CN208444850U - Silicon wafer wafer separator - Google Patents
Silicon wafer wafer separator Download PDFInfo
- Publication number
- CN208444850U CN208444850U CN201821009353.8U CN201821009353U CN208444850U CN 208444850 U CN208444850 U CN 208444850U CN 201821009353 U CN201821009353 U CN 201821009353U CN 208444850 U CN208444850 U CN 208444850U
- Authority
- CN
- China
- Prior art keywords
- sucker
- flower basket
- silicon chip
- silicon
- chip flower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model relates to a kind of silicon wafer wafer separators, including workbench, clamping device, side sucker, top sucker, the working face of the workbench is equipped with the silicon chip flower basket supporting region for carrying silicon chip flower basket, the clamping device is located above the working face of the workbench, the side sucker is located at the side of the silicon chip flower basket supporting region on the workbench, the top sucker is located at the top of the silicon chip flower basket supporting region on the workbench, the side sucker and top sucker are inserted into silicon chip flower basket from the side of silicon chip flower basket and top respectively at work.Above-mentioned silicon wafer wafer separator, it is not necessary that the silicon wafer in silicon chip flower basket is taken out in advance, the silicon wafer being pulled together can be separated in silicon chip flower basket, fragment efficiency is improved by the synergic sorption of side sucker and top sucker simultaneously, reduce the probability that fragment and crack occurs in the silicon wafer in Slicing procedure, the whole-course automation operation for realizing silicon wafer fragment, is not necessarily to artificial treatment.
Description
Technical field
The utility model relates to silicon chip process technology fields, more particularly to a kind of silicon wafer wafer separator.
Background technique
Two panels silicon during silicon wafer carries out one texture-etching side in black silicone groove type machine, in the same basket tooth of silicon chip flower basket
Sector-meeting is completed to need after the silicon wafer of surface wool manufacturing comes out from black silicone groove type machine since the tension force effect of liquid is pulled together two-by-two
The silicon wafer being pulled together in silicon chip flower basket is separated, making herbs into wool cleaning chain type machine is just can enter and carries out silicon wafer surface cleaning, dries
Dry and subsequent inspection, packaging.At present for silicon wafer fragment take be artificial fragment method, not only fragment low efficiency, hold
Fragment and crack are easily caused, the acid-base solution being mingled in silicon wafer can also damage the health of worker.
Utility model content
Based on this, it is necessary to aiming at the problem that the artificial fragment low efficiency of silicon wafer, unstable quality, easily causing Health cost,
A kind of silicon wafer wafer separator is provided.
A kind of silicon wafer wafer separator, including workbench, clamping device, side sucker, top sucker, the workbench
Working face is equipped with the silicon chip flower basket supporting region for carrying silicon chip flower basket, and the clamping device is located at the workbench
Above working face, for silicon chip flower basket to be fixed on to the working face of the workbench, the side by clamping action
Terminal sucker is located at the side of the silicon chip flower basket supporting region on the workbench, and the top sucker is located on the workbench
Silicon chip flower basket supporting region top, the side sucker and top sucker are at work respectively from the side of silicon chip flower basket and top
In end insertion silicon chip flower basket.
Above-mentioned silicon wafer wafer separator can will be attracted in silicon chip flower basket without taking out the silicon wafer in silicon chip flower basket in advance
Silicon wafer together separates, and the continuous operation between silicon wafer upstream and downstream processing equipment may be implemented, while inhaling by side
The synergic sorption of disk and top sucker improves fragment efficiency, reduces the silicon wafer in Slicing procedure and fragment and crack occurs
Probability, the daily output of separate unit fragment machine up to 170,000, can realize the whole-course automation operation of silicon wafer fragment, without artificial place
Reason.
The clamping device is cylinder clamping device in one of the embodiments, and the cylinder clamping device includes phase
For silicon chip flower basket supporting region X to cylinder and Y-direction cylinder.
The side sucker and top sucker are micropore ceramics vacuum chuck in one of the embodiments,.
The side sucker is opposite along the lead screw being set on the working face of workbench in one of the embodiments,
It is mobile that position is carried out in silicon chip flower basket.
The side sucker is electrically connected with servo motor in one of the embodiments,.
The robot device of the top sucker and peripheral hardware connects in one of the embodiments,.
Detailed description of the invention
Fig. 1 is the silicon wafer wafer separator structural schematic diagram (sucker is not drawn into) of the utility model embodiment;
Fig. 2 is position signal of the side sucker of the silicon wafer wafer separator of the utility model embodiment before being inserted into silicon chip flower basket
Figure;
Fig. 3 is position signal of the side sucker of the silicon wafer wafer separator of the utility model embodiment after being inserted into silicon chip flower basket
Figure;
Fig. 4 is the side sucker of the silicon wafer wafer separator of the utility model embodiment after being inserted into silicon chip flower basket, top sucker
Position view before being inserted into silicon chip flower basket;
Fig. 5 is silicon in the side sucker and top sucker suction silicon chip flower basket of the silicon wafer wafer separator of the utility model embodiment
The position view of piece specific location;
Fig. 6 be the utility model embodiment silicon wafer wafer separator top sucker suction silicon wafer after robot device drive
The schematic diagram that the lower silicon wafer that will be sucked moves up;
Fig. 7 is the signal of the side sucker vacuum breaker backed off after random silicon chip flower basket of the silicon wafer wafer separator of the utility model embodiment
Figure;
Fig. 8 is the silicon wafer that the top sucker suction of the silicon wafer wafer separator of the utility model embodiment has been separated with side sucker
Schematic diagram.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact
It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model
The understanding for opening content is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" includes
Any and all combinations of one or more related listed items.
As shown in figures 1-8, the silicon wafer wafer separator 100 of the utility model, including workbench 110, clamping device 120, side
Terminal sucker 130, top sucker 140, the working face of the workbench 110 are equipped with the silicon wafer flower for carrying silicon chip flower basket
Basket supporting region, the clamping device 120 is located above the working face of the workbench 110, for passing through silicon chip flower basket
Clamping action is fixed on the working face of the workbench 110, and the side sucker 130 is located at the workbench 110
On silicon chip flower basket supporting region side, the top sucker 140 is located at the silicon chip flower basket supporting region on the workbench 110
Top, the side sucker 130 and top sucker 140 are inserted into silicon wafer from the side of silicon chip flower basket and top respectively at work
In the gaily decorated basket.
The workbench 110 of the silicon wafer wafer separator 100 is that an area is smooth flat slightly larger than silicon chip flower basket base area
Face, set silicon chip flower basket supporting region is located at 110 center of workbench in the plane, fills fitting silicon to be separated for carrying
The silicon chip flower basket of piece, there are setting clamping device 120 and the spaces of other mechanisms for surrounding.The effect of clamping device 120 is will to hold
The silicon chip flower basket for being loaded in 110 center of workbench is anchored on workbench 110, and in side, sucker 130 and top sucker 140 are inserted
The displacement that silicon chip flower basket can be prevented when entering silicon chip flower basket, avoids the adverse effect to Slicing procedure.Side sucker 130 and top
Sucker 140 adsorbs fit together two silicon wafers in fragment respectively, and top sucker 140 moves upwards, and will be bonded
Two silicon wafers separation together.Side sucker 130 and top sucker 140 are to adsorb after being inserted into silicon chip flower basket with silicon wafer, whole
The process of a absorption and fragment is completed in silicon chip flower basket, without taking out the silicon wafer in silicon chip flower basket in advance, may be implemented
With the continuous operation between silicon wafer upstream and downstream processing equipment.
In one optionally embodiment, the clamping device 120 is cylinder clamping device, the cylinder clamping device packet
X relative to silicon chip flower basket supporting region is included to cylinder and Y-direction cylinder.
The pressure energy of compressed gas is converted to mechanical energy using cylinder by the cylinder clamping device, by being set to the gaily decorated basket
The X of supporting region realizes the clamping fastener to silicon chip flower basket, to guarantee that the position of silicon chip flower basket exists to two cylinders with Y-direction
It does not change in entire silicon wafer Slicing procedure.
In one optionally embodiment, the side sucker 130 and top sucker 140 are micropore ceramics vacuum chuck.
The minimum of sucker thickness may be implemented compared to other kinds of sucker for the micropore ceramics vacuum chuck,
Can relatively easily be inserted into fitting silicon wafer that silicon chip flower basket is loaded among the adjacent gap being bonded between silicon wafer.
In one optionally embodiment, silk of the side sucker 130 on the working face for being set to workbench
Thick stick carries out position movement relative to silicon chip flower basket.
The side sucker 130 needs to be inserted into fitting silicon wafer and the adjacent seam being bonded between silicon wafer from the side of silicon chip flower basket
Among gap, a kind of mode for realizing that position is mobile on this direction is to be arranged accordingly to walk on the working face of workbench 110
To lead screw, side sucker 130 along lead screw relative to silicon chip flower basket carry out position move.
In one optionally embodiment, the side sucker 130 is electrically connected with servo motor.
The servo motor provides side sucker 130 and carries out the baseline power that position is moved along lead screw, and can realize opposite side
The accurate control of 130 movement speed of terminal sucker.
In one optionally embodiment, the top sucker 140 is connect with the robot device 150 of peripheral hardware.
The robot device 150 can be realized the accurate control to top sucker 140, including can inhale whole group top
Disk 140 is properly inserted fitting silicon wafer and the adjacent gap being bonded between silicon wafer, carries out to top sucker 140 and silicon chip surface distance
Accurate control, and top sucker movement velocity, active force are accurately controlled when to Fragmentation, to further increase suction
There is the probability of fragment and crack in silicon wafer in attached efficiency, reduction Slicing procedure.
A kind of working method of the silicon wafer wafer separator 100 of the utility model is as follows:
The silicon chip flower basket of silicon wafer is mounted with after black silicone groove type machine completes surface wool manufacturing, is transferred to silicon wafer wafer separator 100
On gaily decorated basket supporting region on workbench 110, the cylinder clamping device above the working face of workbench is respectively from flower
The silicon chip flower basket for being located at gaily decorated basket supporting region is fixed to Y-direction by the X of basket supporting region.Side sucker 130 is along being set to work
Lead screw on the working face of platform 110 carries out position movement relative to silicon chip flower basket, is inserted into and is bonded from the side of silicon chip flower basket
With among the adjacent gap being bonded between silicon wafer, side sucker 130 is sucked in fitting silicon wafer wherein silicon wafer by suction function
The outer surface of a piece of silicon wafer.The top sucker 140 connecting with the robot device 150 of peripheral hardware is inserted into from the top of silicon chip flower basket and pastes
Silicon wafer is closed among the adjacent gap being bonded between silicon wafer, top sucker 140 is sucked in fitting silicon wafer not by suction function
The outer surface of another silicon wafer adsorbed by side sucker 130.Robot device 150 moves upwards, and the top of connection is driven to inhale
Disk 140 moves up the silicon wafer being sucked, to mutually separate with the silicon wafer that side sucker 130 is sucked, and passes through robot device
150 will be at the feeding of isolated silicon slice loading to making herbs into wool cleaning chain type machine.130 vacuum breaker of side sucker, side sucker 130 and silicon
The silicon wafer retained in the piece gaily decorated basket separates and exits silicon chip flower basket, and the top sucker 140 that the robot device 150 of peripheral hardware connects is from silicon
The top of the piece gaily decorated basket is again insertable into the silicon slice loading of absorption to making herbs into wool is cleaned chain by the absorption silicon wafer isolated with side sucker 130
At the feeding of formula machine, first separation process is completed.It can be realized using the silicon wafer wafer separator 100 of the utility model greater than 170,000
Day production capacity, the day production capacity for being fully able to meet 120,000, black silicone groove type machine corresponds to demand, and fragment, crack, broken can will occurs
The probability of piece controls within 0.5%.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (6)
1. a kind of silicon wafer wafer separator, which is characterized in that described including workbench, clamping device, side sucker, top sucker
The working face of workbench is equipped with the silicon chip flower basket supporting region for carrying silicon chip flower basket, and the clamping device is located at described
Above the working face of workbench, for silicon chip flower basket to be fixed on to the working face of the workbench by clamping action
On, the side sucker is located at the side of the silicon chip flower basket supporting region on the workbench, and the top sucker is located at described
The top of silicon chip flower basket supporting region on workbench, the side sucker and top sucker are at work respectively from silicon chip flower basket
Side and top insertion silicon chip flower basket in.
2. silicon wafer wafer separator according to claim 1, which is characterized in that the clamping device is cylinder clamping device, institute
Stating cylinder clamping device includes the X relative to silicon chip flower basket supporting region to cylinder and Y-direction cylinder.
3. silicon wafer wafer separator according to claim 1, which is characterized in that the side sucker and top sucker are micropore pottery
Porcelain vacuum chuck.
4. silicon wafer wafer separator according to claim 1, which is characterized in that the side sucker edge is set to workbench
Lead screw on working face carries out position movement relative to silicon chip flower basket.
5. silicon wafer wafer separator according to claim 1, which is characterized in that the side sucker is electrically connected with servo motor.
6. silicon wafer wafer separator according to claim 1, which is characterized in that the robot device of the top sucker and peripheral hardware
Connection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821009353.8U CN208444850U (en) | 2018-06-28 | 2018-06-28 | Silicon wafer wafer separator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821009353.8U CN208444850U (en) | 2018-06-28 | 2018-06-28 | Silicon wafer wafer separator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208444850U true CN208444850U (en) | 2019-01-29 |
Family
ID=65087051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821009353.8U Expired - Fee Related CN208444850U (en) | 2018-06-28 | 2018-06-28 | Silicon wafer wafer separator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208444850U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108538965A (en) * | 2018-06-28 | 2018-09-14 | 扬州协鑫光伏科技有限公司 | Silicon chip wafer separator |
CN109860083A (en) * | 2019-02-21 | 2019-06-07 | 中国科学院物理研究所 | For the chain equipment of crystal silicon making herbs into wool and the preparation method of single side inverted pyramid making herbs into wool |
CN110379750A (en) * | 2019-07-21 | 2019-10-25 | 常州时创能源科技有限公司 | It is a kind of for carrying the quartz boat of silicon wafer |
-
2018
- 2018-06-28 CN CN201821009353.8U patent/CN208444850U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108538965A (en) * | 2018-06-28 | 2018-09-14 | 扬州协鑫光伏科技有限公司 | Silicon chip wafer separator |
CN109860083A (en) * | 2019-02-21 | 2019-06-07 | 中国科学院物理研究所 | For the chain equipment of crystal silicon making herbs into wool and the preparation method of single side inverted pyramid making herbs into wool |
CN110379750A (en) * | 2019-07-21 | 2019-10-25 | 常州时创能源科技有限公司 | It is a kind of for carrying the quartz boat of silicon wafer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN208444850U (en) | Silicon wafer wafer separator | |
CN104942594B (en) | Battery of mobile phone both positive and negative polarity pole piece cuts detection machine automatically | |
WO2022021573A1 (en) | Clamping mechanism for facilitating overturning of electronic component | |
JP2007157996A (en) | Work carrying device and work carrying method | |
KR101446170B1 (en) | Aligning Apparatus of Semiconductor Package, Cutting and Aligning Apparatus of Semiconductor Package, and Mothod of Cutting and Aligning of Semiconductor Package | |
KR20190070833A (en) | Separation Device and Separation Method For Film and Wafer | |
WO2019105021A1 (en) | Independently driven membrane separation mechanism | |
CN104347435A (en) | An adsorption collet chuck and a chip adapter | |
KR20170043997A (en) | Semiconductor Package Processing Apparatus | |
CN106292194A (en) | Silicon chip transmission system | |
CN108538965A (en) | Silicon chip wafer separator | |
WO2024032802A1 (en) | Clamping apparatus for wire-cutting machining of blanking part and using method of clamping apparatus | |
CN110364464A (en) | Full-automatic multi-functional paster apparatus and full-automatic paster technique | |
CN212967642U (en) | High-efficient device of getting of silicon chip | |
JPH02130103A (en) | Dicing jig | |
KR100817068B1 (en) | Thinn semiconductor chip pick-up apparatus and method | |
CN210640204U (en) | Silicon wafer combining and splitting device | |
JPH08227904A (en) | Chip bonder | |
CN114335253B (en) | Silicon wafer picking and placing device and method | |
CN202405242U (en) | Wafer overturning machine | |
CN210925950U (en) | Novel multilayer chip welding die bonder | |
CN208413235U (en) | It is a kind of abnormity smallclothes for material separating device | |
CN201366414Y (en) | Device for automatically separating paper honeycomb flexible material cuttings and iron powder particles | |
CN206720326U (en) | A kind of glass baseplate conveying device | |
JP2012084685A (en) | Chip peeling device and chip peeling method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190129 |