200938015 六、發明說明： 【發明所屬之技術領域】 本發月係關於電路板，電路板之製造方法及覆蓋層（c〇ver lay)薄膜。 【先前技術】 可撓式電路板主要係擔負將剛性電路板彼此電性連接的 功用’而’近年來，由於$撓式電路板薄、輕且 出曲在優異’故被利用於以行動電話、腿及液晶顯示裝置 等之行動機 1 rl·» 爺馬中心，代替剛性電路板。因此，近年來，於 路板上搭載電子零件之情況急遽增加。又，於最近 之機0中’由於訊號之高速化，使於傳送時等自電路板發射 之電磁波所致之勉成為問題。 作為對上述執的對策之__，可考慮於可撓式電路板上設 置隔絕層（例如’專散獻1)。專敎獻1中所記載之可撓 式電路板，係依序積層基材、導體電路、覆蓋層薄膜等之表 面被覆層及接地〜隔絕圖案者。 此處所明之「隔絕」（shield)，即所謂電磁波隔絕。於以 電磁波之電場為E、以磁場為Η、以波阻抗為Zs時，此等之 關係通常可用下式表示。 E=Zs · Η 於隔絕層和與其相鄰之其他層（例如空氣層）之波阻抗Zs 之差愈大’隔絕層對電磁波之反射率愈增大。例如，相對於 097148177 200938015 空氣中之波阻抗Zs為與真空中相同之377Ω，金屬中之波 阻抗Zs極小，為Zs<a。因而’已知於隔絕廣的材料為金屬 之情況，入射至隔絕層之電磁波會以非常高的比例於隔絕層 ，反射，故即使隔絕層再薄亦可發揮充分的隔絕效果。 • 專利文獻1:日本專利實開昭62_124896號 • 【發明内容】 - (發明所欲解決之問題） 〇 專敎獻1中所記載之電路板係於覆蓋層㈣等之表面 被覆層上設置隔絕層。若由實用面考量，必需於隔絕層上設 懿護層。因此，電路板會變厚而無法得到可滿足近年來^ 場所要求之屈曲特性，例如耐久性與小屈曲半徑。 本發明係鍟於上述情況而完成者，其目的在於提供厚度較 薄的電路板，電路板之製造方法及覆蓋層薄膜。 (解決問題之手段） Ο 依據本發明，可提供一種電路板，係具備： 電路基板，其具有基材、與形成於上述基材之至少一面側 的導體電路；及 覆蓋層薄膜，其被覆上述導體電路； 上述覆蓋層薄膜具有使接著劑層、導電層及樹脂薄臈依序 積層之構造，上述導電層係與上述導體電路電性連接。 依據此電路板，於覆蓋層薄膜中設置有導電層，此導電層 係與導體電路電性連接。由於導電層可發揮作為隔絕層之作 097148177 5 200938015 用’故於覆蓋層薄膜上無設置隔絕層之必要。因而，可減薄 電路板。 依據本發明，可提供一種電路板之製造方法，其具備有： 準備由依序積層了樹脂薄膜、導電層及接著劑層之覆蓋層 薄膜、基材及形成於該基材的至少一面側之導體電路所構成 之電路基板的步驟； 於以使上述接著劑層與上述導體電路相對向的方式配置 了上述覆蓋層薄膜與上述電路基板的狀態下，將上述覆蓋層 薄膜與上述電路基板壓合的步驟；及 使上述導電層與上述導體電路電性連接的步驟。 依據本發明，可提供一種覆蓋層薄膜，係用以被覆具有電 路基板之導體電路者；其具有： 接著劑層； 形成於上述接著劑層上之導電層；及 形成於上述導電層上之樹脂薄膜。 (發明效果） 依據本發明可使電路板減薄。 【實施方式】 上述之目的及其他目的 較佳實施形態及其賴隨之圖可藉由訂所述之 有二針實施形態用圈式進行說明。又，於所 有圖式中’對共通之構成要素_同_符號，並適當地省略 097148177 200938015 其說明。 首先’針辦第1實施形態進行說明。 如圖1所示般，本實施形態之電路板300具備有電路基板 ， 130及覆蓋層薄膜1〇()。電路基板13〇具備有基材2〇1及導 . 體電路203。導體電路203係形成於基材201之至少一面 - 側。覆蓋層薄膜100係被覆著導體電路203 ’具有依序積層 ， .了接著劑層105、導電層103及樹脂薄膜101之構造。導電 ❹層1〇3係與導體電路203電性連接。又，覆蓋層薄膜1〇〇 亦可不被覆導體電路203之一部分。 本實施形態中’導電層103係藉由部分地與導體電路203 接觸而電性連接於導體電路203。具體而言’導電層1〇3係 於與導體電路203接觸之部分，藉由朝向導體電路203變形 為凸狀而與導體電路203接觸。此凸狀之變形部3〇1之形狀 只要可使導電層103與導體電路203接觸即可。變形部3〇1 © 之形狀為例如，碗形、楔形等，惟並非限定於此等。 如此般，於電路板300中係於覆蓋層薄膜1〇〇的内層設置 導電層103。藉此，可不必在覆蓋層薄膜1〇〇上設置導電性 隔絕層與用以保護此隔絕層之絕緣層。因而，可使電路板 300減薄。因此，於電路板300中，可於維持著電子隔絕特 性之下提高屈曲特性（例如，小的屈曲半徑與耐久性）。 其次，用圖2之各圖’針對電路板300之各構成及製造方 法之一例詳細地進行說明。 097148177 7 200938015 (覆蓋層薄膜之準備） 首先，如圖2(a)所示般，準備覆蓋層薄膜1〇〇。覆蓋層薄 膜100具有依序積層了接著劑層105、導電層103及樹脂薄 膜101之構造。 接著劑層105較佳係以由含有例如環氧樹脂、聚酯系樹 月曰、聚醯亞胺系樹脂、聚醯胺系樹脂、聚醯胺醯亞胺系樹脂、 聚^： 土甲酸ga系翻日、環氧系樹脂等熱硬化性細旨之樹脂組 成物所構成。此等之中，龍為以環㈣樹脂作為接著劑層 1〇5。此情況下可提高覆蓋層薄膜⑽之密著性。再者，亦 可提高覆蓋層薄膜100之耐熱性。 樹脂薄膜101係例如為可撓性薄膜。作為樹脂薄膜101， ::如:聚醯亞胺樹脂薄膜、聚《亞胺樹脂薄膜、聚酿 =亞:樹脂薄膜等之聚醒亞胺系樹脂薄膜，聚醯胺樹脂薄 ::Γ:彈系樹㈣膜等之聚_薄 亞胺系樹脂薄膜作為樹脂_ H 枝為以聚酿 樹脂薄膜ΗΠ之厚度並無特別限定，較 5〇,以下’特佳為以上 、m乂上、 圍内，則電路板300之屈曲性心以下。厚度若在此範 導電声]禕由么遥思 才折性特別優異。 導電層103係由金屬層所構成。 屬可舉出:銅、銅系合金、銘人:籌成導電層103之金 以銅為更佳。又，導電層1〇3亦可由\膜=鐵系合金等， 由溥膜構成，藉此，可使 097148177 200938015 覆蓋層薄膜100進一步減薄。 導電層103之厚度並無特別限定’較佳為〇. 1/ZID以上、 35/z m以下，特佳為〇. 以上、以下。厚度若於此 範圍内，於形成變形部301時之加工性變佳。 - 作為覆蓋層薄膜100之製造方法係有如下述之方法。首 ' 先’準備樹脂薄膜101。接著，於樹脂薄膜101上形成導電 層1 〇3。導電層103可使用例如濺鍍法、蒸鍍法、鍍敷法及 〇 離子錢法而形成薄膜。又，以金屬膜貼附於樹脂薄膜101 上作為導電層103亦可。此情況下’較佳係不存在用於貼合 樹脂薄膜101與金屬膜的接著劑層存在，惟使用接著劑亦 可。然後，在導電層103面上形成構成接著劑層105之樹脂 組成物。 (覆銅板之準備） 然後’準備作為具有可撓性之基材201的樹脂薄膜與金屬 ❹ 箔所積層之覆鋼板。作為構成金屬箔之金屬可使用例如： 銅、銅系合金、鋁、鋁系合金、鐵及鐵系合金等，以銅為較 佳。又’作為基材2〇1之樹脂薄膜可使用例如：聚醯亞胺樹 脂薄膜、聚醚醯亞胺樹脂薄膜、聚醯胺醯亞胺樹脂薄膜等之 聚醯亞胺系樹脂薄膜，聚醯胺樹脂薄膜等之聚醯胺系樹脂薄 膜’聚酯樹脂薄膜等之聚酯系樹脂薄膜。其中，由提升彈性 係數與耐熱性之觀點而言，尤以聚醯亞胺系樹脂薄膜為佳。 金屬箔之厚度並無特別限定，較佳為6//m以上、70以 097148177 9 200938015 下，特佳為以上、心。厚度若在此範圍内， 則電路板300之屈曲性、对折性優異。 (中間板之製作） 然後’將此金屬錢由去除法進行餘刻，形成導體電路 203。藉此得到電路基板130。接著，如圖2⑻所示般，以 使接著劑層H)5與導體電路203成為相對向之方式配置覆蓋 層薄膜剛與電路基板130。接著，辦電路基板⑽與覆蓋 層薄膜⑽進行熱壓合。藉此形成中間板·。熱壓合之條 件，可定為壓合溫度為 (電路板）200938015 VI. Description of the invention: [Technical field to which the invention pertains] This is a circuit board, a method of manufacturing a circuit board, and a cover layer. [Prior Art] The flexible circuit board is mainly responsible for the function of electrically connecting the rigid circuit boards to each other. In recent years, since the flexible circuit board is thin, light, and excellent in its appearance, it is utilized in mobile phones. Mobile machines such as legs, liquid crystal display devices, etc. rl·» The center of the horse, instead of a rigid circuit board. Therefore, in recent years, the number of electronic components mounted on the road boards has increased rapidly. Further, in the recent machine 0, the speed of the signal has become a problem due to electromagnetic waves emitted from the board during transmission or the like. As a countermeasure against the above, it is conceivable to provide an isolation layer on the flexible circuit board (for example, 'Distribution 1'). The flexible circuit board described in the first aspect is a surface coating layer and a grounding-insulating pattern of a substrate, a conductor circuit, and a cover film. The term "shield" as used herein means electromagnetic wave isolation. When the electric field of the electromagnetic wave is E, the magnetic field is Η, and the wave impedance is Zs, the relationship is generally expressed by the following equation. E = Zs · 愈 The greater the difference between the wave impedance Zs of the insulating layer and other layers adjacent thereto (for example, the air layer), the greater the reflectance of the insulating layer to electromagnetic waves. For example, with respect to 097148177 200938015, the wave impedance Zs in the air is the same as 377 Ω in vacuum, and the wave impedance Zs in the metal is extremely small, which is Zs < a. Therefore, it is known that when the material which is widely insulated is a metal, the electromagnetic wave incident on the insulating layer is reflected at a very high ratio to the insulating layer, so that even if the insulating layer is thinner, a sufficient insulating effect can be exerted. • Patent Document 1: Japanese Patent Publication No. Sho 62-124896 • [Summary of the Invention] - (Problems to be Solved by the Invention) The circuit board described in 〇Specialism 1 is provided on the surface coating layer of the cover layer (4) and the like. Floor. If it is considered by the practical side, it is necessary to provide a protective layer on the insulation layer. Therefore, the board becomes thick and it is impossible to obtain buckling characteristics satisfying the requirements of recent places, such as durability and small buckling radius. The present invention has been accomplished in view of the above circumstances, and an object thereof is to provide a circuit board having a small thickness, a method of manufacturing the circuit board, and a cover film. (Means for Solving the Problem) According to the present invention, there is provided a circuit board comprising: a circuit board having a base material; and a conductor circuit formed on at least one side of the base material; and a cover film covering the above Conductor circuit; The cover film has a structure in which an adhesive layer, a conductive layer, and a resin thin layer are sequentially laminated, and the conductive layer is electrically connected to the conductor circuit. According to the circuit board, a conductive layer is disposed in the cover film, and the conductive layer is electrically connected to the conductor circuit. Since the conductive layer can function as an insulating layer, 097148177 5 200938015 is necessary for the absence of an insulating layer on the cover film. Thus, the board can be thinned. According to the present invention, there is provided a method of manufacturing a circuit board comprising: preparing a cover film, a substrate, and a conductor formed on at least one side of the substrate by sequentially laminating a resin film, a conductive layer, and an adhesive layer; a step of arranging the cover film and the circuit board in a state in which the cover film and the circuit board are disposed such that the adhesive layer and the conductor circuit face each other; And a step of electrically connecting the conductive layer to the conductor circuit. According to the present invention, there is provided a cover film for coating a conductor circuit having a circuit substrate; the method comprising: a subsequent layer; a conductive layer formed on the adhesive layer; and a resin formed on the conductive layer film. (Effect of the Invention) According to the present invention, the circuit board can be thinned. [Embodiment] The above and other objects and preferred embodiments thereof will be described with reference to the two-needle embodiment. Further, in all the drawings, the common constituent elements are the same as the _ symbol, and the description of 097148177 200938015 is omitted as appropriate. First, the first embodiment will be described. As shown in Fig. 1, the circuit board 300 of the present embodiment includes a circuit board 130 and a cover film 1 (). The circuit board 13A is provided with a substrate 2〇1 and a conductor circuit 203. The conductor circuit 203 is formed on at least one side of the substrate 201. The cover film 100 is covered with a conductor circuit 203' having a structure in which the adhesive layer 105, the conductive layer 103, and the resin film 101 are laminated. The conductive germanium layer 1〇3 is electrically connected to the conductor circuit 203. Further, the cover film 1 亦可 may not cover a part of the conductor circuit 203. In the present embodiment, the conductive layer 103 is electrically connected to the conductor circuit 203 by being partially in contact with the conductor circuit 203. Specifically, the conductive layer 1〇3 is in contact with the conductor circuit 203, and is deformed into a convex shape toward the conductor circuit 203 to be in contact with the conductor circuit 203. The shape of the convex deformation portion 3〇1 may be such that the conductive layer 103 can be brought into contact with the conductor circuit 203. The shape of the deformed portion 3〇1 © is, for example, a bowl shape, a wedge shape, or the like, but is not limited thereto. In this manner, the conductive layer 103 is provided on the inner layer of the cover film 1 〇〇 in the circuit board 300. Thereby, it is not necessary to provide a conductive insulating layer and an insulating layer for protecting the insulating layer on the cover film 1 . Thus, the circuit board 300 can be thinned. Therefore, in the circuit board 300, the buckling characteristics (e.g., small buckling radius and durability) can be improved while maintaining the electronic isolation characteristics. Next, each of the configurations and manufacturing methods of the circuit board 300 will be described in detail with reference to the respective drawings of Fig. 2 . 097148177 7 200938015 (Preparation of cover film) First, as shown in Fig. 2 (a), a cover film 1 准备 is prepared. The cover film 100 has a structure in which an adhesive layer 105, a conductive layer 103, and a resin film 101 are laminated in this order. The adhesive layer 105 is preferably made of, for example, an epoxy resin, a polyester eucalyptus, a polyimide resin, a polyamide resin, a polyamide amide resin, or a carboxylic acid ga. It is composed of a resin composition such as a heat-curing property such as a day-breaking or epoxy resin. Among these, the dragon is a ring (four) resin as an adhesive layer 1〇5. In this case, the adhesion of the cover film (10) can be improved. Further, the heat resistance of the cover film 100 can also be improved. The resin film 101 is, for example, a flexible film. As the resin film 101, ::, for example, a polyimide film, a polyimine resin film, a poly-imide resin film such as a poly-resin film, and a polyimide film, a polyimide resin film: Γ: a bomb The thickness of the poly-thinimide resin film such as the typhus (4) film is not particularly limited as the thickness of the styrofoam resin film, and is less than or equal to 5 Å. Then, the flexural core of the circuit board 300 is below. If the thickness is in this range, the conductive sound is very good. The conductive layer 103 is composed of a metal layer. The genus can be exemplified by copper, copper alloy, and inscription: the gold of the conductive layer 103 is made of copper. Further, the conductive layer 1〇3 may be composed of a ruthenium film, such as a film = an iron-based alloy, whereby the cover film 100 of the 097148177 200938015 can be further thinned. The thickness of the conductive layer 103 is not particularly limited, and is preferably 〇. 1/ZID or more and 35/z m or less, particularly preferably 以上. When the thickness is within this range, the workability at the time of forming the deformed portion 301 is improved. - As a method of manufacturing the cover film 100, there is a method as described below. The resin film 101 is prepared first. Next, a conductive layer 1 〇 3 is formed on the resin film 101. The conductive layer 103 can be formed into a film by, for example, a sputtering method, a vapor deposition method, a plating method, and a ruthenium ion method. Further, a metal film may be attached to the resin film 101 as the conductive layer 103. In this case, it is preferable that the adhesive layer for bonding the resin film 101 and the metal film is not present, but an adhesive may be used. Then, a resin composition constituting the adhesive layer 105 is formed on the surface of the conductive layer 103. (Preparation of a copper clad laminate) Then, a steel clad which is a laminate of a resin film having a flexible base material 201 and a metal ruthenium foil is prepared. As the metal constituting the metal foil, for example, copper, a copper alloy, aluminum, an aluminum alloy, iron, and an iron-based alloy can be used, and copper is preferable. Further, as the resin film of the substrate 2〇1, for example, a polyimide film such as a polyimide film, a polyether quinone resin film, or a polyimide film may be used. A polyester resin film such as a polyester resin film such as a polyamide resin film or the like. Among them, a polyimide-based resin film is preferable from the viewpoint of improving the elastic modulus and heat resistance. The thickness of the metal foil is not particularly limited, but is preferably 6//m or more and 70 is 097148177 9 200938015, and particularly preferably the above. When the thickness is within this range, the circuit board 300 is excellent in buckling property and folding property. (Production of the intermediate plate) Then, the metal money is left by the removal method to form the conductor circuit 203. Thereby, the circuit board 130 is obtained. Then, as shown in Fig. 2 (8), the cover film layer and the circuit board 130 are disposed so that the adhesive layer H) 5 and the conductor circuit 203 face each other. Next, the circuit board (10) is thermally pressed together with the cover film (10). Thereby forming an intermediate plate. The condition of hot pressing can be determined as the pressing temperature (circuit board)
然後，如圖2(c)所不般形成變形部3〇1。於變形部 中，導電層103係局部地朝向導體電路2〇3變形為凸狀，於 該變形部”與導體電路203接觸。變形部3〇1彳藉由例如 將圓柱、橢圓柱、多角形柱及方形柱之前端經去角之棒狀工 模自覆蓋層薄膜刚之樹脂薄膜1Q1側按壓而形成。按壓條 件可設定為按壓溫度為室溫〜22()ΐ、按壓壓力為Q lOMPa。卫模可絲用於航之模具，亦可安裝用於電路導 通檢查之油壓及空氣壓檢查衝壓㈣。又，亦可於覆蓋層薄 膜100之熱壓成形時，藉由在熱壓合用工模中對應於變形部 301的心安裝上述之棒狀工模，於熱壓合步驟中形成變形 部 3(H。 如此可形成電路板300。又，依據本實施形態，可提供具 097148177 200938015 備有接著劑層105、形成於接著劑層105上之導電層103、 與形成導電層103上之樹脂薄膜1〇1，且用以被覆電路基板 103所具有之導體電路203的覆蓋層薄膜110。 - 依據本實施形態’於覆蓋層薄膜100之上不須隔絕層與被 - 覆該隔絕層之絕緣層。因而，電路板300可減薄。又，即使 不用特殊設備亦可簡單地形成凸狀的變形部3〇1。又，於使 ' 覆蓋層薄膜之熱壓成形與變形步驟為同一步驟之情 ❹ 況’步驟可得以簡化。 其次，使用圖3針對第2實施形態進行說明。本實施形態 之電路板320係如圖3(d)所示般，除了未形成變形部3〇1、 未形成開口部109、及在開口部109内埋設導電構件305之 外，係與第1實施形態之電路板3〇()為相同之構成。開口部 109係設置於覆蓋層薄膜1〇〇中，位於導體電路2〇3上。因 而導電層1〇3係經由導電構件305而與導體電路203電性連 〇 接。 其次’針料路板320之各構成及製造紐之—例詳細地 進行說明。 如圖3(a)、⑹所示之覆蓋層薄膜1〇〇及中間板·，可 藉由於第1實施形態中使用圖2(a)、⑻所說明之方法來形 成。 (中間板之製作） 然後，如圖3(0所示般，於導體電路上之覆蓋層薄 097148177 11 200938015 膜⑽上形成位於導體電路203上之開口部109。開口部⑽ 之形成枝，可使用例如雷射加工、鐵孔加工及起槽（襲㈣ 加工來形成。再者，若藉由使用祕酸_水溶液之濕式除污 (desmear)、或電漿之乾式除污等方法將殘存於開口部⑽ 内之樹脂除去’則可提高連接可靠性。開 特別限定，較佳和〜左右。又，㈣朗之口^ 時，於覆蓋層薄膜100上可形成用以使導體電路2〇3與電子 零件連接之開口圖案（未圖示）。 (電路板） 然後，如圖3(d)所不般，於開口部1〇9内埋設導電構件 305。導電構件305含有熱硬化性樹脂與金屬粉，可用例如 銅膏、銀膏專。作為埋設方法’可使用例如分注器（di Spenser) 法、網版印刷法等。埋設導電構件305之後，亦可進一步於 覆蓋層薄膜100及導電構件305表面設置絕緣層（未圖示）。 藉此’導電構件305即使自覆蓋層薄膜100面突出，亦可防 止例如與金屬框體之短路。 如此，可形成電路板320。 依據本實施形態，則於覆蓋層薄膜100上不須隔絕層與被 覆該隔絕層之絕緣層。因而，電路板320可減薄。由於可依 衝孔等使覆蓋層薄膜100的開口部109之形成與用以將導體 電路203連接至電子零件的開口圖案之形成同時進行，故可 抑制步驟數之增加。 097148177 12 200938015 其次，用圖4針對第3實施形態之電路板310進行說明。 如圖4(d)所示般，電路板31〇係除了下述諸點之外，與第1 實施形態之電路板300為同樣的構成。首先，導體電路2〇3 - 係以金屬被覆層205被覆。金屬被覆層205之至少一部分， - 係於變形部301中形成有用以接合導電層103與導體電路 - 203之填角（fiUet)303，又，係使用具有焊劑作用之接著 - 劑層代替接著劑層1〇5。 ❹ 藉由在變形部301中形成填角303,可提高導電層1〇3與 導體電路203之連接可靠性。 其次’針對電路板310之各構成及製造方法之一例進行說 明。 (覆蓋層薄膜之準備） 如圖4(a)所示般，準備覆蓋層薄膜110。覆蓋層薄膜110 之構成及製造方法，係除了使用具有焊劑作用之接著劑層 © 107代替接著劑層105之外，係與第！實施形態中之覆蓋層 薄膜10 0相同。 接著劑層107含有具有羧基及/或苯酚性羥基之焊劑活性 化合物與熱硬化性樹脂。以下，針對各成分進行說明。 本實施形射使狀具有絲及/或祕雜基之焊劑活 性化合物，係指分子中至少存在丨個以上之羧基及/或苯紛 性羥基之化合物，可為液狀亦可為固體。 作為含有幾基之坪劑活性化合物，可舉出··脂肪族酸野、 097148177 13 200938015 脂環型麟、芳香族酸酐、脂肪顧酸、芳香顧酸等。作 為具有苯祕基之烊劑活性化合物可舉出苯盼類。 焊劑活性化合物係由於藉由與環氧樹脂等之熱硬化性樹 脂的反應而三維地結合，故較佳為具有在1分子中可加成至 環氧樹脂之至少2個笨雜羥基、與對金騎倾顯示焊劑 作用之直接鍵結至芳香族的叛基在1分子中至少有1個之化 合物。作為此等化合物，可舉出：2, 3-二經基苯？酸、2, 4_Then, the deformation portion 3〇1 is formed as shown in Fig. 2(c). In the deformed portion, the conductive layer 103 is partially deformed into a convex shape toward the conductor circuit 2〇3, and the deformed portion is in contact with the conductor circuit 203. The deformed portion 3〇1彳 is, for example, a cylinder, an elliptical cylinder, or a polygon The bar and the front end of the square column are formed by pressing the strip-shaped die of the cover film from the 1Q1 side of the cover film. The pressing condition can be set to a pressing temperature of room temperature to 22 (), and a pressing pressure of Q lOMPa. Weimo can be used for aerospace molds, and can also be installed for oil pressure and air pressure inspection stamping for circuit conduction inspection (4). Also, during hot press forming of the cover film 100, by hot pressing The above-mentioned rod-shaped die is mounted in the mold corresponding to the core of the deforming portion 301, and the deformed portion 3 is formed in the thermocompression bonding step (H. Thus, the circuit board 300 can be formed. Further, according to the present embodiment, it can be provided with 097148177 200938015 The adhesive layer 105, the conductive layer 103 formed on the adhesive layer 105, and the cover film 110 for forming the resin film 1:1 on the conductive layer 103 and covering the conductor circuit 203 of the circuit substrate 103 are provided. - according to this embodiment The insulating layer is not required to be insulated from the insulating layer on the cover film 100. Therefore, the circuit board 300 can be thinned. Further, the convex deformation portion 3〇 can be simply formed without special equipment. Further, the step of "the same step as the hot press forming and deforming step of the cover film" can be simplified. Next, the second embodiment will be described with reference to Fig. 3. The circuit board 320 of the present embodiment is As shown in Fig. 3 (d), the circuit board 3 of the first embodiment is replaced by the fact that the deformation portion 3 is not formed, the opening portion 109 is not formed, and the conductive member 305 is embedded in the opening portion 109. The opening portion 109 is provided in the cover film 1〇〇 and is located on the conductor circuit 2〇3. Therefore, the conductive layer 1〇3 is electrically connected to the conductor circuit 203 via the conductive member 305. Next, the respective configurations and manufacturing of the needle flow path plate 320 will be described in detail. The cover film 1 〇〇 and the intermediate plate shown in Figs. 3(a) and (6) can be used in the first embodiment. It is formed by the method described in Fig. 2 (a) and (8). Then, as shown in Fig. 3 (0), the opening portion 109 on the conductor circuit 203 is formed on the film (10) on the cover layer 097148177 11 200938015 on the conductor circuit. The opening portion (10) is formed by branching, for example, a thunder can be used. It is formed by shot processing, iron hole processing, and grooving (attacking (4) processing. Further, if it is wet decontamination (desmear) using a secret acid _ aqueous solution or dry decontamination of plasma, it will remain in the opening. (10) Resin removal in the case can improve the connection reliability. It is particularly limited, preferably about ~. Also, (4) Lang's mouth ^, on the cover film 100 can be formed to make the conductor circuit 2〇3 and the electron The opening pattern of the part connection (not shown). (Circuit Board) Then, as shown in Fig. 3 (d), the conductive member 305 is buried in the opening portion 1〇9. The conductive member 305 contains a thermosetting resin and a metal powder, and may be, for example, a copper paste or a silver paste. As the embedding method, for example, a dispenser method, a screen printing method, or the like can be used. After the conductive member 305 is buried, an insulating layer (not shown) may be further provided on the surfaces of the cover film 100 and the conductive member 305. Thereby, even if the conductive member 305 protrudes from the surface of the cover film 100, it is possible to prevent, for example, short-circuiting with the metal frame. As such, the circuit board 320 can be formed. According to this embodiment, the insulating layer is not required to be provided on the cover film 100 and the insulating layer covering the insulating layer. Thus, the circuit board 320 can be thinned. Since the formation of the opening portion 109 of the cover film 100 can be performed simultaneously with the formation of the opening pattern for connecting the conductor circuit 203 to the electronic component by punching or the like, the increase in the number of steps can be suppressed. 097148177 12 200938015 Next, the circuit board 310 of the third embodiment will be described with reference to Fig. 4 . As shown in Fig. 4 (d), the circuit board 31 has the same configuration as the circuit board 300 of the first embodiment except for the following points. First, the conductor circuit 2〇3 - is covered with a metal coating layer 205. At least a portion of the metal coating layer 205 is formed in the deformation portion 301 to form a fillet (fiUet) 303 for bonding the conductive layer 103 and the conductor circuit - 203, and further, a binder layer having a flux action is used instead of the adhesive. Layer 1〇5.形成 By forming the fillet 303 in the deformed portion 301, the connection reliability of the conductive layer 1〇3 and the conductor circuit 203 can be improved. Next, an example of each configuration and manufacturing method of the circuit board 310 will be described. (Preparation of Cover Film) As shown in Fig. 4 (a), a cover film 110 is prepared. The composition and manufacturing method of the cover film 110 are in addition to the use of a flux-carrying adhesive layer © 107 instead of the adhesive layer 105. The cover layer 10 in the embodiment is the same. The subsequent agent layer 107 contains a flux active compound having a carboxyl group and/or a phenolic hydroxyl group and a thermosetting resin. Hereinafter, each component will be described. In the present embodiment, a flux-active compound having a filament and/or a crypto group is a compound having at least one or more carboxyl groups and/or benzene hydroxy groups in the molecule, and may be liquid or solid. Examples of the active compound containing a plurality of bases include aliphatic acid field, 097148177 13 200938015 alicyclic type lining, aromatic acid anhydride, fatty acid, and aromatic acid. As the active compound having an oxime base, a benzophenone can be mentioned. Since the flux active compound is three-dimensionally bonded by reaction with a thermosetting resin such as an epoxy resin, it is preferred to have at least two stupid hydroxyl groups which can be added to the epoxy resin in one molecule, and The gold rider shows the direct bonding of the flux to the aromatic tetamine with at least one compound in one molecule. As such a compound, 2, 3-di-based benzene is mentioned. Acid, 2, 4_
-經基苯甲酸、龍膽酸（2, 5_二經基苯甲酸）、& 6—二經基苯 曱酸、3, 4-二羥基笨甲酸、五倍子酸（3, 4,卜三經基苯甲酸） 等之苯曱Hi生物，ι，4_二經基_2_萘甲酸、3 5_二經基一2_ 萘曱酸、3, 7-二經基—2_萘甲酸等之萘？酸衍生物；苯盼蔡； 及二苯酚酸等。 此等焊劑活性化合物可單獨使用，亦可組合2種以上使 用。 匕作為本實施形態巾可使狀熱硬化性樹脂，可用：環氧樹❹ 脂、氧雜環丁烧樹脂、祕樹脂、（甲基）丙婦酸醋樹脂、不 紗聚S旨樹脂、二稀丙基苯二甲_旨樹脂、順丁稀二酿亞胺 樹月曰等。其中尤以硬化性、保存性、硬化物之耐熱性、耐濕 性、耐藥品性優異之環氧樹脂為佳。 _ 熱硬化性樹脂亦可含有硬化劑。作為硬化劑，可舉出：苯 - 紛類、胺類、硫醇類。於使用環氧樹脂作為熱硬化性樹脂之 情況’就可得到與此環氧樹脂之良好的反應性、硬化時之尺 097148177 14 200938015 寸變化低及硬化後之適當的物性（例如，而愤性、耐濕性等） 之觀點而言，以苯酚類為佳。 作為其他硬化劑，可使用例如熔點為15(rc以上之咪唑化 ' 合物。咪唑化合物的熔點若過低，則於焊料粉移動至電極表 - 面之前具有焊㈣狀接著_ 料發生硬化，可 - 能造成連接不穩定、或具有焊劑作用之接著劑層107的保存 • 性降低。因此，咪唑化合物之熔點以150°C以上為佳。作為 ❹熔點為150°C以上之咪唑化合物，可舉出：2-苯基羥其^米 唑、2-苯基-4-曱基羧基咪峻等。又，咪嗤化合物之二= 上限並無特別限制，例如，可依具有焊劑作用的 107之接著溫度而適當地設定。 層 接著劑層107亦可進而含有石夕烧偶合劑，藉由作成為含有 矽烷偶合劑之構成’接著劑層1〇7對被接著物之密著性^更 加提高。作為矽烷偶合劑，可舉出：環氧矽烷偶合劑、含芳 ❹香族胺基矽烷偶合劑等。此等可單獨使用，亦可組合2方 上使用。石夕燒偶合劑之調配量，可作成為相對於接著劑^ 107之調配成分之合計量為例如〇. 〇1〜5重量％。 料’接著劑们(Π亦可含有上述以外的成分。例如，為 了提高樹脂的相溶性、安定性、作業性等各種特性，亦可、*、、、 當地添加各種添加劑。 ’、可適 (中間板之準備） 然後’準備作為基材2〇1之樹脂薄膜與積層了金屬落之覆 097148177 15 200938015 銅板。覆銅板之構成係與第1實施形態相同。 然後，對此金屬箔藉由去除法之蝕刻形成導體電路203， 再形成電路基板150。然後，形成被覆導體電路2〇3之金屬 被覆層205(圖4(b)>構成金屬被覆層205之金屬為例如分 別與導電層103及導體電路203形成合金的金屬，可舉出例 如.金、銀、鎳、錫、錯、鋅、絲、錄、銅之至少i種，或 含有此等中之1種以上之合金。此情況下，作為合金，較佳 者為以上述金屬中之2種以上的金屬為主之焊材（焊料），可 舉出例如.錫-船系、錫一銀系、錫_鋅系、錫★系、錫一録 系、錫-銀-鉍系、錫-銅系等。構成金屬被覆層2〇5之金屬 的組口或組成並無特別限^，可考慮其特性而選擇最適者。 、金屬被覆層205之厚度並無特別限定，較佳為G 〇一 以上’更佳為0. 5 // m以上。 然後，對覆蓋層薄臈110與電路基板150進行熱廢合形成 中間板21〇(圖4⑷），再形成變形部3〇ι。此等之細節如下 述首先將圓柱、橢圓柱、多角形柱及方形柱之前端經去 角之棒狀工模安裝於熱壓合用工模中之對應於變形部抓 的。P刀然後，用熱壓合用工模對覆蓋層薄膜11〇與電路基 板150進行熱壓合。此時亦形成變形部30卜 又於熱麼合中，須將覆蓋層薄膜110與電路基板150 加:、、至金屬被覆層2〇5分別與導體電路2〇3及導電層⑽ 進订°金化之第1溫度（例如，於金屬被覆層205為焊料之 097148177 200938015- benzoic acid, gentisic acid (2,5-di-benzoic acid), & 6-di-benzoic acid, 3,4-dihydroxybenzoic acid, gallic acid (3, 4, Bu San Benzoic acid, such as benzoic acid, etc., iota, 4_di-based 2-naphthoic acid, 3 5_di-based 2- 2 -naphthoic acid, 3, 7-di-yl-naphthoic acid, etc. Naphthalene? Acid derivatives; benzene hope Cai; and diphenolic acid. These flux-active compounds may be used singly or in combination of two or more.匕 As the heat-curable resin of the present embodiment, an epoxy resin, an oxetan resin, a secret resin, a (meth) acetoacetate resin, a non-woven resin, and a resin can be used. Dilyl benzophenone _ resin, cis-butadiene di-animine tree ruthenium and so on. Among them, an epoxy resin excellent in curability, preservability, heat resistance of a cured product, moisture resistance, and chemical resistance is preferable. _ The thermosetting resin may also contain a hardener. Examples of the curing agent include benzene-forms, amines, and mercaptans. In the case of using an epoxy resin as a thermosetting resin, good reactivity with the epoxy resin is obtained, and the ruler 097148177 14 200938015 inch change is low and the appropriate physical properties after hardening (for example, inversion) From the viewpoint of moisture resistance, etc., phenol is preferred. As the other curing agent, for example, an imidazole compound having a melting point of 15 or more can be used. If the melting point of the imidazole compound is too low, the solder powder has a weld (four) shape and then hardens before the solder powder moves to the surface of the electrode. It is possible to reduce the storage stability of the adhesive layer 107 which is unstable in connection or has a flux action. Therefore, the melting point of the imidazole compound is preferably 150 ° C or higher, and the imidazole compound having a melting point of 150 ° C or higher can be used. For example, 2-phenylhydroxyl-mazole, 2-phenyl-4-mercaptocarboxyl, etc. Further, the upper limit of the amidine compound is not particularly limited, and for example, it may be 107 with a flux action. The layer of the adhesive layer 107 may be further appropriately set. The layer of the adhesive layer 107 may further contain a sulphur coupling agent, and the adhesion of the smectic coupling layer 1 〇 7 to the smectic layer is further improved. The decane coupling agent may, for example, be an epoxy decane coupling agent or an aryl sulfonium amino decane coupling agent, etc. These may be used singly or in combination of two. Quantity can be used as a relative The total amount of the compounding ingredients of the agent ^107 is, for example, 〇1 to 5% by weight. The materials "adhesives" may contain components other than the above. For example, in order to improve the compatibility, stability, workability, etc. of the resin, Various characteristics, can also be *,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The configuration of the copper plate is the same as that of the first embodiment. Then, the metal foil is formed by etching to form the conductor circuit 203, and then the circuit substrate 150 is formed. Then, the metal coating layer 205 of the coated conductor circuit 2〇3 is formed (Fig. 4(b)> The metal constituting the metal coating layer 205 is, for example, a metal which is alloyed with the conductive layer 103 and the conductor circuit 203, and examples thereof include gold, silver, nickel, tin, aluminum, zinc, silk, and silk. At least one type of copper or an alloy containing one or more of these metals. In this case, the alloy is preferably a solder material (solder) mainly composed of two or more of the above metals. For example, tin-ship , tin-silver, tin-zinc, tin-, tin-tin, tin-silver-bismuth, tin-copper, etc. The composition or composition of the metal constituting the metal coating layer 2〇5 is not particularly The thickness of the metal coating layer 205 is not particularly limited, and it is preferably G 〇 or more 'more preferably 0.5 pm or more. Then, the cover layer is thin. 110 is thermally dissipated with the circuit substrate 150 to form an intermediate plate 21 (Fig. 4 (4)), and then a deformation portion 3 is formed. The details of the above are as follows: first, the front end of the cylinder, the elliptical column, the polygonal column and the square column are passed. The corner bar mold is mounted in the thermocompression mold corresponding to the deformation portion. The P blade is then thermocompression bonded to the circuit substrate 150 by the thermocompression mold. At this time, the deformation portion 30 is also formed, and the cover film 110 and the circuit substrate 150 are added, and the metal coating layer 2〇5 is bonded to the conductor circuit 2〇3 and the conductive layer (10), respectively. The first temperature of the gold (for example, the metal coating layer 205 is solder 097148177 200938015
It況為焊料熔融之溫度）。藉此，導電層⑽中之變形部 301可經由具有谭劑作用之接著劑層107而和導體電路2〇3 與金屬被覆層205接合。於較第丨溫度低的第2溫度（例如 .焊料不纽融之溫度且適於接㈣硬化之溫度）進行再加 •熱’可使具有焊劑作用之接著劑層107硬化。藉此，可將各 層接合而形成電路板310(圖4(d))。如此，藉由在熱壓合之 .步驟f設定温度差（前半於高溫加熱、後半於低溫加熱）而進 ❹行焊材（焊料）可充分熔融而可抑制接合不良，同時，於導 體電㈣3與金屬被覆層2〇5接合後，立刻使具有焊劑作用 接著齊丨層107硬化’將接合部（尤其是熔融接合部）固定化 而可形成填角3G3。因而，導電層⑽與導體電路之連 接可靠性得以提高。 又，上述第1溫度，較佳為17〇〜3〇〇〇c為佳，更佳為185 〜26〇°C ;上述第2溫度，較佳為120〜200。〇，更佳為15〇 ❹〜靴。壓合壓力為例如G.2〜蕭ae 作為用以將覆蓋層薄膜11G與電路基板15G熱壓合的方 法’可使用例如併用真空衝壓或熱積層與烘烤之方法等。 X ’變形部301之形成’並非必須與熱壓成形同時進行， 亦可為熱壓成形後。此情況下，變形部3〇1可與第^實施形 態同樣地’可藉由將圓桂、橢圓柱、多角形柱及方形柱之前 端側經去角之棒狀工模自覆蓋層薄膜110之樹脂薄膜1〇1 側按壓而形成。按壓條件為，例如，按壓溫度為例如⑽〜 097148177 17 200938015 300°C，按壓壓力為例如0. 2〜1〇MPa。工模可安裝用於衝孔 之模具，亦可安裝用於電路導通檢查之油壓及空氣壓檢查衝 壓板等。 如此，可形成電路板310。又，依據本實施形態，可提供 具備接著劑層107、形成於接著劑層1〇7上之導電層1〇3、 與形成於導電層103上之樹脂薄膜1〇1，用以被覆電路基板 150所具有之導體電路2〇3的覆蓋層薄膜11〇。 依據本實施形態，可得到與第丨實施形態相同之效果。 又，由於金屬被覆層205溶融而形成填角303，故可提高導 電層103與導體電路203之連接可靠性。又，由於可使導電 層103與導體電路203的接合面藉由接著劑層1〇7之焊劑作 用而清淨化，故導電層103與導體電路2〇3之連接可靠性更 加提高。 其次，針對第4實施形態之電路板進行說明。本實施形態 之電路板之構成及製造方法，除了於第丨實施形態之電路板 300中，改用第3實施形態所示之接著劑層1〇7代替接著劑 層105之外，係與第1實施形態相同。 依據本實施形態亦可得到與第丨實施形態相同之效果。 以上係參照實施形態及實施例說明本案發明，惟本案發明 並不限定於上述實施形態。本案發明之構成與細節，係於本 案發明之範疇内，可進行業者可理解之各種變更。 【圖式簡單說明】 097148177 18 200938015 圖1為第1實施形態之電路板的截面圖。 圖2(a)至（c)為第1實施形態之電路板之製造方法的步驟 截面圖。 • 圖3(a)至（d)為第2實施形態之電路板之製造方法的步驟 • 截面圖。 • 圖4(a)至（d)為第3實施形態之電路板之製造方法的步驟 • 截面圖。 Q 【主要元件符號說明】 100 覆蓋層薄膜 101 樹脂薄膜 103 導電層 105 接著劑層 107 接著劑層 109 開口部 110 覆蓋層薄膜 130 ' 150 電路基板 200 、 210 中間板 201 基材 203 導體電路 205 金屬被覆層 300 、 310 、 320 電路板 301 變形部 097148177 19 200938015 303 305 填角 導電構件 097148177It is the temperature at which the solder melts. Thereby, the deformed portion 301 in the conductive layer (10) can be bonded to the metal coating layer 205 via the conductor circuit 2〇3 via the adhesive layer 107 having a tangent action. Reheating at a second temperature lower than the second temperature (e.g., the temperature at which the solder is not melted and suitable for bonding (4) hardening) hardens the adhesive layer 107 having a flux action. Thereby, the layers can be joined to form the circuit board 310 (Fig. 4(d)). In this way, by setting the temperature difference in the step (f) of the thermocompression bonding (the first half is heated at a high temperature and the second half is heated at a low temperature), the solder material (solder) can be sufficiently melted to suppress the joint failure, and at the same time, the conductor is electrically (4) 3 Immediately after bonding to the metal coating layer 2〇5, the flux is applied and the uniform layer 107 is hardened. The joint portion (particularly, the fusion bonded portion) is fixed to form the fillet 3G3. Thus, the reliability of the connection of the conductive layer (10) to the conductor circuit is improved. Further, the first temperature is preferably 17 〇 to 3 〇〇〇 c, more preferably 185 to 26 ° C, and the second temperature is preferably 120 to 200. Hey, better for 15 〇 靴 ~ boots. The pressing pressure is, for example, G.2 to Xiaoae. As a method for thermocompression bonding the cover film 11G and the circuit board 15G, for example, a method of vacuum pressing, heat lamination, baking, or the like can be used. The formation of the X' deforming portion 301 does not necessarily have to be performed simultaneously with hot press forming, and may be after hot press forming. In this case, the deformed portion 3〇1 can be self-covering the thin film 110 by using a rounded mold, an elliptical cylinder, a polygonal column, and a front end side of the square column through the chamfering mold as in the second embodiment. The resin film is formed by pressing the side of the film 1〇1. 2〜1〇MPa。 The pressing pressure is, for example, (10) ~ 097148177 17 200938015 300 ° C, the pressing pressure is, for example, 0. 2~1〇MPa. The mold can be installed with a mold for punching, or a hydraulic pressure and air pressure check plate for circuit conduction inspection. As such, the circuit board 310 can be formed. Further, according to the present embodiment, the adhesive layer 107, the conductive layer 1〇3 formed on the adhesive layer 1〇7, and the resin film 1〇1 formed on the conductive layer 103 can be provided for coating the circuit substrate. 150 cover film 11〇 of the conductor circuit 2〇3. According to this embodiment, the same effects as those of the second embodiment can be obtained. Further, since the metal coating layer 205 is melted to form the fillet 303, the connection reliability between the conductive layer 103 and the conductor circuit 203 can be improved. Further, since the bonding surface of the conductive layer 103 and the conductor circuit 203 can be cleaned by the flux of the adhesive layer 1〇7, the connection reliability between the conductive layer 103 and the conductor circuit 2〇3 is further improved. Next, a circuit board of the fourth embodiment will be described. In the circuit board 300 of the second embodiment, the adhesive layer 1〇7 shown in the third embodiment is used instead of the adhesive layer 105, and the structure and the manufacturing method are the same. 1 embodiment is the same. According to this embodiment, the same effects as those of the second embodiment can be obtained. The present invention has been described above with reference to the embodiments and examples, but the present invention is not limited to the above embodiments. The constitution and details of the invention are within the scope of the invention and can be varied as understood by the practitioner. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a circuit board according to a first embodiment. Fig. 2 (a) to (c) are cross-sectional views showing the steps of a method of manufacturing a circuit board according to the first embodiment. • Figs. 3(a) to 3(d) are the steps of the method of manufacturing the circuit board of the second embodiment. • Fig. 4 (a) to (d) are steps of a method of manufacturing a circuit board according to a third embodiment. Q [Description of main component symbols] 100 Overlay film 101 Resin film 103 Conductive layer 105 Subsequent layer 107 Subsequent layer 109 Opening portion 110 Cover film 130' 150 Circuit board 200, 210 Intermediate board 201 Substrate 203 Conductor circuit 205 Metal Coating layer 300, 310, 320 circuit board 301 deformation portion 097148177 19 200938015 303 305 fillet conductive member 097148177