, so that the wafer and the pins of the lead frame are fixed on the substrate, which saves The process of thermocompression welding of the lead frame and the substrate is eliminated, which simplifies the process of semiconductor packaging, thereby improving the production efficiency of the product. Moreover, during reflow, the substrate and lead frame are fixed by the reflow tooling provided by this solution to ensure the accuracy of the relative position of the substrate and lead frame, prevent the misalignment of the lead frame and the substrate, and thus ensure the quality of the product.

Wherein, when the substrate and the lead frame are fixed on the reflow tooling, the bead presses the lead frame but does not cover the pins connected between the lead frame and the substrate and the substrate, so as to prevent the bead from affecting the reflow effect. Carriers and beading are made of high temperature resistant, low thermal conductivity materials, such as synthetic stone, which are generally required to withstand temperatures of 300°C or even higher.

In the above technical solution, preferably, the first fixing part includes a first magnet fixed on the carrier, the second fixing part includes a second magnet fixed on the bead, and the bead passes through The first magnet and the second magnet are attracted to be detachably connected to the carrier.

In this solution, a first magnet and a second magnet are respectively arranged on the carrier and the bead. When the carrier and the bead are opposite, the polarity of the first magnet and the second magnet are opposite, and the bead and the bead are attracted by the first magnet and the second magnet. The detachable connection of the carrier makes it easy to disassemble and assemble the bead and the carrier. It takes less time to fix the substrate and lead frame on the reflow tooling or remove it from the tooling, which can improve the production efficiency of the product.

It should be noted that the carrier and the pressing bar are also detachably connected through other matching methods, for example, matching sockets and plug posts are respectively provided on the carrier and the pressing bar.

In any of the above technical solutions, preferably, a substrate positioning portion is provided on the carrier, and the substrate positioning portion is used to limit the placement position of the substrate on the carrier.

Through the design of the substrate positioning part, the accuracy of the relative position between the substrate and the carrier can be guaranteed, and the deviation of the substrate can be avoided from affecting the fixing effect of the reflow tooling on the substrate and the subsequent reflow effect.

In any of the above technical solutions, preferably, the substrate positioning portion includes a receiving groove adapted to the substrate.

In this solution, the substrate positioning part is a receiving groove adapted to the substrate, and the substrate is placed in the receiving groove, so that the positioning effect is good, and the problem of the substrate being misaligned can be effectively avoided.

In any of the above technical solutions, preferably, a through hole is provided in the receiving groove and/or at an edge of the receiving groove.

The purpose of setting the through hole at the position of the receiving groove is to better heat the substrate during the reflow process to ensure the reflow effect, thereby fixing the wafer and the pins of the lead frame on the substrate.

In any of the above technical solutions, preferably, a lead frame positioning portion is provided on the carrier, and the lead frame positioning portion is used to limit the placement position of the lead frame on the carrier.

The design of the substrate positioning part can ensure the accuracy of the relative position of the lead frame and the carrier, thereby ensuring the accuracy of the relative position of the lead frame and the base, avoiding the misalignment of the lead frame and the base, and preparing for subsequent reflow.

In any of the above technical solutions, preferably, the lead frame is provided with a positioning hole, and the lead frame positioning part includes a positioning protruding pin, and when the substrate and the lead frame are placed on the carrier, the positioning The protruding pin is matched with the positioning hole.

In this solution, positioning protruding pins that match the positioning holes on the lead frame are provided on the carrier to ensure the accuracy of the relative position between the lead frame and the carrier. In this way, the structure of the positioning part of the lead frame is designed to be simple, and the processing difficulty of the reflow tooling is low.

In any of the above technical solutions, preferably, the bead is provided with a positioning groove, and when the bead is assembled on the carrier, the positioning groove cooperates with the positioning protruding pin to limit the distance between the bead and the positioning pin. The relative position of the vehicle.

In this solution, positioning grooves are provided at the corresponding positions of the bead, and when the bead is assembled on the carrier, the positioning groove cooperates with the positioning protruding pin to ensure the accuracy of the relative position of the bead and the carrier, thereby ensuring that the bead effectively compresses the lead frame, and Prevent bead misalignment from covering the leads and substrate of the lead frame.

In any of the above technical solutions, preferably, the positioning groove is a through groove, and the opening of the through groove opposite to the wall of the bottom groove is located at the edge of the first end of the bead.

Designing the positioning groove as a through groove makes it easier for the positioning protruding pins to enter the positioning groove, reducing the difficulty of the bead and the carrier, thereby shortening the time spent on fixing the substrate and lead frame on the reflow tooling and improving packaging efficiency.

In any of the above technical solutions, preferably, one of the second end of the bead and the carrier is provided with a limiting protrusion, and the other is provided with a limiting groove, and the bead is assembled to the carrier When it is on, the limiting groove is matched with the limiting protrusion.

In this scheme, a positioning groove and a positioning protruding pin are set at the first end of the bead and the carrier, and a limit groove and a limit protrusion are set at the second end of the bead and the carrier to limit the bead and the carrier to ensure that the bead The accuracy of the relative position with the carrier avoids the misalignment problem after the bead and the carrier are attracted, so as to prevent the misalignment of the lead frame and the substrate during the reflow process to ensure the packaging quality.

The embodiment of the second aspect of the present invention provides a semiconductor packaging method, including: providing a substrate, brushing solder paste on the substrate, and pasting a wafer; providing a lead frame, tinning the lead frame; The substrate is placed on the carrier of the reflow tool according to any embodiment of the first aspect of the present invention; the lead frame is placed on the carrier, and the pins of the lead frame are pasted on the substrate on; assemble the bead of the reflow tooling on the carrier to fix the lead frame and the substrate; reflow the substrate and the lead frame fixed on the reflow tooling, so that The substrate and the lead frame are welded together.

It should be noted that in the above semiconductor packaging method, the process of providing the substrate, brushing solder paste on it, and attaching the wafer is in no particular order with the process of providing the lead frame and tinning it, and the positions of the two can be interchanged.

When using the packaging method provided by this solution for semiconductor packaging, first brush solder paste on the substrate, attach the wafer, and tin-plate the lead frame, and then place the substrate with the brushed solder paste and attached wafer on the carrier Then place the tin-plated lead frame at the corresponding position on the carrier and paste the pins of the lead frame on the substrate, then assemble the bead on the carrier, and the bead will press the lead frame tightly on the carrier , and the pins of the lead frame press the substrate on the carrier, thereby fixing the substrate and the lead frame, and then reflow the substrate and the lead frame fixed on the reflow tooling, so that the tin material on the substrate is melted and solidified again, Thereby, the pins of the wafer and the lead frame are fixed on the substrate, so that the process of thermocompression welding of the lead frame and the substrate is omitted, the process of semiconductor packaging is simplified, and the production efficiency of the product is improved. And when the substrate and lead frame are reflowed, the reflow tool provided by this solution is fixed to ensure the accuracy of the relative position of the substrate and lead frame, prevent the misalignment of the lead frame and the substrate, and thus ensure the quality of the product.

The tin plating layer of the lead frame of the product produced by the semiconductor packaging method provided by this solution has traces of re-melting.

In the above technical solution, the semiconductor packaging method further includes: cleaning the reflowed substrate and the lead frame; bonding the wafer to the substrate so that the wafer and the substrate are electrically connected. connecting; plastic-sealing the substrate and the lead frame; cutting legs of the plastic-packed device, and shaping the lead frame.

The embodiment of the third aspect of the present invention provides a semiconductor package manufactured by the semiconductor packaging method provided in any embodiment of the second aspect of the present invention.

The semiconductor package provided by this solution is manufactured by a simplified semiconductor packaging method, and its production process is simpler than that of existing products, so the production efficiency of the product is higher and the production cost is lower. In addition, when the product is in the reflow process, it is fixed by the above-mentioned reflow tooling to prevent the misalignment of the lead frame and the substrate, thereby improving the pass rate of the product. In addition, the tin plating layer of the lead frame of the semiconductor package provided by this solution has traces of melting again.

The embodiment of the fourth aspect of the present invention provides an air conditioner, including the semiconductor package provided in any embodiment of the third aspect of the present invention.

The air conditioner provided by the embodiment of the fourth aspect of the present invention has the semiconductor package provided by any embodiment of the third aspect of the present invention, so the air conditioner has all the beneficial effects of the semiconductor package provided by any of the above embodiments, here No longer.

Additional aspects and advantages of the invention will become apparent in the description which follows, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

Fig. 1 is a schematic structural diagram of a reflow tooling provided in an embodiment of the present invention in a disassembled state;

Fig. 2 is a structural schematic diagram of another angle of the reflow tooling shown in Fig. 2;

Fig. 3 is a schematic structural view of the assembly state of the reflow tooling shown in Fig. 1;

Fig. 4 is a schematic structural view of the carrier shown in Fig. 1 when carrying a substrate and a lead frame;

Fig. 5 is a schematic structural view of the reflow tooling shown in Fig. 1 when fixing the substrate and the lead frame;

FIG. 6 is a schematic flow diagram of a semiconductor packaging method provided by an embodiment of the present invention;

FIG. 7 is a schematic flowchart of a semiconductor packaging method provided by another embodiment of the present invention.

Wherein, the corresponding relationship between the reference numerals and the part names in Fig. 1 to Fig. 5 is:

1 carrier, 11 first magnet, 12 receiving groove, 13 through hole, 14 positioning protruding pin, 15 limiting bump, 2 bead, 21 second magnet, 22 positioning groove, 23 limiting groove, 3 substrate, 4 crystal round, 5 leadframe.

Detailed ways

In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways than described here. Therefore, the protection scope of the present invention is not limited by the specific implementation disclosed below. Example limitations.

As shown in FIG. 1 to FIG. 5 , the embodiment of the first aspect of the present invention provides a reflow tool for semiconductor packaging, which includes: a carrier 1 and a bead 2 . Wherein, the carrier 1 is used to carry the substrate 3 on which the wafer 4 is attached and the lead frame 5 , and the carrier 1 is provided with a first connecting portion. The bead 2 is provided with a second connecting portion, and the bead 2 is detachably connected with the carrier 1 through the first connecting portion and the second connecting portion. The bead 2 is used to press the lead frame 5 on the carrier 1 and the substrate 3. superior.

This solution provides a reflow tooling. When semiconductor packaging is performed, the substrate 3 coated with solder paste and attached to the wafer 4 is placed on the corresponding position on the carrier 1, and then the tin-plated lead frame 5 is placed on the carrier. 1 and paste the pins of the lead frame 5 on the substrate 3, and then assemble the bead 2 on the carrier 1. At this time, the bead 2 presses the lead frame 5 on the carrier 1, and the lead frame 5 The pins press the substrate 3 on the carrier 1, thereby fixing the substrate 3 and the lead frame 5, and then reflow the substrate 3 and the lead frame 5 fixed on the reflow tooling, so that the tin material on the substrate 3 is melted again, Solidification, thereby fixing the pins of the wafer 4 and the lead frame 5 on the substrate 3, thus eliminating the process of thermocompression welding of the lead frame 5 and the substrate 3, simplifying the process of semiconductor packaging, thereby improving the production efficiency of the product . Moreover, the substrate 3 and the lead frame 5 are fixed by the reflow tooling provided by this solution during reflow, ensuring the relative position accuracy of the substrate 3 and the lead frame 5, preventing the misalignment of the lead frame 5 and the substrate 3, thereby ensuring the quality of the product.

Wherein, when the substrate 3 and the lead frame 5 are fixed on the reflow tooling, the bead 2 presses the lead frame 5 but does not cover the pins connected between the lead frame 5 and the substrate 3 and the substrate 3, so as to prevent the bead 2 from affecting the reflow effect. The carrier 1 and the bead 2 are made of materials with high temperature resistance and low thermal conductivity, such as synthetic stone, and it is generally required that the carrier 1 and the bead 2 can withstand a temperature of 300°C or even higher. The tin-plated layer of the lead frame 5 of the product produced through the above packaging process has traces of melting again.

As shown in Figure 1 and Figure 2, in the above technical solution, preferably, the first fixing part includes a first magnet 11 fixed on the carrier 1, and the second fixing part includes a second magnet 21 fixed on the bead 2 , the pressure strip 2 is detachably connected to the carrier 1 through the first magnet 11 and the second magnet 21 .

In this solution, the first magnet 11 and the second magnet 21 are respectively arranged on the carrier 1 and the bead 2. When the carrier 1 and the bead 2 face each other, the polarity of the first magnet 11 and the second magnet 21 are opposite. and the second magnet 21 to make the bead 2 detachably connected to the carrier 1, so that the bead 2 and the carrier 1 are designed to be easily disassembled, and the substrate 3 and the lead frame 5 are fixed on the reflow tooling or removed from the tooling. The required time is short, which can improve the production efficiency of the product.

Specifically, a plurality of magnets can be arranged at intervals on the carrier 1 and the bead 2 to improve connection reliability.

It should be noted that the carrier 1 and the bead 2 are also detachably connected by other matching means, for example, matching sockets and plug posts are respectively provided on the carrier 1 and the bead 2 .

In any of the above technical solutions, preferably, a substrate positioning portion is provided on the carrier 1 , and the substrate positioning portion is used to limit the placement position of the substrate 3 on the carrier 1 .

Through the design of the substrate positioning part, the relative position accuracy of the substrate 3 and the carrier 1 can be guaranteed, and the deflection of the substrate 3 can be prevented from affecting the fixing effect of the reflow tooling on the substrate 3 and the subsequent reflow effect.

In any of the above technical solutions, preferably, the fixing part of the substrate 3 includes a receiving groove 12 adapted to the substrate 3 .

In this solution, the fixing part of the substrate 3 is the receiving groove 12 adapted to the substrate 3, and the substrate 3 is placed in the receiving groove 12, so that the positioning effect is good, and the problem of the substrate 3 being misaligned can be effectively avoided.

In any of the above technical solutions, preferably, through holes are provided in the receiving groove 12 and/or on the edge of the receiving groove 12 .

The purpose of setting the through hole at the position of the receiving groove 12 is to make the substrate 3 be better heated during the reflow process to ensure the reflow effect, thereby fixing the wafer 4 and the pins of the lead frame 5 on the substrate 3 .

In any of the above technical solutions, preferably, a lead frame positioning portion is provided on the carrier 1 , and the lead frame positioning portion is used to limit the placement position of the lead frame 5 on the carrier 1 .

Through the design of the substrate positioning part, the accuracy of the relative position between the lead frame 5 and the carrier 1 can be ensured, thereby ensuring the accuracy of the relative position between the lead frame 5 and the base, avoiding misalignment between the lead frame 5 and the base, and preparing for subsequent reflow.

Specifically, multiple substrate positioning parts and multiple lead frame positioning parts can be set on the carrier 1, so that multiple groups of substrates 3 and lead frames 5 can be fixed at the same time, so that multiple groups of substrates 3 and lead frames 5 can be simultaneously fixed. Reflow is performed to improve the efficiency of semiconductor packaging production.

As shown in FIG. 4 , in any of the above technical solutions, preferably, the lead frame 5 is provided with a positioning hole, and the lead frame positioning part includes a positioning protruding pin 14. When the substrate 3 and the lead frame 5 are placed on the carrier 1, The positioning protruding pin 14 cooperates with the positioning hole.

In this solution, positioning protruding pins 14 that match the positioning holes on the lead frame 5 are provided on the carrier 1 to ensure the accuracy of the relative position of the lead frame 5 and the carrier 1. In this way, the structure of the positioning part of the lead frame is designed to be simple, and the reflow tooling The processing difficulty is low.

Preferably, the lead frame positioning part includes a plurality of positioning protruding pins 14 arranged at intervals and arranged in a line, and the multiple positioning protruding pins 14 are respectively inserted into the positioning holes of the corresponding positions of the lead frame 5. This design has a good positioning effect and can prevent the lead frame 5 from Rotate relative to carrier 1.

In any of the above technical solutions, preferably, the bead 2 is provided with a positioning groove 22. When the bead 2 is assembled on the carrier 1, the positioning groove 22 cooperates with the positioning protruding pin 14 to limit the relative position between the bead 2 and the carrier 1. Location.

In this solution, the corresponding position of the bead 2 is provided with a positioning groove 22. When the bead 2 is assembled on the carrier 1, the positioning groove 22 cooperates with the positioning protruding pin 14 to ensure the accuracy of the relative position of the bead 2 and the carrier 1, thereby ensuring The bead 2 effectively compresses the lead frame 5 and prevents the bead 2 from covering the pins of the lead frame 5 and the substrate 3 .

In any of the above technical solutions, preferably, the positioning groove 22 is a through groove, and the opening of the through groove opposite to the wall of the bottom groove is located at the edge of the first end of the bead 2 .

Designing the positioning groove 22 as a through groove makes it easier for the positioning protruding pin 14 to enter the positioning groove 22, which reduces the difficulty of the bead 2 and the carrier 1, thereby shortening the time spent on fixing the substrate 3 and the lead frame 5 on the reflow tooling, Improve packaging efficiency.

As shown in Figures 1 to 5, in any of the above technical solutions, preferably, one of the second end of the bead 2 and the carrier 1 is provided with a limiting protrusion 15, and the other is provided with a limiting groove 23, When the bead 2 is assembled on the carrier 1 , the limiting groove 23 cooperates with the limiting protrusion 15 .

In this scheme, a positioning groove 22 and a positioning protruding pin 14 are arranged at the first end of the bead 2 and the carrier 1, and a limit groove 23 and a limit protrusion 15 are arranged at the second end of the bead 2 and the carrier 1, and the bead 2 Limit the position with the carrier 1 to ensure the accuracy of the relative position of the bead 2 and the carrier 1, and avoid the misalignment problem after the bead 2 and the carrier 1 are attracted, so as to prevent the misalignment of the lead frame 5 and the substrate 3 during the reflow process. To ensure the packaging quality.

As shown in Figure 6, the embodiment of the second aspect of the present invention provides a semiconductor packaging method, including: Step 102 provides a substrate, brushes solder paste on the substrate, and pastes the wafer; Step 104 provides a lead frame, and on the lead frame Tin plating; step 106, placing the substrate on the carrier of the reflow tooling in any embodiment of the first aspect of the present invention; step 108, placing the lead frame on the carrier, and pasting the pins of the lead frame on the substrate; Step 110 assembles the bead of the reflow tooling on the carrier to fix the lead frame and the substrate; step 112 reflows the substrate and the lead frame fixed on the reflow tool to solder the substrate and the lead frame.

It should be noted that, in the above semiconductor packaging method, step 102 and step 104 are in no particular order, and the positions of the two can be interchanged.

When using the packaging method provided by this solution for semiconductor packaging, first brush solder paste on the substrate, attach the wafer, and tin-plate the lead frame, and then place the substrate with the brushed solder paste and attached wafer on the carrier Then place the tin-plated lead frame at the corresponding position on the carrier and paste the pins of the lead frame on the substrate, then assemble the bead on the carrier, and the bead will press the lead frame tightly on the carrier , and the pins of the lead frame press the substrate on the carrier, thereby fixing the substrate and the lead frame, and then reflow the substrate and the lead frame fixed on the reflow tooling, so that the tin material on the substrate is melted and solidified again, Thereby, the pins of the wafer and the lead frame are fixed on the substrate, so that the process of thermocompression welding of the lead frame and the substrate is omitted, the process of semiconductor packaging is simplified, and the production efficiency of the product is improved. And when the substrate and lead frame are reflowed, the reflow tool provided by this solution is fixed to ensure the accuracy of the relative position of the substrate and lead frame, prevent the misalignment of the lead frame and the substrate, and thus ensure the quality of the product.

The tin plating layer of the lead frame of the product produced by the semiconductor packaging method provided by this solution has traces of re-melting.

As shown in FIG. 7, in the above technical solution, the semiconductor packaging method further includes: step 114 cleaning the reflowed substrate and lead frame; step 116 bonding the wafer to the substrate to electrically connect the wafer to the substrate; Step 118 plastic-encapsulates the substrate and lead frame; step 120 cuts the legs of the plastic-encapsulated device and shapes the lead frame.

The embodiment of the third aspect of the present invention provides a semiconductor package manufactured by the semiconductor packaging method provided in any embodiment of the second aspect of the present invention.

The semiconductor package provided in the embodiment of the third aspect of the present invention is manufactured by the semiconductor packaging method provided in any embodiment of the second aspect of the present invention, so the semiconductor package has the advantages of the semiconductor packaging method provided in any of the above-mentioned embodiments All beneficial effects will not be repeated here.

The embodiment of the fourth aspect of the present invention provides an air conditioner, including the semiconductor package provided in any embodiment of the third aspect of the present invention.

The air conditioner provided by the embodiment of the fourth aspect of the present invention has the semiconductor package provided by any embodiment of the third aspect of the present invention, so the air conditioner has all the beneficial effects of the semiconductor package provided by any of the above embodiments, here No longer.

In the description of the present invention, the terms "first" and "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance, unless otherwise clearly specified and limited.

In the description of this specification, descriptions of the terms "one embodiment", "some embodiments", "specific embodiments" and the like mean that specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in the present invention In at least one embodiment or example of . In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. The terms "connection", "installation" and "fixation" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or through an intermediate The medium is indirectly connected. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (11)

1. The utility model provides a reflow tool for semiconductor package, its characterized in that includes:

The carrier is used for bearing the substrate pasted with the wafer and the lead frame, and a first connecting part is arranged on the carrier;

The pressing strip is provided with a second connecting part, the pressing strip is connected with the carrier in a detachable mode through the matching of the first connecting part and the second connecting part, and the pressing strip is used for pressing the lead frame on the carrier and the substrate;

The carrier is provided with a lead frame positioning part, and the lead frame positioning part is used for limiting the placing position of the lead frame on the carrier;

The lead frame is provided with a positioning hole, the positioning part of the lead frame comprises a positioning convex needle, and the positioning convex needle is matched with the positioning hole when the substrate and the lead frame are placed on the carrier;

The pressing strip is provided with a positioning groove, and when the pressing strip is assembled on the carrier, the positioning groove is matched with the positioning convex needle to limit the relative position of the pressing strip and the carrier;

And in the assembled state, one end of the pressing strip, which is far away from the base plate, exceeds the arrangement position of the positioning convex needle.

2. The reflow tool of claim 1,

The first connecting part comprises a first magnet fixed on the carrier, the second connecting part comprises a second magnet fixed on the pressing strip, and the pressing strip is connected with the carrier in a detachable mode through the first magnet and the second magnet in an attraction mode.

3. the reflow tool of claim 1,

The carrier is provided with a substrate positioning part which is used for limiting the placing position of the substrate on the carrier.

4. The reflow tool of claim 3,

The substrate positioning portion includes an accommodation groove adapted to the substrate.

5. The reflow tool of claim 4,

Through holes are formed in the containing groove and/or the edge of the containing groove.

6. the reflow tool of claim 1,

The positioning groove is a through groove, and an opening of the through groove, which is opposite to the bottom groove wall, is positioned at the edge of the first end of the pressing strip.

7. The reflow tool of claim 6,

One of the second end of the pressing strip and the carrier is provided with a limiting lug, the other one of the second end of the pressing strip and the carrier is provided with a limiting groove, and when the pressing strip is assembled on the carrier, the limiting groove is matched with the limiting lug.

8. A semiconductor packaging method, comprising:

Providing a substrate, brushing solder paste on the substrate, and adhering a wafer;

Providing a lead frame, and plating tin on the lead frame;

Placing the substrate on a carrier of a reflow tool of any one of claims 1 to 7;

Placing the lead frame on the carrier, and adhering the pins of the lead frame on the substrate;

Assembling a pressing strip of the reflow tool on the carrier so as to fix the lead frame and the substrate;

And reflowing the substrate fixed on the reflow tool and the lead frame so as to weld the substrate and the lead frame.

9. The semiconductor packaging method according to claim 8, further comprising:

cleaning the reflowed substrate and the reflowed lead frame;

Binding the wafer and the substrate to enable the wafer and the substrate to be electrically connected;

Carrying out plastic package on the substrate and the lead frame;

and cutting the pins of the device after plastic packaging, and shaping the lead frame.

10. A semiconductor package manufactured by the semiconductor packaging method according to claim 8 or 9.

11. An air conditioner, comprising the semiconductor package according to claim 10.