CN103088379A - Surface treatment technique in electrolytic copper foil production - Google Patents
Surface treatment technique in electrolytic copper foil production Download PDFInfo
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- CN103088379A CN103088379A CN2013100601140A CN201310060114A CN103088379A CN 103088379 A CN103088379 A CN 103088379A CN 2013100601140 A CN2013100601140 A CN 2013100601140A CN 201310060114 A CN201310060114 A CN 201310060114A CN 103088379 A CN103088379 A CN 103088379A
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Abstract
The invention relates to a surface treatment technique in electrolytic copper foil production, which comprises a treatment process of plating copper nodule on the copper foil surface, wherein the treatment process of plating copper nodule on the copper foil surface comprises the steps of primary coarsening, primary solidifying, secondary coarsening and secondary solidifying; the technological conditions for the primary coarsening and secondary coarsening are as follows: the Cu<2+> concentration is 5-30 g/L, the H2SO4 concentration is 40-60 g/L, the temperature 15-40 is DEG C, and the current density is 1300-2100A/m<2>; and the technological conditions for the primary solidifying and secondary solidifying are as follows: the Cu<2+> concentration is 30-50 g/L, the H2SO4 concentration is 40-60 g/L, the temperature 15-40 is DEG C, and the current density is 1500-1800A/m<2>. The technique does not use any arsenic compound in the surface treatment process, thereby reducing the pollution to the personnel and environment and being more environment-friendly.
Description
Technical field
The invention belongs to the electrolytic copper foil production technical field, be specifically related to alligatoring and curing process in process of surface treatment, the especially process of surface treatment in a kind of electrolytic copper foil production.
Background technology
Surface treatment is an important step during Copper Foil is produced, and it comprises carries out roughened layer processing, refractory layer processing and antioxidation coating processing etc. to Copper Foil.Wherein, roughened layer is processed to make has stronger bonding force between Copper Foil and base material, and it comprises alligatoring and solidifies two processes.Traditional roughened layer treatment process is: alligatoring for the first time → alligatoring for the second time → solidify for the first time → solidify for the second time.Because hair side has certain roughness, under galvanic action, the copper facing speed on the hair side mountain peak is very fast, and the lowest point is difficult for copper facing.The copper tooth that plates on the mountain peak so on the one hand is higher, makes Copper Foil very easily cause the not phenomenon of short circuit only of etching when downstream PCB industry is used, effectively electroplates bottom the mountain valley on the other hand, makes the peel strength can not be up to standard.Therefore, the method that usually addresses this problem is the arsenic powder (AS that adds 0.1-1g/L in the alligatoring groove
2O
5), this is because AS
2O
5Have translocation, can be with Cu
2+Deliver to the lowest point, copper is plated on copper foil surface uniformly, play the effect of even alligatoring, thereby improve peel strength, its electromicroscopic photograph as shown in Figure 1.
But, AS
2O
5Belong to poisonous banned substance, along with the enhancing of people's environmental consciousness, AS
2O
5Use be restricted.Therefore, solve this problem in the urgent need to researching and developing new technique.
Summary of the invention
The object of the invention is for the deficiencies in the prior art, and the process of surface treatment in a kind of electrolytic copper foil production is provided, and does not add arsenic compound, more environmental protection in this technique.
For achieving the above object, the present invention adopts following technical scheme:
Process of surface treatment during a kind of electrolytic copper foil is produced is included in the treatment process of copper-clad surface copper facing knurl body, and wherein, described treatment process at copper-clad surface copper facing knurl body is specially: alligatoring for the first time → curings → alligatoring for the second time for the first time → curing for the second time.
Concrete, the processing condition of described alligatoring for the first time and alligatoring for the second time are: Cu
2+Concentration 5-30g/l, H
2SO
4Concentration 40-60g/l, temperature 15-40 ℃, current density 1300-2100A/m
2
The described processing condition of solidifying for the first time and solidifying for the second time are: Cu
2+Concentration 30-50g/l, H
2SO
4Concentration 40-60g/l, temperature 15-40 ℃, current density 1500-1800A/m
2
The present invention is studied the not same-action of alligatoring and solidification treatment, and find through test: after will being adjusted into " alligatoring → curing → alligatoring → curing " by traditional " alligatoring → alligatoring → curing → curing " at the treatment process of copper-clad surface copper facing knurl body, the alligatoring effect is better.This is because after the first alligatoring, at hair paper tinsel surface generation copper knurl body, then carries out first curing, and copper knurl body is ganged up; Then carry out the second alligatoring on the basis of last time solidifying, can make the further growth of copper knurl body, carry out at last second and solidify, be beneficial to encirclement and the reinforcing of alligatoring knurl body.
The key that determines Copper Foil peel strength size is alligatoring.In the roughened layer treating processes, study copper acid concentration height to the impact of alligatoring by controlling different concns copper acid content.Through test find when the copper ion concentration scope be 5-30g/L, sulfuric acid concentration ranges be 40-60g/L, when copper acid solution temperature is 15-40 ℃ alligatoring respond well.Realize good copper knurl body by controlling different current densities, test finds that it is 1300-2100A/m that current density is selected in alligatoring
2The time, can make copper foil surface generate loose knurl body, and then be cured and select suitable curing process condition, can make the knurl body of alligatoring be surrounded and reinforce by normal copper coating, roughened layer is combined firmly with the Copper Foil matrix, form final roughened layer.
Compared to the prior art, the advantage of technique of the present invention is: 1) do not using under the condition that contains the arsenic additive, by selecting suitable alligatoring, curing process condition, obtained to contain the same alligatoring effect preferably of arsenic additive treating with former employing, arsenic contamination problem when having solved the copper foil surface processing of perplexing for a long time people, both met current environmental requirement, for condition has been created in the sustainable development of Copper Foil industry.2) after tested, adopt the Copper Foil product of technique preparation of the present invention, 18 μ m peel strengths are more than 1.4N/mm, and 35 μ m peel strengths meet the IPC-4562 standard more than 1.9N/mm, can satisfy downstream client's production requirement.The electromicroscopic photograph of Copper Foil finished product as shown in Figure 2.
Description of drawings
Fig. 1 amplifies 2000 times of electromicroscopic photographs for the Copper Foil product that adopts tradition to contain the preparation of arsenic roughening treatment technique;
Fig. 2 amplifies 2000 times of electromicroscopic photographs for the Copper Foil product that adopts process of surface treatment preparation of the present invention.
Embodiment
Below by specific embodiment, technical scheme of the present invention is described, but protection scope of the present invention is not limited to this.
Embodiment 1
Process of surface treatment during a kind of electrolytic copper foil is produced, this technique is: 18 prepared μ m hair paper tinsels of paper tinsel are given birth in electrolysis carry out successively following processing at copper-clad surface copper facing knurl body: alligatoring for the first time → curing → alligatoring for the second time for the first time → solidify for the second time; Wherein, the processing condition of described alligatoring for the first time and alligatoring for the second time are: Cu
2+Concentration 10g/l, H
2SO
4Concentration 50g/l, 20 ℃ of temperature, current density 2100A/m
2The described processing condition of solidifying for the first time and solidifying for the second time are: Cu
2+Concentration 40g/l, H
2SO
4Concentration 40g/l, 20 ℃ of temperature, current density 1800A/m
2Hair paper tinsel after alligatoring is solidified is processed (with so that Copper Foil can be heat-resisting, corrosion-resistant and anti-oxidation) and is cut through conventional zinc-plated, chromium plating again and is packaged to be the Copper Foil finished product.
Embodiment 2
Process of surface treatment during a kind of electrolytic copper foil is produced, this technique is: 18 prepared μ m hair paper tinsels of paper tinsel are given birth in electrolysis carry out successively following processing at copper-clad surface copper facing knurl body: alligatoring for the first time → curing → alligatoring for the second time for the first time → solidify for the second time; Wherein, the processing condition of described alligatoring for the first time and alligatoring for the second time are: Cu
2+Concentration 18g/l, H
2SO
4Concentration 40g/l, 30 ℃ of temperature, current density 1500A/m
2The described processing condition of solidifying for the first time and solidifying for the second time are: Cu
2+Concentration 50g/l, H
2SO
4Concentration 50g/l, 30 ℃ of temperature, current density 1600A/m
2Hair paper tinsel after alligatoring is solidified is processed and is cut through conventional zinc-plated, chromium plating again and is packaged to be the Copper Foil finished product.
Embodiment 3
Process of surface treatment during a kind of electrolytic copper foil is produced, this technique is: 35 prepared μ m hair paper tinsels of paper tinsel are given birth in electrolysis carry out successively following processing at copper-clad surface copper facing knurl body: alligatoring for the first time → curing → alligatoring for the second time for the first time → solidify for the second time; Wherein, the processing condition of described alligatoring for the first time and alligatoring for the second time are: Cu
2+Concentration 25g/l, H
2SO
4Concentration 60g/l, 40 ℃ of temperature, current density 1300A/m
2The described processing condition of solidifying for the first time and solidifying for the second time are: Cu
2+Concentration 30g/l, H
2SO
4Concentration 60g/l, 40 ℃ of temperature, current density 1500A/m
2Hair paper tinsel after alligatoring is solidified is processed and is cut through conventional zinc-plated, chromium plating again and is packaged to be the Copper Foil finished product.
The Copper Foil product of above-described embodiment gained, the copper foil surface roughness Rz of 18 μ m＜6.5 μ m, peel strength〉1.4N/mm.The copper foil surface roughness Rz of 35 μ m＜8.5 μ m, peel strength〉1.9N/mm.This technique is not used arsenic compound in surface treatment process, reduce the pollution to employee, environment, more environmental protection.
Claims (3)
1. the process of surface treatment during an electrolytic copper foil is produced is included in the treatment process of copper-clad surface copper facing knurl body, and wherein, described treatment process at copper-clad surface copper facing knurl body is specially: alligatoring for the first time → curings → alligatoring for the second time for the first time → curing for the second time.
2. the process of surface treatment during electrolytic copper foil is produced as claimed in claim 1 is characterized in that the processing condition of described alligatoring for the first time and alligatoring for the second time are: Cu
2+Concentration 5-30g/l, H
2SO
4Concentration 40-60g/l, temperature 15-40 ℃, current density 1300-2100A/m
2
3. the process of surface treatment during electrolytic copper foil is produced as claimed in claim 1 is characterized in that, the described processing condition of solidifying for the first time and solidifying for the second time are: Cu
2+Concentration 30-50g/l, H
2SO
4Concentration 40-60g/l, temperature 15-40 ℃, current density 1500-1800A/m
2
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|---|---|---|---|
| CN2013100601140A CN103088379A (en) | 2013-02-26 | 2013-02-26 | Surface treatment technique in electrolytic copper foil production |
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| CN2013100601140A CN103088379A (en) | 2013-02-26 | 2013-02-26 | Surface treatment technique in electrolytic copper foil production |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104562119A (en) * | 2015-01-08 | 2015-04-29 | 河南红日铜箔科技有限公司 | Multi-section non-arsenic roughening treatment method for electrolytic copper foil |
| CN105163518A (en) * | 2015-08-28 | 2015-12-16 | 灵宝华鑫铜箔有限责任公司 | Method for improving anti-stripping value between copper foil and base material |
| TWI619851B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having needle-shaped copper particles and circuit board assembly |
| TWI619852B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having football-shaped copper particles and circuit board assembly |
| CN110205656A (en) * | 2019-06-06 | 2019-09-06 | 贵州中鼎高精铜箔制造有限公司 | A kind of fine roughening treatment technique of electrolytic copper foil surface |
| CN113981494A (en) * | 2021-12-10 | 2022-01-28 | 铜陵市华创新材料有限公司 | Surface treatment process for reducing peeling strength heat loss rate of electrolytic copper foil |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277605A (en) * | 2011-08-12 | 2011-12-14 | 合肥铜冠国轩铜材有限公司 | Process for manufacturing smooth surface roughened electrolytic copper foil |
-
2013
- 2013-02-26 CN CN2013100601140A patent/CN103088379A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277605A (en) * | 2011-08-12 | 2011-12-14 | 合肥铜冠国轩铜材有限公司 | Process for manufacturing smooth surface roughened electrolytic copper foil |
Non-Patent Citations (1)
| Title |
|---|
| 李文康: "电解铜箔制造技术探讨", 《上海有色金属》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104562119A (en) * | 2015-01-08 | 2015-04-29 | 河南红日铜箔科技有限公司 | Multi-section non-arsenic roughening treatment method for electrolytic copper foil |
| CN105163518A (en) * | 2015-08-28 | 2015-12-16 | 灵宝华鑫铜箔有限责任公司 | Method for improving anti-stripping value between copper foil and base material |
| CN105163518B (en) * | 2015-08-28 | 2018-06-29 | 灵宝华鑫铜箔有限责任公司 | A kind of method for improving antistripping value between copper foil and base material |
| TWI619851B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having needle-shaped copper particles and circuit board assembly |
| TWI619852B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having football-shaped copper particles and circuit board assembly |
| CN108505075A (en) * | 2017-02-24 | 2018-09-07 | 南亚塑胶工业股份有限公司 | Method for manufacturing electrolytic copper foil with approximately rugby-shaped copper nodules and circuit board assembly |
| CN108505081A (en) * | 2017-02-24 | 2018-09-07 | 南亚塑胶工业股份有限公司 | Method for manufacturing electrolytic copper foil with approximate villiform copper nodules and circuit board assembly |
| CN110205656A (en) * | 2019-06-06 | 2019-09-06 | 贵州中鼎高精铜箔制造有限公司 | A kind of fine roughening treatment technique of electrolytic copper foil surface |
| CN113981494A (en) * | 2021-12-10 | 2022-01-28 | 铜陵市华创新材料有限公司 | Surface treatment process for reducing peeling strength heat loss rate of electrolytic copper foil |
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Application publication date: 20130508 |