CN108511578B - 一种led照明面板 - Google Patents
一种led照明面板 Download PDFInfo
- Publication number
- CN108511578B CN108511578B CN201810354385.XA CN201810354385A CN108511578B CN 108511578 B CN108511578 B CN 108511578B CN 201810354385 A CN201810354385 A CN 201810354385A CN 108511578 B CN108511578 B CN 108511578B
- Authority
- CN
- China
- Prior art keywords
- grooves
- holes
- led
- lighting panel
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810354385.XA CN108511578B (zh) | 2018-04-19 | 2018-04-19 | 一种led照明面板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810354385.XA CN108511578B (zh) | 2018-04-19 | 2018-04-19 | 一种led照明面板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108511578A CN108511578A (zh) | 2018-09-07 |
CN108511578B true CN108511578B (zh) | 2020-05-22 |
Family
ID=63382671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810354385.XA Active CN108511578B (zh) | 2018-04-19 | 2018-04-19 | 一种led照明面板 |
Country Status (1)
Country | Link |
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CN (1) | CN108511578B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10651351B1 (en) * | 2018-11-13 | 2020-05-12 | Cree, Inc. | Light emitting diode packages |
US10923024B2 (en) * | 2018-12-13 | 2021-02-16 | Sct Ltd. | LED display module and method of making thereof |
CN112838079B (zh) * | 2020-12-31 | 2022-06-10 | 湖北长江新型显示产业创新中心有限公司 | 显示模组及其制作方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201011936A (en) * | 2008-09-05 | 2010-03-16 | Advanced Optoelectronic Tech | Light emitting device and fabrication thereof |
US20130056773A1 (en) * | 2011-09-02 | 2013-03-07 | Wen Kun Yang | Led package and method of the same |
CN202855803U (zh) * | 2012-10-31 | 2013-04-03 | 深圳市志金电子有限公司 | 一种高导热led封装基板 |
CN104584208B (zh) * | 2012-12-21 | 2018-01-30 | 松下知识产权经营株式会社 | 电子部件封装以及其制造方法 |
CN113658943A (zh) * | 2013-12-13 | 2021-11-16 | 晶元光电股份有限公司 | 发光装置及其制作方法 |
CN105244419A (zh) * | 2014-06-18 | 2016-01-13 | 晶能光电(常州)有限公司 | 一种晶圆级薄膜倒装led芯片的制备方法 |
CN105280626A (zh) * | 2014-06-25 | 2016-01-27 | 常州欧密格光电科技有限公司 | 超小超薄高光效侧射型高亮白光led元件 |
CN105161431A (zh) * | 2015-08-12 | 2015-12-16 | 中芯长电半导体(江阴)有限公司 | 晶圆级芯片封装方法 |
CN206134648U (zh) * | 2016-05-09 | 2017-04-26 | 中芯长电半导体(江阴)有限公司 | 一种扇出型封装结构 |
-
2018
- 2018-04-19 CN CN201810354385.XA patent/CN108511578B/zh active Active
Also Published As
Publication number | Publication date |
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CN108511578A (zh) | 2018-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200427 Address after: Zhonglou District Zou Yang Village 213000 Jiangsu city of Changzhou Province Applicant after: Changzhou Baoda Photoelectric Technology Co., Ltd Address before: 262500 No. 1366, Hai Dai Nan Road, Qingzhou, Weifang, Shandong. Applicant before: Zhuang Minglei |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210112 Address after: 221600 Peixian Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Millennium Hangxiao Assembly Building Technology Co.,Ltd. Address before: 213000 Yangzhuang Village, Zou District Town, Zhonglou District, Changzhou City, Jiangsu Province Patentee before: Changzhou Baoda Photoelectric Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211231 Address after: 213000 Zou Qu Zhen Dong Feng Qiao, Zhonglou District, Changzhou City, Jiangsu Province Patentee after: Changzhou Vientiane lamp industry Co.,Ltd. Address before: 221600 Peixian Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: Jiangsu Millennium Hangxiao Assembly Building Technology Co.,Ltd. |