CN105337027B - A kind of preparation method of antenna modules - Google Patents
A kind of preparation method of antenna modules Download PDFInfo
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- CN105337027B CN105337027B CN201410302146.1A CN201410302146A CN105337027B CN 105337027 B CN105337027 B CN 105337027B CN 201410302146 A CN201410302146 A CN 201410302146A CN 105337027 B CN105337027 B CN 105337027B
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Abstract
The invention provides a kind of antenna modules and preparation method thereof, the antenna modules include screen layer, antenna stack and by antenna stack and screen layer cementing layer glued together；The screen layer includes the ferrite layer and the ferrite protective layer positioned at the ferrite surfaces bonded with the surface of cementing layer one；The antenna stack includes the copper wire layer bonded with another surface of the cementing layer and the copper cash protective layer positioned at copper cash layer surface.The transmission range of the antenna modules of the present invention is more than the transmission range of the antenna modules of comparative example, illustrates that the resistivity of the antenna modules of the present invention is low, signal intensity is high.While the antenna modules thickness of thin of the present invention.
Description
Technical field
The invention belongs to field of antenna, more particularly to a kind of antenna modules and preparation method thereof.
Background technology
When antenna modules are applied to portable data assistance, due to the influence of neighbouring metalwork eddy current effect, communication is caused
Distance is greatly reduced, or even cannot respond to.By adding ferrite magnetic sheet between antenna and metal parts, high magnetic conductance is utilized
Soft magnetic ferrite shields metalwork, so as to reach lifting inductance performance, increases the purpose of communication distance.With setting about
The parts such as machine constantly develop to miniaturization, slimming, and the requirement on antenna modules thickness is also increasingly improved, thus need to prepare
The smaller antenna modules product of thickness.
In actual existing production, use paster method more.Paster method is to be prepared into FPC antenna and ferrite magnetic sheet respectively respectively
From finished product after again will antenna attachment to preparing antenna modules on magnetic sheet.Because sheet type ferrite magnetic sheet material is enbrittled
Easily there is fragmentation in height, the characteristics of toughness is low, thus protective layer must be all pasted on magnetic sheet two sides, to prevent magnetic sheet from peeling off to lack
Damage；And main body copper conductor has the problem of softness is difficult curable type and is oxidizable thus must have supporting layer and anti-oxidant in FPC antenna
Layer.So, after ferrite and FPC attachments, would have between the copper antenna of core functional components and ferrite magnetic sheet
There is copper cash support film layer, layers of two-sided, ferrite protection film layer.Do not simply fail to meet the requirement of module sheet, and system
The long complex procedures of standby process route, simultaneously because the distance between copper antenna and ferrite layer is big, can not also make ferrite fetter magnetic
The effect of the line of force is performed to most preferably.
Publication No. CN101485046A patent, which is disclosed, is directly printed onto conducting resinl on ferrite, after curing molding
Form the preparation method of antenna.But in this method using which kind of conducting resinl all can because in raw material containing large amount of organic
Make the conductor resistance rate to be formed very high, much can not mutually be reached with the low-resistivity of fine copper wire.It is well known that resistivity is day
The important evaluation index of line itself, the antenna copper loss of high resistivity is high, it is difficult to prepared by the antenna modules for meeting high request.
Publication number position CN101501930A patent also uses in disclosing and copper foil is etched after lamination into the mode of circuit,
Its same magnetic material uses alloy material, but the alloy material is powdery alloy, is directly mixed with organic matter, suppresses
Overlapped after slabbing then at copper foil hot pressing.Inherently there is the problem of magnetic conductivity is relatively low in this material, simultaneously because the material
Belong to powdery alloy material, so also having the characteristics of impedance is low, magnetic loss is high.
The content of the invention
There is provided a kind of thickness of thin, electricity to solve the existing technical problem that antenna modules are thicker and resistivity is high by the present invention
Low antenna modules of resistance rate and preparation method thereof.
The invention provides a kind of antenna modules, the antenna modules include screen layer, antenna stack and by antenna stack with shielding
Cover layer cementing layer glued together；The screen layer includes the ferrite layer bonded with the surface of cementing layer one and positioned at the iron
The ferrite protective layer on oxysome surface；The antenna stack includes the copper wire layer bonded with another surface of the cementing layer and positioned at copper
The copper cash protective layer of line layer surface.
The antenna modules of the present invention, antenna is directly bonded together with ferrite by cementing layer, minimize antenna with
The distance between ferrite, plays the effect that ferrite fetters the magnetic line of force to greatest extent, maximizes the performance of antenna modules；Use
Ferrite reduces the laminated construction such as protection and reinforcement used in ferrite and copper cash, risen simultaneously as the base material of copper antenna
The effect of reinforcement has been arrived, has not only reduced module thickness but also simplifies technological process.
Present invention also offers a kind of preparation method of antenna modules, it the described method comprises the following steps：
S1, post on a surface and to paste cementing layer on ferritic another surface of ferrite protective layer, then in gluing
Copper foil on layer, glue-line carries out hot-press solidifying；
S2, copper foil surface paste resist layer then exposure, development, etching obtain copper wire layer；
S3, in copper wire layer surface mount copper cash protective layer.
The invention provides a kind of method for directly manufacturing antenna on the ferrite, the minimum of antenna and magnetic sheet module is reached
Type and sheet, simplification of flowsheet simplify operation, improve production efficiency, reduce production cost.
Then the present invention is formed the copper foil covered on the ferrite by the way of etching using copper foil is covered on the ferrite
Antenna.Glue protection, opposite side spraying adhesive, then at gluing are protected or covered to unilateral overlay film on ferrite i.e. after sinter molding
Agent side mounts copper foil, and the copper foil formation circuit on ferrite is then directly made by the way of etching, then patch is protected on the outside of circuit
Cuticula.The copper foil that will be directly overlying on ferrite, directly forms antenna by the way of etching, it is ensured that least copper loss, keeps away
The high defect of the resistance lossy of printed antenna is exempted from, it is ensured that antenna performance；Circuit is directly formed on the ferrite, is minimized
The distance between antenna and ferrite, play the effect that ferrite fetters the magnetic line of force, maximize module performance to greatest extent；Make
With base material of the ferrite as copper antenna, the laminated construction such as the PI base materials used in FPC and reinforcement are reduced, while serving benefit
Strong effect, not only reduces module thickness but also simplifies technological process；Directly etching copper foil forms circuit on the ferrite,
The alignment issues of the attachment shaping FPC circuits on shaping ferrite are also avoid, simplification of flowsheet simplifies operation, improved
Production efficiency, reduces production cost.
Embodiment
In order that technical problem solved by the invention, technical scheme and beneficial effect are more clearly understood, below in conjunction with
Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only to explain
The present invention, is not intended to limit the present invention.
The invention provides a kind of antenna modules, the antenna modules include screen layer, antenna stack and by antenna stack with shielding
Cover layer cementing layer glued together；The screen layer includes the ferrite layer bonded with the surface of cementing layer one and positioned at the iron
The ferrite protective layer on oxysome surface；The antenna stack includes the copper wire layer bonded with another surface of the cementing layer and positioned at copper
The copper cash protective layer of line layer surface.
The antenna modules of the present invention, the thickness of the cementing layer is 5 μm -10 μm, the thickness of the ferrite layer for 25 μm -
1mm, the thickness of the ferrite protection film layer is 5 μm -10 μm, and the thickness of the ferrite glue-line is 5 μm -10 μm, the copper
The thickness of line layer is 10 μm -30 μm, and the thickness of the copper cash glue-line is 5 μm -10 μm, and the thickness of the copper cash protection film layer is 5 μ
m-10μm 10μm。
According to antenna modules provided by the present invention, it is preferable that the ferrite protective layer includes ferrite protection film layer
And its ferrite glue-line for bonding the ferrite and the ferrite protection film layer.
According to antenna modules provided by the present invention, it is preferable that the copper cash protective layer includes copper cash protective layer and its will
The copper cash glue-line that the copper wire layer and the copper cash protective layer are bonded.
According to antenna modules provided by the present invention, it is contemplated that antenna modules will be subsequently mounted on device, in order to simultaneously
Play a part of antenna modules surfacecti proteon and flexible support reinforcement, it is preferable that the ferrite glue-line is layers of two-sided, described
Ferrite protection film layer is off-style paper layer；And/or the copper cash glue-line is double faced adhesive tape, the copper cash protective layer is release liners.Such as
Fruit copper antenna side is also needed to if being mounted on body surface, can be thereon just double faced adhesive tape and off-style paper layer, such as by module
It is made in the design of inside battery；Can be just that double faced adhesive tape and PE films are protected thereon if copper cash side is as outer surface
Sheath, such as current universal scheme accomplished module on rear shell.
In the present invention, the copper cash protection film layer copper cash glue-line is ink layer.
In the present invention, ferrite can be preferred in high frequency use using the material that magnetic conductivity is high in frequency of use, loss is small
Nickel-zinc ferrite, more preferably in the case of, to ensure good surface smoothness, hardness and the consistency of material, from ambrose alloy zinc-iron
Ferrite.
Present invention also offers a kind of preparation method of antenna modules, it the described method comprises the following steps：
S1, post on a surface and to paste cementing layer on ferritic another surface of ferrite protective layer, then in gluing
Copper foil on layer, then hot-press solidifying is carried out to glue-line；
S2, copper foil surface paste resist layer then exposure, development, etching obtain copper wire layer；
S3, in copper wire layer surface mount copper cash protective layer.
According to the preparation method of antenna modules provided by the present invention, in order to ensure good adhesion, subsequently mistake is prevented
Sepage and peeling in journey, it is preferable that the hot-press solidifying includes precompressed and hot pressing；The pressure of the precompressed is 1-5MPa, when
Between be 3-15S, temperature be 170 DEG C -190 DEG C；The pressure of the hot pressing is 7-15MPa, and the time is 80-180S, and temperature is 170
℃-190℃。
According to the preparation method of antenna modules provided by the present invention, because Ferrite Material fragility is higher, and subsequent operation
In have more pressing step, for prevent ferrite in subsequent process steps because collide or press caused by fragmentation come off, preferably
Ground, the step of also including carrying out stickup protective layer to ferrite before step S1, the method for the stickup protective layer is included in
The surface of ferrite one pastes ferrite glue-line, and pastes ferrite protection film layer on the glue-line, is then pressed.Iron
Oxysome protection film layer can select the higher epoxy resin thin film or organic siliconresin film of thickness smaller intensity, because of temperature stability
Height, preferably good corrosion resistance, PI（Pi）Film.And pasted by hot-forming completion, to ensure good adhesion, prevent
The only sepage and peeling in subsequent process.Ferrite glue-line can for conventional acrylic resin, cure silicone resin and
Epoxylite etc..
According to the preparation method of antenna modules provided by the present invention, the cementing layer can be cure silicone tree
Fat, but because the temperature stability of pi is high, good corrosion resistance, excellent insulation performance, therefore it is preferred to use PI（Polyimides）
Resin, is used as cementing layer.
According to the preparation method of antenna modules provided by the present invention, in order to ensure good adhesion, subsequently mistake is prevented
Sepage and peeling in journey, it is preferable that the pressure 1-5MPa of the pressing, the time are 3-15S, and temperature is 170 DEG C -190 DEG C.
According to the preparation method of antenna modules provided by the present invention, it is preferable that in step S1, iron oxygen is posted on a surface
It is spraying, printing or the mode directly fitted that the method for cementing layer is pasted on ferritic another surface of body protective layer, enters one
Preferred spraying method is walked, which thickness can make coating layer thickness small and uniform.
According to the preparation method of antenna modules provided by the present invention, it is preferable that in step S2, the temperature of the etching is
80-90 DEG C, speed is 1.45-2m/min.If etching speed is too fast, it may etch not exclusively, cannot cut through, Ke Nengzao
Into over etching, if while etching speed may cause very much glue-line corrosion failure, over etching slowly.
According to the preparation method of antenna modules provided by the present invention, it is preferable that to copper foil table before resist layer is pasted
Face carries out oil removing, to lift the adhesion of copper foil and resist layer, prevents that short circuit, open circuit etc. are bad.Resist layer can be using spray
The mode for applying or printing or directly fitting, preferably spraying method, which thickness can make coating uniform, it is to avoid bubble or holiday.
For simple circuit, cost consideration can also be realized using mode of printing.The resist layer is light sensation film.
It is described to expose, develop, being etched to conventional exposure, development and engraving method in the present invention, it will not be repeated here.
Because the capacity antacid of adhesive is poor, preferred alkaline etching liquid can guarantee that and complete etching operation in the short time in high-temperature operation,
To prevent adhesive not to be corroded denaturation.The normal process steps such as demoulding, cleaning, drying are then completed in time.
According to the preparation method of antenna modules provided by the present invention, it is preferable that in copper wire layer surface mount in step S3
Then the method for copper cash protective layer pastes copper cash protection film layer to paste copper cash glue-line in copper cash layer surface on copper cash glue-line,
Then hot-press solidifying.It is described to paste by the way of spraying, printing or directly fitting, for better simply figure, preferably print
Mode, can also save the mask steps on spraying process to pin position, while less coating layer thickness can also be reached.
According to the preparation method of antenna modules provided by the present invention, it is preferable that the hot-press solidifying protection precompressed and heat
Pressure；The pressure of the precompressed is 1-5MPa, and the time is 3-15S, and temperature is 170 DEG C -190 DEG C；The pressure of the hot pressing is 7-
15MPa, the time is 80-180S, and temperature is 170 DEG C -190 DEG C.
In the present invention, it is additionally included in after stickup copper cash protective layer to antenna modules progress pin plating anti oxidation layer：
The plating anti oxidation layer can be will not be repeated here using conventional nickel plating, craft of gilding.In the present invention, preferred chemical plating is kept away
Having exempted from plating needs the problem of bracing wire is conductive.Thickness of coating can routinely select 2-6 μm of nickel dam, 0.05-0.2 μm of layer gold.
In the present invention, stamp encapsulation is carried out after pin plating anti oxidation layer.
The present invention is described in further detail below by specific embodiment.
It is real part 120 ± 5, the nickel zinc copper and iron oxygen of imaginary part 1 ± 0.2 for 0.08mm complex permeability to use naked magnetic sheet thickness
The copper foil of 20 μm of body magnetic sheet and fine copper thickness, according to identical line pattern, carries out module in following examples and prepares.
Embodiment 1
1st, ferrite pad pasting is protected：Using nickel-copper-zinc ferrite, conventional epoxy glue to coming out of the stove after ferrite carry out
Coat protective layer.Hot-press solidifying, pressure 7MPa, time 180S, 190 DEG C of temperature.
2nd, ferrite front covers PI layers, pastes copper foil：PI layers are sprayed in ferrite opposite side.Preliminary hot-press solidifying, pressure
1MPa, time 15S, 190 DEG C of temperature, 10 μm of thickness after solidification.Copper foil is attached on PI layers afterwards, is pressed.Pressing pressure
10MPa, time 100S, 190 DEG C of temperature.
3rd, copper foil surface is handled, and covers resist layer：Copper foil alkaline degreasing, prints resist layer.
Copper foil is etched：Rotine exposure, development, etching, demoulding, cleaning, drying.Use alkaline copper chloride etching solution, temperature
90 DEG C, speed 2m/min.
4th, cover layer：PI opens a window, and contraposition is attached to copper cash layer surface, hot-press solidifying.Preload pressure 1MPa, time 15S, temperature
190 DEG C of degree.Pressing pressure 7MPa, time 180S, 190 DEG C of temperature.
5th, pin plating anti oxidation layer：Conventional nickel plating, craft of gilding, preferably chemical plating, it is to avoid plating needs bracing wire conductive
The problem of.Thickness of coating can routinely select 4 μm of nickel dam, 0.1 μm of layer gold.
6th, stamp is encapsulated：By good module stamp encapsulation made above, that is, obtain the antenna modules production prepared by this programme
Product A1.
Embodiment 2
1st, ferrite pad pasting is protected：Using nickel-copper-zinc ferrite, PI films are coated with.Hot-press solidifying, pressure 15MPa, time
80S, 170 DEG C of temperature.
2nd, ferrite front covers PI layers, pastes copper foil：PI layers are sprayed in ferrite opposite side.Preliminary hot-press solidifying, pressure
5MPa, time 3S, 170 DEG C of temperature, 10 μm of thickness after solidification.Copper foil is attached on PI layers afterwards, is pressed.Pressing pressure 15MPa,
Time 80S, 170 DEG C of temperature.
3rd, copper foil surface is handled, and covers resist layer：Copper foil alkaline degreasing, sprays resist layer.
Copper foil is etched：Rotine exposure, development, etching, demoulding, cleaning, drying.Inexpensive acid copper chloride etching liquid, temperature
85 DEG C of degree, speed 1.45m/min
4th, cover layer：PI layers of printing, 10 μm of thickness.Hot-press solidifying, pressure 5MPa, time 120S, 170 DEG C of temperature.
5th, pin plating anti oxidation layer：Conventional nickel plating, craft of gilding, preferably chemical plating, it is to avoid plating needs bracing wire conductive
The problem of.Thickness of coating can routinely select 4 μm of nickel dam, 0.1 μm of layer gold.
6th, stamp is encapsulated：By good module stamp encapsulation made above, that is, obtain the antenna modules production prepared by this programme
Product A2.
Embodiment 3
1st, ferrite pad pasting is protected：Using nickel-copper-zinc ferrite, PI films are coated with.Hot-press solidifying, pressure 10MPa, time
150S, 180 DEG C of temperature.
2nd, ferrite front covers PI layers, pastes copper foil：PI layers are sprayed in ferrite opposite side.Preliminary hot-press solidifying, pressure
3MPa, time 10S, 180 DEG C of temperature, 10 μm of thickness after solidification.Copper foil is attached on PI layers afterwards, is pressed.Pressing pressure
12MPa, time 90S, 180 DEG C of temperature.
3rd, copper foil surface is handled, and covers resist layer：Copper foil alkaline degreasing, sprays resist layer.
Copper foil is etched：Rotine exposure, development, etching, demoulding, cleaning, drying.Inexpensive acid copper chloride etching liquid, temperature
90 DEG C of degree, speed 1.45m/min
4th, cover layer：Below PI layers of printing, 10 μm of thickness.Preload pressure 3MPa, time 10S, 180 DEG C of temperature.Pressing pressure
Power 10MPa, time 120S, 180 DEG C of temperature.
5th, pin plating anti oxidation layer：Conventional nickel plating, craft of gilding, preferably chemical plating, it is to avoid plating needs bracing wire conductive
The problem of.Thickness of coating can routinely select 4 μm of nickel dam, 0.1 μm of layer gold.
6th, stamp is encapsulated：By good module stamp encapsulation made above, that is, obtain the antenna modules production prepared by this programme
Product A3.
Comparative example 1
Antenna modules CA1 is prepared using existing paster method：
1st, ferrite pad pasting is protected：Using nickel-copper-zinc ferrite, conventional epoxy with film glue to coming out of the stove after ferrite
Film on surface is protected；
2nd, ferrite patch gum：Using nickel-copper-zinc ferrite, conventional epoxy glue to coming out of the stove after ferrite gum and
Release liners are attached；
3rd, prepared by copper wire：Antenna pattern needed for prepared by copper foil routine FPC techniques；
4th, ferrite stamp：The ferrite mounted carries out stamp, completes elementary contour；
5th, assemble：Ferrite removes release liners, and after copper FPC antenna and ferrite contraposition, relevant position is arrived in attachment.
Comparative example 2
CA2 is prepared using the method disclosed in CN101485046A.
Comparative example 3
CA3 is prepared using the method disclosed in CN101501930A.
Performance test
Communication distance is tested：Using Agilent E4991A types electric impedance analyzer and distance test fixture, module is loaded solid
Determine in mobile phone, using mode card and VIVO pay reader as card reader, 0 DEG C of test angle tests communication distance in 13.56MHz
Data, the results are shown in Table 1.
Table 1
。
From table 1 it follows that the transmission range of the antenna modules of the present invention is more than the transmission of the antenna modules of comparative example
Distance, illustrates that the resistivity of the antenna modules of the present invention is low, signal intensity is high.The antenna modules of the present invention are by antenna stack simultaneously
Antenna is reprocessed after being fitted with screen layer, so eliminating the protective layer on screen layer and antenna stack, antenna mould is seen in reduction
The thickness of group.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (8)
1. a kind of preparation method of antenna modules, it is characterised in that the described method comprises the following steps：
S1, post on a surface and to paste cementing layer on ferritic another surface of ferrite protective layer, then on cementing layer
Copper foil, then hot-press solidifying is carried out to glue and layer；
S2, copper foil surface paste resist layer then exposure, development, etching obtain copper wire layer；
S3, in copper wire layer surface mount copper cash protective layer.
2. the preparation method of antenna modules according to claim 1, it is characterised in that the hot-press solidifying include precompressed and
Hot pressing；The pressure of the precompressed is 1-5MPa, and the time is 3-15S, and temperature is 170 DEG C -190 DEG C；The pressure of the hot pressing is 7-
15MPa, the time is 80-180S, and temperature is 170 DEG C -190 DEG C.
3. the preparation method of antenna modules according to claim 1, it is characterised in that also include before step S1 to iron
The step of oxysome carries out stickup protective layer, the method for the stickup protective layer is included in the surface of ferrite one and pastes ferrite
Glue-line, and ferrite protection film layer is pasted on the glue-line, then pressed.
4. the preparation method of antenna modules according to claim 3, it is characterised in that the pressure 1-5MPa of the pressing,
Time is 3-15S, and temperature is 170 DEG C -190 DEG C.
5. the preparation method of antenna modules according to claim 1, it is characterised in that in step S2, the temperature of the etching
Spend for 80-90 DEG C, speed is 1.45-2m/min.
6. the preparation method of antenna modules according to claim 1, it is characterised in that viscous in copper cash layer surface in step S3
Then the method for copper-surfaced line protective layer pastes copper cash diaphragm to paste copper cash glue-line in copper cash layer surface on copper cash glue-line
Layer, then hot-press solidifying.
7. the preparation method of antenna modules according to claim 6, it is characterised in that the hot-press solidifying protection precompressed and
Hot pressing；The pressure of the precompressed is 1-5MPa, and the time is 3-15S, and temperature is 170 DEG C -190 DEG C；The pressure of the hot pressing is 7-
15MPa, the time is 80-180S, and temperature is 170 DEG C -190 DEG C.
8. the preparation method of antenna modules according to claim 1, it is characterised in that in step S1, the side pasted
Method is one kind in spraying, print or fitting.
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| CN201410302146.1A CN105337027B (en) | 2014-06-30 | 2014-06-30 | A kind of preparation method of antenna modules |
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|---|---|---|---|
| CN201410302146.1A CN105337027B (en) | 2014-06-30 | 2014-06-30 | A kind of preparation method of antenna modules |
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| CN105337027A CN105337027A (en) | 2016-02-17 |
| CN105337027B true CN105337027B (en) | 2017-08-04 |
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| JP4260917B2 (en) * | 1998-03-31 | 2009-04-30 | 株式会社東芝 | Loop antenna |
| JP5029371B2 (en) * | 2008-01-08 | 2012-09-19 | パナソニック株式会社 | Antenna device and adjustment method thereof |
| CN102427158A (en) * | 2011-08-11 | 2012-04-25 | 瑞声声学科技(深圳)有限公司 | Method for making radio frequency identification antenna |
| CN103515698A (en) * | 2012-06-28 | 2014-01-15 | 比亚迪股份有限公司 | NFC (Near Field Communication) antenna and electronic equipment |
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