CN108521710A - Wireless charger flexible circuit board and preparation method thereof - Google Patents
Wireless charger flexible circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN108521710A CN108521710A CN201810463919.2A CN201810463919A CN108521710A CN 108521710 A CN108521710 A CN 108521710A CN 201810463919 A CN201810463919 A CN 201810463919A CN 108521710 A CN108521710 A CN 108521710A
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- film
- circuit board
- black
- covering film
- parent metal
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of wireless charger flexible circuit boards, including flexible parent metal, the flexible parent metal top surface is provided with the first black covering film, bottom surface is provided with the second black covering film, first black covering film top surface is provided with yellow cover film, and second black covering film bottom surface has been sequentially arranged strengthening course and gummed paper layer along the direction far from the flexible parent metal.The flexible circuit board both sides are both provided with ultra-thin cover film, and bottom is additionally provided with strengthening course and gummed paper layer, and product structure stability is high, is hardly damaged, reliability and service life are significantly enhanced.Also disclose the manufacture craft of the circuit board, the technique pressed again after PET release films is being covered using on ultra-thin black covering film surface, it solves the problems, such as the easy fold of ultra-thin cover film, tears, is bonded efficiency and yield is low, and it is combined cracky when solving the problems, such as cover film pressing using fast pressure and vacuum pressing-combining, can not be compacted, improve the reliability of product.
Description
Technical field
The invention belongs to printed circuit board production technical field, it is related to a kind of flexible printed-circuit board and preparation method thereof,
Relate in particular to a kind of wireless charger flexible circuit board and preparation method thereof.
Background technology
Wireless charging is a kind of New-type charge technology of rising in recent years, i.e., not can be realized to one by charging wire rod
The electronic product determined in spatial dimension charges, be convert the current into electromagnetism in emitter terminals using electromagnetic technique, then
Using built-in chip receiver by electromagnetic conversion be electric current, using in air of the magnetic resonance between charger and electronic equipment
Charge is transmitted, realizes the high efficiency of transmission of electric energy.Compared with traditional wire charging technique, wireless charging has small, portability
Height, compatibility is strong, is conducive to the advantages that charging equipment water proof and dust proof design.Some new mobile phones have used wireless charging at present
Power technology, in addition onboard wireless charging scheme also occurred, i.e., onboard place wireless charging holder, when driving can be by mobile phone
It is charged with the wireless charging holder, onboard wireless charger and traditional wire charger are close in charge efficiency.
It needs that the printed circuit board for installing electronic component, being electrically connected is arranged in wireless charger, in order to subtract
The volume of small wireless charger, generally use flexible PCB (also referred to as flexible electric circuit board or FPC), wireless charger is used at present
Flexible PCB has that single structure, stability and reliability are relatively low, is embodied in, and wireless charger is flexible
The circuit design of circuit board is the precise circuit in coiled type, and surface copper overall thickness reaches 50-65 μm, and layers of copper overall thickness is super
Thickness, therefore electroplating evenness, etching are difficult to meet the requirements.Wireless charging FPC includes WPC (wireless charging), MST (magnetism peaces
Full transmission), three big modules of NFC (wireless near field communication), characteristic resistance value interacts, as changed one of module
Circuit can influence the resistance value of other two module, therefore there is a problem of that characteristic resistance value instability, fluctuation are big.In addition, wireless charging
Electric flexible PCB also needs to paste cover film, and it is small (12.5-20 μm) to cover film thickness due to its surface copper thick high (>=1OZ),
Filling capacity is insufficient when causing to press, and traditional process for pressing easily leads to cover film blistering, corrugation, and is caused breakage by easy squeeze
It is bad.
Invention content
For this purpose, the present invention exactly will solve above-mentioned technical problem, to propose that a kind of cover film is not easy fold, breakage, table
Face copper thickness is smaller, is easy to the wireless charger flexible circuit board and preparation method thereof for being electroplated and etching.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of wireless charger flexible circuit board, and the flexible circuit board includes flexibility
Base material, the flexible parent metal top surface is provided with the first black covering film, bottom surface is provided with the second black covering film, and described first
Black covering film top surface is provided with yellow cover film, and second black covering film bottom surface is along the side far from the flexible parent metal
To being sequentially arranged strengthening course and gummed paper layer.
Preferably, the strengthening course bottom surface is additionally provided with foamed cotton layer.
Preferably, the flexible parent metal has coiled type line pattern, the spacing between circuit is described not less than 100 μm
Flexible parent metal copper coating thickness is 8-15 μm, and the flexible parent metal layers of copper overall thickness is 50-60 μm.
Preferably, the flexible parent metal is two-sided electrolytic copper foil, copper thickness 1-1.5OZ.
Preferably, first black covering film, the second black covering film are by black polyamide thin film and hot-setting adhesive
Layer composition, thickness are 10-15 μm, and the yellow cover film is made of yellow polyimide film and thermosetting glue-line, and thickness is
30-50μm。
Preferably, the strengthening course is made of brown Kapton and thermosetting glue-line, thickness is 100-200 μm；
The gummed paper layer is made of release film and thermosetting glue-line.
The present invention also provides a kind of methods making the wireless charger flexible circuit board comprising as follows
Step：
S1, sawing sheet, drilling, black holes and the processing of outer-layer circuit graphic making are carried out to flexible parent metal；
S2, the first black covering film, the second black covering film are covered respectively in the flexible parent metal top and bottom, and
First black covering film, the second black covering film surface cover release film, remove release film after fast pressure；
S3, yellow cover film is pasted on first black covering film surface, and PET is pasted in yellow covering film surface
Film, vacuum pressing-combining；
S4, PI strengthening courses are prepared on second black covering film surface；
S5, gummed paper layer is pasted in the strengthening course surface-assembled foamed cotton layer, and in foam layer surface.
Preferably, before being pressed in the step S3, TPX is sequentially stacked along the direction far from PET film on PET film surface
Release film, polychloroethylene film, common release film, single side are without silicon release film.
Preferably, pressing-in temp is 180 DEG C, pressure 170kg during being pressed soon described in the step S2, pressing
Time is 130s；When preparing PI strengthening courses in the step S4, mended after strengthening course is fitted in the second black covering film surface
Strong layer surface pastes TPX release films, and presses 130s soon at 160 DEG C.
Preferably, the release film used in the step S2 is PET release film, thickness is 60-1000 μm, PET viscosity
Less than 0.3N/mm.
The above technical solution of the present invention has the following advantages over the prior art：
(1) wireless charger flexible circuit board of the present invention, including flexible parent metal, the flexible parent metal
Top surface is provided with the first black covering film, bottom surface is provided with the second black covering film, the setting of first black covering film top surface
There are yellow cover film, second black covering film bottom surface to be sequentially arranged strengthening course along the direction far from the flexible parent metal
With gummed paper layer.The flexible circuit board both sides are both provided with ultra-thin cover film, and bottom is additionally provided with strengthening course and gummed paper layer,
Product structure stability is high, is hardly damaged, reliability and service life are significantly enhanced.
(2) wireless charger flexible circuit board of the present invention, the flexible parent metal have coiled type circuit
Figure, the spacing between circuit are not less than 100 μm, and copper coating thickness is 8-15 μm, and the flexible parent metal layers of copper overall thickness is
50-60μm.Circuit spacing is big, has also reserved 40-60 μm of offset to line width in the design phase, has solved conventional wireless and fill
Electric appliance flexible circuit board characteristic resistance value characteristic resistance value caused by line spacing is too small is unstable, fluctuation is big asks
Topic.
(3) manufacture craft of wireless charger flexible circuit board of the present invention, using in ultra-thin black
Covering film surface covers the technique after PET release films in pressing, solve the easy fold of ultra-thin cover film, tear, be bonded efficiency and
The low problem of yield, and cracky when solving cover film pressing is combined using fast pressure and vacuum pressing-combining, can not be compacted
Problem improves the reliability of product.
Description of the drawings
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and ties
Attached drawing is closed, the present invention is described in further detail, wherein
Fig. 1 is the structural schematic diagram of the wireless charger flexible circuit board described in the embodiment of the present invention.
Reference numeral is expressed as in figure：1- flexible parent metals；The first black covering films of 2-；The second black covering films of 3-；4- is yellow
Wrapping epiphragma；5- strengthening courses；6- gummed paper layers；7- foamed cotton layers.
Specific implementation mode
Embodiment 1
The present embodiment provides a kind of wireless charger flexible circuit boards, as shown in Figure 1, the flexible print is electric
Road plate includes flexible parent metal 1, and the flexible parent metal 1 is two-sided electrolytic copper foil, and the surface of the flexible parent metal 1, which makes, coil
Shape line pattern, the egative film line width that works before circuit graphic making have reserved 40-60 μm of offset, and between adjacent lines
Spacing be not less than 100 μm, in the present embodiment, 1 copper coating thickness of flexible parent metal be 8 μm, the copper thickness of flexible parent metal 1
For 1.4OZ (49 μm), i.e. 1 surface layers of copper overall thickness of flexible parent metal is 57 μm, and the flexible parent metal also has for transmitting signal
Via hole, copper thickness is more than 8 μm in copper plating treatment metapore.
1 top surface of the flexible parent metal is provided with the first black covering film 2, bottom surface is provided with the second black covering film 3, institute
State the first black covering film 2, the second black covering film 3 is made of black polyamide thin film and thermosetting glue-line, thickness is equal
It it is 10 μm, thermosetting glue layer pastes the setting of the flexible parent metal 1.First black covering film, 2 top surface is provided with yellow covering
Film 4, the yellow cover film 4 are made of yellow polyimide film and thermosetting glue-line, and thickness is 30 μm, yellow cover film 4
Thermosetting glue-line pastes first black covering film 2 and is arranged.Second black covering film, 3 bottom surface is along far from the flexible base
The direction of material 1 has been sequentially arranged strengthening course 5 and gummed paper layer 6, also, bubble is additionally provided between the strengthening course 5 and gummed paper layer 6
Cotton layer 7, the foamed cotton layer 7 is used to shield the interference of electromagnetism.Wherein, the strengthening course 5 by brown polyimides (PI) film with
Thermosetting glue-line form, thickness be 100 μm, thermosetting glue-line paste 3 surface of the second black covering film setting, the gummed paper layer 6 by from
Type film is formed with thermosetting glue-line, and thermosetting glue-line pastes the setting of foamed cotton layer 7.
Embodiment 2
The present embodiment provides a kind of wireless charger flexible circuit boards, and structure is substantially the same manner as Example 1,
The flexible circuit board includes flexible parent metal 1, and the flexible parent metal 1 is two-sided electrolytic copper foil, the flexible parent metal 1
Surface, which makes, coiled type line pattern, and the egative film line width that works before circuit graphic making has reserved 40-60 μm of offset,
And the spacing between adjacent lines is not less than 100 μm, in the present embodiment, 1 copper coating thickness of flexible parent metal is 15 μm, two-sided
The copper foil layer thickness of electrolytic copper foil is 1OZ (35 μm), i.e., 1 surface layers of copper overall thickness of flexible parent metal is 50 μm, the flexibility base
Material also has a via hole for transmitting signal, and copper thickness is more than 8 μm in copper plating treatment metapore.
1 top surface of the flexible parent metal is provided with the first black covering film 2, bottom surface is provided with the second black covering film 3, institute
State the first black covering film 2, the second black covering film 3 is made of black polyamide thin film and thermosetting glue-line, thickness is equal
It it is 15 μm, thermosetting glue layer pastes the setting of the flexible parent metal 1.First black covering film, 2 top surface is provided with yellow covering
Film 4, the yellow cover film 4 are made of yellow polyimide film and thermosetting glue-line, and thickness is 50 μm, yellow cover film 4
Thermosetting glue-line pastes first black covering film 2 and is arranged.Second black covering film, 3 bottom surface is along far from the flexible base
The direction of material 1 has been sequentially arranged strengthening course 5 and gummed paper layer 6, also, bubble is additionally provided between the strengthening course 5 and gummed paper layer 6
Cotton layer 7, the foamed cotton layer 7 is used to shield the interference of electromagnetism.Wherein, the strengthening course 5 by brown polyimides (PI) film with
Thermosetting glue-line form, thickness be 200 μm, thermosetting glue-line paste 3 surface of the second black covering film setting, the gummed paper layer 6 by from
Type film is formed with thermosetting glue-line, and thermosetting glue-line pastes the setting of foamed cotton layer 7.
Embodiment 3
The present embodiment provides a kind of wireless charger flexible circuit boards, and structure is substantially the same manner as Example 1,
The flexible circuit board includes flexible parent metal 1, and the flexible parent metal 1 is two-sided electrolytic copper foil, the flexible parent metal 1
Surface, which makes, coiled type line pattern, and the egative film line width that works before circuit graphic making has reserved 40-60 μm of offset,
And the spacing between adjacent lines is not less than 100 μm, in the present embodiment, 1 copper coating thickness of flexible parent metal is 10 μm, two-sided
The copper thickness of electrolytic copper foil is 1.3OZ (45.5 μm), i.e., the layers of copper overall thickness on 1 surface of flexible parent metal is 55.5 μm, described
Flexible parent metal also has a via hole for transmitting signal, and copper thickness is more than 8 μm in copper plating treatment metapore.
1 top surface of the flexible parent metal is provided with the first black covering film 2, bottom surface is provided with the second black covering film 3, institute
State the first black covering film 2, the second black covering film 3 is made of black polyamide thin film and thermosetting glue-line, thickness is equal
It it is 12 μm, thermosetting glue layer pastes the setting of the flexible parent metal 1.First black covering film, 2 top surface is provided with yellow covering
Film 4, the yellow cover film 4 are made of yellow polyimide film and thermosetting glue-line, and thickness is 40 μm, yellow cover film 4
Thermosetting glue-line pastes first black covering film 2 and is arranged.Second black covering film, 3 bottom surface is along far from the flexible base
The direction of material 1 has been sequentially arranged strengthening course 5 and gummed paper layer 6, also, bubble is additionally provided between the strengthening course 5 and gummed paper layer 6
Cotton layer 7, the foamed cotton layer 7 is used to shield the interference of electromagnetism.Wherein, the strengthening course 5 by brown polyimides (PI) film with
Thermosetting glue-line form, thickness be 150 μm, thermosetting glue-line paste 3 surface of the second black covering film setting, the gummed paper layer 6 by from
Type film is formed with thermosetting glue-line, and thermosetting glue-line pastes the setting of foamed cotton layer 7.
Embodiment 4
The present embodiment provides a kind of sides of wireless charger flexible circuit board of making as described in embodiment 1-3
Method comprising following steps：
S1, sawing sheet, drilling, black holes and outer-layer circuit graphic making are carried out to flexible parent metal 1 using common process, and right
Outer layer carries out acid etching and moves back film process.
After S2, AOI detection are qualified, the first black covering film 2 is pasted in 1 top surface of flexible parent metal, in 1 bottom surface of flexible parent metal
Paste the second black covering film 3, then the first black covering film 2,3 surface of the second black covering film covering high temperature resistant PET from
Type film, thickness are 60-100 μm, and the viscosity of PET is less than 0.3N/mm, then in 180 DEG C of temperature, the pressing item of pressure 170kg
130s is pressed under part soon, then removes release film.
S3, yellow cover film 4 is pasted in 2 surface of the first black covering film (GTL, top line layer side), and is covered in yellow
Epiphragma surface pastes PET film, cover film fold, breakage when to prevent pressing, in 4 surface laying assisted compression of yellow cover film
Layer, the assisted compression layer include along far from 4 direction of yellow cover film sequentially set the TPX release films stacked, polychloroethylene film,
Common release film (for PET film) and single side no-silicon type release film, the rough surface of wherein single side no-silicon type release film fit in commonly
Release film is arranged.
After S4, plating nickel gold and making surface word and punching, in 3 surface of the second black covering film (GBL, the bottom line
Road floor side) PI strengthening courses 5 are prepared, after PI strengthening courses 5 are covered on 3 surface of the second black covering film, pasted on 5 surface of strengthening course
TPX high temperature release films are covered, then press 130s soon at 160 DEG C.
After S5, punching and SMT processing, in 5 surface-assembled foamed cotton layer 7 of strengthening course, after being punched again, on 7 surface of foamed cotton layer
Paste gummed paper layer 6.
The upper pressing is pressed using vacuum pressing-combining machine in step S3, can the parameters such as the how short setting pressure of part, temperature, with
Keep filling effect in bonding processes more preferable, solves the problems, such as the pressing ginseng that covering membrane pressure is unreal and wrinkles, and is used in the present embodiment
Number is as shown in table 1：
Table 1
Under the cooperation of above-mentioned specific process for pressing and parameter, the hot-setting adhesive flowing and solidification of cover film are more abundant, carry
The high binding force of flexible PCB, heat resistance and insulating properties.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.
For those of ordinary skill in the art, other various forms of changes can also be made on the basis of the above description
Change or changes.There is no necessity and possibility to exhaust all the enbodiments.And obvious change extended from this
Change or changes still within the protection scope of the invention.
Claims (10)
1. a kind of wireless charger flexible circuit board, which is characterized in that the flexible circuit board includes flexible base
Material, the flexible parent metal top surface is provided with the first black covering film, bottom surface is provided with the second black covering film, first black
Cover film top surface is provided with yellow cover film, second black covering film bottom surface along the direction far from the flexible parent metal sequentially
It is provided with strengthening course and gummed paper layer.
2. wireless charger flexible circuit board according to claim 1, which is characterized in that the strengthening course bottom surface
It is additionally provided with foamed cotton layer.
3. wireless charger flexible circuit board according to claim 1 or 2, which is characterized in that the flexibility base
Material has coiled type line pattern, and the spacing between circuit is not less than 100 μm, and the flexible parent metal copper coating thickness is 8-15 μ
M, the flexible parent metal layers of copper overall thickness are 50-60 μm.
4. wireless charger flexible circuit board according to claim 3, which is characterized in that the flexible parent metal is
Two-sided electrolytic copper foil, copper thickness 1-1.5OZ.
5. wireless charger flexible circuit board according to claim 4, which is characterized in that first black covers
Epiphragma, the second black covering film are made of black polyamide thin film and thermosetting glue-line, and thickness is 10-15 μm, and the yellow is covered
Epiphragma is made of yellow polyimide film and thermosetting glue-line, and thickness is 30-50 μm.
6. wireless charger flexible circuit board according to claim 5, which is characterized in that the strengthening course is by palm fibre
Color Kapton and thermosetting glue-line composition, thickness are 100-200 μm；The gummed paper layer is by release film and thermosetting glue-line group
At.
7. a kind of method making wireless charger flexible circuit board as claimed in any one of claims 1 to 6, special
Sign is, includes the following steps：
S1, sawing sheet, drilling, black holes and the processing of outer-layer circuit graphic making are carried out to flexible parent metal；
S2, the first black covering film, the second black covering film are covered respectively in the flexible parent metal top and bottom, and black first
Wrapping epiphragma, the second black covering film surface cover release film, remove release film after fast pressure；
S3, yellow cover film is pasted on first black covering film surface, and PET film is pasted in yellow covering film surface, very
Pneumatics closes；
S4, PI strengthening courses are prepared on second black covering film surface；
S5, gummed paper layer is pasted in the strengthening course surface-assembled foamed cotton layer, and in foam layer surface.
8. the production method of wireless charger flexible circuit board according to claim 7, which is characterized in that described
Before being pressed in step S3, TPX release films, polychloroethylene film, common are sequentially stacked along the direction far from PET film on PET film surface
Release film, single side are without silicon release film.
9. the production method of wireless charger flexible circuit board according to claim 8, which is characterized in that described
Pressing-in temp is 180 DEG C, pressure 170kg, pressing time 130s during being pressed soon described in step S2；In the step S4
When preparing PI strengthening courses, strengthening course is fitted in behind the second black covering film surface and pastes TPX release films in reinforcement layer surface, and
130s is pressed soon at 160 DEG C.
10. the production method of wireless charger flexible circuit board according to claim 9, which is characterized in that institute
The release film used in step S2 is stated as PET release films, thickness is 60-1000 μm, and PET viscosity is less than 0.3N/mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810463919.2A CN108521710B (en) | 2018-05-15 | 2018-05-15 | Flexible printed circuit board for wireless charger and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810463919.2A CN108521710B (en) | 2018-05-15 | 2018-05-15 | Flexible printed circuit board for wireless charger and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN108521710A true CN108521710A (en) | 2018-09-11 |
| CN108521710B CN108521710B (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810463919.2A Active CN108521710B (en) | 2018-05-15 | 2018-05-15 | Flexible printed circuit board for wireless charger and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110636709A (en) * | 2019-08-09 | 2019-12-31 | 精电(河源)显示技术有限公司 | FPC calendering copper manufacturing process capable of controlling expansion and contraction |
| CN110769614A (en) * | 2019-10-28 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | FPC full-process tracing method with black cover film |
| CN114786365A (en) * | 2022-04-14 | 2022-07-22 | 扬州华盟电子有限公司 | Flexible circuit board for wireless charging and manufacturing method and application thereof |
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| CN103140019A (en) * | 2011-12-05 | 2013-06-05 | 昆山雅森电子材料科技有限公司 | Black cover film of soft printed circuit board, soft printed circuit board structure and manufacturing method of black cover film of soft printed circuit board and soft printed circuit board structure |
| CN103879119A (en) * | 2012-12-20 | 2014-06-25 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
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| CN110636709A (en) * | 2019-08-09 | 2019-12-31 | 精电(河源)显示技术有限公司 | FPC calendering copper manufacturing process capable of controlling expansion and contraction |
| CN110636709B (en) * | 2019-08-09 | 2021-05-18 | 精电(河源)显示技术有限公司 | FPC calendering copper manufacturing process capable of controlling expansion and contraction |
| CN110769614A (en) * | 2019-10-28 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | FPC full-process tracing method with black cover film |
| CN114786365A (en) * | 2022-04-14 | 2022-07-22 | 扬州华盟电子有限公司 | Flexible circuit board for wireless charging and manufacturing method and application thereof |
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| Publication number | Publication date |
|---|---|
| CN108521710B (en) | 2021-03-02 |
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