JP3500339B2 - Manufacturing method of flexible wiring board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the technical field of flexible wiring boards, and more particularly to the technical field of flexible wiring boards to which electronic component circuits for high-speed signal transmission can be connected.

[0002]

2. Description of the Related Art In recent years, the speed of signals in electronic devices has been increasing, and along with this, a wiring film provided on a flexible wiring board has an impedance of a predetermined value in order to prevent delay of signal transmission. Is formed to have. The flexible wiring board as described above may be manufactured by laminating a plurality of flexible board pieces.

Reference numerals 110 and 130 in FIGS. 9 (a) and 9 (b) indicate
2 shows two flexible substrate pieces used for bonding. A method of manufacturing a flexible wiring board having a multi-layer structure will be described in which the one indicated by reference numeral 110 in the drawing is the first flexible substrate piece and the one indicated by reference numeral 130 is the second flexible substrate piece.

The first flexible substrate piece 110 shown in FIG. 9A is a base film 111, a wiring film 113 arranged on the base film 111, and a wiring film 11.
3 and the cover film 115 arranged on the upper surface of the upper part 3.

The wiring film 113 is patterned into a predetermined shape and is routed over the base film 111 so as to connect circuits (not shown). Here, one wiring film 113 is divided into two wiring films 113A and 113B, and a second flexible substrate piece 1 described later is formed.
By the impedance adjusting conductor film 133 on 30
The two wiring films 113A and 113B are connected to each other. The cover film 115 is patterned, and on the end portions of the wiring films 113A and 113B ,
Openings 118A and 118B are provided, respectively.

The second flexible substrate element 130 shown in FIG. 9B is a flexible substrate element for impedance adjustment, and includes a base film 131 and an impedance adjustment conductor arranged on the base film 131. It has a film 133 and a cover film 135 formed on the impedance adjusting conductor film 133.

The impedance adjusting conductor film 133 is patterned into a predetermined shape. Here, the impedance adjusting conductor film 133C which is linearly patterned is shown. This second flexible substrate piece 130
The cover film 135 is also patterned, and openings 138A and 138B are arranged at both ends of the impedance adjusting conductor film 133C.

Copper is grown in each of the openings 138A and 138B by a plating method. As a result, metal bumps whose tips are projected on the surface of the cover film 135 are formed on both ends of the impedance adjusting conductor film 133C. 140
A and 140B are formed respectively.

The positions of the metal bumps 140A and 140B are
Openings 118A, 118 on the wiring films 113A, 113B
When the first and second flexible substrate pieces 110, 130 are arranged at a position corresponding to B, the tips of the bumps 140A, 140B are aligned with the opening 118A,
The wiring films 113A and 113B are respectively brought into contact with the surfaces of the wiring films 113A and 113B exposed on the bottom surface of 118B, and the wiring films 113A and 113B are connected to each other by the impedance adjusting conductor film 133C.

Reference numeral 150 in FIG. 9 (c) indicates a multilayer-structured flexible wiring board manufactured as described above. The first and second flexible substrate pieces 110 and 130 are mechanically bonded by a thermoplastic resin film 151. FIG. 10 shows the impedance adjusting conductor film 133 and the wiring films 113A and 11A of the flexible wiring board 150.
It is a top view which shows the positional relationship of 3B.

When the flexible wiring board 150 is used, the wiring films 113A and 11B are formed by connecting the ends (not shown) of the wiring films 113A and 113B to predetermined circuits.
The circuits are connected by 3B and the impedance adjusting conductor film 133C. The optimum value of the impedance for connecting the circuits is calculated in advance, and the impedance values of the wiring films 113A and 113B are also calculated in advance.

The impedance adjusting conductor film 133C is
From the optimum impedance value, the wiring films 113A and 113B
The width and length are set so as to be values obtained by subtracting the impedance value of, and as a result, the wiring film 113A,
The sum of the impedances of 113B and the impedance adjusting conductor film 133C is equal to the optimum value of the impedance for connecting the circuits.

However, the wiring films 113A and 113B
Impedance value fluctuates due to manufacturing variations, and as a result, the impedance adjusting conductor film 133.
Even if C is set to the above optimum value, the wiring film 113
The impedance values of the A and 113B and the impedance adjusting conductor film 133C are not always the optimum values. In that case, the impedances between the circuits are not matched.

[0014]

The present invention was created in order to solve the above-mentioned disadvantages of the prior art, and its purpose is to achieve even if the impedance value of the wiring film varies.
It is to provide a technique capable of obtaining an optimum impedance value.

[0015]

In order to solve the above-mentioned problems, the invention according to claim 1 provides a second flexible substrate between wiring films arranged on a base film of a first flexible substrate piece. A method for manufacturing a flexible wiring board having a multilayer structure by connecting with an impedance adjusting conductor film provided on an element, wherein the impedance of the wiring film to be connected on the first flexible substrate element is measured. , Inpi to shortages for the impedance that require
Impedance is calculated from the measurement result and the impedance is adjusted.
The conductive film for use to provide the above-mentioned insufficient impedance
Select and connect the impedance adjusting conductor film.
The method is a method for manufacturing a flexible wiring board connected to a desired wiring film . According to a second aspect of the present invention, at least three bumps are provided on either one of the wiring film and the impedance adjusting conductor film, and the bumps connect the wiring film and the impedance adjusting conductor film. The method for manufacturing a flexible wiring board according to claim 1, wherein the bump at a position corresponding to the measurement result is selected, and the wiring film and the impedance adjusting conductor film are connected. A third aspect of the present invention is the method for manufacturing a flexible wiring board according to the second aspect, wherein a resin is previously disposed on the bump surface and the resin is partially destroyed to thereby form the wiring film and the wiring film. It is characterized in that a conductor film for impedance adjustment is connected.
The invention according to claim 4 is the method for manufacturing a flexible wiring board according to any one of claims 2 and 3.
An ultrasonic wave is applied to the selected bump to connect the wiring film and the impedance 44 adjusting conductor film. The invention according to claim 5 is the method for manufacturing a flexible wiring board according to any one of claims 1 to 4, wherein the first flexible board element and the second flexible board element are characterized by bonding a resin having adhesive properties to.

The present invention is configured as described above, and for adjusting the impedance provided on the second flexible board element between the wiring films arranged on the base film of the first flexible board element. It is a method of manufacturing a flexible wiring board having a multilayer structure by connecting with a conductor film.

In the present invention, the impedance of the wiring film to be connected on the first flexible substrate element is actually measured, and the impedance adjusting conductor film is the impedance adjusting conductor film for the impedance corresponding to the measurement result. Connecting.

Even if the impedance of the wiring film fluctuates due to manufacturing variations, the impedance of the wiring film is measured because the impedance of the wiring film is measured by measuring the actual impedance of the wiring film and connecting the impedance adjusting conductor film corresponding to the impedance. The sum of the impedances of the impedance adjusting conductor film and the impedance adjusting conductor film can be set to an optimum impedance regardless of manufacturing variations.

When the impedance adjusting conductor film and the wiring film are connected via the bump, three or more bumps are arranged between the wiring film and the impedance adjusting conductor film, and the impedance adjusting wiring film is provided with the wiring film. By selecting a bump at a position that gives a length or width according to the result of measuring the impedance and connecting the wiring film and the impedance adjusting conductor film by the bump, the whole can have an optimum impedance. .

In order to selectively connect the bumps, ultrasonic waves can be applied only to the selected bumps to connect the bump wiring film or the bump and the impedance adjusting conductor film. In this case, by disposing an insulating resin layer on the surface of each bump and applying ultrasonic waves to destroy the insulating layer on the selected bump surface, the bump and the wiring film, or the bump and the impedance adjusting conductor. It can be connected to a membrane. Ultrasonic waves are not applied to the unselected bumps, and the insulating property of the resin layer is maintained. When the flexible substrate pieces are adhered to each other with a thermoplastic resin, the mechanical strength of the multilayer flexible wiring board is increased.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION First, a first flexible substrate piece used in the method of the present invention will be described together with its manufacturing process. Reference numeral 11 in FIG. 1A indicates a metal foil made of rolled copper foil. First, a base film 12 made of non-thermoplastic polyimide is formed on the surface of the metal foil 11 (FIG. 2B). Next, the metal foil 11 is patterned by a photolithography process and an etching process to form a wiring film 13 (FIG. 7C).

The wiring film 13 is divided at a portion where the wiring film 13 is removed by patterning, and here, two wiring films 13A and 13B are shown. A plan view of the wiring film 13 is shown in FIG.

One wiring film 13A is composed of one connection portion 14A that is widely patterned and a first wiring portion 15A that is narrowly patterned and has one end connected to the connection portion 14A. There is.

The other wiring film 13B has a plurality of wide connecting portions 14B _{1 to} 14B ₃ (here, three), and similarly a plurality of narrow and short second wiring portions 17 ( 6, the reference numeral of the second wiring portion is represented by 17. The reference numeral 17 indicating the second wiring portion is omitted except for FIG. 6) and one first wiring portion 15B. ing.

The connecting portions 14B _{1 to} 14B ₃ are arranged on a straight line, and the connecting portions 14B _{1 to} 14B ₃ are connected by the second wiring portion 17. One end of the first wire unit 15B, a straight line placement connection portions 14B ₁ ~
Among 14B _3, and is connected to the connection portion 14B ₃ located at the end.

A thermosetting polyimide precursor is applied on the wiring film 13 and the base film 12 and patterned by a photolithography process and an etching process, and then heat-treated to form a cover film 16.
(Fig. 1 (d)). This cover film 16, by patterning, the connecting portions 14A, 14B ₁ ~14B ₃ on respective positions opening 18 is provided.

[0027] By then plating the connecting portions 14A exposed on the bottom of each opening 18, to form the respective metal coating 19 on the 14B ₁ ~14B ₃ (FIG. (E)). Reference numeral 1 in FIG.
Reference numeral 0 indicates the first flexible substrate element 10 in the state where the metal coating 19 is formed. Here, the metal coating 19 is a gold coating.

Next, the manufacturing process of the second flexible board piece used together with the first flexible board piece 10 will be described. Reference numeral 31 in FIG. 2A indicates a metal foil for impedance adjustment, and a protective film 32 is first attached to the back surface of the metal foil 31 (FIG. 2B).

Next, on the surface of the metal foil 31, a patterned cover film 33 is formed in the same process as in FIG. 1D (FIG. 1C). A plurality of openings 35 (four are shown here) are formed in the cover film 33 by patterning, and the metal foil 3 is formed on the bottom surface of each opening 35.
1 is exposed.

Then, copper is deposited on the metal foil 31 on the bottom surface of the opening 35 by a plating method so that each opening 35 is filled with copper and a plurality of bump bodies 37A, 3A, 3 are formed on the surface of the metal foil 31.
7B _{1 to} 37B ₃ are formed ((d) in the same figure). The back surface of the resistance metal foil 31 is protected by the protective film 32, and copper is not deposited on that portion during copper plating.

Next, the protective film 32 is peeled off, the metal foil 31 is patterned by a photolithography process and an etching process, and each bump main body 37A, 37B _{1 to} 37.
The impedance adjusting conductor film 40 is formed so that B ₃ is connected to each other ((e) in the figure).

Impedance adjusting conductor film 4 in this state
A plan view of 0C is shown in FIG. The impedance adjusting conductor film 40C is formed on the bump main body 37 of the metal foil 31.
A, 37B ₁ ~37B ₃ wide connection portion 38A made of parts provided with, 38B ₁ ~38B ₃ and the narrow impedance portion 39 for forming the impedance component _{1-39 3}
It consists of and.

Here, the impedance units 39 _{1 to} 39 ₃
Are connected in series via connection parts 38B ₁ and 38B ₂ , and the remaining connection parts 38A and 38B ₃ are connected to both ends thereof. With reference to the connection portion 38A at the right end of the drawing, the impedance of the impedance portion 39 ₁ between the connection portion 39A and the adjacent connection portion 38B ₁ is r ₁ , and the reference connection portion 38A to the next connection portion 38B ₂ Between 2
Pieces of the impedance unit 39 _1, 39 ₂ of the impedance r ₂ the total value of Similarly, three impedance portion 39 _{1-39 3} between the reference and the connecting portion 38A to the drawings the left end of the connecting portion 38B ₃ Let r ₃ be the total value of the impedances.

After forming the impedance adjusting conductor film 40 having the above-described pattern, the bump main body 37A,
37B ₁ ~37B ₃ opposite surface polyimide precursor solution subjected paint to the can that the formed surface, was patterned by photolithography and etching processes, heat treatment, to form a base film 42 (FIG. 2 (f)).

By patterning the base film 42, the connecting portion 38 is formed at a position above the connecting portions 38A, 38B _{1 to} 38B ₃ of the impedance adjusting conductor film 40C.
A, an opening 44 having a smaller diameter than 38B _{1 to} 38B ₃ is provided.

Next, the bump main body 37 is formed by plating.
A, 37B ₁ ~37B ₃ tip surface and the opening portion 44 bottom surface of the connection portion 38A, the 38B ₁ ~38B ₃ surface, to form a metal coating 48, the bump main body 37A, the a 37B ₁ ~37B ₃ and the metal film 48 , Bumps 49A, 49B ₁ to 49
B ₃ is constructed ((g) in the figure). 30 is a bump 49
The second flexible substrate piece in a state in which A, 49B _{1 to} 49B ₃ are formed is shown. Here, a gold coating is used as the metal coating 48.

Next, the step of bonding the first flexible substrate piece 10 and the second flexible substrate piece 30 together will be described. First, the connection portion 14A of the first flexible wiring board piece 10, with respect 14B ₁ ~14B _3, is disposed facing the bumps 49A of the second flexible wiring board piece 10, the 49B ₁ ~49B _3.

FIG. 3 (a) shows the flexible substrate pieces 10 and 30 in this state, and an adhesive film 51 made of a thermoplastic resin is arranged between them. Bumps 49A, 49B of the second flexible substrate piece 30
₁ ～49B _3, the connection portion 14A of the first flexible wiring board piece 10 is disposed at a position corresponding to the 14B ₁ ~14B _3, aligning the flexible wiring board piece 10, 30 to each other, the adhesive film 51 And put them in between and bring them into close contact while heating.

The thermoplastic resin has a property of softening when heated, and the first and second flexible substrate pieces 1
When 0 and 30 are pressed against each other, bumps 49A and 49B ₁
~ 49B ₃ is embedded in the softened adhesive film 51,
The tips of the bumps 49A, 49B _{1 to} 49B ₃ are connected to the connecting portions 14A, 14B ₁ to 1 of the first flexible substrate element 10.
Approach to the vicinity of 4B ₃ .

At this time, the bumps 49A, 49B ₁ to 4 are formed.
The first and second flexible substrate pieces 10, ₃ to the extent that 9B ₃ does not come into contact with the connecting portions 14A, 14B _{1 to} 14B _3.
0 is pressed to prevent the impedance adjusting conductor film 40C and the wiring films 13A and 13B from being electrically connected (FIG. 3B). When cooled in that state, the first flexible substrate piece 10 and the second flexible substrate piece 3
0 is bonded by an adhesive film 51 (see FIG. 3).
(B)).

Next, the impedances of the wiring films 13A and 13B are actually measured by using a measuring machine (not shown). Here, from the measurement results, assuming that the impedance of the actual wiring films 13A and 13 is insufficient by the value r ₃ with respect to the impedance required between the circuits connected using the wiring films 13A and 13B, impedance adjustment Conductor film 4
On 0C, this value r ₃
Selecting a connection portion 38B ₃ giving equal impedance. Then, in order to connect the connecting portion 38B ₃ and the reference connecting portion 38A, first, the single point bonder 54 connected to the ultrasonic generator (Model 7700A manufactured by Kankaku Electronics Co., Ltd.) As shown in (c), when the ultrasonic wave is applied while being brought into contact with the rear surface of the reference connecting portion 38A through the opening 44 and pressing the ultrasonic wave, the ultrasonic vibration is transmitted to the reference bump 49A, and the bump 49A.
The adhesive film 51 at the A tip portion is spread by ultrasonic vibration, and the tip end of the bump 49A is brought into contact with the connection portion 14A of the first wiring film 13A. Then, by the seismic power of ultrasonic waves, the metal coating 49 at the tip of the bump 49A and the connecting portion 14
The metal coating 19 on the surface A is joined.

Next, the single point bonder 54 is moved onto the selected connecting portion 38B ₃ and brought into contact with the rear surface thereof, and ultrasonic waves are applied in the same manner as above, and then the connecting portion 38B ₃ is applied.
The bump 49B ₃ on B ₃ is connected to the corresponding connection portion 14B ₃ on the wiring film 13B (FIG. 9 (d)). Here, the opening 44 is provided in the base film 42, and the single point bonder 54 is exposed on the rear surface of the opening 44.
8 (a back surface of the impedance adjusting conductor film 40),
Although the ultrasonic waves were applied while being pressed, the ultrasonic waves may be applied by pressing the base film 42 located on the back surface of the bump 49 without providing the opening 44.

The wiring film 13 divided by the above steps
A, inter 13B, out of the impedance adjusting conductor film 44C, it is connected by the impedance unit 39B ₁ ~39B ₃ having an impedance r ₃ required. FIG. 8 shows the wiring films 13A and 13B and the impedance adjusting conductor film 40.
It is a top view which shows the overlapping state with C. Reference numeral 50 in FIG.
Shows a flexible wiring board formed by the above process.

The above is the case where the wiring films 13A and 13B are connected by the impedance r ₃ , but the wiring film 1 is actually used.
As a result of measuring the impedances of 3A and 13B, when the impedance to be connected between them is r ₂ , the reference bump 49A and the connecting portion 38B ₂ which gives the impedance r ₂ to the bump 49A are selected. Then
The wiring films 13A and 13B are connected to each other in the portion between the connecting portions 38A and 38B _{2 of the} impedance adjusting conductor film 40C.

[0045] If the impedance value is r _1, of the impedance adjusting conductor film 40C, the connection portions 38A which gives the impedance r _1, the wiring film 13A in 38B _1,
13B will be connected.

In the above embodiment, the first and second flexible substrate pieces 10 and 30 are adhered to each other by the thermoplastic resin film 51, but the cover film 33 of the second flexible substrate piece 30 is used. If the cover film 33 is made of a thermoplastic resin, the cover film 33 can be used for bonding the first and second flexible substrate pieces 10 and 30 to each other.

Next, another embodiment of the present invention will be described. Reference numeral 60 in FIG. 5A indicates a second flexible substrate piece different from that represented by the reference numeral 30.

This flexible substrate piece 60 is similar to the flexible substrate piece 30 in that it has a base film 62.
And an impedance adjusting conductor film 63 disposed on the base film 62. The impedance adjusting conductor film 63 is formed in the same pattern as the impedance adjusting conductor film 40 shown in FIG. 7.

On the other hand, the impedance adjusting conductor film 6
A cover film 62 composed of a thermosetting resin layer 68 and a thermoplastic resin layer 66 formed on the thermosetting resin layer 68 is disposed on the surface 3.

Reference numeral 90 in FIG. 5 (b) indicates a flexible wiring board manufactured by attaching the first flexible substrate 10 shown in FIG. 1 (e) to the second flexible substrate piece 60. There is. The FIG. 5 (a), the (b), the bump main body 70A, 70B ₁ ~70B ₃ surface of the metal coating and the openings 78
The metal coating on the surface of the impedance adjusting conductor film 63 exposed on the bottom surface is omitted.

When manufacturing this flexible wiring board 90, the first and second flexible board pieces 10 and 60 are pressed while the same steps as those shown in FIGS. 3A to 3D. Upon heating, the bumps 70A, 70B ₁ ~70B ₃ is embedment in the thermoplastic resin layer 66, the connection portion of the wiring layer 13 through the thermosetting resin layer 68 (here not shown) is brought into contact.

When the bumps 70A and 70B ₃ are selected and ultrasonic waves are applied in that state, the bumps 7 to which the ultrasonic waves are applied are selected.
The thermosetting resin layer 68 on 0A and 70B ₃ is removed, and the bumps 70A and 70B ₃ and the connecting portion of the wiring film 13 are directly contacted with each other to connect them.

In this case, the bump 7 to which ultrasonic waves are not applied
Since the insulative thermosetting resin layer 68 is disposed between the connecting portions of 0B ₁ and 70B ₂ and the wiring film 13, the bumps 70B ₁ and 70B _{2 which} are not used for the connection should contact the connecting portions. There is no.

The flexible wiring boards 50 and 9 described above
In 0, one wiring film 13A of the divided wiring films 13A and 13B is provided with only one connecting portion 13A, and by selecting a bump to be connected on the other wiring film 13B, Although the impedance values of the impedance adjusting conductor films 40 and 63 are adjusted, the present invention is not limited thereto. Divided wiring films 13A, 13
The impedance of the impedance adjusting conductor film may be adjusted by providing a plurality of connecting portions on each of B and selecting a bump to be connected.

Furthermore, in the above, the impedance is adjusted by selecting the bump used for the connection and adjusting the length of the impedance adjusting conductor films 40 and 63 connecting the divided wiring films 13A and 13B. However, for example, a plurality of impedance adjusting conductor films are arranged between the wiring films 13A and 13B, and the number of impedance adjusting conductor films to be connected is made different by selecting bumps.
It is also possible to connect between 3A and 13B with a desired impedance.

In short, the present invention broadly includes a method for manufacturing a flexible wiring board in which the impedance of the impedance adjusting conductor film to be connected can be selected by selecting the bump.

In the above embodiment, the adhesive film 51
Although the polyimide-based adhesive was used as the thermoplastic resin constituting the above, the present invention is not limited to the thermoplastic resin, and a thermosetting resin can also be used. For example, a resin other than a polyimide adhesive such as an epoxy adhesive (A100 manufactured by SCC, etc.) or the like can be used because it has adhesiveness. When using a thermosetting resin, after bonding the flexible substrate pieces to each other in a state where they are not completely cured,
Good to harden. In short, the present invention can widely use resins having adhesiveness. Alternatively, a resin layer having adhesiveness may be formed in advance on the cover film of one of the two types of flexible substrate pieces and used for bonding.

The metal coating used in the present invention is not limited to a coating containing gold as a main component, and a coating containing silver as a main component, a coating containing nickel as a main component, an alloy coating of copper and nickel. , A solder coating can be used. Good connection can be obtained by forming the same kind of metal coating on the two flexible substrate pieces to be bonded.

[0059]

Since the divided wiring films are connected by the impedance adjusting conductor film, the impedance of the connected wiring film and the input / output impedance of the electronic component circuit connected to the wiring film are matched. Since the wiring film is connected at the point where the impedance adjusting conductor film has the desired resistance, even if the wiring film resistance of each flexible board element is different, the impedance of the wiring film is set to the target value for each flexible board element. Can be set.

[Brief description of drawings]

FIG. 1 (a) to (e): Manufacturing process drawing of a first flexible substrate piece used in the present invention.

2 (a) to (g): Manufacturing process drawing of a second flexible substrate piece used in the present invention.

3A to 3B are views for explaining a manufacturing process of the present invention in which a first flexible substrate piece and a second flexible substrate piece are attached to each other.

FIG. 4 is a cross-sectional view of a flexible wiring board manufactured by the manufacturing method of the present invention.

FIG. 5A is a sectional view of a second flexible substrate piece used in another embodiment of the present invention. FIG. 5B is a sectional view of a flexible wiring board prepared in another embodiment.

FIG. 6 is a plan view for explaining a wiring film of a first flexible substrate piece.

FIG. 7 is a plan view for explaining a resistance adjusting conductive film of a second flexible substrate piece.

FIG. 8 is a plan view showing an overlapping state of a wiring film and an impedance adjusting conductor film of a flexible wiring board manufactured by the manufacturing method of the present invention.

9A to 9C are views for explaining a conventional method of manufacturing a flexible wiring board.

FIG. 10 is a plan view showing an overlapping state of a wiring film and a conductor film for impedance adjustment of a flexible wiring board manufactured by a conventional technique.

[Explanation of symbols]

10 ... First flexible substrate element 12, 42, 72 ... Base film 13A, 13B ... Wiring film 30, 60 ... Second flexible substrate element 40, 63 ... Impedance adjusting conductor film 49A, 49B _{1 to} 49B ₃ , 70A, 70B _{1 to} 70B ₃
... Bumps 50, 90 ... Flexible wiring board 51 ... Thermoplastic resin

Front Page Continuation (72) Inventor Soichiro Kishimoto 12-3 Satsukicho, Kanuma City, Tochigi Prefecture Sony Chemical Co., Ltd. 2nd factory (72) Inventor Yoshio Arimitsu 12-3 Satsukicho, Kanuma City, Tochigi Prefecture Sony Chemical Co., Ltd. Two factories (56) Reference JP-A-7-106759 (JP, A) JP-A-7-202519 (JP, A) JP-A-9-199863 (JP, A) JP-A-11-317572 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 1/00-3/46

Claims (5)

(57) [Claims] 1. A flexible structure having a multilayer structure, wherein wiring films arranged on a base film of a first flexible substrate element are connected by an impedance adjusting conductor film provided on a second flexible substrate element. a method of manufacturing a wiring board, and measuring the impedance of the first on the strip flexible substrate containing the wiring layer to be connected requires
Measures the impedance that is insufficient for the impedance
Obtained from the results, the impedance adjustment conductor film is the
Select the position that gives the insufficient impedance and
Connect the impedance adjustment conductor film to the wiring film to be connected.
A method for manufacturing a flexible wiring board, characterized by the following. 2. The at least three bumps are provided on either one of the wiring film or the impedance adjusting conductor film, and the wiring film and the impedance adjusting conductor film are connected by the bumps. The method for manufacturing a flexible wiring board according to 1, wherein the bumps at positions corresponding to the measurement results are selected and the wiring film and the impedance adjusting conductor film are connected to each other. Production method. 3. The wiring film and the impedance adjusting conductor film are connected to each other by disposing a resin in advance on the surface of the bump and partially destroying the resin. Flexible wiring board manufacturing method. 4. The method for manufacturing a flexible wiring board according to claim 2, wherein ultrasonic waves are applied to the selected bumps to connect the wiring film and the impedance adjusting conductor film. . 5. The first flexible substrate piece and the second flexible substrate piece are adhered to each other with a resin having an adhesive property, according to any one of claims 1 to 4. Of flexible wiring board.