CN109979857A - Semiconductor crystal wafer silicon wafer slicing apparatus - Google Patents
Semiconductor crystal wafer silicon wafer slicing apparatus Download PDFInfo
- Publication number
- CN109979857A CN109979857A CN201910278510.8A CN201910278510A CN109979857A CN 109979857 A CN109979857 A CN 109979857A CN 201910278510 A CN201910278510 A CN 201910278510A CN 109979857 A CN109979857 A CN 109979857A
- Authority
- CN
- China
- Prior art keywords
- conveyer belt
- pair
- rotary shaft
- silicon wafer
- semiconductor crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 45
- 239000010703 silicon Substances 0.000 title claims abstract description 45
- 239000013078 crystal Substances 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000001360 synchronised effect Effects 0.000 claims abstract description 8
- 239000012634 fragment Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
This application discloses a kind of semiconductor crystal wafer silicon wafer slicing apparatus, including water tank, water tank bottom is successively arranged input mechanism and separating mechanism, output mechanism is equipped with above separating mechanism, the input mechanism includes a pair of synchronous first conveyer belt, the output mechanism includes a pair of the second synchronous conveyer belt, a pair of second conveyer belt extends to outside water tank, baffle is fixedly connected between a pair of first conveyer belt, the separating mechanism includes a pair of bearing and the rotary shaft that is arranged on bearing block, fixing sleeve is equipped with linking arm in the rotary shaft, the linking arm is connected with vacuum adapter far from one end of rotary shaft, the vacuum adapter is equipped with sucker far from one end of linking arm, it just can be simultaneously from being passed through between a pair of second conveyer belt between a pair of of first conveyer belt when the sucker rotates.The semiconductor crystal wafer silicon wafer slicing apparatus is connected input mechanism and output mechanism by separating mechanism, and ingenious cooperation carries out silicon wafer fragment, efficient and high degree of automation.
Description
Technical field
This application involves silicon wafer fragment field, especially a kind of semiconductor crystal wafer silicon wafer slicing apparatus.
Background technique
The degree of automation of existing semiconductor crystal wafer silicon wafer production equipment is not high, and the linking between equipment also excessively relies on people
The defects of work is completed, and is be easy to cause semiconductor crystal wafer wafer contamination, is crushed.
Summary of the invention
The purpose of the present invention is to provide a kind of semiconductor crystal wafer silicon wafer slicing apparatus, with overcome it is in the prior art not
Foot.
To achieve the above object, the invention provides the following technical scheme:
The embodiment of the present application discloses semiconductor crystal wafer silicon wafer slicing apparatus, it is characterised in that: including water tank, the water tank
Bottom is successively arranged input mechanism and separating mechanism, is equipped with output mechanism above the separating mechanism, the input mechanism includes
The synchronous first conveyer belt of a pair, the output mechanism include a pair of the second synchronous conveyer belt, a pair of second conveyer belt
It extends to outside water tank, baffle is fixedly connected between a pair of first conveyer belt, the shelves of the baffle are conveyed facing towards first
The conveying direction of band, the separating mechanism include a pair of bearing and the rotary shaft that is arranged on bearing block, the rotary shaft
Upper fixing sleeve is equipped with linking arm, and the linking arm is connected with vacuum adapter far from one end of rotary shaft, and the vacuum adapter is separate
One end of linking arm is equipped with sucker, and the rotary shaft is connect by synchronizing wheel and belt with rotating electric machine, when the sucker rotates
It just can be simultaneously from being passed through between a pair of second conveyer belt between a pair of of first conveyer belt.
Preferably, in above-mentioned semiconductor crystal wafer silicon wafer slicing apparatus, the first conveyer belt close to rotary shaft one
End is equipped with limited block.
Preferably, in above-mentioned semiconductor crystal wafer silicon wafer slicing apparatus, the limited block is in " 7 " font, the limit
The opposite direction of block towards first conveyer belt conveying direction is arranged.
Preferably, in above-mentioned semiconductor crystal wafer silicon wafer slicing apparatus, the linking arm is in " ten " font, the connection
It is equipped with the hole being arranged on the rotary shaft at arm center, is equipped with vacuum adapter at four ports of the linking arm.
Preferably, in above-mentioned semiconductor crystal wafer silicon wafer slicing apparatus, the rotary shaft is equipped with cooperation vacuum adapter
Air inlet and air outlet, the position that gas outlet is corresponded in the rotary shaft is arranged with axle sleeve, and the axle sleeve, which is equipped with, to be cooperated out
The connector of port.
Preferably, in above-mentioned semiconductor crystal wafer silicon wafer slicing apparatus, the shelves face of the baffle is inclined-plane.
Compared with the prior art, the advantages of the present invention are as follows:
1, the semiconductor crystal wafer silicon wafer slicing apparatus is connected input mechanism and output mechanism, ingenious cooperation by separating mechanism
Carry out silicon wafer fragment, efficient and high degree of automation.
2, single unit system is placed in water tank and carries out fragment, prevent silicon chip in Slicing procedure, operation is convenient and can protect
Hinder the quality of semiconductor crystal wafer silicon wafer.
3, in input mechanism and output mechanism by the way of a pair of of conveyer belt, instead of one whole original conveyer belt,
Reduce the friction area between silicon wafer and conveyer belt, protects silicon wafer, prevent from damaging.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application are not making the creative labor according to this for those of ordinary skill in the art
A little attached drawings obtain other attached drawings.
Fig. 1 show the main view of semiconductor crystal wafer silicon wafer slicing apparatus in the specific embodiment of the invention；
Fig. 2 show the schematic diagram of internal structure of semiconductor crystal wafer silicon wafer slicing apparatus in the specific embodiment of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out detailed retouch
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, those of ordinary skill in the art's every other implementation obtained without making creative work
Example, shall fall within the protection scope of the present invention.
Join shown in Fig. 1~2, the semiconductor crystal wafer silicon wafer slicing apparatus in the present embodiment, including water tank 1,1 bottom of water tank according to
It is secondary to be equipped with input mechanism 2 and separating mechanism 3, output mechanism 4 is equipped with above separating mechanism 3.
Input mechanism 2 includes a pair of synchronous first conveyer belt 201, and output mechanism 4 includes a pair of the second synchronous conveying
Band 401, a pair second convey 401 bands and extend to outside water tank 1, are fixedly connected with baffle 202 between a pair of of first conveyer belt 201,
For the shelves of baffle 202 facing towards the conveying direction of first conveyer belt 201, separating mechanism 3 includes that a pair of bearing 301 and setting exist
Rotary shaft 302 on bearing block 301, fixing sleeve is equipped with linking arm 303 in rotary shaft 302, and linking arm 303 is far from rotary shaft 302
One end be connected with vacuum adapter 304, vacuum adapter 304 is equipped with sucker 305 far from one end of linking arm 303, and rotary shaft 302 is logical
Cross synchronizing wheel and belt connect with rotating electric machine, when sucker 305 rotates just can simultaneously between a pair of of first conveyer belt 201 and
It is passed through between a pair of second conveyer belt 401.
Further, the shelves face of baffle 202 is inclined-plane, and silicon wafer generates the inclination in angle, avoids pushing when placing shelves face
When silicon wafer overturn.
In the technical scheme, which is connected input mechanism and output by separating mechanism
Mechanism, ingenious cooperation carry out silicon wafer fragment, efficient and high degree of automation；Single unit system is placed in water tank and carries out fragment, is prevented
Only silicon chip in Slicing procedure, operation is convenient and can ensure the quality of semiconductor crystal wafer silicon wafer；Input mechanism and output mechanism
It is middle by the way of a pair of of conveyer belt, instead of one whole original conveyer belt, reduce the friction between silicon wafer and conveyer belt
Area protects silicon wafer, prevents from damaging.
In one embodiment, first conveyer belt 201 is equipped with limited block 203, limited block 203 close to one end of rotary shaft 302
In " 7 " font, the opposite direction of limited block 203 towards 201 conveying direction of first conveyer belt is arranged.
In the technical scheme, silicon wafer is easy to miss optimal with chalaza with vacuum chuck when transporting on input mechanism,
Cause sucker to be inhaled and directly sink to water tank bottom less than silicon wafer or silicon wafer, therefore limited block is set, one is carried out to the position that silicon wafer transmits
A limit, facilitates sucker to be grabbed.
In one embodiment, linking arm 303 is in " ten " font, is equipped with and is set in rotary shaft 302 at 303 center of linking arm
Hole, be equipped with vacuum adapter 304 at four ports of linking arm 302.
Further, rotary shaft 302 is equipped with the air inlet 306 of cooperation vacuum adapter 304 and gas outlet (is not drawn in figure
Out), the position that gas outlet (being not drawn into figure) is corresponded in rotary shaft 302 is arranged with axle sleeve 307, and axle sleeve 307, which is equipped with, to be cooperated out
The connector 308 of port (being not drawn into figure).
In the technical scheme, directly the air inlet/outlet of setting cooperation vacuum adapter, gas directly flow in axis in rotary shaft
It is dynamic, it is connect by air inlet pipe with air inlet and vacuum adapter, escape pipe is connect with connector, prevents tracheae from following rotation and occurring
The phenomenon that winding, reduces maintenance time, improves fragment efficiency.
It is as follows that principle is embodied:
The silicon wafer of fragment will be needed to be placed on baffle, be sent to by input mechanism at the position of limited block restriction, led to
It crosses sucker and vacuum suction is carried out to one piece of nearest silicon wafer, then between the gap of rotatory vacuum connector to output mechanism, to sucker
Deflate acts on sucker to silicon wafer, and silicon wafer removes outside water tank with output mechanism, can be continuous due to the presence of four suckers
Continual carry out fragment.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including element.
The above is only the specific embodiments of the application, it is noted that those skilled in the art are come
It says, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications also should be regarded as
The protection scope of the application.
Claims (6)
1. a kind of semiconductor crystal wafer silicon wafer slicing apparatus, it is characterised in that: including water tank, the water tank bottom is successively arranged input
Mechanism and separating mechanism, are equipped with output mechanism above the separating mechanism, and the input mechanism includes a pair of synchronous first defeated
Band is sent, the output mechanism includes a pair of the second synchronous conveyer belt, and a pair of second conveyer belt extends to outside water tank, a pair of
Be fixedly connected with baffle between the first conveyer belt, the shelves of the baffle facing towards first conveyer belt conveying direction, it is described
Separating mechanism includes a pair of bearing and the rotary shaft that is arranged on bearing block, and fixing sleeve is equipped with connection in the rotary shaft
Arm, the linking arm are connected with vacuum adapter far from one end of rotary shaft, and the vacuum adapter is equipped with far from one end of linking arm
Sucker, the rotary shaft are connect by synchronizing wheel and belt with rotating electric machine, just can be simultaneously from a pair when the sucker rotates
It is passed through between a pair of second conveyer belt between first conveyer belt.
2. a kind of semiconductor crystal wafer silicon wafer slicing apparatus according to claim 1, it is characterised in that: the first conveyer belt
Limited block is equipped with close to one end of rotary shaft.
3. a kind of semiconductor crystal wafer silicon wafer slicing apparatus according to claim 2, it is characterised in that: the limited block is in
The opposite direction of " 7 " font, the limited block towards first conveyer belt conveying direction is arranged.
4. a kind of semiconductor crystal wafer silicon wafer slicing apparatus according to claim 1, it is characterised in that: the linking arm is in
" ten " font, it is described to connect the hole for being equipped with and being arranged on the rotary shaft at arm center, it is equipped at four ports of the linking arm
Vacuum adapter.
5. a kind of semiconductor crystal wafer silicon wafer slicing apparatus according to claim 1, it is characterised in that: set in the rotary shaft
There are the air inlet and air outlet of cooperation vacuum adapter, the position that gas outlet is corresponded in the rotary shaft is arranged with axle sleeve, the axis
Put on the connector for being equipped with cooperation gas outlet.
6. a kind of semiconductor crystal wafer silicon wafer slicing apparatus according to claim 1, it is characterised in that: the shelves face of the baffle
For inclined-plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910278510.8A CN109979857A (en) | 2019-04-09 | 2019-04-09 | Semiconductor crystal wafer silicon wafer slicing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910278510.8A CN109979857A (en) | 2019-04-09 | 2019-04-09 | Semiconductor crystal wafer silicon wafer slicing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109979857A true CN109979857A (en) | 2019-07-05 |
Family
ID=67083509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910278510.8A Pending CN109979857A (en) | 2019-04-09 | 2019-04-09 | Semiconductor crystal wafer silicon wafer slicing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109979857A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379755A (en) * | 2019-08-05 | 2019-10-25 | 常州时创能源科技有限公司 | A kind of solar battery sheet production feeding device of chain equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11278626A (en) * | 1998-03-30 | 1999-10-12 | Toyama Kikai Kk | Conveyor device, transferring device, and transporting mechanism |
| CN102623372A (en) * | 2012-03-27 | 2012-08-01 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wafer-separating device for wet silicon wafers |
| CN202487547U (en) * | 2012-03-27 | 2012-10-10 | 江西赛维Ldk太阳能高科技有限公司 | Wet silicon wafer automatic separation device |
| CN105845598A (en) * | 2015-01-15 | 2016-08-10 | 南京华伯仪器科技有限公司 | Silicon wafer separation device and silicon wafer loading and unloading system |
| CN108538965A (en) * | 2018-06-28 | 2018-09-14 | 扬州协鑫光伏科技有限公司 | Silicon chip wafer separator |
| CN109132547A (en) * | 2018-09-04 | 2019-01-04 | 上海釜川自动化设备有限公司 | One texture-etching side slicing apparatus and its application method |
| CN109524341A (en) * | 2018-12-13 | 2019-03-26 | 卢路平 | The fragment feeding structure of silicon wafer |
| CN209880550U (en) * | 2019-04-09 | 2019-12-31 | 张家港市德昶自动化科技有限公司 | Semiconductor wafer silicon wafer slicing device |
-
2019
- 2019-04-09 CN CN201910278510.8A patent/CN109979857A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11278626A (en) * | 1998-03-30 | 1999-10-12 | Toyama Kikai Kk | Conveyor device, transferring device, and transporting mechanism |
| CN102623372A (en) * | 2012-03-27 | 2012-08-01 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wafer-separating device for wet silicon wafers |
| CN202487547U (en) * | 2012-03-27 | 2012-10-10 | 江西赛维Ldk太阳能高科技有限公司 | Wet silicon wafer automatic separation device |
| CN105845598A (en) * | 2015-01-15 | 2016-08-10 | 南京华伯仪器科技有限公司 | Silicon wafer separation device and silicon wafer loading and unloading system |
| CN108538965A (en) * | 2018-06-28 | 2018-09-14 | 扬州协鑫光伏科技有限公司 | Silicon chip wafer separator |
| CN109132547A (en) * | 2018-09-04 | 2019-01-04 | 上海釜川自动化设备有限公司 | One texture-etching side slicing apparatus and its application method |
| CN109524341A (en) * | 2018-12-13 | 2019-03-26 | 卢路平 | The fragment feeding structure of silicon wafer |
| CN209880550U (en) * | 2019-04-09 | 2019-12-31 | 张家港市德昶自动化科技有限公司 | Semiconductor wafer silicon wafer slicing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379755A (en) * | 2019-08-05 | 2019-10-25 | 常州时创能源科技有限公司 | A kind of solar battery sheet production feeding device of chain equipment |
| CN110379755B (en) * | 2019-08-05 | 2024-02-13 | 常州时创能源股份有限公司 | Loading attachment of chain equipment for solar wafer production |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2018166539A1 (en) | Diamond special-shaped grinding wheel and vertical machining cooling system | |
| CN109979857A (en) | Semiconductor crystal wafer silicon wafer slicing apparatus | |
| WO2021164674A1 (en) | Polishing liquid feeding system | |
| CN103515270B (en) | Vacuum cup anti-block system in a kind of wet processing apparatus | |
| CN208927928U (en) | Cement industry self-loopa dry method desulfuration system | |
| CN209880550U (en) | Semiconductor wafer silicon wafer slicing device | |
| US6254362B1 (en) | Vacuum pump with dust collecting function | |
| CN108168963B (en) | Multifunctional gas sampling device and method thereof | |
| WO2014029297A1 (en) | Vacuum separation system and bottle discharging device | |
| CN205471640U (en) | Send out power boiler ashes conveying system | |
| CN206280737U (en) | A kind of liquid conducting pipes with buffering and impurity removal function | |
| CN212508817U (en) | Dry type vacuum main machine for pharmaceutical industry | |
| CN206832074U (en) | A kind of low-power consumption vacuum maintains system | |
| CN204816984U (en) | Monocrystalline silicon mounting platform supplies wax device | |
| CN107891377A (en) | A kind of shot second-time recycling device of shot-blasting machine | |
| CN111486093A (en) | Dry type vacuum main machine for pharmaceutical industry | |
| CN208115418U (en) | A kind of centrifugal dedusting depassing unit | |
| CN206590171U (en) | A kind of material residue discharges recovery system | |
| CN201560265U (en) | Impurity suction and impurity collection device of rotating cup spinning machine | |
| CN215089481U (en) | Ash removal pipeline of epitaxial device and epitaxial device | |
| CN215940313U (en) | Slag slurry treatment system | |
| CN217058387U (en) | Sintering furnace evacuation pipeline | |
| CN212953073U (en) | Material conveying bin | |
| CN209442798U (en) | Give up light liquid recycling equipment | |
| CN208886809U (en) | A kind of cinerary device for boiler flue gas dust remover |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |