CN116435086A - Wireless charging coil and manufacturing method thereof - Google Patents
Wireless charging coil and manufacturing method thereof Download PDFInfo
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- CN116435086A CN116435086A CN202310273708.3A CN202310273708A CN116435086A CN 116435086 A CN116435086 A CN 116435086A CN 202310273708 A CN202310273708 A CN 202310273708A CN 116435086 A CN116435086 A CN 116435086A
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- charging coil
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229910052802 copper Inorganic materials 0.000 claims abstract description 120
- 239000010949 copper Substances 0.000 claims abstract description 120
- 238000007747 plating Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000004804 winding Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 36
- 239000010410 layer Substances 0.000 claims description 24
- 239000010408 film Substances 0.000 claims description 16
- 239000013039 cover film Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 10
- 238000009832 plasma treatment Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention discloses a manufacturing method of a wireless charging coil, which comprises the following steps: s1: pretreating to obtain a substrate, arranging copper wires with a certain thickness on the substrate, and winding the copper wires into an original copper coil; s2: copper plating is carried out on the original copper coil for the first time, so that a primary copper plated coil is obtained; s3: and carrying out secondary copper plating on the primary copper-plated coil to obtain the conductive coil. Correspondingly, the invention also discloses a wireless charging coil prepared by adopting the manufacturing method, and the distance between adjacent copper wires in the conductive coil of the wireless charging coil is smaller than that of the coil in the prior art, so that the wireless charging coil can be provided with more copper wires under the same area, the impedance of the wireless charging coil can be greatly reduced, the charging efficiency of the wireless charging coil is improved, the charging experience of a user is optimized, and the wireless charging coil has good popularization prospect and application value.
Description
Technical Field
The invention relates to the technical field of wireless charging, in particular to a wireless charging coil and a manufacturing method thereof.
Background
In recent years, with rapid improvement of technology level and continuous updating of electronic devices, requirements of consumers on performance and functions of the electronic devices are becoming higher, and in particular, requirements on charging modes of the electronic devices are being higher.
At present, traditional charging mode has brought a lot of inconvenience for people's life when using, and the consumer generally needs to adopt the charging mouth of specific charging wire butt joint electronic equipment, just realizes the charging to electronic equipment, and its charging mode is comparatively complicated. Therefore, a wireless charging mode with simpler charging flow is generated, the electronic equipment is mainly charged through an electromagnetic induction principle, and the electronic equipment can be directly charged without a charging wire, so that the wireless charging method is more convenient and quick.
However, the inventor researches and discovers that in the current wireless charging field, there is still a certain disadvantage that the impedance of the wireless charging coil arranged in the flexible circuit board is high, which affects the efficiency of wireless charging. For this purpose, it is necessary to design a wireless charging coil with lower impedance and higher charging efficiency.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the novel wireless charging coil manufacturing method is characterized in that when the wireless charging coil is manufactured, the secondary copper plating mode is adopted, so that the impedance of the wireless charging coil can be greatly reduced, the charging efficiency of the wireless charging coil is improved, the charging experience of a user is optimized, and the novel wireless charging coil has good popularization prospect and application value.
In order to solve the technical problems, the invention adopts the following technical scheme: a manufacturing method of a wireless charging coil comprises the following steps:
s1: pretreating to obtain a substrate, arranging copper wires with a certain thickness on the substrate, and winding the copper wires into an original copper coil;
s2: copper plating is carried out on the original copper coil for the first time, so that a primary copper plated coil is obtained;
s3: and carrying out secondary copper plating on the primary copper-plated coil to obtain the conductive coil.
Further, in the method for manufacturing a wireless charging coil according to the present invention, in the step S2, a distance between adjacent copper wires in the primary copper-plated coil is between 70 and 90 um.
Further, in the method for manufacturing a wireless charging coil according to the present invention, in the step S3, a distance between adjacent copper wires in the conductive coil is between 25 and 55 um.
Further, in the method for manufacturing a wireless charging coil according to the present invention, in step S1, the pretreatment process includes: cutting, drilling, plasma treatment and black hole treatment.
Further, in the method for manufacturing a wireless charging coil according to the present invention, in the step S2, the primary copper plating process includes: copper plating, outer layer circuit, outer layer etching and outer layer film stripping treatment.
Further, in the method for manufacturing a wireless charging coil according to the present invention, in the step S3, the secondary copper plating process includes: optical detection, pattern film pasting, pattern exposure, pattern development, pattern electroplating and outer layer film removing treatment.
Correspondingly, the invention also discloses a wireless charging coil which is prepared by the manufacturing method.
Further, in the wireless charging coil of the present invention, the wireless charging coil includes a substrate and a conductive coil, the conductive coil includes a first coil and a second coil, and the first coil and the second coil are disposed in a multi-layer arrangement or a single-layer side-by-side arrangement or a partially overlapping arrangement.
Further, in the wireless charging coil according to the present invention, the first coil is disposed on the upper surface of the substrate, the second coil is disposed on the lower surface of the substrate, a through hole is further formed in the substrate, a conductor is disposed in the through hole, and the first coil and the second coil are interconnected and conducted through the conductor.
Further, in the wireless charging coil of the present invention, a layer of CVL cover film is disposed on a side of the first coil and the second coil away from the substrate, so that an interlayer structure of the wireless charging coil sequentially includes, from top to bottom: the CVL cover film, the first coil, the substrate, the second coil and the CVL cover film.
The invention has the beneficial effects that: the manufacturing method of the wireless charging coil is optimized, so that when the wireless charging coil is manufactured, a secondary copper plating mode is adopted, the distance between adjacent copper wires in the conductive coil is controlled to be smaller than the distance between the copper wires in the prior art, so that the wireless charging coil can be provided with more copper wires under the same area, the impedance of the wireless charging coil can be greatly reduced, the charging efficiency of the wireless charging coil is improved, the charging experience of a user is optimized, and the wireless charging coil has good popularization prospect and application value.
Drawings
FIG. 1 is a flowchart illustrating steps of a method for manufacturing a wireless charging coil according to an embodiment of the present invention;
FIG. 2 is a top view of a conductive coil of a wireless charging coil according to the present invention in one embodiment;
fig. 3 schematically shows a line spacing analysis of adjacent copper lines in the conductive coil of fig. 2 relative to each other;
fig. 4 schematically shows a line spacing analysis of adjacent copper lines from each other in a wireless charging coil of the prior art.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present invention in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 to 4, the present invention provides a method for manufacturing a wireless charging coil, which includes the following steps:
s1: pretreating to obtain a substrate, arranging copper wires with a certain thickness on the substrate, and winding the copper wires into an original copper coil;
s2: copper plating is carried out on the original copper coil for the first time, so that a primary copper plated coil is obtained;
s3: and carrying out secondary copper plating on the primary copper-plated coil to obtain the conductive coil.
From the above description, it can be seen that the most critical idea of the invention is: the inventor carries out optimization design on the copper plating process of the wireless charging coil so as to design a secondary copper plating process on the basis of the original primary copper plating, thereby changing the distance between adjacent copper wires in the conductive coil through the secondary copper plating, controlling the distance between the adjacent copper wires to be between 25 and 55um in certain embodiments, and having smaller distance compared with the coil in the prior art; the line spacing between the adjacent copper wires of the conductive coil obtained after the secondary copper plating is smaller and is equivalent to the fact that more copper foils can be arranged under the same area, namely, the copper content in the wireless charging coil can be more, so that the impedance of the wireless charging coil can be greatly reduced, the charging efficiency of the wireless charging coil is improved, the charging experience of a user is optimized, and the wireless charging coil has good popularization prospect and application value.
It should be noted that, the wire spacing between adjacent copper wires of the conductive coil in the wireless charging coil can be reduced to 25-55um by adopting the manufacturing method of secondary copper plating designed by the invention.
As to why the wireless charging coil designed in the prior art cannot be directly plated with copper once to achieve smaller spacing, the spacing is reduced to between 25 and 55um, because: in the primary copper plating process, an operator winds a primary copper coil by using a copper wire of 50um, the coil thickness is too large, the total thickness of a single copper wire reaches 60um after primary copper plating is performed by 10um, and the adjacent copper wire spacing of the primary copper-plated wireless charging coil can only be minimized to 100um after etching due to the process limitation.
In some embodiments, an operator can select 18um copper wire specifically and control copper plating 15um once to make the thickness of single copper wire of the primary copper-plated coil reach 33um, and the line spacing between copper wires becomes 80um after primary etching; then copper is required to be plated once again, namely, copper is plated twice for 20um, so that the line spacing between adjacent copper wires of the finally manufactured conductive coil can be 40um.
Further, in the step S2, a distance between adjacent copper wires in the primary copper-plated coil is between 70 um and 90 um.
Further, in the step S3, a distance between adjacent copper wires in the conductive coil is between 25 um and 55 um.
In some embodiments of the present invention, in order to ensure that the distance between adjacent copper wires of the conductive coil prepared after the secondary copper plating is sufficiently small, the distance between adjacent copper wires in the primary copper plated coil can be controlled to be between 70 and 90um by controlling the thickness of the original copper (i.e., the copper wire used in step S1) in combination with the primary copper plating. Based on the primary copper plating coil, the interval between the adjacent copper wires in the conductive coil can be 25-55um by secondary copper plating again, so that the line interval between the adjacent copper wires in the conductive coil is greatly reduced, and the impedance of the wireless charging coil is greatly reduced.
Further, in step S1, the pretreatment process includes: cutting, drilling, plasma treatment and black hole treatment.
As shown in fig. 1, in the present invention, a pretreatment process may be performed before copper plating is performed once to obtain a substrate, and the substrate may be specifically a flexible copper-clad plate, and the pretreatment process may specifically include processes of cutting, drilling, plasma treatment and black hole treatment, which are all common knowledge in the art and are not described herein.
Further, in the step S2, the primary copper plating process includes: copper plating, outer layer circuit, outer layer etching and outer layer film stripping treatment.
Further, in the step S3, the secondary copper plating process includes: optical detection, pattern film pasting, pattern exposure, pattern development, pattern electroplating and outer layer film removing treatment.
In the step S2 of the present invention, copper plating is performed on the substrate, then the outer layer circuit for wireless charging is displayed, and outer layer etching is performed to etch away the unnecessary copper foil, and after outer layer etching is completed, outer layer film stripping treatment is controlled to obtain the finished product of the primary copper-plated coil. In addition, it should be noted that in the above step S3, the optical detection process may specifically detect whether or not a short circuit exists in the line.
In addition, as shown in fig. 1, in the present embodiment, in practical application, after the secondary copper plating process of step S3 is completed and the conductive coil is obtained, step S4 may be further performed, and the step S4 may be specifically: punching and welding preventing treatment are carried out on the prepared wireless charging coil, a covering film is attached to the wireless charging coil, then rapid pressing, pressing and curing, surface pretreatment, plasma treatment, gold precipitation treatment, silk screen printing characters and forming treatment are carried out on the wireless charging coil, then adhesive paper is assembled on the obtained wireless charging coil product, then the product is tested and packaged, and the finished wireless charging coil can be output to the market of users.
Correspondingly, the invention also discloses a wireless charging coil which is prepared by the manufacturing method.
Further, the wireless charging coil comprises a substrate and a conductive coil, wherein the conductive coil comprises a first coil and a second coil, and the first coil and the second coil are arranged in a multi-layer mode or a single-layer side-by-side mode or a partial overlapping mode.
In the above technical solution of the present invention, in order to meet different use requirements, the applicability of the wireless charging coil of the present invention is improved, and the prepared conductive coil of the wireless charging coil may specifically include a first coil and a second coil, as shown in fig. 2, and the two coils may be arranged in multiple combinations, i.e. the first coil and the second coil may be arranged in multiple layers, or may be arranged in a single layer side by side, or may be arranged in overlapping manner, and an operator may select a specific arrangement manner of the two coils on the substrate according to specific use requirements.
Further, the first coil is arranged on the upper surface of the substrate, the second coil is arranged on the lower surface of the substrate, a through hole is further formed in the substrate, a conductor is arranged in the through hole, and the first coil and the second coil are interconnected and conducted through the conductor.
Further, one side of the first coil and the second coil, which is far away from the substrate, is provided with a layer of CVL cover film, so that the interlayer structure of the wireless charging coil sequentially comprises from top to bottom: the CVL cover film, the first coil, the substrate, the second coil and the CVL cover film.
In the above technical solution of the present invention, the first coil and the second coil in the conductive coil may be disposed in multiple layers, that is, the first coil is disposed on the upper surface of the substrate, the second coil is disposed on the lower surface of the substrate, and the substrate is provided with a through hole, so that the interconnection and conduction between the first coil and the second coil are realized by using the conductor in the through hole. Accordingly, in order to protect the two coils, the inventors have provided a CVL cover film on both the first coil and the second coil on the side away from the substrate.
Embodiment one:
referring to fig. 1, 2 and 3, a first embodiment of the present invention is as follows: a wireless charging coil, comprising: a substrate and a conductive coil. The conductive coil comprises a first coil and a second coil, the first coil is arranged on the upper surface of the substrate, the second coil is arranged on the lower surface of the substrate, and a through hole is further formed in the substrate so as to interconnect and conduct the first coil and the second coil by using a conductor in the through hole; in addition, to protect both coils, the first coil and the second coil are each provided with a CVL cover film on a side away from the substrate.
In this embodiment, the substrate is specifically prepared by a pretreatment process of cutting, drilling, plasma treatment and black hole treatment shown in fig. 1, and the substrate is a flexible copper-clad plate. Correspondingly, after the substrate is obtained, copper wires with the thickness of 18um are selected to be wound on the upper surface and the lower surface of the substrate to form a first original copper coil and a second original copper coil respectively; based on the first original copper coil and the second original copper coil, carrying out primary copper plating treatment, controlling primary copper plating to 15um, displaying an outer layer circuit after copper plating, and then carrying out outer layer etching and outer layer film stripping treatment so that the thickness of a single copper wire of the primary copper plating coil reaches 33um, wherein after primary etching, the line spacing between the copper wires can be 80um; then copper is required to be plated again, namely, the copper is plated for 20um again through the processes of optical detection, pattern film pasting, pattern exposure, pattern development, pattern electroplating and outer film stripping treatment, so that the line spacing between the adjacent copper wires of the finally manufactured first coil and second coil is 40um.
In this example one, the stack, material selection, thickness, and wire spacing between adjacent copper wires of the first and second coils of the final prepared wireless charging coil are shown in table 1 below:
table 1.
In table 1, PI is a polyimide material in the CVL cover film; AD is epoxy thermosetting adhesive of the CVL covering film; CU is raw copper.
Comparative example one:
in the present invention, a first comparative example is also disclosed, which is a wireless charging coil prepared by a conventional one-time copper plating process in the prior art, the lamination of the first comparative example is similar to that of the first embodiment prepared by the present invention, and the upper and lower surfaces of the flexible copper clad laminate are also provided with a third coil and a fourth coil, respectively, but unlike the first embodiment, the third coil and the fourth coil of the first comparative example are uniformly copper plated once.
Thus, in the present invention, the stack, the material selection, the thickness, and the line spacing between the adjacent copper wires of the first coil and the second coil of the wireless charging coil of comparative example one are shown in table 2 below.
Table 2.
In table 2, PI is a polyimide material in the CVL cover film; AD is epoxy thermosetting adhesive of the CVL covering film; CU is raw copper.
Accordingly, referring to fig. 3 and 4, all symbols in fig. 3 and 4 for thickness and spacing are um, and the original copper in fig. 3 and 4 represents: copper wires before copper plating, namely CU on the flexible copper clad laminate in the above tables 1 and 2; the original copper thickness is the CU thickness of the corresponding winding copper-clad plate.
Comparing fig. 3 and 4, and referring to the above tables 1 and 2, it is apparent that in the present invention, the line spacing between the adjacent copper wires of the third coil and the fourth coil in the wireless charging coil of the comparative example one, which was designed in the prior art, is 100um. In the method for manufacturing the wireless charging coil of the embodiment 1, because the method for manufacturing the wireless charging coil needs to be plated with copper twice, an operator specifically selects a copper wire of 18um and controls copper plating for 15um once so that the thickness of a single copper wire of the primary copper-plated coil reaches 33um, and the line spacing between the copper wires becomes 80um after primary etching; then copper plating is required once again, i.e., copper plating is performed twice by 20um, so that the line spacing between adjacent copper wires of the finally produced first coil and second coil can be made 40um, which is much smaller than that of the third coil and fourth coil in comparative example one.
In summary, in the invention, the line between the adjacent copper wires of the first coil and the second coil obtained after the secondary copper plating is adopted is smaller, which is equivalent to that more copper foils can be arranged under the same area, namely, the copper content in the wireless charging coil can be more, so that the impedance of the wireless charging coil can be greatly reduced, the charging efficiency of the wireless charging coil is improved, the charging experience of a user is optimized, and the wireless charging coil has good popularization prospect and application value.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent changes made by the specification and drawings of the present invention, or direct or indirect application in the relevant art, are included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the wireless charging coil is characterized by comprising the following steps of:
s1: pretreating to obtain a substrate, arranging copper wires with a certain thickness on the substrate, and winding the copper wires into an original copper coil;
s2: copper plating is carried out on the original copper coil for the first time, so that a primary copper plated coil is obtained;
s3: and carrying out secondary copper plating on the primary copper-plated coil to obtain the conductive coil.
2. The method according to claim 1, wherein in the step S2, a distance between adjacent copper wires in the primary copper-plated coil is between 70 um and 90 um.
3. The method according to claim 1, wherein in the step S3, a distance between adjacent copper wires in the conductive coil is between 25 um and 55 um.
4. The method of claim 1, wherein in step S1, the pretreatment process includes: cutting, drilling, plasma treatment and black hole treatment.
5. The method of claim 1, wherein in the step S2, the primary copper plating process includes: copper plating, outer layer circuit, outer layer etching and outer layer film stripping treatment.
6. The method of claim 1, wherein in the step S3, the secondary copper plating process includes: optical detection, pattern film pasting, pattern exposure, pattern development, pattern electroplating and outer layer film removing treatment.
7. A wireless charging coil manufactured by the manufacturing method according to any one of claims 1 to 6.
8. The wireless charging coil of claim 7, wherein the wireless charging coil comprises a substrate and a conductive coil, the conductive coil comprising a first coil and a second coil, the first coil and the second coil being disposed in a multi-layer arrangement or a single-layer side-by-side arrangement or a partially overlapping arrangement.
9. The wireless charging coil of claim 8, wherein the first coil is disposed on an upper surface of the substrate, the second coil is disposed on a lower surface of the substrate, a through hole is further formed in the substrate, a conductive body is disposed in the through hole, and the first coil and the second coil are interconnected and conducted through the conductive body.
10. The wireless charging coil of claim 9, wherein a CVL cover film is disposed on a side of the first coil and the second coil away from the substrate, so that an interlayer structure of the wireless charging coil is sequentially as follows: the CVL cover film, the first coil, the substrate, the second coil and the CVL cover film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310273708.3A CN116435086A (en) | 2023-03-20 | 2023-03-20 | Wireless charging coil and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310273708.3A CN116435086A (en) | 2023-03-20 | 2023-03-20 | Wireless charging coil and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116435086A true CN116435086A (en) | 2023-07-14 |
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ID=87086409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310273708.3A Pending CN116435086A (en) | 2023-03-20 | 2023-03-20 | Wireless charging coil and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116435086A (en) |
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2023
- 2023-03-20 CN CN202310273708.3A patent/CN116435086A/en active Pending
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