CN114786365A - Flexible circuit board for wireless charging and manufacturing method and application thereof - Google Patents
Flexible circuit board for wireless charging and manufacturing method and application thereof Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229910052802 copper Inorganic materials 0.000 claims abstract description 124
- 239000010949 copper Substances 0.000 claims abstract description 124
- 238000007747 plating Methods 0.000 claims abstract description 73
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000005530 etching Methods 0.000 claims abstract description 35
- 238000005553 drilling Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 24
- 239000000463 material Substances 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
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- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention provides a flexible circuit board for wireless charging and a manufacturing method and application thereof, wherein the manufacturing method comprises the following steps: (1) drilling a via hole at a preset position of the double-sided flexible copper-clad plate, performing black hole treatment on the via hole, then performing copper plating on the hole wall of the via hole so as to communicate the front side and the back side of the double-sided flexible copper-clad plate, and then performing copper plating on the front side and the back side of the double-sided flexible copper-clad plate for one time respectively; (2) etching coils on the front side and the back side of the double-sided flexible copper-clad plate respectively through an etching process, and conducting the coils on the front side and the back side through the conducting holes; (3) then, secondary copper plating is respectively carried out on the coils on the front side and the back side; (4) and (4) pressing an insulating film outside the product obtained in the step (3) and then carrying out post-process treatment to obtain the flexible circuit board. The manufacturing method realizes the high requirement of low copper plating tolerance by a mode of slowly plating copper for multiple times (reducing current density), and compared with a conventional etching mode, the efficiency of the etching process is improved by 2.5-3 times.
Description
Technical Field
The invention relates to a flexible circuit board for wireless charging and a manufacturing method and application thereof, and belongs to the technical field of printed circuit board manufacturing.
Background
With the rapid development of electronic equipment, the terminal products are irreversible in light, thin, short and small trend, and have more dense wiring and more severe volume requirements, which brings brand new challenges to the whole circuit board industry. The Flexible circuit board (FPC for short) just accords with the development direction of the circuit board industry in the future, has the characteristics of high wiring density, small volume, light weight, bending resistance and the like, is popular with emerging electronic products, and is a wireless charger for mobile phones.
Currently, wireless charging of a mobile phone is mainly realized in an electromagnetic induction mode, and an induction coil for transmitting electric energy is a flexible circuit board. The resonance of the primary and secondary coils is the main principle for achieving wireless charging, the visible coil being the main carrier. The coil has two forms: firstly, the coil is directly wound by copper wires, but the dependence of the wound coil on equipment is high, and the current related technology is mainly monopolized abroad and is not beneficial to domestic practical application; and secondly, the flexible printed circuit board is manufactured and obtained through an FPC etching process.
The main consideration of the wireless charging of the FPC is charging efficiency, i.e., quick charging. In order to meet the requirement of fast charging, strict requirements on the relevant performance of the coil are bound, such as high inductance, low resistance, low tolerance (about +/-15 um) and ultra-thinness (the current trend requirement of light weight). In order to obtain the requirement of high inductance and low resistance, the flexible circuit board itself needs to be thick, the thickness of the copper plate is generally required to be more than 50 μm, and the thick copper plate has the following problems in the manufacturing of the coil:
1) the traditional manufacturing method needs large-scale electroplating equipment as an auxiliary, and the copper plate with the thickness can cause that the tolerance of the later copper plating is difficult to control and easily exceeds the tolerance requirement;
2) the etching efficiency is seriously reduced, particularly, the copper is thicker, the etching speed is very slow, and the production efficiency of the coil board is reduced by about 2.5 to 3 times compared with the etching efficiency of the conventional FPC;
3) the ultra-thin property and the low resistance value are mutually contradictory, and the two requirements can reach the standard at the same time only by the right condition, which is another embodiment of strict requirements on the tolerance.
Therefore, it is an urgent technical problem in the art to provide a novel flexible circuit board for wireless charging, a method for manufacturing the same, and applications of the same.
Disclosure of Invention
In order to solve the above disadvantages and shortcomings, an object of the present invention is to provide a method for manufacturing a flexible circuit board for wireless charging.
The invention also aims to provide a flexible circuit board for wireless charging, which is prepared by the manufacturing method of the flexible circuit board for wireless charging.
The invention also aims to provide an application of the flexible circuit board for wireless charging in wireless charging power supply.
Still another object of the present invention is to provide an electronic device including the above-mentioned flexible printed circuit for wireless charging.
In order to achieve the above object, in one aspect, the present invention provides a method for manufacturing a flexible circuit board for wireless charging, where the method includes:
(1) drilling a via hole at a preset position of the double-sided flexible copper-clad plate, carrying out black hole treatment on the via hole so as to enable a conductor layer to be formed on a middle insulating substrate layer of the double-sided flexible copper-clad plate, then carrying out copper plating on the hole wall of the via hole so as to enable the front side and the back side of the double-sided flexible copper-clad plate to be communicated, and then respectively carrying out primary copper plating on the front side and the back side of the double-sided flexible copper-clad plate;
(2) etching coils on the front side and the back side of the double-sided flexible copper-clad plate respectively through an etching process, and conducting the coils on the front side and the back side through the conducting holes;
(3) respectively carrying out secondary copper plating on the coils on the front side and the back side;
(4) and (4) pressing an insulating film outside the product obtained in the step (3) and then performing post-process treatment to obtain the flexible circuit board for wireless charging.
As a specific embodiment of the above manufacturing method of the present invention, in the step (1), the thickness of the single-sided copper foil of the double-sided flexible copper clad laminate is 9 to 18 μm, preferably 18 μm.
In a specific embodiment of the above manufacturing method of the present invention, in the step (1), the copper plating and the primary copper plating are slow copper plating, and the copper plating rate is 20 to 40 microinches/min.
In a specific embodiment of the above manufacturing method according to the present invention, in the step (1), the thickness of the single-sided copper layer plated by the one-time copper plating is in a range of 3 to 5 μm.
As a specific embodiment of the above manufacturing method of the present invention, in the step (1), in the black hole treatment process, carbon powder in the black hole liquid can be attached to an intermediate insulating substrate layer (such as a polypropylene layer or a polyimide layer) of the double-sided flexible copper clad laminate, so that the intermediate insulating substrate layer forms a conductor layer.
As a specific implementation mode of the manufacturing method, the copper plating can thicken the hole wall of the conducting hole in the step (1), so that the requirement of conducting the front side and the back side of the double-sided flexible copper-clad plate is met.
As a specific embodiment of the above manufacturing method of the present invention, in the step (2), the shape, parameters, and the like of the coil can be reasonably adjusted according to actual needs. In addition, the coils on the front side and the back side are conducted through the through holes, which is equivalent to increase of the number of turns of the coils, so that the inductance value of the wireless charging flexible circuit board is larger, and the charging efficiency is improved.
In a specific embodiment of the above manufacturing method of the present invention, in the step (3), the second copper plating is performed a plurality of times, so that the thickness of the single-sided copper of the product obtained in the step (3) reaches 65 μm.
In the above-mentioned manufacturing method of the invention, in the step (3), the thickness of the single-sided copper layer plated in each time in the secondary copper plating process is in a range of 8-20 μm.
The specific times of the secondary copper plating are not required, the thickness of the copper layer plated with copper each time in the secondary copper plating process depends on the size of the etching residual area, the more the residual copper area is, the lower the single copper thickness is, and the low current is utilized to slowly plate copper, so that the error can be basically avoided.
In the above embodiment of the manufacturing method of the present invention, in the step (3), the second copper plating is slow copper plating, and the copper plating rate is 20-40 microinches/min.
As a specific embodiment of the above manufacturing method of the present invention, wherein the tolerance of the total thickness of the single-sided thickness of the primary copper plating in step (1) and the secondary copper plating in step (3) is ± 2 μm; the total thickness tolerance of the flexible circuit board for wireless charging is +/-4 mu m.
The copper layer plated by secondary copper plating in the step (3) can increase the overall copper thickness, so that the requirement of the flexible circuit board for wireless charging on the resistance value is met.
In addition, after the etching in the step (2) is finished, half of the copper layer in the coil is etched, and then the copper plating is carried out for the second time, so that the plated area is reduced by half, the copper plating can be finished by using lower current, and the copper plating tolerance is reduced, and meanwhile, the copper plating amount is reduced. Although the thickness of the copper plating is thick, the final copper plating cost is not increased or decreased because the previous etching results in the decrease of the plated area.
In an embodiment of the above manufacturing method of the present invention, the insulating film is a black insulating film.
In an embodiment of the above manufacturing method of the present invention, the insulating film includes a polyimide film or the like.
In the invention, the via hole drilling, black hole processing, copper plating, etching process (or pattern transfer), post process and the like are all conventional technical means in the field, and the operation can be reasonably carried out according to actual field needs, and raw materials used in each process, process parameters used in each process and the like can be reasonably selected. For example, in some embodiments of the present invention, the etching process (or pattern transfer) may be accomplished using existing conventional etching stations.
On the other hand, the invention also provides the flexible circuit board for wireless charging, which is prepared by the manufacturing method of the flexible circuit board for wireless charging.
In another aspect, the invention also provides an application of the flexible circuit board for wireless charging in wireless charging power supply.
In another aspect, the present invention further provides an electronic device, where the electronic device includes the above flexible circuit board for wireless charging.
As a specific embodiment of the above electronic device of the present invention, the electronic device includes a mobile phone.
The flexible circuit board for wireless charging provided by the invention realizes space-isolated charging through the energy conversion principle of electromagnetic generation and magnetic regeneration, and can be applied to the fields of wireless charging, radio frequency and the like of electronic equipment, such as mobile phones and the like.
The existing manufacturing method of the conventional flexible circuit board generally uses a thicker copper plate, and the copper plate is etched after being drilled and plated with copper, so that the method has high cost and low efficiency; compared with the conventional manufacturing method, the manufacturing method of the flexible circuit board for wireless charging provided by the invention uses a thinner double-sided flexible copper-clad plate, the copper plate is etched after being drilled with copper and then is subjected to secondary copper plating on the coil obtained by etching, and the method has the advantages of high etching efficiency, low cost, low requirement on equipment and very high manufacturing efficiency.
In summary, the manufacturing method of the flexible circuit board for wireless charging provided by the invention has the following beneficial technical effects:
1) the invention abandons the conventional material selection mode, uses thin copper to manufacture the flexible circuit board for wireless charging, reduces the material consumption and reduces the cost;
2) according to the invention, the manufacturing process is optimized while large electroplating equipment is not used for auxiliary manufacturing, namely, a mode of slowly plating copper for multiple times is adopted, so that on one hand, the thickness of the thin copper foil substrate is improved to meet the resistance requirement, on the other hand, the current density is reduced, the high requirement of low copper plating tolerance is realized, and the control on the thickness tolerance is finer; specifically, the thickness tolerance of the traditional manufacturing method of thick copper plus one-time electroplating is +/-15 microns, while the thickness tolerance of the process optimized by thin copper plus multiple times of electroplating provided by the invention can be accurate to +/-4 microns, and the coil performance is more excellent;
3) the invention completes the etching process without adding an etching line body, and the comprehensive efficiency has no influence, but compared with the conventional etching mode, the efficiency of the etching process is improved by 2.5-3 times.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of via hole drilling in embodiment 1 of the present invention.
Fig. 2 is a schematic view of copper plating on the hole wall of the via hole in embodiment 1 of the present invention.
Fig. 3 is a schematic diagram of a coil obtained by etching the coil on the front and back sides of the double-sided flexible copper-clad plate respectively through an etching process in embodiment 1 of the invention.
FIG. 4 is a schematic view showing the copper plating of example 1 of the present invention after the second copper plating.
FIG. 5 is a schematic view of the product obtained in step (3) being pressed with a black polyimide film in example 1 of the present invention.
Fig. 6 is a schematic diagram of a finished product of the flexible circuit board for wireless charging manufactured in embodiment 1 of the present invention.
Detailed Description
It should be noted that the term "comprises/comprising" and any variations thereof in the description and claims of this invention and the above-described drawings is intended to cover non-exclusive inclusions, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In the present invention, the terms "upper", "front", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
The "ranges" disclosed herein are given as lower and upper limits. There may be one or more lower limits, and one or more upper limits, respectively. The given range is defined by the selection of a lower limit and an upper limit. The selected lower and upper limits define the boundaries of the particular range. All ranges defined in this manner are combinable, i.e., any lower limit can be combined with any upper limit to form a range. For example, ranges of 60-120 and 80-110 are listed for particular parameters, with the understanding that ranges of 60-110 and 80-120 are also contemplated. Further, if the minimum range values listed are 1 and 2 and the maximum range values listed are 3, 4, and 5, then the following ranges are all contemplated: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5.
In the present invention, unless otherwise stated, the numerical range "a-b" represents a shorthand representation of any combination of real numbers between a and b, where a and b are both real numbers. For example, a numerical range of "0 to 5" indicates that all real numbers between "0 to 5" have been listed throughout this disclosure, and "0 to 5" is only a shorthand representation of the combination of these numbers.
In the present invention, all the embodiments and preferred embodiments mentioned in the present invention may be combined with each other to form a new technical solution, if not specifically stated.
In the present invention, all the technical features mentioned in the present invention and preferred features may be combined with each other to form a new technical solution, if not specifically stated.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. The following described embodiments are illustrative of some, but not all, of the present invention and should not be construed as limiting the scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The examples, in which specific conditions are not specified, were carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Example 1
The embodiment provides a manufacturing method of a flexible circuit board for wireless charging, wherein the manufacturing method specifically comprises the following steps:
(1) drilling a plurality of via holes at preset positions of a double-sided flexible copper clad laminate (the outer layer is a copper foil, the middle layer is a polyimide base material, and the thickness of the middle layer is 12.5 microns) with the copper foil thickness (single side) of 18 microns, wherein the size range of the via holes is 0.15-0.2mm, specifically 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm and the like, performing black hole treatment on the via holes as shown in figure 1 to enable the middle insulating base material layer of the double-sided flexible copper clad laminate to form a conductor layer, then performing copper plating on the hole walls of the via holes to enable the front side and the back side of the double-sided flexible copper clad laminate to be communicated, and performing one-time copper plating on the front side and the back side of the double-sided flexible copper clad laminate as shown in figure 2;
in the step (1), black hole liquid used for black hole treatment contains carbon powder (such as graphite), and the concentration of solid matters is 3 wt%;
in the step (1), both the copper plating and the primary copper plating are slow copper plating, and the copper plating rate is 30 microinches/min;
in the step (1), the thickness range of the single-sided copper layer plated by the primary copper plating is 5 microns;
(2) etching coils on the front side and the back side of the double-sided flexible copper-clad plate respectively through an etching process, as shown in figure 3, and conducting the coils on the front side and the back side through the via holes;
(3) and then, respectively carrying out secondary copper plating on the coils on the front side and the back side, wherein the secondary copper plating is carried out for four times, and the thickness of the single-side copper layer plated each time is respectively 15 micrometers, 17 micrometers and 10 micrometers, so that the single-side copper thickness of the product obtained in the step (3) reaches 65 micrometers;
in the step (3), the secondary copper plating is also slow copper plating, and the copper plating rate is 30 microinches/min;
the tolerance of the total thickness of the single surfaces of the primary copper plating in the step (1) and the secondary copper plating in the step (3) is +/-2 mu m; the tolerance of the total thickness of the flexible circuit board for wireless charging is +/-4 mu m, namely the total thickness of the product obtained in the step (3) is 142.5 +/-4 mu m;
(4) pressing a black polyimide film (shown in fig. 5) outside the product obtained in the step (3), and then carrying out post-process treatment to obtain a finished product of the flexible circuit board for wireless charging, as shown in fig. 6;
wherein, the thickness of the black polyimide film is 7.5 μm, and the thickness of the glue layer for adhering the black polyimide film and the copper material is 5 μm.
Comparative example 1
The comparative example provides a manufacturing method of a traditional flexible circuit board, wherein the manufacturing method specifically comprises the following steps:
(1) drilling a plurality of via holes at preset positions of a double-sided flexible copper clad laminate (the outer layer is a copper foil, the middle layer is a polyimide base material, and the thickness of the middle layer is 12.5 mu m) with the copper foil thickness (single side) of 50 mu m, wherein the size ranges of the via holes are 0.15-0.2mm, and specifically can be 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm and the like;
(2) adopting a traditional direct copper plating method to respectively carry out copper plating on the front surface and the back surface of the double-sided flexible copper-clad plate, wherein the thickness of the plated single-layer copper is 15 +/-5 mu m, so that the total thickness of the single-sided copper of the product obtained in the step (2) reaches 65 +/-5 mu m, the total thickness of the double-sided copper is 130 +/-10 mu m, and the total thickness of the product obtained in the step (2) is 142.5 +/-10 mu m;
(3) respectively manufacturing patterns on the front side and the back side of the double-sided flexible copper-clad plate in a film covering-developing-etching (commonly called DES) mode, and etching away redundant copper;
(4) pressing a black polyimide film outside the product obtained in the step (3), and then performing post-process treatment to obtain a finished product of the traditional flexible circuit board;
wherein, the thickness of the black polyimide film is 7.5 μm, and the thickness of the glue layer for adhering the black polyimide film and the copper material is 5 μm.
Test example 1
In the test example, the charging equipment for respectively installing the flexible circuit boards prepared in the embodiment 1 and the comparative example 1 is adopted to carry out the charging test on the mobile phone, and the test result shows that:
for the charging equipment provided with the traditional flexible circuit board, namely the flexible circuit board prepared in the comparative example 1, the charging efficiency obtained by wireless charging at the distance of 0V self-flowing voltage is generally 150 milliamperes, and the current obtained at the distance of 5mm is 109-120 milliamperes; when the charging equipment provided with the flexible circuit board for wireless charging prepared in the embodiment 1 of the invention is used for charging a mobile phone, the charging efficiency obtained by wireless charging at a distance of 5V self-flowing voltage 0 can reach 150.6-151.3 milliamperes, and the current obtained at a distance of 5mm can reach 118 milliamperes plus 130 milliamperes, which shows that the coil performance of the flexible circuit board for wireless charging provided by the embodiment of the invention is more excellent.
The existing manufacturing method of the conventional flexible circuit board generally uses a thicker copper plate, and the copper plate is etched after being drilled and plated with copper, so that the method has high cost and low efficiency; compared with the conventional manufacturing method, the manufacturing method of the flexible circuit board for wireless charging provided by the invention uses the thin double-sided flexible copper-clad plate, the copper plate is etched after drilling and copper plating, and then secondary copper plating is carried out on the coil obtained by etching.
In summary, the manufacturing method of the flexible circuit board for wireless charging provided by the invention has the following beneficial technical effects:
1) the invention abandons the conventional material selection mode, uses thin copper to manufacture the flexible circuit board for wireless charging, reduces the material consumption and reduces the cost;
2) according to the invention, the manufacturing process is optimized while large electroplating equipment is not used for auxiliary manufacturing, namely, the copper plating is slowly carried out for multiple times, so that on one hand, the thickness of the thin copper foil substrate is improved to meet the resistance requirement, on the other hand, the current density is reduced, the high requirement of low copper plating tolerance is realized, and the control on the thickness tolerance is finer; specifically, the thickness tolerance of the traditional manufacturing method of thick copper plus one-time electroplating is +/-15 microns, while the thickness tolerance of the process optimized by thin copper plus multiple times of electroplating provided by the invention can be accurate to +/-4 microns, and the coil performance is more excellent;
3) the invention completes the etching process without adding an etching line body, and the comprehensive efficiency has no influence, but compared with the conventional etching mode, the efficiency of the etching process is improved by 2.5-3 times.
The above description is only exemplary of the invention and should not be taken as limiting the scope of the invention, so that the invention is intended to cover all modifications and equivalents of the embodiments described herein. In addition, the technical features and the technical inventions of the present invention, the technical features and the technical inventions, and the technical inventions can be freely combined and used.
Claims (10)
1. A manufacturing method of a flexible circuit board for wireless charging is characterized by comprising the following steps:
(1) drilling a via hole at a preset position of the double-sided flexible copper-clad plate, carrying out black hole treatment on the via hole so as to enable an intermediate insulating substrate layer of the double-sided flexible copper-clad plate to form a conductor layer, then carrying out copper plating on the hole wall of the via hole so as to enable the front side and the back side of the double-sided flexible copper-clad plate to be communicated, and then respectively carrying out primary copper plating on the front side and the back side of the double-sided flexible copper-clad plate;
(2) etching coils on the front side and the back side of the double-sided flexible copper-clad plate respectively through an etching process, and conducting the coils on the front side and the back side through the conducting holes;
(3) respectively carrying out secondary copper plating on the coils on the front side and the back side;
(4) and (4) pressing an insulating film outside the product obtained in the step (3), and then performing post-process treatment to obtain the flexible circuit board for wireless charging.
2. The manufacturing method according to claim 1, wherein the thickness of the single-sided copper foil of the double-sided flexible copper clad laminate is 9-18 μm, preferably 18 μm;
it is also preferable that in the step (1), the copper plating and the one-time copper plating are slow copper plating at a copper plating rate of 20 to 40 microinches/min.
3. The manufacturing method according to claim 1 or 2, wherein in the step (1), the thickness of the single-sided copper layer plated by the primary copper plating is in a range of 3-5 μm.
4. The manufacturing method according to claim 1 or 2, wherein the secondary copper plating is performed in a plurality of times so that the single-sided copper thickness of the product obtained in the step (3) reaches 65 μm;
preferably, the thickness of the single-sided copper layer plated in each time in the secondary copper plating process is in the range of 8-20 μm;
also preferably, in the step (3), the secondary copper plating is slow copper plating, and the copper plating rate is 20-40 microinches/min.
5. The production method according to any one of claims 1 to 4, wherein the tolerance of the total thickness of the single-sided thickness of the primary copper plating in step (1) and the secondary copper plating in step (3) is ± 2 μm; the total thickness tolerance of the flexible circuit board for wireless charging is +/-4 mu m.
6. The manufacturing method according to claim 1 or 2, wherein the insulating film is a black insulating film;
preferably, the insulating film includes a polyimide film.
7. A flexible wiring board for wireless charging produced by the method for producing a flexible wiring board for wireless charging according to any one of claims 1 to 6.
8. The use of the flexible circuit board for wireless charging according to claim 7 in wireless charging and power supply.
9. An electronic device, characterized in that the electronic device comprises the flexible wiring board for wireless charging of claim 7.
10. The electronic device of claim 9, wherein the electronic device comprises a cell phone.
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