CN108565225B - 一种led封装金属线的测试方法及装置 - Google Patents
一种led封装金属线的测试方法及装置 Download PDFInfo
- Publication number
- CN108565225B CN108565225B CN201810222422.1A CN201810222422A CN108565225B CN 108565225 B CN108565225 B CN 108565225B CN 201810222422 A CN201810222422 A CN 201810222422A CN 108565225 B CN108565225 B CN 108565225B
- Authority
- CN
- China
- Prior art keywords
- packaging
- metal wire
- heating
- led chip
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 98
- 239000002184 metal Substances 0.000 title claims abstract description 53
- 238000012360 testing method Methods 0.000 title claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 239000000084 colloidal system Substances 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 12
- 239000011324 bead Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810222422.1A CN108565225B (zh) | 2018-03-19 | 2018-03-19 | 一种led封装金属线的测试方法及装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810222422.1A CN108565225B (zh) | 2018-03-19 | 2018-03-19 | 一种led封装金属线的测试方法及装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108565225A CN108565225A (zh) | 2018-09-21 |
CN108565225B true CN108565225B (zh) | 2024-05-24 |
Family
ID=63531695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810222422.1A Active CN108565225B (zh) | 2018-03-19 | 2018-03-19 | 一种led封装金属线的测试方法及装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108565225B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212390A (en) * | 1992-05-04 | 1993-05-18 | Motorola, Inc. | Lead inspection method using a plane of light for producing reflected lead images |
CN101170155A (zh) * | 2007-12-03 | 2008-04-30 | 重庆大学 | 一种带led缺陷检测装置的焊线机 |
JP2009290032A (ja) * | 2008-05-29 | 2009-12-10 | Sharp Corp | 評価解析システム及びプローブカード |
CN102144307A (zh) * | 2008-07-03 | 2011-08-03 | 三星Led株式会社 | 发光二极管封装件和具有该发光二极管封装件的背光单元 |
CN204666522U (zh) * | 2015-04-09 | 2015-09-23 | 杭州市质量技术监督检测院 | Led芯片结构的成像测量装置 |
CN105023989A (zh) * | 2014-04-30 | 2015-11-04 | 广东爱华新光电科技有限公司 | 一种led制作方法 |
CN205944043U (zh) * | 2016-08-17 | 2017-02-08 | 鸿利智汇集团股份有限公司 | 一种led金线检测装置 |
CN208045454U (zh) * | 2018-03-19 | 2018-11-02 | 厦门多彩光电子科技有限公司 | 一种led封装金属线的测试装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050199899A1 (en) * | 2004-03-11 | 2005-09-15 | Ming-Der Lin | Package array and package unit of flip chip LED |
-
2018
- 2018-03-19 CN CN201810222422.1A patent/CN108565225B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212390A (en) * | 1992-05-04 | 1993-05-18 | Motorola, Inc. | Lead inspection method using a plane of light for producing reflected lead images |
CN101170155A (zh) * | 2007-12-03 | 2008-04-30 | 重庆大学 | 一种带led缺陷检测装置的焊线机 |
JP2009290032A (ja) * | 2008-05-29 | 2009-12-10 | Sharp Corp | 評価解析システム及びプローブカード |
CN102144307A (zh) * | 2008-07-03 | 2011-08-03 | 三星Led株式会社 | 发光二极管封装件和具有该发光二极管封装件的背光单元 |
CN105023989A (zh) * | 2014-04-30 | 2015-11-04 | 广东爱华新光电科技有限公司 | 一种led制作方法 |
CN204666522U (zh) * | 2015-04-09 | 2015-09-23 | 杭州市质量技术监督检测院 | Led芯片结构的成像测量装置 |
CN205944043U (zh) * | 2016-08-17 | 2017-02-08 | 鸿利智汇集团股份有限公司 | 一种led金线检测装置 |
CN208045454U (zh) * | 2018-03-19 | 2018-11-02 | 厦门多彩光电子科技有限公司 | 一种led封装金属线的测试装置 |
Non-Patent Citations (4)
Title |
---|
"LED封装胶体与引线框架热失配可视化研究";朱本明;"LED封装胶体与引线框架热失配可视化研究";I135-67 * |
LED封装技术发展的研究与展望;熊新华;刘芳娇;王琦;;新材料产业(第12期);第12页1.LED正装芯片封装 * |
发光二极管固晶品质检测教学模型研究;杜中一;于雯雯;刘畅;;考试周刊(第A0期);全文 * |
高性能LED封装材料的制备和研究;郑剑飞;;电子世界(第18期);全文 * |
Also Published As
Publication number | Publication date |
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CN108565225A (zh) | 2018-09-21 |
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Effective date of registration: 20240418 Address after: Building 1, No. 57, Jinfu Avenue, Gunan Street, Qijiang District, Chongqing 400000 (self-promised) Applicant after: Chongqing XinShiTong Intelligent Technology Co.,Ltd. Country or region after: China Address before: No. 8021, Xiang'an West Road, torch high tech Zone (Xiang'an) Industrial Zone, Xiamen, Fujian Province Applicant before: XIAMEN DACOL PHOTOELECTRONICS TECHNOLOGY Co.,Ltd. Country or region before: China |
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