CN108613023A - A kind of LED light of embedded serial drive control chip - Google Patents
A kind of LED light of embedded serial drive control chip Download PDFInfo
- Publication number
- CN108613023A CN108613023A CN201611225535.4A CN201611225535A CN108613023A CN 108613023 A CN108613023 A CN 108613023A CN 201611225535 A CN201611225535 A CN 201611225535A CN 108613023 A CN108613023 A CN 108613023A
- Authority
- CN
- China
- Prior art keywords
- ring
- temperature
- uniforming plate
- radiator structure
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
- F21V5/048—Refractors for light sources of lens shape the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
Abstract
The present invention relates to a kind of LED light of embedded serial drive control chip, including LED luminescence units, temperature-uniforming plate（1）And radiator structure（2）, wherein LED luminescence units are fixed on temperature-uniforming plate（1）Top, radiator structure（2）It is fixed on temperature-uniforming plate（1）Lower section, it is characterised in that：Radiator structure（2）With temperature-uniforming plate（1）Between pass through graphite patch（8）It conducts heat.The present invention is equipped with graphite patch between radiator structure and temperature-uniforming plate, and graphite patch has good thermal conductivity, compared to the use that traditional structure reduces by one layer of heat conductive silica gel, greatly improves radiating efficiency.
Description
Technical field
The present invention relates to a kind of LED lamps and lanterns, more particularly, to a kind of LED light of embedded serial drive control chip.
Background technology
As LED luminescence chips luminous efficiency is constantly promoted, LED illumination substitution traditional lightings have been within sight
.The luminous efficiency of lamps and lanterns is other than the LED chips luminous efficiencies of itself, the optics of encapsulation procedure and lamps and lanterns, mechanism, driving
The designs such as power supply, heat dissipation are all very crucial.
Optical design is the design for needing to make lamp light source light distribution of user, in addition in the saturating of lens and reflective mirror
Light and reflected light design are the light efficiency of relationship lamps and lanterns.The high conversion efficiency of driving power, represents low in energy consumption, and light efficiency just carries naturally
It rises.Good heat dissipation design can reduce the light decay of lamps and lanterns, increase light school, prolonging service lives of lamps.
The advantage of integrated packaging power source is that close to traditional point light source, area is small, lamp assembled is convenient, but disadvantage is
Chip is excessively concentrated, especially high to cooling requirements, therefore common integrated packaging power source, and power, dare not all within 60W
Do too high power.Temperature-uniforming plate quick conductive, short, small, light advantage are from the application of electronic product radiating, in LED lamps
The heat dissipation of tool is slowly used, but also needs to use heat-conducting cream in each heat dissipation interface to fill up the gap between interface, is avoided
Air remains, its thermal coefficient of heat-conducting cream about between 1-6, imitate by the heat conduction compared to copper, aluminium, ceramic substrate, temperature-uniforming plate etc.
Fruit, heat-conducting cream become a thermal resistance, and after heat-conducting cream long-time use, are easy to cure instead, influence heat-conducting effect, therefore
Lamps and lanterns more preferably heat dissipation effect is pursued, heat-conducting cream how is reduced or replace, lamps and lanterns heat dissipation design is regarded very crucial.
In addition, to deal with LED lamps and lanterns use occasion difference and cooling requirements, different molds are generally required, mold is caused
More, cost is high.In terms of optical lens, in order to reduce cost, plastic material is generally used, but is be easy to cause old
Change deformation, influences light transmittance and and water resistance when being in direct contact outside air.
Invention content
In order to solve above-mentioned technical problem, present invention employs following scheme：
A kind of LED light of embedded serial drive control chip, including LED luminescence units, temperature-uniforming plate（1）And radiator structure
（2）, wherein LED luminescence units are fixed on temperature-uniforming plate（1）Top, radiator structure（2）It is fixed on temperature-uniforming plate（1）Lower section, it is special
Sign is：Radiator structure（2）With temperature-uniforming plate（1）Between pass through graphite patch（8）It conducts heat.
Further, it is additionally provided with glass lens above the LED luminescence units（7）, the glass lens（7）Pass through branch
Pushing out ring（6）, lens chuck ring（73）And lens chuck ring screw（72）Cooperation be fixed, glass lens（7）It is clamped in support
Ring（6）With lens chuck ring（73）Between, lens chuck ring screw（72）Across support ring（6）And lens chuck ring（73）And it is fixed on scattered
Heat structure（2）On.
Further, the first rubber ring（61）With third rubber ring（71）It is separately positioned on lens chuck ring（73）Bottom two is solely
In vertical groove；Wherein, the first rubber ring（61）Seal support ring（6）With lens chuck ring（73）Between gap, third rubber ring
（71）Seal glass lens（7）With sealing support ring（6）Between gap；Second rubber ring（62）It is arranged in support ring（6）Bottom
In portion's groove, the second rubber ring（62）Seal support ring（6）With radiator structure（2）Between gap.
Further, lens chuck ring screw（72）Nut below be equipped with trapezoidal rubber washer（723）, trapezoidal rubber washer
（723）Lower section be equipped with trapezoidal faces（722）, one and the trapezoidal faces are cased in lead screw（722）Matched trapezoidal rubber washer
（723）, lens chuck ring（73）Screwhole position also has trapezoidal faces, size and rubber washer（723）Outer trapezoidal faces formation interferes
And sealing.
Further, radiator structure（2）By multiple radiating fins（22）Composition, radiator structure（2）With temperature-uniforming plate（1）Connection
Face is equipped with multiple ventilation holes（21）.
Further, LED luminescence units include circuit layer（31）, multiple LED chips（4）, gold thread（44）And reflecting piece
Holder（43）, multiple LED chips（4）It is arranged in circuit layer（31）Above and by reflective plate rack（43）It surrounds, often row LED chips
（4）Pass through gold thread（44）With multiple circuit layers（31）Connect into series circuit（311）, all LED chips of each column（4）All simultaneously
Connection is connected to two adjacent circuit layers（31）Between form parallel circuit（312）, in circuit layer（31）It is equipped with and external world's electricity
The positive electricity polar contact of source connection（313）With negative electricity polar contact（314）.
Further, in each LED chips（4）On be cased with a reflector（45）, reflector（45）Inside be halfpace structure or
Frustum structure.
Further, in reflector（45）In be filled with fluorescent powder（41）.
Further, circuit layer（31）On positive electricity polar contact（313）With negative electricity polar contact（314）Respectively with cable（34）
Two electric wires of one end（33）Connection, cable（34）The other end is equipped with a waterproof connector（341）；Cable（34）Across heat dissipation
Structure（2）And pass through two waterproof end plugs（324）With radiator structure（2）Upper through-hole is sealed.
Further, in temperature-uniforming plate（1）Edge is equipped with temperature-uniforming plate pressure ring（15）, temperature-uniforming plate pressure ring screw（16）It sequentially passes through
Temperature-uniforming plate pressure ring（15）, temperature-uniforming plate（1）Edge, graphite patch（8）And radiator structure（2）And it is fixed.
LED light of the embedded serial drive control chip and preparation method thereof has the advantages that：
（1）The present invention is equipped with graphite patch between radiator structure and temperature-uniforming plate, and graphite patch has good thermal conductivity, compares
Traditional structure reduces the use of one layer of heat conductive silica gel, greatly improves radiating efficiency.
（2）The present invention avoids LED chips due to forming a reflector on each LED chips by chip set
The light sent out stops each other, with the heat dissipation capacity for increasing LED chip light-emitting efficiencies He reducing chip.
（3）Reflector is back taper platform structure or inverted trapezoidal platform structure in the present invention, compares existing white light LEDs lamps and lanterns, can
To reduce the usage amount of fluorescent powder, but the brightness of illumination of lamps and lanterns improves instead.
（4）The present invention is set on lens chuck ring and support ring there are three rubber ring, which prevents respectively
It intakes, ensure that between mirror pressure ring and support ring, between lens chuck ring and glass lens and between support ring and radiator structure
The drying property of circuit, avoids short circuit.
（5）The present invention is equipped with multiple ventilation holes on the joint face of radiator structure and temperature-uniforming plate, so that radiator structure
Heat transfer can be not only carried out, hot transmission can also be carried out using cross-ventilation, improve heat-transfer effect.
（6）The present invention, using glass material, solves lens aging, problem on deformation, does not have deformation in terms of optical lens
Problem and waterproof problem when lens being caused to be in direct contact outside air.
（7）It uses honeycomb supporter inside temperature-uniforming plate of the present invention, utilizes the robustness and high intensity of honeycomb
Advantage avoids caving between the above, the lower lid, while cellular porous structure will not generate any resistance to working-fluid flow
Hinder, working fluid can carry out flow at high speed and heat transfer in honeycomb cavity, therefore support effect and heat-transfer effect may be implemented
Largest optimization.
Description of the drawings
Fig. 1：The schematic elevation view of the LED light of embedded serial drive control chip of the present invention；
Fig. 2：The side structure schematic view of the LED light of embedded serial drive control chip of the present invention；
Fig. 3：The vertical view of Fig. 2；
Fig. 4：The LED light of embedded serial drive control chip of the present invention（Add reflector）Side view；
Fig. 5：The vertical view of Fig. 4.
Specific implementation mode
With reference to specific embodiment, the present invention is described in detail.Following embodiment will be helpful to the technology of this field
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill of this field
For personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made.These belong to the present invention
Protection domain.
With reference to Fig. 1 to Fig. 5, the present invention will be further described：
As shown in Figure 1, " chip on board " in the LED light of embedded serial drive control chip refers to by chip direct package equal
On warm plate, concrete structure is as follows：
1 inner wall of temperature-uniforming plate has been attached into capillary structure 12, has been supported, 11 temperature-uniforming plate is sealed, and stays there are one inlet 13,
The dielectric of a floor height heat conduction is coated in 1 upper lid surface of temperature-uniforming plate, forms an insulating medium layer 32.
A circuit layer 31 is made on this insulating medium layer 32 again, through die bond, beat gold thread, upper reflective plate rack 43, plus
Phosphor powder 41（White light source is made just to need）Equal processing procedures, complete first stage processing procedure.
The structure of the above processing procedure will be completed, working fluid is added in inlet 13 and vacuumized, then by inlet 13
Seal the processing procedure for completing chip on board.
Temperature-uniforming plate 1：Metal material, generally metal material, such as copper or aluminium.Shape is square, round or rectangle.Injection
Mouth 13：It is used to vacuumize and injecting working fluid.
4 surrounding of LED chips places reflective plate rack 43, and light is put together, light efficiency can be increased.
As shown in Fig. 3, multiple LED chips 4 are arranged on circuit layer 31 and are surrounded by reflective plate rack 43, often go
LED chips 4 connect into series circuit 311 by gold thread 44 and multiple circuit layers 31, and all LED chips 4 of each column are all simultaneously
Connection forms parallel circuit 312 between being connected to two adjacent circuit layers 31, is equipped on circuit layer 31 and connects with extraneous power supply
The positive electricity polar contact 313 and negative electricity polar contact 314 connect.Therefore, 31 circuit design of circuit layer is to go here and there and even mode, will not be because of
It is normal shinny not interfere with other LED chips 4 for a wherein chips failure.
As shown in Fig. 4 and Fig. 5, reflector 45 is sleeved on each 4 top of LED chips, makes 4 side of LED chips
Light is reflected, and light efficiency is increased.45 cooperated with LED chip of reflector, 4 arrangement mode, it is integrated in a manner of plastic shaping
Molding.Insulating medium layer 32 is equipped between temperature-uniforming plate 1 and LED luminescence units, LED luminescence units include circuit layer 31, multiple
LED chips 4, gold thread 44 and reflective plate rack 43, multiple LED chips 4 are arranged on circuit layer 31 and by reflecting piece branch
Frame 43 surrounds.Temperature-uniforming plate 1 includes the cavity that temperature-uniforming plate upper cover plate and temperature-uniforming plate lower cover are composed, and wall has in the cavity
One layer of capillary structure 12.It is supported by supporter 11 between the above, the lower lid.It is additionally provided with glass above LED luminescence units
Glass lens 7, glass lens 7 are fixed by the cooperation of support ring 6, lens chuck ring 73 and lens chuck ring screw 72, glass
Glass lens 7 are clamped between support ring 6 and lens chuck ring 73, and lens chuck ring screw 72 passes through support ring 6 and lens chuck ring
It 73 and is fixed on radiator structure 2.LED luminescence units are sealed waterproof by arranged below：First rubber ring, 61 He
Third rubber ring 71 is separately positioned in the independent grooves of lens chuck ring 73 bottom two；Wherein, the first rubber ring 61 sealing branch
Gap between pushing out ring 6 and lens chuck ring 73, between 71 seal glass lens 7 of third rubber ring and sealing support ring 6
Gap；Second rubber ring 62 is arranged in 6 bottom groove of support ring, and the second rubber ring 62 seals support ring 6 and tied with heat dissipation
Gap between structure 2.There is also waterproof sealings with lens chuck ring 73 for lens chuck ring screw 72, pass through following mechanism and mode
It realizes：Trapezoidal rubber washer 723 is equipped with below the nut of lens chuck ring screw 72, the lower section of trapezoidal rubber washer 723 is equipped with
Trapezoidal faces 722 are cased with one and the matched trapezoidal rubber washer 723 of the trapezoidal faces 722,73 screw hole of lens chuck ring in lead screw
Position also has trapezoidal faces, size to interfere and seal with the formation of 723 outer trapezoidal faces of rubber washer.In addition, lens chuck ring screw
Screw gasket 721 is additionally provided between 72 nut and lens chuck ring 73, Screw gasket 721 is more than 73 screw hole of lens chuck ring
Area.
Prevent rainwater from entering in 73 screw hole of lens chuck ring it can be seen that Screw gasket 721 can play, while lens pressure
The nut of ring screw 72, which is equipped with trapezoidal rubber washer 723, further to prevent rainwater from entering in LED luminescence units.
As described above, although the present invention has been indicated and described with reference to specific preferred embodiment, must not explain
For the limitation to invention itself.Without prejudice to the spirit and scope of the invention as defined in the appended claims,
It can various changes can be made in the form and details to it.
Claims (1)
1. a kind of LED light of embedded serial drive control chip, including LED luminescence units, temperature-uniforming plate (1) and radiator structure
(2), wherein LED luminescence units are fixed on above temperature-uniforming plate (1), and radiator structure (2) is fixed below temperature-uniforming plate (1),
It is characterized in that：It is conducted heat by graphite patch (8) between radiator structure (2) and temperature-uniforming plate (1)；It shines in the LED
It is additionally provided with glass lens (7) above unit, the glass lens (7) passes through support ring (6), lens chuck ring (73) and lens
The cooperation of pressure ring screw (72) is fixed, and glass lens (7) is clamped between support ring (6) and lens chuck ring (73),
Lens chuck ring screw (72) passes through support ring (6) and lens chuck ring (73) and is fixed on radiator structure (2)；First rubber
Ring (61) and third rubber ring (71) are separately positioned in the independent grooves of lens chuck ring (73) bottom two；Wherein, the first rubber
Rubber ring (61) seals the gap between support ring (6) and lens chuck ring (73), third rubber ring (71) seal glass lens
(7) gap between sealing support ring (6)；Second rubber ring (62) is arranged in support ring (6) bottom groove, and second
Rubber ring (62) seals the gap between support ring (6) and radiator structure (2)；Below the nut of lens chuck ring screw (72)
Equipped with trapezoidal rubber washer (723), the lower section of trapezoidal rubber washer (723) is equipped with trapezoidal faces (722), and one is cased in lead screw
With the matched trapezoidal rubber washer (723) of the trapezoidal faces (722), lens chuck ring (73) screwhole position also has trapezoidal faces, greatly
It is small to interfere and seal with the outer trapezoidal faces formation of rubber washer (723)；Radiator structure (2) is by multiple radiating fins (22)
Composition, radiator structure (2) and the joint face of temperature-uniforming plate (1) are equipped with multiple ventilation holes (21)；LED luminescence units include electricity
Road floor (31), multiple LED chips (4), gold thread (44) and reflective plate rack (43), multiple LED chips (4) are arranged in electricity
It is surrounded on road floor (31) and by reflective plate rack (43), often row LED chips (4) pass through gold thread (44) and multiple circuit layers
(31) series circuit (311) is connected into, all LED chips (4) of each column are all connected in two adjacent circuit layers in parallel
(31) parallel circuit (312) is formed between, and the positive electricity polar contact (313) being connect with extraneous power supply is equipped on circuit layer (31)
With negative electricity polar contact (314)；It is cased with a reflector (45) on each LED chips (4), is halfpace inside reflector (45)
Structure or frustum structure；Fluorescent powder (41) is filled in reflector (45)；Positive electricity polar contact on circuit layer (31)
(313) it is connect respectively with two electric wires (33) of cable (34) one end with negative electricity polar contact (314), cable (34)
The other end is equipped with a waterproof connector (341)；Cable (34) passes through radiator structure (2) and passes through two waterproof end plugs (324)
It is sealed with through-hole on radiator structure (2)；It is equipped with temperature-uniforming plate pressure ring (15), temperature-uniforming plate pressure ring in temperature-uniforming plate (1) edge
Screw (16) sequentially passes through temperature-uniforming plate pressure ring (15), temperature-uniforming plate (1) edge, graphite patch (8) and radiator structure (2)
And it is fixed；Temperature-uniforming plate (1) includes upper cover body ontology and lower cover ontology, between upper cover body ontology and lower cover ontology
Supporter (11) is honeycomb, and temperature-uniforming plate (1) inner support body (11) is by the unilateral thin slice of plural pieces honeycomb (111) group
At, shape hexagonal honeycomb hole (112) in a row between the adjacent unilateral thin slice of two panels honeycomb (111), the bee on supporter (11)
Socket bore (112) forms process fluid passages between upper cover body ontology and lower cover ontology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611225535.4A CN108613023A (en) | 2016-12-27 | 2016-12-27 | A kind of LED light of embedded serial drive control chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611225535.4A CN108613023A (en) | 2016-12-27 | 2016-12-27 | A kind of LED light of embedded serial drive control chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108613023A true CN108613023A (en) | 2018-10-02 |
Family
ID=63658260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611225535.4A Withdrawn CN108613023A (en) | 2016-12-27 | 2016-12-27 | A kind of LED light of embedded serial drive control chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108613023A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114543572A (en) * | 2022-03-10 | 2022-05-27 | 山东大学 | Soaking plate with honeycomb-like structure composite liquid absorption core, radiator and electronic equipment |
-
2016
- 2016-12-27 CN CN201611225535.4A patent/CN108613023A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114543572A (en) * | 2022-03-10 | 2022-05-27 | 山东大学 | Soaking plate with honeycomb-like structure composite liquid absorption core, radiator and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181002 |
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| WW01 | Invention patent application withdrawn after publication |