CN108521710B - Flexible printed circuit board for wireless charger and manufacturing method thereof - Google Patents
Flexible printed circuit board for wireless charger and manufacturing method thereof Download PDFInfo
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- CN108521710B CN108521710B CN201810463919.2A CN201810463919A CN108521710B CN 108521710 B CN108521710 B CN 108521710B CN 201810463919 A CN201810463919 A CN 201810463919A CN 108521710 B CN108521710 B CN 108521710B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The invention discloses a flexible printed circuit board for a wireless charger, which comprises a flexible base material, wherein a first black covering film is arranged on the top surface of the flexible base material, a second black covering film is arranged on the bottom surface of the flexible base material, a yellow covering film is arranged on the top surface of the first black covering film, and a reinforcing layer and a gummed paper layer are sequentially arranged on the bottom surface of the second black covering film along the direction far away from the flexible base material. This flexible printed circuit board both sides all are provided with ultra-thin cover film, and the bottom still is provided with strengthening layer and glued paper layer, and product structural stability is high, and is not fragile, and reliability and life have obtained promoting by a wide margin. The manufacturing process of the circuit board is also disclosed, the process of pressing and covering the PET release film on the surface of the ultrathin black covering film is adopted, the problems of easy folding, tearing, low laminating efficiency and low yield of the ultrathin covering film are solved, the problems of easy damage and incapability of compacting when the covering film is pressed are solved by combining quick pressing and vacuum pressing, and the reliability of the product is improved.
Description
Technical Field
The invention belongs to the technical field of printed circuit board production, relates to a flexible printed circuit board and a manufacturing method thereof, and particularly relates to a flexible printed circuit board for a wireless charger and a manufacturing method thereof.
Background
The wireless charging is a novel charging technology which is started in recent years, namely, the electronic product in a certain space range can be charged without the help of a charging wire, the current is converted into electromagnetism at a transmitter end by utilizing an electromagnetic technology, the electromagnetism is converted into the current by utilizing a built-in chip receiver, and the charge is transmitted in the air between a charger and electronic equipment by utilizing magnetic resonance, so that the efficient transmission of electric energy is realized. Compared with the traditional wired charging technology, the wireless charging has the advantages of small size, high portability, strong compatibility, contribution to the waterproof and dustproof design of charging equipment and the like. Some new cell-phones have adopted wireless charging technology at present, and on-vehicle wireless charging scheme has also appeared in addition, places wireless charging support promptly on the car, can charge with this wireless charging support of cell-phone during driving, and on-vehicle wireless charger is similar in charging efficiency with traditional wired charger.
The wireless charger is provided with a printed circuit board for mounting electronic components and electrically connecting, in order to reduce the volume of the wireless charger, a flexible circuit board (also called as a flexible circuit board or FPC) is usually adopted, the flexible circuit board for the wireless charger at present has the problems of single structure and low stability and reliability, and particularly, the flexible circuit board for the wireless charger is designed into a coil-shaped precise circuit, the total thickness of copper on the surface of the flexible circuit board reaches 50-65 mu m, and the total thickness of copper layers is super-thick, so that the electroplating uniformity and etching cannot meet the requirements easily. The wireless FPC that charges contains three big modules of WPC (wireless charging), MST (magnetism safety transmission), NFC (near field communication), and its characteristic resistance influences each other, and the circuit that if changes one of them module can influence the resistance of two other modules, consequently has the unstable, undulant big problem of characteristic resistance. In addition, a covering film is required to be attached to the wireless charging flexible circuit board, the filling capacity is insufficient during pressing due to the fact that the copper thickness of the surface of the wireless charging flexible circuit board is larger than or equal to 1OZ and the thickness of the covering film is small (12.5-20 micrometers), and the covering film is prone to bubbling and wrinkling and is prone to being damaged and badly caused by being extruded in the traditional pressing process.
Disclosure of Invention
Therefore, the present invention is directed to solve the above technical problems, and therefore, a flexible printed circuit board for a wireless charger and a method for manufacturing the same are provided, in which a cover film is not easily wrinkled or damaged, has a small surface copper thickness, and is easily plated and etched.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the invention provides a flexible printed circuit board for a wireless charger, which comprises a flexible base material, wherein the top surface of the flexible base material is provided with a first black covering film, the bottom surface of the flexible base material is provided with a second black covering film, the top surface of the first black covering film is provided with a yellow covering film, and the bottom surface of the second black covering film is sequentially provided with a reinforcing layer and a gummed paper layer along the direction far away from the flexible base material.
Preferably, the bottom surface of the reinforcing layer is also provided with a foam layer.
Preferably, the flexible substrate is provided with a coil-shaped circuit pattern, the spacing between circuits is not less than 100 μm, the copper plating thickness on the surface of the flexible substrate is 8-15 μm, and the total thickness of the copper layer of the flexible substrate is 50-60 μm.
Preferably, the flexible substrate is a double-sided electrolytic copper foil, and the thickness of the copper foil is 1-1.5 OZ.
Preferably, the first black cover film and the second black cover film are composed of a black polyimide film and a thermosetting adhesive layer and have a thickness of 10-15 μm, and the yellow cover film is composed of a yellow polyimide film and a thermosetting adhesive layer and have a thickness of 30-50 μm.
Preferably, the reinforcing layer is composed of a brown polyimide film and a thermosetting adhesive layer, and the thickness of the reinforcing layer is 100-200 μm; the adhesive paper layer consists of a release film and a thermosetting adhesive layer.
The invention also provides a method for manufacturing the flexible printed circuit board for the wireless charger, which comprises the following steps:
s1, cutting, drilling, making black holes and outer layer circuit patterns on the flexible base material;
s2, covering a first black covering film and a second black covering film on the top surface and the bottom surface of the flexible substrate respectively, pressing and covering release films on the surfaces of the first black covering film and the second black covering film, and tearing off the release films after quick pressing;
s3, pasting a yellow covering film on the surface of the first black covering film, pasting a PET film on the surface of the yellow covering film, and performing vacuum lamination;
s4, preparing a PI reinforcing layer on the surface of the second black covering film;
and S5, assembling a foam layer on the surface of the reinforcing layer, and attaching a glue paper layer on the surface of the foam layer.
Preferably, before the lamination in step S3, a TPX release film, a polyvinyl chloride film, a common release film, and a single-sided silicon-free release film are sequentially stacked on the surface of the PET film along a direction away from the PET film.
Preferably, in the step S2, the pressing temperature in the rapid pressing process is 180 ℃, the pressure is 170kg, and the pressing time is 130S; when the PI reinforcing layer is prepared in step S4, the reinforcing layer is attached to the surface of the second black cover film, and then the TPX release film is attached to the surface of the reinforcing layer, and the PI reinforcing layer is quickly pressed at 160 ℃ for 130S.
Preferably, the release film used in step S2 is a PET release film, the thickness is 60-1000 μm, and the viscosity of PET is less than 0.3N/mm.
Compared with the prior art, the technical scheme of the invention has the following advantages:
(1) the flexible printed circuit board for the wireless charger comprises a flexible base material, wherein a first black covering film is arranged on the top surface of the flexible base material, a second black covering film is arranged on the bottom surface of the flexible base material, a yellow covering film is arranged on the top surface of the first black covering film, and a reinforcing layer and a gummed paper layer are sequentially arranged on the bottom surface of the second black covering film along the direction far away from the flexible base material. This flexible printed circuit board both sides all are provided with ultra-thin cover film, and the bottom still is provided with strengthening layer and glued paper layer, and product structural stability is high, and is not fragile, and reliability and life have obtained promoting by a wide margin.
(2) The flexible printed circuit board for the wireless charger is characterized in that the flexible base material is provided with a coil-shaped circuit pattern, the distance between circuits is not less than 100 mu m, the thickness of plated copper on the surface is 8-15 mu m, and the total thickness of a copper layer of the flexible base material is 50-60 mu m. The line spacing is large, a compensation value of 40-60 mu m is reserved for the line width in the design stage, and the problems that the characteristic resistance value of the flexible printed circuit board for the traditional wireless charger is unstable and fluctuates greatly due to the fact that the line spacing is too small are solved.
(3) According to the manufacturing process of the flexible printed circuit board for the wireless charger, the process of laminating after the PET release film is laminated on the surface of the ultrathin black covering film is adopted, the problems that the ultrathin covering film is easy to wrinkle and tear and low in laminating efficiency and yield are solved, the problems that the covering film is easy to damage and cannot be compacted when being laminated are solved by combining quick pressing and vacuum pressing, and the reliability of products is improved.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the embodiments of the present disclosure taken in conjunction with the accompanying drawings, in which
Fig. 1 is a schematic structural diagram of a flexible printed circuit board for a wireless charger according to an embodiment of the present invention.
The reference numbers in the figures denote: 1-a flexible substrate; 2-a first black cover film; 3-a second black cover film; 4-yellow cover film; 5-a strengthening layer; 6-adhesive paper layer; 7-foam cotton layer.
Detailed Description
Example 1
The embodiment provides a flexible printed circuit board for wireless charger, as shown in fig. 1, the flexible printed circuit board includes a flexible substrate 1, the flexible substrate 1 is a double-sided electrolytic copper foil, a coil-shaped line pattern is manufactured on the surface of the flexible substrate 1, a compensation value of 40-60 μm is reserved for the line width of a working negative before the line pattern is manufactured, the distance between adjacent lines is not less than 100 μm, in the embodiment, the thickness of copper plated on the surface of the flexible substrate 1 is 8 μm, the thickness of the copper foil of the flexible substrate 1 is 1.4OZ (49 μm), namely, the total thickness of the copper layer on the surface of the flexible substrate 1 is 57 μm, the flexible substrate further has a via hole for transmitting signals, and the thickness of copper in the via hole after copper plating is greater than 8 μm.
The flexible substrate is characterized in that a first black covering film 2 is arranged on the top surface of the flexible substrate 1, a second black covering film 3 is arranged on the bottom surface of the flexible substrate, the first black covering film 2 and the second black covering film 3 are both composed of black polyimide films and thermosetting adhesive layers, the thickness of each of the first black covering film 2 and the second black covering film 3 is 10 micrometers, and the thermosetting adhesive layers are laminated on the flexible substrate 1. The top surface of the first black covering film 2 is provided with a yellow covering film 4, the yellow covering film 4 is composed of a yellow polyimide film and a thermosetting adhesive layer, the thickness of the yellow covering film is 30 micrometers, and the thermosetting adhesive layer of the yellow covering film 4 is attached to and covers the first black covering film 2. The second black covers 3 bottom surfaces of membrane and is followed and is kept away from flexible substrate 1's direction is provided with strengthening layer 5 and adhesive tape layer 6 in order, and, still be provided with the cotton layer 7 of bubble between strengthening layer 5 and the adhesive tape layer 6, the cotton layer 7 of bubble is used for shielding electromagnetic interference. The reinforcing layer 5 is composed of a brown Polyimide (PI) film and a thermosetting adhesive layer, the thickness of the reinforcing layer is 100 micrometers, the thermosetting adhesive layer is attached to the surface of the second black covering film 3, the adhesive paper layer 6 is composed of a release film and the thermosetting adhesive layer, and the thermosetting adhesive layer is attached to the foam layer 7.
Example 2
The embodiment provides a flexible printed circuit board for a wireless charger, the structure of the flexible printed circuit board is basically the same as that of embodiment 1, the flexible printed circuit board comprises a flexible substrate 1, the flexible substrate 1 is a double-sided electrolytic copper foil, a coil-shaped circuit pattern is manufactured on the surface of the flexible substrate 1, a compensation value of 40-60 mu m is reserved for the line width of a working negative before the circuit pattern is manufactured, the distance between adjacent circuits is not less than 100 mu m, in the embodiment, the thickness of copper plated on the surface of the flexible substrate 1 is 15 mu m, the thickness of the copper foil layer of the double-sided electrolytic copper foil is 1OZ (35 mu m), namely, the total thickness of the copper layer on the surface of the flexible substrate 1 is 50 mu m, the flexible substrate further comprises a via hole for transmitting signals, and the thickness of copper in.
The flexible substrate is characterized in that a first black covering film 2 is arranged on the top surface of the flexible substrate 1, a second black covering film 3 is arranged on the bottom surface of the flexible substrate, the first black covering film 2 and the second black covering film 3 are both composed of black polyimide films and thermosetting adhesive layers, the thickness of each of the first black covering film 2 and the second black covering film 3 is 15 micrometers, and the thermosetting adhesive layers are laminated on the flexible substrate 1. The top surface of the first black covering film 2 is provided with a yellow covering film 4, the yellow covering film 4 is composed of a yellow polyimide film and a thermosetting adhesive layer, the thickness of the yellow covering film is 50 micrometers, and the thermosetting adhesive layer of the yellow covering film 4 is attached to and covers the first black covering film 2. The second black covers 3 bottom surfaces of membrane and is followed and is kept away from flexible substrate 1's direction is provided with strengthening layer 5 and adhesive tape layer 6 in order, and, still be provided with the cotton layer 7 of bubble between strengthening layer 5 and the adhesive tape layer 6, the cotton layer 7 of bubble is used for shielding electromagnetic interference. The reinforcing layer 5 is composed of a brown Polyimide (PI) film and a thermosetting adhesive layer, the thickness of the reinforcing layer is 200 microns, the thermosetting adhesive layer is attached to the surface of the second black covering film 3, the adhesive paper layer 6 is composed of a release film and the thermosetting adhesive layer, and the thermosetting adhesive layer is attached to the foam layer 7.
Example 3
The embodiment provides a flexible printed circuit board for a wireless charger, the structure of the flexible printed circuit board is basically the same as that of embodiment 1, the flexible printed circuit board comprises a flexible substrate 1, the flexible substrate 1 is a double-sided electrolytic copper foil, a coil-shaped circuit pattern is manufactured on the surface of the flexible substrate 1, a compensation value of 40-60 μm is reserved for the line width of a working negative before the circuit pattern is manufactured, the distance between adjacent circuits is not less than 100 μm, in the embodiment, the copper plating thickness of the surface of the flexible substrate 1 is 10 μm, the copper foil thickness of the double-sided electrolytic copper foil is 1.3OZ (45.5 μm), namely the total thickness of the copper layer on the surface of the flexible substrate 1 is 55.5 μm, the flexible substrate further comprises a through hole for transmitting signals, and the copper thickness in the through hole after copper plating is.
The flexible substrate is characterized in that a first black covering film 2 is arranged on the top surface of the flexible substrate 1, a second black covering film 3 is arranged on the bottom surface of the flexible substrate, the first black covering film 2 and the second black covering film 3 are both composed of black polyimide films and thermosetting adhesive layers, the thickness of each of the first black covering film 2 and the second black covering film 3 is 12 micrometers, and the thermosetting adhesive layers are laminated on the flexible substrate 1. The top surface of the first black covering film 2 is provided with a yellow covering film 4, the yellow covering film 4 is composed of a yellow polyimide film and a thermosetting adhesive layer, the thickness of the yellow covering film is 40 micrometers, and the thermosetting adhesive layer of the yellow covering film 4 is attached to and covers the first black covering film 2. The second black covers 3 bottom surfaces of membrane and is followed and is kept away from flexible substrate 1's direction is provided with strengthening layer 5 and adhesive tape layer 6 in order, and, still be provided with the cotton layer 7 of bubble between strengthening layer 5 and the adhesive tape layer 6, the cotton layer 7 of bubble is used for shielding electromagnetic interference. The reinforcing layer 5 is composed of a brown Polyimide (PI) film and a thermosetting adhesive layer, the thickness of the reinforcing layer is 150 micrometers, the thermosetting adhesive layer is attached to the surface of the second black covering film 3, the adhesive paper layer 6 is composed of a release film and the thermosetting adhesive layer, and the thermosetting adhesive layer is attached to the foam layer 7.
Example 4
The present embodiment provides a method for manufacturing the flexible printed circuit board for a wireless charger according to embodiments 1 to 3, which includes the steps of:
and S1, cutting, drilling, making black holes and outer layer circuit patterns on the flexible substrate 1 by adopting a conventional process, and performing acid etching and film stripping treatment on the outer layer.
S2, after AOI detection is qualified, attaching a first black covering film 2 on the top surface of a flexible substrate 1, attaching a second black covering film 3 on the bottom surface of the flexible substrate 1, then covering high-temperature-resistant PET release films on the surfaces of the first black covering film 2 and the second black covering film 3, wherein the thickness of the PET release films is 60-100 mu m, the viscosity of PET is less than 0.3N/mm, then quickly pressing for 130S under the pressing condition of temperature 180 ℃ and pressure 170kg, and then tearing off the release films.
S3, attaching a yellow cover film 4 to the surface (GTL, top circuit layer side) of the first black cover film 2, attaching a PET film to the surface of the yellow cover film, and laying an auxiliary pressing layer on the surface of the yellow cover film 4 in order to prevent the cover film from wrinkling and damage during pressing, wherein the auxiliary pressing layer comprises a TPX release film, a polyvinyl chloride film, a common release film (PET film) and a single-sided silicon-free release film which are sequentially stacked along the direction away from the yellow cover film 4, and the rough surface of the single-sided silicon-free release film is attached to the common release film.
And S4, plating nickel and gold, manufacturing surface characters, punching, preparing a PI reinforcing layer 5 on the surface (GBL, bottom layer circuit layer side) of the second black covering film 3, attaching the PI reinforcing layer 5 to the surface of the second black covering film 3, attaching a TPX high-temperature release film on the surface of the reinforcing layer 5, and then quickly pressing at 160 ℃ for 130S.
And S5, punching and carrying out SMT treatment, assembling the foam layer 7 on the surface of the reinforcing layer 5, punching again, and then pasting the gummed paper layer 6 on the surface of the foam layer 7.
In the step S3, the vacuum pressing machine is used for pressing the upper part of the lamination, and parameters such as pressure and temperature can be set for more than two times, so that the filling effect is better in the pressing process, and the problems of incompact pressing and wrinkling of the covering film are solved, wherein the pressing parameters used in the embodiment are shown in table 1:
TABLE 1
Under the matching of the specific pressing process and parameters, the thermosetting adhesive of the covering film flows and is cured more fully, and the binding force, heat resistance and insulativity of the flexible circuit board are improved.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (5)
1. The manufacturing method of the flexible printed circuit board for the wireless charger is characterized in that the flexible printed circuit board comprises a flexible base material, a first black covering film is arranged on the top surface of the flexible base material, a second black covering film is arranged on the bottom surface of the flexible base material, a yellow covering film is arranged on the top surface of the first black covering film, and a reinforcing layer and a gummed paper layer are sequentially arranged on the bottom surface of the second black covering film along the direction far away from the flexible base material;
the bottom surface of the reinforcing layer is also provided with a foam layer;
the flexible base material is provided with a coil-shaped circuit pattern, the distance between circuits is not less than 100 mu m, the copper plating thickness on the surface of the flexible base material is 8-15 mu m, and the total thickness of the copper layer of the flexible base material is 50-60 mu m;
the first black covering film and the second black covering film are composed of black polyimide films and thermosetting adhesive layers, the thickness of the first black covering film and the second black covering film is 10-15 micrometers, and the yellow covering film is composed of yellow polyimide films and thermosetting adhesive layers, and the thickness of the yellow covering film is 30-50 micrometers;
the manufacturing method of the flexible printed circuit board for the wireless charger comprises the following steps:
s1, cutting, drilling, making black holes and outer layer circuit patterns on the flexible base material;
s2, covering a first black covering film and a second black covering film on the top surface and the bottom surface of the flexible substrate respectively, pressing and covering release films on the surfaces of the first black covering film and the second black covering film, and tearing off the release films after quick pressing;
s3, pasting a yellow covering film on the surface of the first black covering film, pasting a PET film on the surface of the yellow covering film, and performing vacuum lamination;
s4, preparing a PI reinforcing layer on the surface of the second black covering film;
s5, assembling a foam layer on the surface of the reinforcing layer, and attaching a glue paper layer on the surface of the foam layer;
before laminating in the step S3, the TPX release film, the polyvinyl chloride film, the common release film, and the single-sided silicon-free release film are sequentially stacked on the surface of the PET film in a direction away from the PET film.
2. The method for manufacturing the flexible printed circuit board for the wireless charger according to claim 1, wherein the flexible substrate is a double-sided electrolytic copper foil, and the thickness of the copper foil is 1-1.5 OZ.
3. The method as claimed in claim 2, wherein the reinforcing layer is composed of a brown polyimide film and a thermosetting adhesive layer, and has a thickness of 100-200 μm; the adhesive paper layer consists of a release film and a thermosetting adhesive layer.
4. The method for manufacturing a flexible printed circuit board for a wireless charger according to claim 3, wherein the pressing temperature in the rapid pressing process in the step S2 is 180 ℃, the pressure is 170kg, and the pressing time is 130S; when the PI reinforcing layer is prepared in step S4, the reinforcing layer is attached to the surface of the second black cover film, and then the TPX release film is attached to the surface of the reinforcing layer, and the PI reinforcing layer is quickly pressed at 160 ℃ for 130S.
5. The method for manufacturing the flexible printed circuit board for the wireless charger according to claim 4, wherein the release film adopted in the step S2 is a PET release film, the thickness of the release film is 60-1000 μm, and the viscosity of PET is less than 0.3N/mm.
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| CN201810463919.2A CN108521710B (en) | 2018-05-15 | 2018-05-15 | Flexible printed circuit board for wireless charger and manufacturing method thereof |
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| CN110636709B (en) * | 2019-08-09 | 2021-05-18 | 精电(河源)显示技术有限公司 | FPC calendering copper manufacturing process capable of controlling expansion and contraction |
| CN110769614A (en) * | 2019-10-28 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | FPC full-process tracing method with black cover film |
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| CN103140019A (en) * | 2011-12-05 | 2013-06-05 | 昆山雅森电子材料科技有限公司 | Black cover film of soft printed circuit board, soft printed circuit board structure and manufacturing method of black cover film of soft printed circuit board and soft printed circuit board structure |
| CN103879119A (en) * | 2012-12-20 | 2014-06-25 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
| CN104325726A (en) * | 2014-10-24 | 2015-02-04 | 苏州安洁科技股份有限公司 | Double-layer PI film and corresponding gluing process thereof |
| CN105873342A (en) * | 2015-01-20 | 2016-08-17 | 群创光电股份有限公司 | Display device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140019A (en) * | 2011-12-05 | 2013-06-05 | 昆山雅森电子材料科技有限公司 | Black cover film of soft printed circuit board, soft printed circuit board structure and manufacturing method of black cover film of soft printed circuit board and soft printed circuit board structure |
| CN103879119A (en) * | 2012-12-20 | 2014-06-25 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
| CN104325726A (en) * | 2014-10-24 | 2015-02-04 | 苏州安洁科技股份有限公司 | Double-layer PI film and corresponding gluing process thereof |
| CN105873342A (en) * | 2015-01-20 | 2016-08-17 | 群创光电股份有限公司 | Display device |
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