CN108624279A - 电子电器专用脱醇型密封胶 - Google Patents

电子电器专用脱醇型密封胶 Download PDF

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CN108624279A
CN108624279A CN201810366292.9A CN201810366292A CN108624279A CN 108624279 A CN108624279 A CN 108624279A CN 201810366292 A CN201810366292 A CN 201810366292A CN 108624279 A CN108624279 A CN 108624279A
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任天斌
安晓东
刘新
石祥凯
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SUZHOU DATONG ADVANCED MATERIAL CO Ltd
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    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
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Abstract

本发明涉及封装胶技术领域,特别是一种电子电器专用脱醇型密封胶,成分包括107胶、硅油、纳米碳酸钙、重质碳酸钙、甲基三甲氧基硅烷、硅烷改性树脂、复合偶联剂和螯合锡催化剂。本封装胶能够在高温高湿环境中保持较高的拉伸强度和伸长率,本密封胶有持久的粘接性,能够有效避免返原现象的发生,尤其适合电子电器产品上使用。

Description

电子电器专用脱醇型密封胶
技术领域
本发明涉及封装胶技术领域,特别涉及一种电子电器专用脱醇型密封胶。
背景技术
返原现象是硅橡胶因长时间热老化所引起的硫化橡胶模量和拉伸强度的下降。发生返原的原因是网状结构被破坏而形成一些环状结构。天然橡胶或合成聚异戊二烯当硫化在高温高湿环境下放置时间过长就时常会发生返原现象。若含橡胶成分的电子电器封装胶上出现返原现象,那么封装胶就会变脆裂开,导致密封失效,大气中的水分就能进入电器内部,导致短路、触电的危险。
本发明就是为了提供一种新的封装胶来解决以上问题。
发明内容
本发明的主要目的是为了提供一种电子电器专用脱醇型密封胶。
本发明通过如下技术方案实现上述目的:一种电子电器专用脱醇型密封胶,其特征在于成分包括:
具体的,所述密封胶还包括2-8质量份的R960型增白剂。
具体的,所述复合偶联剂由KH550、KH560、KH792按1:2:2质量比混合而成。
具体的,所述硅烷改性树脂为EST280树脂。
与现有技术相比,本发明电子电器专用脱醇型密封胶的有益效果在于:
本封装胶能够在高温高湿环境中保持较高的拉伸强度和伸长率,本密封胶有持久的粘接性,能够有效避免返原现象的发生,尤其适合电子电器产品上使用。
具体实施方式
本发明中107胶和硅油由美国道康宁公司提供。纳米碳酸钙是由日本竹原化学工业株式会社提供的平均粒径60nm的碳酸钙。重质碳酸钙是由欧米亚公司提供的2000目的碳酸钙。R960增白剂由美国杜邦公司提供。EST280硅烷改性树脂由日本钟化公司提供。复合偶联剂由KH550、KH560、KH792按1:2:2质量比混合而成,由迈图高新材料(中国)有限公司提供。螯合锡催化剂由日本日东化成产业株式会社提供。
以下实施例用于说明本发明,但不用来限制本发明的范围。
实施例1-4
对纳米碳酸钙和重质碳酸钙组成的颜填料预烘干处理,在110℃的环境中需脱水4h以上再进行使用;将107胶100份,硅油2-20份,纳米碳酸钙80-120份,重质碳酸钙30-70份,可加入增白剂2-8份,依次投入搅拌釜中,此过程,转速需保持1200r/min,开启真空,并打开加热装置,温度达120℃以上时,计时保温3h;转速保持600r/min降温至40℃以下,加入交联剂5-15份,真空保压搅拌60min,然后加入复合偶联剂2-5份,螯合锡催化剂0.5-2份,真空搅拌20min,得成品。
按照表1,
成分 实施例1 实施例2 实施例3 实施例4
107胶 100 100 100 100
硅油 20 2 11 15
纳米碳酸钙 80 120 96 100
重质碳酸钙 70 30 44 63
增白剂 - 2 8 5
甲基三甲氧基硅烷 5 15 10 12
硅烷改性树脂 10 30 20 15
复合偶联剂 2 5 3 4.6
螯合锡催化剂 2 0.5 1 1.2
以市售单组分脱醇型密封胶作为对照例,将密封胶成型于ppo基材上,在120℃高温、100%高湿环境下放置24小时,实验前后进行伸长率、拉伸强度测试,结果见表2。
表2电子电器专用脱醇型密封胶性能测试:
实施例1 实施例2 实施例3 实施例4 对照例
前伸长率/% 395 404 412 399 468
后伸长率/% 368 374 386 375 256
前拉伸强度/MPa 2.53 2.46 2.72 2.85 2.57
后拉伸强度/MPa 2.45 2.40 2.64 2.77 1.66
由表1可知,与对照例单组分脱醇型密封胶相比,实施例1-4所制得的封装胶经过24小时湿热实验能保持具有360%以上的伸长率和2.4MPa以上的拉伸强度,伸长率损失在拉伸强度损失在5%以内,拉伸强度损失在8%以内,表征了本密封胶有持久的粘接性,能够有效避免返原现象的发生,尤其适合电子电器产品上使用。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。

Claims (4)

1.一种电子电器专用脱醇型密封胶,其特征在于成分包括:
2.根据权利要求1所述的密封胶,其特征在于:还包括2-8质量份的R960型增白剂。
3.根据权利要求1所述的密封胶,其特征在于:所述复合偶联剂由KH550、KH560、KH792按1:2:2质量比混合而成。
4.根据权利要求1所述的密封胶,其特征在于:所述硅烷改性树脂为EST280树脂。
CN201810366292.9A 2018-04-23 2018-04-23 电子电器专用脱醇型密封胶 Pending CN108624279A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114350312A (zh) * 2022-01-27 2022-04-15 深圳诚立胜新材料科技有限公司 一种耐高温有机硅组合物及其制备方法

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CN102977840A (zh) * 2012-12-31 2013-03-20 上海回天化工新材料有限公司 耐湿热老化的太阳能组件用双组份硅酮密封胶及其制备方法
CN104559914A (zh) * 2015-01-28 2015-04-29 北京天山新材料技术有限公司 一种油面粘接室温硫化脱醇硅橡胶及其制备方法
CN104559191A (zh) * 2015-01-28 2015-04-29 北京天山新材料技术有限公司 一种油面粘接室温硫化脱肟硅橡胶及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
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CN102977840A (zh) * 2012-12-31 2013-03-20 上海回天化工新材料有限公司 耐湿热老化的太阳能组件用双组份硅酮密封胶及其制备方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114350312A (zh) * 2022-01-27 2022-04-15 深圳诚立胜新材料科技有限公司 一种耐高温有机硅组合物及其制备方法
CN114350312B (zh) * 2022-01-27 2023-06-27 深圳诚立胜新材料科技有限公司 一种耐高温有机硅组合物及其制备方法

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