CN108505075A - Method for manufacturing electrolytic copper foil with approximately rugby-shaped copper nodules and circuit board assembly - Google Patents
Method for manufacturing electrolytic copper foil with approximately rugby-shaped copper nodules and circuit board assembly Download PDFInfo
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- CN108505075A CN108505075A CN201710160942.XA CN201710160942A CN108505075A CN 108505075 A CN108505075 A CN 108505075A CN 201710160942 A CN201710160942 A CN 201710160942A CN 108505075 A CN108505075 A CN 108505075A
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- Prior art keywords
- american football
- copper foil
- tumor
- roughening treatment
- manufacturing
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 265
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 136
- 239000010949 copper Substances 0.000 title claims abstract description 136
- 239000011889 copper foil Substances 0.000 title claims abstract description 126
- 238000000034 method Methods 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
- 238000007788 roughening Methods 0.000 claims abstract description 100
- 239000010410 layer Substances 0.000 claims abstract description 89
- 239000011888 foil Substances 0.000 claims abstract description 51
- 239000002344 surface layer Substances 0.000 claims abstract description 14
- 206010028980 Neoplasm Diseases 0.000 claims description 101
- 238000007747 plating Methods 0.000 claims description 81
- 239000000758 substrate Substances 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 36
- 239000007788 liquid Substances 0.000 claims description 26
- 238000012545 processing Methods 0.000 claims description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000003792 electrolyte Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims description 10
- JRIGVWDKYXCHMG-UHFFFAOYSA-N (5-arsoroso-2-hydroxyphenyl)azanium;chloride Chemical compound Cl.NC1=CC([As]=O)=CC=C1O JRIGVWDKYXCHMG-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 229910000413 arsenic oxide Inorganic materials 0.000 claims description 9
- 229960002594 arsenic trioxide Drugs 0.000 claims description 9
- KTTMEOWBIWLMSE-UHFFFAOYSA-N diarsenic trioxide Chemical compound O1[As](O2)O[As]3O[As]1O[As]2O3 KTTMEOWBIWLMSE-UHFFFAOYSA-N 0.000 claims description 9
- 229950008475 oxophenarsine Drugs 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 7
- 230000003078 antioxidant effect Effects 0.000 claims description 7
- 235000006708 antioxidants Nutrition 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 claims description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 230000003064 anti-oxidating effect Effects 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 description 16
- 230000003746 surface roughness Effects 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 8
- 238000007711 solidification Methods 0.000 description 8
- 230000008023 solidification Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 6
- 238000010884 ion-beam technique Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- -1 polyoxy Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
the invention discloses a method for manufacturing an electrolytic copper foil with approximate rugby-shaped copper nodules and a circuit board assembly, wherein the method for manufacturing the electrolytic copper foil with the approximate rugby-shaped copper nodules comprises the steps of forming a raw foil layer through an electrolytic method, wherein the raw foil layer is provided with a preset surface, then, forming a roughening treatment layer on the preset surface of the raw foil layer to form the electrolytic copper foil with the approximate rugby-shaped bulges on the surface layer, wherein the roughening treatment layer comprises a plurality of rugby-shaped copper nodules, and an approximately funnel-shaped accommodating space is formed between every two adjacent rugby-shaped copper nodules.
Description
Technical field
The present invention relates to the manufacturing methods of a kind of electrolytic copper foil and circuit board module, have more particularly to a kind of surface layer
The manufacturing method of the electrolytic copper foil of multiple approximation American football shape copper tumors and a kind of use surface layer have multiple approximate American football shapes
The manufacturing method of the circuit board module of the electrolytic copper foil of copper tumor.
Background technology
The existing copper foil applied to printed circuit board can form former foil, using back segment by being electroplated in cathode wheel
It handles processing procedure and forms final product.Back segment processing includes executing roughening treatment to the rough surface of former foil, in the thick of former foil
Matte forms multiple copper tumors, to increase the Bonding strength between copper foil and circuit board, that is, increase copper foil stripping it is strong
Degree.
However, electronic product tends to high-frequency high-speed in recent years, when transmitting high-frequency signal, the shape of copper foil surface is to passing
Defeated loss has a great impact.The big copper foil of surface roughness, the propagation distance of signal is longer, and signal can be caused to decay or prolong
Late.In other words, loss of the more smooth then signal in the surface of copper foil when transmitting is smaller.Therefore, the planarization of copper foil surface is played the part of
Drill very important role.
Referring to FIG. 1, it shows the partial cutaway schematic of copper foil in the prior art.As shown in Figure 1, in the prior art
The surface of middle copper foil F1 is formed by multiple copper tumor F10 and is generally spherical, and the copper tumor F10 of most of spherical shape is in level
The full-size in direction can be more than full-size in vertical direction.In this way, although the roughness of copper foil can be made relatively low, with
Meets the needs of high-frequency transmission, but copper foil, when being engaged with high frequency substrate, the bond strength of copper foil and high frequency substrate is more insufficient.
If attempting to reduce high frequency signal transmission loss to reduce the roughness of copper foil surface, and copper foil and circuit can be reduced
The peel strength of substrate pressing.Therefore, how when promoting the peel strength of copper foil, and the smooth of copper foil surface can be kept simultaneously
Property be current industry personnel research and development a big project.
Invention content
Technical problem to be solved by the present invention lies in provide a kind of tool approximation American football shape in view of the deficiencies of the prior art
The electrolytic copper foil of copper tumor and the manufacturing method of circuit board module.
In order to solve the above technical problems, it is approximate to be to provide a kind of tool for a wherein technical solution of the present invention
The manufacturing method of the electrolytic copper foil of American football shape copper tumor.The manufacturing method of the electrolytic copper foil of the approximate American football shape copper tumor of tool includes logical
Electrolytic method is crossed to form foil layer, and foil layer has a predetermined surface.Then, one is formed slightly in the predetermined surface of foil layer
Change process layer, to form the electrolytic copper foil of the approximate rugby protrusion of surface layer tool.Roughening treatment layer includes multiple approximate American football shapes
Copper tumor, and an approximate funnelform accommodating space is formed between the copper tumor of each two adjacent approximate American football shape.It is formed thick
The step of changing process layer still further comprises：It executes a plating roughening treatment for the first time and executes at a plating solidification for the first time
Reason, wherein containing 3 to 40g/L copper, 100 to 120g/L's in one first electroplate liquid used in plating roughening treatment for the first time
Sulfuric acid, the arsenic oxide arsenoxide no more than 20ppm and 5 to 20ppm tungstate ion.
Preferably, when executing the first plating roughening treatment, used current density is 40 to 80A/dm2, and institute
It is rough surface or shiny surface to state predetermined surface.
Preferably, the step of forming the roughening treatment layer still further comprises：Execute second of plating roughening treatment
And second of plating curing process is executed, second of plating roughening treatment uses first electroplate liquid, is executing
Used current density is 50 to 90A/dm when the second plating roughening treatment2, and second of plating curing process
Parameter and the first time plating parameter of curing process it is identical.
Preferably, the step of forming the roughening treatment layer is sequentially to execute first time plating roughening treatment, described
Plating curing process, second of plating roughening treatment and second of plating curing process for the first time.
Preferably, the step of forming the roughening treatment layer is sequentially to execute first time plating roughening treatment, described
Second of plating roughening treatment, first time plating curing process and second of plating curing process.
Preferably, contain 50 to 70g/ in used one second electroplate liquid when executing the first time plating curing process
The copper of L, 70 to 100g/L sulfuric acid and arsenic oxide arsenoxide less than 30ppm, and when executing the first time curing process being electroplated
Used current density is 15 to 40A/dm2。
Preferably, the manufacturing method for having the electrolytic copper foil of approximate American football shape copper tumor still further comprises at one heat resistanceheat resistant of execution
Reason, to form a kirsite heat shield on the roughening treatment layer, wherein the used electricity when executing the heat resistanceheat resistant processing
Solution liquid composition includes 1 to 4g/L zinc and 0.3 to 2.0g/L nickel, and the used electric current when executing the heat resistanceheat resistant and handling
Density is 0.4 to 2.5A/dm2。
Preferably, it is anti-oxidant to still further comprise execution one for the manufacturing method of the electrolytic copper foil of the approximate American football shape copper tumor of tool
Processing, to form an anti oxidation layer on the roughening treatment layer, wherein the used electricity when executing the anti-oxidant treatment
Solution liquid composition includes 1 to 4g/L chromium oxide and 5 to 20g/L sodium hydroxide, and is made when executing the heat resistanceheat resistant processing
Current density is 0.3 to 3.0A/dm2。
Preferably, the manufacturing method for having the electrolytic copper foil of approximate American football shape copper tumor still further comprises one silane coupling of execution
Conjunction is handled, to form a silane coupling agent process layer on the roughening treatment layer, wherein is executing the silane coupling processing
When use 0.3 to 1.5% weight silane coupling agent.
Preferably, the copper tumor of multiple approximate American football shapes has a maximum major diameter and a maximum short axle
Diameter, maximum major diameter between 1.6 μm to 2.5 μm, maximum minor axis diameter between 1.1 μm to 2.0 μm, and
Ratio between maximum minor axis diameter and maximum major diameter is 0.3 to 0.8.
Preferably, the distribution density of the copper tumor of multiple approximate American football shapes is per square micron 0.5 to 1.7 and every two
Spacing between the copper tumor of a adjacent approximate American football shape is between 0.5 to 1.8 μm.
A wherein technical solution of the present invention is to provide a kind of manufacturing method of circuit board module comprising carries
For being formed by the electrolytic copper foil of the approximate American football shape copper tumor of tool by the manufacturing method；And it will the approximate American football shape copper tumor of tool
Electrolytic copper foil pressed face-to-face with a resin substrate, to form a circuit board module, wherein roughening treatment level is to the tree
Aliphatic radical plate.
Preferably, the peel strength of the electrolytic copper foil of the approximate American football shape copper tumor of the tool is at least more than 4lb/in.
Preferably, the electrolytic copper foil of the approximate American football shape copper tumor of the tool is sticked together with the resin substrate by one cementing
It closes, and a part for the adhesion glue is inserted in the funnelform accommodating space of approximation.
Preferably, the resin substrate is semi-solid preparation substrate or liquid crystal polymer substrate, and when the approximate rugby of the tool
When the electrolytic copper foil of shape copper tumor is pressed with the resin substrate, the part filling approximation of the resin substrate is funnelform
In accommodating space.
The beneficial effects of the present invention are by above-mentioned manufacturing method, can be such that the roughening treatment layer of electrolytic copper foil has
There are multiple American football shape copper tumors or the copper tumor of approximate American football shape.That is, American football shape copper tumor or approximate American football shape
The width of the spherical shape copper tumor of the width of copper tumor than in the prior art is small.Therefore, when surface layer has the electricity of approximate American football shape copper tumor
When solving copper foil and resin substrate then, compared to the prior art in for the electrolytic copper foil with spherical shape copper tumor, surface layer tool is close
The contact area between the electrolytic copper foil and resin substrate like American football shape copper tumor with bigger, so as to higher stripping
Intensity.
For the enabled feature and technology contents for being further understood that the present invention, please refer to below in connection with the present invention specifically
Bright and attached drawing, however the attached drawing provided is only for reference and description, the person of being not intended to limit the present invention.
Description of the drawings
Fig. 1 is the partial cutaway schematic of electrolytic copper foil in the prior art.
Fig. 2 is the flow chart of the manufacturing method of the electrolytic copper foil of the approximate American football shape copper tumor of tool of the embodiment of the present invention.
Fig. 3 is the signal of the system of the manufacturing method of the electrolytic copper foil to execute the approximate American football shape copper tumor of the tool of Fig. 2
Figure.
Fig. 4 is the partial cutaway schematic of the electrolytic copper foil of the approximate American football shape copper tumor of tool of the embodiment of the present invention.
Close-up schematic view of the electrolytic copper foil for the approximate American football shape copper tumor of tool that Fig. 5 is Fig. 4 in region V.
Fig. 6 is the electrolytic copper foil of the approximate American football shape copper tumor of tool of the embodiment of the present invention in scanning electron microscope
(SEM) photo.
Fig. 7 is photo of the electrolytic copper foil in scanning electron microscope (SEM) of comparative example.
Fig. 8 is focused ion beam (FIB) photo of the electrolytic copper foil of the approximate American football shape copper tumor of tool of the embodiment of the present invention.
Fig. 9 is the diagrammatic cross-section of the circuit board module of the embodiment of the present invention.
Partial enlarged view of the circuit board module in region X that Figure 10 is Fig. 9.
Figure 11 is the diagrammatic cross-section of the circuit board module of another embodiment of the present invention.
Specific implementation mode
It is to illustrate presently disclosed related " the approximate American football shape shape copper tumor of tool by particular specific embodiment below
Electric electrolytic copper foil and circuit board module manufacturing method " embodiment.The manufacturing method that the embodiment of the present invention is provided
The electrolytic copper foil that can get the approximate American football shape copper tumor of surface layer tool, with low rugosity and high-peeling strength.In addition, with aforementioned side
The electrolytic copper foil and resin substrate of the approximate American football shape copper tumor of surface layer tool manufactured by method are interconnected and are formed by circuit board group
Part can be applied to high frequency signal transmission.
Please refer to Fig. 2 and Fig. 3.Fig. 2 shows the electrolytic copper foil of the approximate American football shape copper tumor of surface layer tool of the embodiment of the present invention
Manufacturing method flow chart, Fig. 3 is the manufacturer of the electrolytic copper foil of the approximate American football shape copper tumor of surface layer tool to execute Fig. 2
The equipment schematic diagram of method.
First, as shown in Fig. 2, in the step s 100, by an electrolytic method to form all one's life layers of foil, wherein the foil
Layer has a predetermined surface.
Referring to FIG. 3, the step of forming foil layer by electrolytic method includes providing a foil device 1, and foil device 1
Including at least an electrolytic cell 10, an anode plate 11, a cathode wheel 12 and a roller 13.
From the above, electrolytic cell 10 is containing electrolyte L0.Anode plate 11 is arranged in electrolytic cell 10, and is electrically connected
To the cathode output end of a power supply device 2.Anode plate 11 is to be coated in titanium plate by iridium or its oxide and formed.It is cloudy
Pole wheel 12 then corresponds to electrolytic cell 10 and is arranged, and positioned at 11 top of anode plate.In addition, cathode wheel 12 is electrically connected to power supply confession
Answer the cathode output end of device 2.In embodiments of the present invention, cathode wheel 12 is titanium roller.
In addition, in the present embodiment, foil device 1 further includes the diversion pipe 14 of one and the fluid communication of electrolytic cell 10.It is aforementioned
Electrolyte L0 be by diversion pipe 14 inject electrolytic cell 10 in, flood anode plate 11, and part cathode wheel 12 is made to be immersed in electricity
It solves in liquid L0.
Then, as shown in figure 3, power supply device E1 exports direct current to anode plate 11 and cathode wheel 12, to electricity
It solves liquid L0 and applies electric current, the copper ion in electrolyte L0 is made to be precipitated in the surface of cathode wheel 12, and form foil layer 30.
In addition, when electrolyte L0 forms foil layer 30, can continue in supply electrolyte L0 to electrolytic cell 10.Specifically
For, electrolyte L0 can be flowed by diversion pipe 14 in electrolytic cell 10, with maintain the copper of the electrolyte L0 in electrolytic cell 10 from
Sub- concentration.Referring again to Fig. 3, the foil layer 30 for being formed in 12 surface of cathode wheel can be by the sur-face peeling of cathode wheel 12, and passes through
Roller 13, to carry out follow-up process.
More specifically, foil layer 30 has a rough surface 30a and shiny surface 30b opposite with aforementioned rough surface 30a,
Wherein shiny surface 30b is the surface of foil layer 30 and the contact of cathode wheel 12 in electrolytic process, therefore shiny surface 30b's is coarse
It spends relatively fixed.Rough surface 30a is then the surface for contacting electrolyte L0.The rough surface 30a or shiny surface 30b of foil layer 30 are usual
There can be multiple graininess protrusions.In one embodiment, 10 mean roughness of the rough surface 30a of foil layer 30 are no more than 2 μ
M, such as between 0.9 μm to 1.9 μm.
Then, referring again to Fig. 2, in step s 200, a roughening treatment layer is formed in the predetermined surface of foil layer, with
Form the electrolytic copper foil of the approximate American football shape protrusion of surface layer tool, wherein roughening treatment layer includes multiple approximate American football shapes
Copper tumor, and an approximate funnelform accommodating space is formed between the copper tumor of each two adjacent approximate American football shape.
From the above, the step S200 of formation roughening treatment layer still further comprises execution and roughening treatment is electroplated at least once
With curing process is electroplated at least once.In embodiments of the present invention, foil layer can pass through is electroplated roughening treatment and twice electricity twice
Plate curing process, with the predetermined surface of foil layer formed roughening treatment layer, wherein predetermined surface can refer to rough surface or
One at least in shiny surface.
Specifically, it is sequentially to execute electricity for the first time after step sloo as shown in Fig. 2, in a wherein embodiment
Plate roughening treatment (step S201), for the first time plating curing process (step S203), second of plating roughening treatment (step
S202) and second is electroplated curing process (step S204).
In another embodiment, after step sloo, it is sequentially to execute plating roughening treatment (step for the first time
S201), second of plating roughening treatment (step S202), first time plating curing process (step S203) and second are electroplated
Curing process (step S204).
More specifically, as plating roughening treatment and the number of plating curing process are more, cathode copper can be increased
The Bonding strength of foil and resin substrate, but the surface roughness of electrolytic copper foil can also increased, and be unfavorable for applying and believe in high frequency
Number transmission.Therefore, plating roughening treatment and number and tune that curing process is electroplated can be increased and decreased according to the needs of practical processing procedure
Whole sequence.
Please refer to Fig. 3.Sequentially to execute plating roughening treatment for the first time, first time plating curing process, be electroplated for second
It is illustrated for roughening treatment and second of plating curing process.
As shown in figure 3, the surface processing device 2 for executing step S201~S204 includes that configuration is online in a production
Multiple transmission units 20, at least one roughening unit 21 (two are painted in Fig. 3), at least one solidified cell 22 (are painted in Fig. 3
Two) and multiple rinse baths 23, wherein the quantity of roughening unit 21, solidified cell 22 and rinse bath 23 according to actual demand and
Setting.Multiple transmission units 20 according to acquiescence processing flow by foil layer 30 be sent to roughening unit 21, rinse bath 23 and
Solidified cell 22 is handled.
Roughening unit 21 includes carrying the roughening slot 210 of the first electroplate liquid L1 and being set in roughening slot 210
One group of roughening anode plate 211.As shown in figure 3, when executing plating roughening treatment for the first time, foil layer 30 can be put into and load
In the roughening slot 210 of first electroplate liquid L1.First electroplate liquid L1 used in the embodiment of the present invention contain 3 to 40g/L copper, 100
To 120g/L sulfuric acid, it is no more than the arsenic oxide arsenoxide (As of 20ppm2O3) and 5 to 20ppm tungstate ion (WO4 2-)。
When executing plating roughening treatment for the first time, roughening anode plate 211 is applied in a positive voltage respectively with foil layer 30
With a negative voltage, so that the copper ion in the first electroplate liquid L1 restores, and multiple wartys are formed in the rough surface 30a of foil layer 30
Copper particle.
It should be noted that the first electroplate liquid L1 used in the embodiment of the present invention has special composition, warty can be limited
The crystalline growth direction of copper particle.In addition, the concentration of arsenic oxide arsenoxide and the concentration of tungstate ion are no more than 20ppm.If arsenic oxide arsenoxide
Excessive concentration, size spheroidal copper tumor bigger than normal may be formed, and be relatively difficult to form approximate American football shape or American football shape
Copper tumor.
Furthermore, when executing plating roughening treatment for the first time, since the copper concentration in the first electroplate liquid L1 is relatively low
(being less than 40g/L), copper atom can only be selected along crystallization direction (i.e. longitudinal) storehouse compared with preference.In other words, warty copper
Direction growth of the particle compared with the rough surface 30a that preference is approximately perpendicular to foil layer 30 towards one, and it is less easily substantially parallel towards one
Grow up in the direction of the rough surface 30a of foil layer 30.Therefore, warty copper particle growth limitation in the horizontal direction, to
Make warty copper particle that there is the American football shape of the rough surface 10b or shiny surface 10a that stand on foil layer 10.
Therefore, after roughening treatment being electroplated by first time, most of warty for being formed on the rough surface 30a of foil layer 30
Copper particle size in the horizontal direction can be less than the size in longitudinal direction, can also make between each two adjacent warty copper particle
Spacing it is wider.
In addition, in one embodiment, when executing plating roughening treatment for the first time, by the electric current for being roughened anode plate 211
Density is between 40 to 80A/dm2, the warty copper particle of the approximate rugby ball shape of tool can be formed.In addition, executing first time
When roughening treatment is electroplated, the temperature of the first electroplate liquid substantially maintains 20 to 40 degree Celsius.
After completing plating roughening treatment for the first time, plating curing process for the first time is executed, to form a covering warty copper
The copper protective layer of particle so that warty copper particle is tightly fastened rough surface 30a or shiny surface 30b in foil layer 30, and is prevented
Only " lose powder " phenomenon.
As shown in figure 3, plating curing process is executed by solidified cell 22 for the first time.Solidified cell 22 includes a use
To carry the solidification slot 220 of the second electroplate liquid L2 and be set to one group of solidification anode plate 221 of solidification slot 220.
In the present embodiment, foil layer 30 first passes through transmission unit after roughening slot 210 completes plating roughening treatment for the first time
After 20 are transferred into the cleaning of rinse bath 23, it is resent to solidification slot 220, to execute plating curing process for the first time.
When executing plating curing process for the first time, solidification anode plate 221 is applied in a positive voltage respectively with foil layer 30
With a negative voltage, so that the copper ion in the second electroplate liquid L2 restores, and covering warty copper particle is formed on foil layer 30
Copper protective layer.
When executing plating curing process for the first time, used second electroplate liquid L2 contains 50 to 70g/L copper, 70 to
The sulfuric acid of 100g/L, and the arsenic oxide arsenoxide less than 30ppm, and the temperature of the second electroplate liquid L2 substantially maintains Celsius 50 to 70
Degree.
It should be noted that the height of the warty copper particle formed in first time plating roughening treatment is not high.If
For the first time when plating curing process, although the probability that picking phenomenon occurs can be reduced by forming thicker copper protective layer, and reduce
The roughness of electrolytic copper foil surface, being but possible to reduction electrolytic copper foil can shell with the surface area of resin substrate then to reduce
From intensity.Therefore, when executing plating curing process for the first time, current density need to pass through especially adjustment, relatively thin and deep to be formed
Plate the preferable copper protective layer of effect.Accordingly, can be in the case where preventing picking, but being not reduction electrolytic copper foil can be with resin base
The surface area of plate then.In one embodiment, in executing plating curing process for the first time, current density is 15 to 40A/dm2。
In one embodiment, after executing plating roughening treatment for the first time and plating curing process for the first time, you can shape
There is the electrolytic copper foil of American football shape protrusion or approximate American football shape protrusion at surface layer.Detailed construction about roughening treatment layer will
In hereinafter further illustrating.
Then, by transmission unit 20, the foil layer 30 for having been subjected to the first plating curing process is first passed by solidification slot 220
It send to rinse bath 23 after cleaning, is resent in next roughening slot 210, to carry out second of plating roughening treatment.
In the present embodiment, first electricity of the parameter of second of plating roughening treatment substantially with first time plating roughening treatment
The composition of plating solution L1 is identical.But used current density is 50 to 90A/dm in second of plating roughening treatment2, it is higher than
Current density when plating roughening treatment for the first time.In this way, can make to have been formed on the rough surface 30a of foil layer 30 originally
Multiple warty copper particle continue to grow up.Since in addition, being to use and plating roughening for the first time when second of plating roughening treatment
Handle identical first electroplate liquid L1.Therefore, the growth direction of warty copper particle, which still can be limited in, is approximately perpendicular to foil
On the direction of the rough surface 30a of layer 30.In this way, the commissure of final electrolytic copper foil and resin substrate can be further increased
Product.
Then, it by transmission unit 20, will be transmitted by roughening slot 210 by the foil layer 30 of second of plating roughening treatment
It after being cleaned to another rinse bath 23, is resent in another solidification slot 220, to carry out second of plating curing process.Second
The composition of the second electroplate liquid L2 in curing process is electroplated, it can be with the group of the second electroplate liquid L2 of first time plating curing process
At identical.In addition, the current density for executing second of plating curing process can also be with electricity when first time plating curing process
Current density is close, ranges approximately from 15 to 40A/dm2.By executing second of plating curing process, copper guarantor can be further provided
Sheath, in order to avoid cause to lose powder.
Please refer to Fig. 4 and Fig. 5.Fig. 4 is the partial cutaway schematic of the electrolytic copper foil of the embodiment of the present invention.Fig. 5 is Fig. 4's
Close-up schematic view of the electrolytic copper foil in region V.
3 surface layer of electrolytic copper foil manufactured by manufacturing method via above-mentioned electrolytic copper foil has American football shape protrusion, and can
Increase and the area of resin substrate then.Specifically, the electrolytic copper foil 3 of the embodiment of the present invention includes all one's life layers of foil 30 and position
In the roughening treatment layer 31 on foil layer 30.
Roughening treatment layer 31 is on the rough surface 30a of foil layer 30 and the one at least in shiny surface 30b.
In the embodiment of Fig. 4, roughening treatment layer 31 is on the rough surface 30a of foil layer 30.In one embodiment, electrolytic copper foil 3
Overall thickness T be to be determined depending on practical application request between 6 to 400 μm.
As shown in figure 5, in embodiments of the present invention, roughening treatment layer 31 includes multiple American football shapes or approximate American football shape
Copper tumor 310, and the copper tumor 310 of each American football shape or approximate American football shape be along with rough surface 30a or shiny surface 30b
Not parallel long axis direction extends.
In addition, the copper tumor 310 of each American football shape or approximate American football shape have a maximum major diameter D1 and
One maximum minor axis diameter D2.In one embodiment, maximum major diameter D1 is between 1.6 μm to 2.5 μm, the maximum
Minor axis diameter D2 between 1.1 μm to 2.0 μm.In addition, forming an approximate funnel-form between each two adjacent copper tumor 310
Accommodating space S1.
It please compare Fig. 1 and Fig. 5, size of the spherical shape copper tumor in the prior art on short-axis direction can be more than long axis side
Upward size, and it is distributed comparatively dense.In comparison, the multiple American football shapes or approximation of the electrolytic copper foil 3 of the embodiment of the present invention
The copper tumor 310 of American football shape is in short-axis direction (direction for being namely parallel to the rough surface 30a or shiny surface 30b of foil layer 30)
On diameter can be also smaller than the diameter on long axis direction.In a preferred embodiment, American football shape or approximate American football shape
The ratio of the maximum minor axis diameter D2 and maximum major diameter D1 of copper tumor 310 are between 0.3 to 0.8.
In the embodiment of the present invention, the maximum major diameter D1 of the copper tumor 310 of American football shape or approximate American football shape and existing
Some spherical shape copper tumors are similar in the size of vertical direction.Therefore, the rough surface of the electrolytic copper foil 3 in the embodiment of the present invention
There is no because the shape of copper tumor changes and is significantly increased for degree.In one embodiment, the thickness t of roughening treatment layer 31 is about to be situated between
Between 1.2 to 4 μm, and 10 average surface roughness (Rz) of roughening treatment layer 31 are about between 1 to 4 μm.According to
This, the electrolytic copper foil 3 of the embodiment of the present invention is still applicable to cooperation high frequency substrate, to transmit high-frequency signal.
On the other hand, in the electrolytic copper foil of the embodiment of the present invention 3, each two adjacent American football shape or approximate rugby
Spacing P1 between the copper tumor 310 of shape is also wider.In other words, the American football shape of the embodiment of the present invention or approximate American football shape
Copper tumor 310 also has lower density.In one embodiment, the copper tumor of each two adjacent American football shape or approximate American football shape
Spacing P1 between 310 is and point of the copper tumor 310 of these American football shapes or approximate American football shape between 0.5 to 1.8 μm
Cloth density is every square micron 0.5 to 1.7.
Please refer to Fig. 6 and Fig. 7.Fig. 6 shows the scanning electron microscope captured by the electrolytic copper foil of the embodiment of the present invention
(SEM) photo, Fig. 7 show the scanning electron microscope photo captured by the electrolytic copper foil of a comparative example.First illustrate,
When the electrolytic copper foil of comparison example, the parameter and the embodiment of the present invention when executing plating roughening treatment are roughly the same, still
Execute roughening treatment is electroplated when used electroplate liquid composition in containing concentration be more than 40g/L copper.
Compare the photo of Fig. 6 and Fig. 7 it can be found that the copper tumor particle of the electrolytic copper foil of the embodiment of the present invention is smaller, and shape
Shape is more elongated.The copper tumor shape of the comparative example electrolytic copper foil of Fig. 7 is rounded, coarseer also more intensive.
Fig. 8 is please referred to, display is electrolysed by focused ion beam and the embodiment of the present invention captured by electron beam microscopic system
The photo of the focused ion beam (FIB) of copper foil.Fig. 8 and show the embodiment of the present invention electrolytic copper foil partial cross-section (cross
Section it) shows up.
By the photo of Fig. 6 and Fig. 8 it can be proved that the electrolytic copper foil of the embodiment of the present invention is after passing through surface treatment, meeting
Form multiple American football shape copper tumors rather than spherical shape copper tumor.In addition, by focused ion beam and electron beam microscopic system to this hair
The electrolytic copper foil of bright embodiment is analyzed, and the copper crystalline particle size of electrolytic copper foil is between 1.2 to 4.0 μm.
Then, referring again to Fig. 2, in embodiments of the present invention, in step S300, a surface treatment is executed.It is above-mentioned
Surface treatment can be heat resistanceheat resistant processing, anti-oxidant treatment, silane coupling agent processing at least one of.
It is to form a kirsite heat resistanceheat resistant on roughening treatment layer by electrolytic method when surface treatment is heat resistanceheat resistant processing
Layer, and increase the heat resistance of electrolytic copper foil.In one embodiment, used electrolyte composition includes when executing heat resistanceheat resistant processing
1 to 4g/L zinc and 0.3 to 2.0g/L nickel, and execute heat resistanceheat resistant processing when used current density be 0.4 to
2.5A/dm2。
It is that an anti oxidation layer is formed on roughening treatment layer by electrolytic method when surface treatment is anti-oxidant treatment,
To increase the inoxidizability of electrolytic copper foil.When executing anti-oxidant treatment, used electrolyte composition includes 1 to 4g/L oxygen
Change chromium and 5 to 20g/L sodium hydroxide, and used current density is 0.3 to 3.0A/dm when executing heat resistanceheat resistant processing2。
When surface treatment is silane coupling processing, a silane coupling agent process layer can be formed on roughening treatment layer,
In, 0.3 to 1.5% weight silane coupling agent is used when executing in silane coupling processing.
Please refer to Fig. 9 and Figure 10.Fig. 9 shows that the diagrammatic cross-section of the circuit board module of the embodiment of the present invention, Figure 10 are shown
Partial enlarged view of the circuit board module of Fig. 9 in region X.The electrolytic copper foil of the embodiment of the present invention can be applied to different wiring boards
Component, such as rigid printed circuit board (PCB), flexible printed wiring board (FPC) and its homologue.
In the embodiment in fig. 9, circuit board module M1 faces face pressure by a resin substrate 4 and above-mentioned electrolytic copper foil 3
It closes and is formed, and the roughening treatment layer 31 of electrolytic copper foil 3 can face resin substrate 4.
Resin substrate 4 can be high frequency substrate, such as：Epoxy resin base plate, polyoxy xylene resin substrate (PPO) or fluorine system
Resin substrate, or by polyimides, ethylene terephthalate, makrolon, liquid crystal polymer or polytetrafluoroethylene (PTFE) etc.
The substrate that material is constituted.
In the embodiment of Fig. 9 and Figure 10, resin substrate 4 is semi-solid preparation substrate or liquid crystal polymer substrate.It can by Figure 10
To find out, since the spacing between the American football shape of the embodiment of the present invention or the copper tumor 310 of approximate American football shape is wider, it is being electrolysed
When copper foil 3 is pressed with resin substrate 4, resin substrate 4 can coat and contact the copper tumor 310 of American football shape or approximate American football shape
Most surfaces, and can go deep into approximate funnelform accommodating space S1.In this way, making between electrolytic copper foil 3 and resin substrate 4
Bonding strength enhances.
Figure 11 is please referred to, shows the diagrammatic cross-section of the circuit board module of another embodiment of the present invention.In the present embodiment,
Resin substrate 4 with line layer 41 be combined by adhesion glue 5, and a part for adhesion glue 5 can insert it is approximate funnelform accommodating
In space.
The electrolytic copper foil 3 of the embodiment of the present invention is tested after being pressed with resin substrate 4, and peel strength can all be more than 4lb/
in.Specifically, in an experimental example, resin substrate 4 is glass mat (FR4), and by glass mat (FR4) and this hair
The electrolytic copper foil of bright embodiment is pressed, and laminated plates test film is formed.Then, it is measured using peel strength puller system.
Test result shows the peel strength of electrolytic copper foil at least more than 7lb/in.
In addition, the manufacturing method of the circuit board module of the embodiment of the present invention can also further comprise in pressing electrolytic copper foil 3
After resin substrate 4, electrolytic copper foil 3 is patterned by etching mode, and forms a line layer.
In conclusion the beneficial effects of the present invention are in the manufacturing method of the electrolytic copper foil using the embodiment of the present invention
The concentration of copper can be made to reduce and make arsenic oxide arsenoxide and tungstate radicle by adjusting the composition of the first electroplate liquid L1 in plating roughening treatment
The content of ion is no more than 20ppm, thus can limit copper tumor crystallization direction and growth direction, to form American football shape or close
Like the copper tumor 310 of American football shape.
The transverse direction of the copper tumor 310 of spherical shape copper tumor F10 in compared to the prior art, American football shape or approximate American football shape
Size is smaller, can increase the then surface area between electrolytic copper foil 3 and resin substrate 4.In addition, two adjacent American football shapes or
There is relatively wide distance between the copper tumor 310 of approximate American football shape, when resin substrate 4 and electrolytic copper foil 3 then when, resin substrate
4 can coat the surface of entire copper tumor, and go deep into the space between the copper tumor 310 of two American football shapes or approximate American football shape,
To increase the degree of sticking together between electrolytic copper foil 3 and resin substrate 4 or adhesion layer 5.
In addition, since the American football shape of the electrolytic copper foil 3 of the embodiment of the present invention or the copper tumor 310 of approximate American football shape are hanging down
The upward size of histogram is not greater than the sizes of spherical shape copper tumor F10 in the prior art in vertical direction, therefore, cathode copper
The surface roughness of foil 3 is lower compared to the surface roughness of existing copper foil.But the stripping of the electrolytic copper foil 3 of the embodiment of the present invention
It does not decline to a great extent because surface roughness reduces from intensity, and meets the demand of practical application.
In addition, please referring to the following table 1, surface roughness (Roughness), the stripping of the embodiment of the present invention and comparative example are shown
The ratio (P/R ratio) of intensity (Peel Strength) and peel strength and surface roughness, wherein surface roughness is
10 mean roughness (Rz).Embodiment is the electrolytic copper foil for having American football shape copper tumor, and comparative example is with spherical shape copper
The electrolytic copper foil of tumor.
Table 1
| Embodiment | Comparative example | |
| Surface roughness (μm) | 2.49 | 3.42 |
| Peel strength (lb/in) | 4.88 | 4.99 |
| Peel strength/surface roughness | 1.96 | 1.46 |
As can be seen from Table 1, the surface roughness of the electrolytic copper foil of the embodiment of the present invention (has ruler compared to comparative example
Very little larger spherical shape copper tumor) surface roughness it is lower, therefore the electrolytic copper foil of the embodiment of the present invention is kept pouring in applied to height
When defeated, the loss of signal can be further decreased.
In addition it is noted that the ratio of peel strength and surface roughness is bigger, the peel strength of copper foil is thick by surface
The influence of rugosity is smaller, and the performance capabilities of peel strength is better.Compared to comparative example it can be seen from upper table, the present invention is real
Apply the peel strength of the electrolytic copper foil of example and the ratio bigger of surface roughness.Therefore, the electrolytic copper foil of the embodiment of the present invention
There is no the losses excessive because of low surface roughness for peel strength.
The foregoing is merely the preferable possible embodiments of the present invention, the protection model of non-therefore the limitation present invention claim
The equivalence techniques variation enclosed, therefore description of the invention and accompanying drawing content is used to be done such as, the right for being both contained in the present invention are wanted
In the protection domain asked.
Claims (15)
1. a kind of manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor, which is characterized in that the approximate rugby of the tool
The manufacturing method of the manufacturing method of the electrolytic copper foil of shape copper tumor includes：
By an electrolytic method to form all one's life layers of foil, wherein the foil layer has a predetermined surface；And
A roughening treatment layer is formed in the predetermined surface of the foil layer, to form the approximate American football shape protrusion of surface layer tool
Electrolytic copper foil, wherein the roughening treatment layer includes the copper tumor of multiple approximate American football shapes, and each two adjacent described close
An approximate funnelform accommodating space is formed between copper tumor like American football shape；
Wherein, the step of forming the roughening treatment layer still further comprises：It executes a plating roughening treatment for the first time and holds
Curing process is electroplated in row one for the first time, wherein in one first electroplate liquid used in first time plating roughening treatment containing 3 to
The copper of 40g/L, 100 to 120g/L sulfuric acid, the arsenic oxide arsenoxide no more than 20ppm and 5 to 20ppm tungstate ion.
2. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as described in claim 1, which is characterized in that holding
It is 40 to 80A/dm that used current density when roughening treatment, which is electroplated, in row described first2, and the predetermined surface is rough surface
Or shiny surface.
3. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as claimed in claim 2, which is characterized in that formed
The step of roughening treatment layer, still further comprises：It executes second of plating roughening treatment and executes second of plating
Curing process, second of plating roughening treatment use first electroplate liquid, are executing the second plating roughening treatment
When used current density be 50 to 90A/dm2, and the parameter of second of plating curing process and first time electricity
The parameter for plating curing process is identical.
4. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as claimed in claim 3, which is characterized in that formed
The step of roughening treatment layer be sequentially execute first time plating roughening treatment, first time plating curing process,
Second of plating roughening treatment and second of plating curing process.
5. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as claimed in claim 3, which is characterized in that formed
The step of roughening treatment layer be sequentially execute first time plating roughening treatment, second of plating roughening treatment,
The first time plating curing process and second of plating curing process.
6. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as described in claim 1, which is characterized in that holding
When row first time plating curing process in used one second electroplate liquid containing 50 to 70g/L copper, 70 to 100g/L's
Sulfuric acid and arsenic oxide arsenoxide less than 30ppm, and execute the first time curing process is electroplated when used current density be
15 to 40A/dm2。
7. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as described in claim 1, which is characterized in that described
The manufacturing method of electrolytic copper foil of the approximate American football shape copper tumor of tool still further comprise：Primary antibody heat treatment is executed, with described
A kirsite heat shield is formed on roughening treatment layer, wherein the used electrolyte composition packet when executing the heat resistanceheat resistant processing
1 to 4g/L zinc and 0.3 to 2.0g/L nickel are included, and used current density is 0.4 when executing the heat resistanceheat resistant processing
To 2.5A/dm2。
8. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as described in claim 1, which is characterized in that execute
One anti-oxidant treatment, to form an anti oxidation layer on the roughening treatment layer, wherein executing anti-oxidant treatment when institute
The electrolyte composition used includes 1 to 4g/L chromium oxide and 5 to 20g/L sodium hydroxide, and is being executed at the heat resistanceheat resistant
Used current density is 0.3 to 3.0A/dm when reason2。
9. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as described in claim 1, which is characterized in that described
The manufacturing method of electrolytic copper foil of the approximate American football shape copper tumor of tool still further comprise：Execute a silane coupling processing, with
A silane coupling agent process layer is formed on the roughening treatment layer, wherein when executing the silane coupling processing using 0.3 to
1.5% weight silane coupling agent.
10. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as described in claim 1, which is characterized in that more
The copper tumor of a approximate American football shape has a maximum major diameter and a maximum minor axis diameter, maximum long axis straight
Diameter between 1.6 μm to 2.5 μm, maximum minor axis diameter between 1.1 μm to 2.0 μm, and maximum minor axis diameter with most
Ratio between big major diameter is 0.3 to 0.8.
11. the manufacturing method of the electrolytic copper foil of tool approximation American football shape copper tumor as described in claim 1, which is characterized in that more
The distribution density of the copper tumor of a approximate American football shape is every square micron 0.5 to 1.7, and each two adjacent described close
Like American football shape copper tumor between spacing be between 0.5 to 1.8 μm.
12. a kind of manufacturing method of circuit board module, which is characterized in that the manufacturing method of the circuit board module includes：
It provides having approximate American football shape copper tumor as described in being formed by such as the manufacturing method of one of claim 1 to 11
Electrolytic copper foil；And
The electrolytic copper foil of the approximate American football shape copper tumor of the tool is pressed face-to-face with a resin substrate, to form a circuit board group
Part, wherein the roughening treatment level is to the resin substrate.
13. the manufacturing method of circuit board module as claimed in claim 12, which is characterized in that the approximate American football shape copper of the tool
The peel strength of the electrolytic copper foil of tumor is at least more than 4lb/in.
14. the manufacturing method of circuit board module as claimed in claim 12, which is characterized in that the approximate American football shape copper of the tool
The electrolytic copper foil of tumor is combined with the resin substrate by an adhesion glue, and the part filling approximate leakage of the adhesion glue
In bucket-shaped accommodating space.
15. the manufacturing method of circuit board module as claimed in claim 12, which is characterized in that the resin substrate is semi-solid preparation
Substrate or liquid crystal polymer substrate, and when the electrolytic copper foil of the approximate American football shape copper tumor of the tool is pressed with the resin substrate
When, a part for the resin substrate is inserted in the funnelform accommodating space of approximation.
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| CN201710160942.XA Pending CN108505075A (en) | 2017-02-24 | 2017-03-17 | Method for manufacturing electrolytic copper foil with approximately rugby-shaped copper nodules and circuit board assembly |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102362559A (en) * | 2009-03-27 | 2012-02-22 | 吉坤日矿日石金属株式会社 | Copper foil for printed wiring board and method for producing same |
| CN102618902A (en) * | 2012-04-24 | 2012-08-01 | 山东金宝电子股份有限公司 | Surface treatment process of copper foil for flexible copper-clad plate |
| CN103088379A (en) * | 2013-02-26 | 2013-05-08 | 灵宝华鑫铜箔有限责任公司 | Surface treatment technique in electrolytic copper foil production |
| CN103469267A (en) * | 2013-08-07 | 2013-12-25 | 江西铜业股份有限公司 | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same |
| CN105849319A (en) * | 2014-01-17 | 2016-08-10 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board |
| CN106011965A (en) * | 2016-06-13 | 2016-10-12 | 山东金宝电子股份有限公司 | Fine roughing treatment technology for surface of electrolytic copper foil |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202367A (en) * | 1993-12-28 | 1995-08-04 | Japan Energy Corp | Surface treatment method of copper foil for printed circuit |
| JP4833556B2 (en) * | 2004-02-06 | 2011-12-07 | 古河電気工業株式会社 | Surface treated copper foil |
| JP4532322B2 (en) * | 2005-03-30 | 2010-08-25 | 古河電気工業株式会社 | Copper foil for built-up board inner layer |
| JP2012064769A (en) * | 2010-09-16 | 2012-03-29 | Hitachi Cable Ltd | Copper foil for printed circuit board |
| EP2624671A4 (en) * | 2010-09-27 | 2016-12-21 | Jx Nippon Mining & Metals Corp | Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board, and printed wiring board |
| CN102418129A (en) * | 2011-11-18 | 2012-04-18 | 山东金宝电子股份有限公司 | Surface treatment process of copper foil for high-Tg halogen-free plate |
| CN102595799B (en) * | 2011-12-30 | 2015-03-25 | 柏承科技(昆山)股份有限公司 | Manufacturing method of high-density interconnected printed circuit board |
| JP6166614B2 (en) * | 2013-07-23 | 2017-07-19 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper foil with carrier, substrate, printed wiring board, printed circuit board, copper-clad laminate, and printed wiring board manufacturing method |
| JP6379055B2 (en) * | 2015-01-30 | 2018-08-22 | Ｊｘ金属株式会社 | Surface-treated copper foil and laminate |
| JP6200042B2 (en) * | 2015-08-06 | 2017-09-20 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method |
| CN105142352A (en) * | 2015-09-24 | 2015-12-09 | 深圳市顺劲辉电子科技有限公司 | Making method of circuit board |
-
2017
- 2017-02-24 TW TW106106455A patent/TWI619852B/en active
- 2017-03-17 CN CN202310895072.6A patent/CN116926631A/en active Pending
- 2017-03-17 CN CN201710160942.XA patent/CN108505075A/en active Pending
- 2017-09-08 JP JP2017172763A patent/JP6894325B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102362559A (en) * | 2009-03-27 | 2012-02-22 | 吉坤日矿日石金属株式会社 | Copper foil for printed wiring board and method for producing same |
| CN102618902A (en) * | 2012-04-24 | 2012-08-01 | 山东金宝电子股份有限公司 | Surface treatment process of copper foil for flexible copper-clad plate |
| CN103088379A (en) * | 2013-02-26 | 2013-05-08 | 灵宝华鑫铜箔有限责任公司 | Surface treatment technique in electrolytic copper foil production |
| CN103469267A (en) * | 2013-08-07 | 2013-12-25 | 江西铜业股份有限公司 | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same |
| CN105849319A (en) * | 2014-01-17 | 2016-08-10 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board |
| CN106011965A (en) * | 2016-06-13 | 2016-10-12 | 山东金宝电子股份有限公司 | Fine roughing treatment technology for surface of electrolytic copper foil |
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|---|---|---|---|---|
| CN112118669A (en) * | 2019-06-19 | 2020-12-22 | 金居开发股份有限公司 | Advanced reverse electrolytic copper foil and copper foil substrate using same |
| US11332839B2 (en) | 2019-06-19 | 2022-05-17 | Co-Tech Development Corp. | Advanced electrodeposited copper foil and copper clad laminate using the same |
| CN112118669B (en) * | 2019-06-19 | 2022-08-26 | 金居开发股份有限公司 | Advanced reverse electrolytic copper foil and copper foil substrate using same |
| CN110656359A (en) * | 2019-10-21 | 2020-01-07 | 湖北中科铜箔科技有限公司 | Production method of high-frequency high-speed electrolytic copper foil |
| CN110656360A (en) * | 2019-10-21 | 2020-01-07 | 湖北中科铜箔科技有限公司 | Production method of electrolytic copper foil for solar energy |
| CN110670093A (en) * | 2019-10-21 | 2020-01-10 | 湖北中科铜箔科技有限公司 | Production method of 4.5-micron double-sided photoelectrolysis copper foil |
| CN110699714A (en) * | 2019-10-21 | 2020-01-17 | 湖北中科铜箔科技有限公司 | Production method of reverse electrolytic copper foil |
| CN112839426A (en) * | 2019-11-25 | 2021-05-25 | 蓝胜堃 | Structure for reducing signal loss of circuit board conductor |
| CN111304700A (en) * | 2020-03-26 | 2020-06-19 | 深圳市惟华电子科技有限公司 | Preparation method of reverse copper foil |
| CN115038238A (en) * | 2022-08-11 | 2022-09-09 | 广州方邦电子股份有限公司 | Metal foil and printed circuit board |
| CN115038238B (en) * | 2022-08-11 | 2022-11-22 | 广州方邦电子股份有限公司 | Metal foil and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201831734A (en) | 2018-09-01 |
| JP6894325B2 (en) | 2021-06-30 |
| JP2018141229A (en) | 2018-09-13 |
| CN116926631A (en) | 2023-10-24 |
| TWI619852B (en) | 2018-04-01 |
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