CN108538965A - Silicon chip wafer separator - Google Patents
Silicon chip wafer separator Download PDFInfo
- Publication number
- CN108538965A CN108538965A CN201810690241.1A CN201810690241A CN108538965A CN 108538965 A CN108538965 A CN 108538965A CN 201810690241 A CN201810690241 A CN 201810690241A CN 108538965 A CN108538965 A CN 108538965A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- sucker
- flower basket
- workbench
- chip flower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 146
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 144
- 239000010703 silicon Substances 0.000 title claims abstract description 144
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 239000012634 fragment Substances 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 9
- 238000001179 sorption measurement Methods 0.000 abstract description 2
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 210000002268 wool Anatomy 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 235000008216 herbs Nutrition 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000011143 downstream manufacturing Methods 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of silicon chip wafer separators, including workbench, clamping device, side sucker, top sucker, the working face of the workbench is equipped with the silicon chip flower basket supporting region for carrying silicon chip flower basket, the clamping device is located above the working face of the workbench, the side sucker is located at the side of the silicon chip flower basket supporting region on the workbench, the top sucker is located at the top of the silicon chip flower basket supporting region on the workbench, the side sucker and top sucker are inserted into from the side of silicon chip flower basket and top in silicon chip flower basket respectively at work.Above-mentioned silicon chip wafer separator, it is not necessary that the silicon chip in silicon chip flower basket is taken out in advance, the silicon chip being pulled together can be separated in silicon chip flower basket, fragment efficiency is improved by the synergic sorption of side sucker and top sucker simultaneously, it reduces the silicon chip in Slicing procedure and fragment and the hidden probability split occurs, the whole-course automation operation for realizing silicon chip fragment, is not necessarily to artificial treatment.
Description
Technical field
The present invention relates to silicon chip process technology fields, more particularly to a kind of silicon chip wafer separator.
Background technology
During silicon chip carries out one texture-etching side in black silicone groove type machine, the two panels silicon in the same basket tooth of silicon chip flower basket
Sector-meeting is completed the silicon chip of surface wool manufacturing after black silicone groove type machine comes out, is needed since the tension force effect of liquid is pulled together two-by-two
The silicon chip being pulled together in silicon chip flower basket is separated, making herbs into wool cleaning chain type machine could be entered and carry out silicon wafer surface cleaning, dry
Dry and subsequent inspection, packaging.At present for silicon chip fragment take be artificial fragment method, not only fragment efficiency it is low, hold
Easily cause fragment and it is hidden split, the acid-base solution being mingled in silicon chip can also damage the health of worker.
Invention content
Based on this, it is necessary to it is low for the artificial fragment efficiency of silicon chip, unstable quality, easily cause the problem of Health cost,
A kind of silicon chip wafer separator is provided.
A kind of silicon chip wafer separator, including workbench, clamping device, side sucker, top sucker, the workbench
Working face is equipped with the silicon chip flower basket supporting region for carrying silicon chip flower basket, and the clamping device is located at the workbench
Above working face, the working face for silicon chip flower basket to be fixed on to the workbench by clamping action, the side
Terminal sucker is located at the side of the silicon chip flower basket supporting region on the workbench, and the top sucker is located on the workbench
Silicon chip flower basket supporting region top, the side sucker and top sucker are at work respectively from the side of silicon chip flower basket and top
End is inserted into silicon chip flower basket.
Above-mentioned silicon chip wafer separator can will be attracted without taking out in advance the silicon chip in silicon chip flower basket in silicon chip flower basket
Silicon chip together separates, and the continuous operation between silicon chip upstream and downstream processing equipment may be implemented, while inhaling by side
The synergic sorption of disk and top sucker improves fragment efficiency, reduces the silicon chip in Slicing procedure and fragment occurs and hidden split
Probability, the daily output of separate unit fragment machine up to 170,000, can realize the whole-course automation operation of silicon chip fragment, without artificial place
Reason.
The clamping device is cylinder clamping device in one of the embodiments, and the cylinder clamping device includes phase
For silicon chip flower basket supporting region X to cylinder and Y-direction cylinder.
The side sucker and top sucker are micropore ceramics vacuum cup in one of the embodiments,.
The side sucker is opposite along the leading screw being set on the working face of workbench in one of the embodiments,
Position movement is carried out in silicon chip flower basket.
The side sucker is electrically connected with servo motor in one of the embodiments,.
The robot device of the top sucker and peripheral hardware connects in one of the embodiments,.
Description of the drawings
Fig. 1 is the silicon chip wafer separator structural schematic diagram of the embodiment of the present invention (sucker is not drawn into)；
Fig. 2 is position view of the side sucker of the silicon chip wafer separator of the embodiment of the present invention before being inserted into silicon chip flower basket；
Fig. 3 is position view of the side sucker of the silicon chip wafer separator of the embodiment of the present invention after being inserted into silicon chip flower basket；
Fig. 4 be the embodiment of the present invention silicon chip wafer separator side sucker after being inserted into silicon chip flower basket, top sucker insertion
Position view before silicon chip flower basket；
Fig. 5 is that the side sucker of the silicon chip wafer separator of the embodiment of the present invention and silicon chip in the sucker suction silicon chip flower basket of top have
The position view of body position；
Fig. 6 be the embodiment of the present invention silicon chip wafer separator top sucker suction silicon chip after robot device drive under will
The schematic diagram that the silicon chip being sucked moves up；
Fig. 7 is the schematic diagram of the side sucker vacuum breaker backed off after random silicon chip flower basket of the silicon chip wafer separator of the embodiment of the present invention；
Fig. 8 is showing for the silicon chip that the top sucker suction of the silicon chip wafer separator of the embodiment of the present invention has been detached with side sucker
It is intended to.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.Keep the understanding to the disclosure more thorough on the contrary, purpose of providing these embodiments is
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more phases
Any and all combinations of the Listed Items of pass.
As shown in figures 1-8, silicon chip wafer separator 100 of the invention, including workbench 110, clamping device 120, side suction
Disk 130, top sucker 140, the working face of the workbench 110 is equipped with to be held for carrying the silicon chip flower basket of silicon chip flower basket
Area is carried, the clamping device 120 is located above the working face of the workbench 110, for silicon chip flower basket to be passed through clamping
Effect is fixed on the working face of the workbench 110, and the side sucker 130 is located on the workbench 110
The side of silicon chip flower basket supporting region, the top sucker 140 are located at the upper of the silicon chip flower basket supporting region on the workbench 110
Side, the side sucker 130 and top sucker 140 are inserted into silicon chip flower basket from the side of silicon chip flower basket and top respectively at work
In.
The workbench 110 of the silicon chip wafer separator 100 is that an area is smooth flat slightly larger than silicon chip flower basket base area
Face, set silicon chip flower basket supporting region is located at 110 center of workbench in the plane, and fitting silicon to be separated is filled for carrying
The silicon chip flower basket of piece, there are setting clamping device 120 and the spaces of other mechanisms for surrounding.The effect of clamping device 120 is will to hold
The silicon chip flower basket for being loaded in 110 center of workbench is anchored on workbench 110, and in side, sucker 130 is inserted with top sucker 140
The displacement that silicon chip flower basket can be prevented when entering silicon chip flower basket, avoids the harmful effect to Slicing procedure.Side sucker 130 and top
Sucker 140 adsorbs fit together two silicon chips in fragment respectively, and top sucker 140 moves upwards, and will be bonded
Two silicon chips separation together.Side sucker 130 and top sucker 140 are adsorbed with silicon chip after being inserted into silicon chip flower basket, whole
The process of a absorption and fragment is completed in silicon chip flower basket, without taking out the silicon chip in silicon chip flower basket in advance, may be implemented
With the continuous operation between silicon chip upstream and downstream processing equipment.
In one optionally embodiment, the clamping device 120 is cylinder clamping device, the cylinder clamping device packet
X relative to silicon chip flower basket supporting region is included to cylinder and Y-direction cylinder.
The pressure energy of compressed gas is converted to mechanical energy by the cylinder clamping device using cylinder, by being set to the gaily decorated basket
The X of supporting region realizes the clamping fastener to silicon chip flower basket, to ensure that the position of silicon chip flower basket exists to two cylinders with Y-direction
It does not change in entire silicon chip Slicing procedure.
In one optionally embodiment, the side sucker 130 and top sucker 140 are micropore ceramics vacuum cup.
The minimum of sucker thickness may be implemented compared to other kinds of sucker for the micropore ceramics vacuum cup,
Can relatively easily be inserted into fitting silicon chip that silicon chip flower basket is loaded among the adjacent gap being bonded between silicon chip.
In one optionally embodiment, the side sucker 130 is along the silk being set on the working face of workbench
Thick stick carries out position movement relative to silicon chip flower basket.
The side sucker 130 needs to be inserted into fitting silicon chip and the adjacent seam being bonded between silicon chip from the side of silicon chip flower basket
Among gap, realize that a kind of mode that position is moved on this direction is to be arranged accordingly to walk on the working face of workbench 110
To leading screw, side sucker 130 along leading screw relative to silicon chip flower basket carry out position move.
In one optionally embodiment, the side sucker 130 is electrically connected with servo motor.
The servo motor provides side sucker 130 and carries out the baseline power that position is moved along leading screw, and can realize offside
130 movement speed of terminal sucker accurately controls.
In one optionally embodiment, the top sucker 140 is connect with the robot device 150 of peripheral hardware.
The robot device 150 can realize accurately controlling to top sucker 140, including can inhale whole group top
Disk 140 is properly inserted fitting silicon chip and the adjacent gap being bonded between silicon chip, is carried out to top sucker 140 and silicon chip surface distance
It accurately controls, and top sucker movement velocity, active force accurately control when to Fragmentation, is inhaled to further increase
There is fragment and the hidden probability split in silicon chip in attached efficiency, reduction Slicing procedure.
A kind of working method of the silicon chip wafer separator 100 of the present invention is as follows：
The silicon chip flower basket of silicon chip is mounted with after completing surface wool manufacturing through black silicone groove type machine, is transferred to silicon chip wafer separator 100
On gaily decorated basket supporting region on workbench 110, it is located at the cylinder clamping device above the working face of workbench respectively from flower
The X of basket supporting region will be fixed to Y-direction positioned at the silicon chip flower basket of gaily decorated basket supporting region.Side sucker 130 is along being set to work
Leading screw on the working face of platform 110 carries out position movement relative to silicon chip flower basket, is inserted into and is bonded from the side of silicon chip flower basket
With among the adjacent gap being bonded between silicon chip, side sucker 130 is sucked in fitting silicon chip wherein silicon chip by suction function
The outer surface of a piece of silicon chip.The top sucker 140 being connect with the robot device 150 of peripheral hardware is inserted into from the top of silicon chip flower basket and pastes
Silicon chip is closed among the adjacent gap being bonded between silicon chip, top sucker 140 is sucked in fitting silicon chip not by suction function
The outer surface of another silicon chip adsorbed by side sucker 130.Robot device 150 moves upwards, and the top of connection is driven to inhale
Disk 140 moves up the silicon chip being sucked, and the silicon chip to be sucked with side sucker 130 is separated, and passes through robot device
150 clean the silicon slice loading of separation to making herbs into wool at the feeding of chain type machine.130 vacuum breaker of side sucker, side sucker 130 and silicon
The silicon chip retained in the piece gaily decorated basket detaches and exits silicon chip flower basket, and the top sucker 140 that the robot device 150 of peripheral hardware connects is from silicon
The top of the piece gaily decorated basket is again insertable into the silicon slice loading of absorption to making herbs into wool is cleaned chain by the silicon chip that absorption is detached with side sucker 130
At the feeding of formula machine, first separation process is completed.Silicon chip wafer separator 100 using the present invention can realize the day more than 170,000
Production capacity, the day production capacity for being fully able to meet 120,000, black silicone groove type machine correspond to demand, and can will occur fragment, it is hidden split, fragmentation
Probability controls within 0.5%.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of silicon chip wafer separator, which is characterized in that described including workbench, clamping device, side sucker, top sucker
The working face of workbench is equipped with the silicon chip flower basket supporting region for carrying silicon chip flower basket, and the clamping device is located at described
Above the working face of workbench, the working face for silicon chip flower basket to be fixed on to the workbench by clamping action
On, the side sucker is located at the side of the silicon chip flower basket supporting region on the workbench, and the top sucker is located at described
The top of silicon chip flower basket supporting region on workbench, the side sucker and top sucker are at work respectively from silicon chip flower basket
Side and top be inserted into silicon chip flower basket in.
2. silicon chip wafer separator according to claim 1, which is characterized in that the clamping device is cylinder clamping device, institute
It includes the X relative to silicon chip flower basket supporting region to cylinder and Y-direction cylinder to state cylinder clamping device.
3. silicon chip wafer separator according to claim 1, which is characterized in that the side sucker and top sucker are made pottery for micropore
Porcelain vacuum cup.
4. silicon chip wafer separator according to claim 1, which is characterized in that the side sucker edge is set to workbench
Leading screw on working face carries out position movement relative to silicon chip flower basket.
5. silicon chip wafer separator according to claim 1, which is characterized in that the side sucker is electrically connected with servo motor.
6. silicon chip wafer separator according to claim 1, which is characterized in that the robot device of the top sucker and peripheral hardware
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810690241.1A CN108538965A (en) | 2018-06-28 | 2018-06-28 | Silicon chip wafer separator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810690241.1A CN108538965A (en) | 2018-06-28 | 2018-06-28 | Silicon chip wafer separator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108538965A true CN108538965A (en) | 2018-09-14 |
Family
ID=63487579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810690241.1A Pending CN108538965A (en) | 2018-06-28 | 2018-06-28 | Silicon chip wafer separator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108538965A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860083A (en) * | 2019-02-21 | 2019-06-07 | 中国科学院物理研究所 | For the chain equipment of crystal silicon making herbs into wool and the preparation method of single side inverted pyramid making herbs into wool |
| CN109979857A (en) * | 2019-04-09 | 2019-07-05 | 张家港市德昶自动化科技有限公司 | Semiconductor crystal wafer silicon wafer slicing apparatus |
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|---|---|---|---|---|
| CN105845598A (en) * | 2015-01-15 | 2016-08-10 | 南京华伯仪器科技有限公司 | Silicon wafer separation device and silicon wafer loading and unloading system |
| CN207158272U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | Silicon chip burst component |
| CN107887314A (en) * | 2017-11-07 | 2018-04-06 | 河北晶龙阳光设备有限公司 | A kind of silicon chip transhipment loading attachment and the silicon chip transhipment stowage based on it |
| CN207353222U (en) * | 2017-09-06 | 2018-05-11 | 无锡市江松科技有限公司 | Silicon chip burst Suction cup assembly |
| CN208444850U (en) * | 2018-06-28 | 2019-01-29 | 扬州协鑫光伏科技有限公司 | Silicon wafer wafer separator |
-
2018
- 2018-06-28 CN CN201810690241.1A patent/CN108538965A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845598A (en) * | 2015-01-15 | 2016-08-10 | 南京华伯仪器科技有限公司 | Silicon wafer separation device and silicon wafer loading and unloading system |
| CN207158272U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | Silicon chip burst component |
| CN207353222U (en) * | 2017-09-06 | 2018-05-11 | 无锡市江松科技有限公司 | Silicon chip burst Suction cup assembly |
| CN107887314A (en) * | 2017-11-07 | 2018-04-06 | 河北晶龙阳光设备有限公司 | A kind of silicon chip transhipment loading attachment and the silicon chip transhipment stowage based on it |
| CN208444850U (en) * | 2018-06-28 | 2019-01-29 | 扬州协鑫光伏科技有限公司 | Silicon wafer wafer separator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860083A (en) * | 2019-02-21 | 2019-06-07 | 中国科学院物理研究所 | For the chain equipment of crystal silicon making herbs into wool and the preparation method of single side inverted pyramid making herbs into wool |
| CN109860083B (en) * | 2019-02-21 | 2021-08-24 | 中国科学院物理研究所 | Chain type equipment for texturing crystalline silicon and preparation method of single-side inverted pyramid texturing |
| CN109979857A (en) * | 2019-04-09 | 2019-07-05 | 张家港市德昶自动化科技有限公司 | Semiconductor crystal wafer silicon wafer slicing apparatus |
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