CN110724983A - Method for preparing nano-copper-coated tungsten carbide core-shell structure powder by pulse electrodeposition - Google Patents
Method for preparing nano-copper-coated tungsten carbide core-shell structure powder by pulse electrodeposition Download PDFInfo
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
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Abstract
The invention relates to a method for preparing nano-copper-coated tungsten carbide core-shell structure powder by using a pulse electrodeposition method; firstly, carrying out acid washing and etching on original tungsten carbide powder in acid, and cleaning and drying the tungsten carbide powder for later use; carrying out intermittent nano-copper electroplating on the tungsten carbide powder subjected to acid cleaning in the prepared electroplating solution by using a pulse power supply; centrifugally cleaning and drying the powder to obtain the nano-scale copper-coated tungsten carbide powder with good dispersibility and coating propertyAnd (3) a body. The electroplating solution is prepared from CuSO4·5H2O、(NH4)2SO4Citric acid, CuCl2Polyethylene glycol and saccharin; the invention utilizes the electrodeposition method to prepare the copper-coated tungsten carbide powder core-shell structure, has high plating speed and can realize the mass production of enterprises; compared with a chemical method, the pretreatment process is simple, economic and environment-friendly; the centrifuged plating solution can be reused after supplementing copper ions, and the utilization rate is high; the prepared powder with the core-shell structure is in a nanometer scale and in a micron level before the nanometer scale; the dispersibility is good.
Description
Technical Field
The invention relates to a method for preparing nano-copper-coated tungsten carbide core-shell structure powder by using pulse electrodeposition, which is a novel coating material and a method for preparing a powder metallurgy material.
Background
The metal-coated powder core-shell structure is a novel coating material and a powder metallurgy material, and is rapidly and widely applied due to the unique performance. For the copper-coated tungsten carbide core-shell structure powder, the metal copper as the shell has good electrical conductivity, thermal conductivity and ductility, and meanwhile, the tungsten carbide coated inside has high strength, wear resistance and corrosion resistance, so that the defects of poor strength and heat resistance of the copper on the outer layer are overcome. The coated core-shell structure material has wide application prospect in the fields of high-efficiency heat radiation substrate materials of electric vacuum devices and electronic devices, overhead conductor cores of high-speed railway electric locomotives, nozzles of plasma cutting guns, electric spark discharge electrodes, low-voltage electrical apparatus contacts and contact supports, electric engineering switch contact bridges, relay copper sheets, integrated circuit lead frames, seam welding rollers, electric tool commutators, asynchronous traction motor rotors of high-speed trains, commutators, microwave tube parts, conductive elastic materials, high-pulse magnetic field conductor materials, wing or blade leading edges of advanced aircrafts, vertical target radiating fins of thermonuclear experimental reactor (ITER) diverters and the like because of high strength, high conductivity and high softening temperature.
At present, the metal-coated core-shell structure powder is mainly prepared by a wet chemical method, a ball milling method, an electrodeposition method and the like, and for the wet chemical method, the reaction speed is slow, the mass production is difficult, and the pretreatment by the wet chemical method is more complex and has poor economy and environmental protection; for the ball milling method, the coating is difficult to be uniform, the performance is poor, and the agglomeration is easy; the core-shell powder prepared by electrodeposition at present is in a micron level, and does not have the advantages of high strength and high toughness of nano materials.
Disclosure of Invention
Aiming at the defects of complex preparation method, difficult mass production, poor economy, poor dispersibility, large particle size and the like of the existing coated powder, the invention prepares the nano-copper coated tungsten carbide core-shell powder by using a pulse electrodeposition method, wherein the particle size of the prepared nano-copper coated tungsten carbide core-shell powder is small, the dispersibility of the prepared nano-copper coated tungsten carbide core-shell powder is good, the coating property of the prepared nano-copper coated tungsten carbide core. The electrodeposition method is a process of adding insoluble solid particles into a plating solution under the condition of electrifying so that metal ions are electroformed and nucleated on the surfaces of the solid particles and grow. The plating solution is stable in the process of electrodeposition, and the plating layer can reach the thickness required by industry, so the method is widely applied in practical production. The invention utilizes a pulse electrodeposition method to prepare a nano-copper-coated tungsten carbide core-shell structure. Firstly, acid-washing and etching the tungsten carbide powder to increase the active sites of plating, then using a pulse power supply to carry out electrochemical plating on the treated powder in a plating solution, controlling the time of each stage of electroplating, adopting intermittent electroplating, and finally drying and storing the powder. The copper-coated tungsten carbide powder prepared by the method has the advantages of uniform coating, small particle size and good dispersibility.
The specific scheme of the invention is as follows:
a method for preparing nano-copper-coated tungsten carbide core-shell structure powder by using a pulse electrodeposition method is characterized by comprising the following steps:
1) firstly, carrying out acid washing and etching on original tungsten carbide powder in acid, and cleaning and drying the tungsten carbide powder for later use;
2) carrying out intermittent nano-copper electroplating on the tungsten carbide powder subjected to acid cleaning in the prepared electroplating solution by using a pulse power supply;
3) and centrifugally cleaning and drying the powder to obtain the nano-scale tungsten carbide powder coated with copper, which has good dispersibility and good coating property.
The composition and content of each liter of electroplating solution in the step 2) are as follows:
in the step 2), a pulse power supply is used for electroplating in the electroplating process, the pulse width is 1-10 ms, the pulse period is 11-20 ms, and the current density is 4-10A/dm2。
The step 2) of intermittent electroplating is that the cathode of the electroplating tank is arranged at the bottom in the electroplating process, the electroplating tank is a conductive acid-alkali corrosion resistant niobium plate, and the anode of the electroplating tank is a copper sheet; firstly, stirring for 3-10 min, wherein the stirring is carried out simultaneously by mechanical stirring and ultrasonic stirring; standing and settling for 3-10 min to enable the tungsten carbide powder after stirring to settle to the bottom niobium plate; electroplating is then performed, which is a cycle.
The invention carries out acid cleaning and etching on the tungsten carbide powder. The acid etching may be performed with a strong acid such as nitric acid, hydrofluoric acid, etc. And then centrifugally cleaning and drying the etched powder. The acid pickling etching is to increase the plating active sites on the surface of the tungsten carbide powder, the appearance before etching is as shown in figure 1a, and the surface is smooth; the topography after etching is shown in fig. 1b, the surface roughness is increased.
The invention uses a pulse power supply and adds PEG and saccharin in the electroplating solution, which is a very important link in the plating process. Because the pulsed electrodeposition process for making nanostructures depends on two basic processes, (1) the nucleation rate; (2) the growth of existing grains. The instantaneous current density can be increased by using a pulse power supply, and the nucleation rate is improved; because the PEG and saccharin surfactants can effectively increase cathode polarization, increase electrochemical reaction resistance, hinder copper ion reduction and slow existing grain growth. The electroplating device is adopted, the cathode is a niobium plate, and the anode is a copper sheet at the bottom of the electroplating bath. Electroplating with a pulse power supply, wherein the pulse width is 1-10 ms, the pulse period is 11-20 ms, and the current density is 4-10A/dm2. An intermittent electroplating method is adopted, each round is firstly stirred for 3-10 min, and the stirring is carried out simultaneously by mechanical stirring and ultrasonic; then standing and settling for 3-10 min to ensure that the tungsten carbide powder after stirringCan settle to the bottom niobium plate; the electroplating time is more than 12min and is selected according to the required thickness. This is a round of plating, and different rounds of plating are performed according to the required thickness.
And after the electroplating is finished, centrifugally cleaning and drying the electroplated powder for later use. FIG. 2 shows the effect of the plating process, and FIG. 2a shows the tungsten carbide powder after acid pickling, which has not been plated yet, and has a rough surface; FIG. 2b shows the copper-coated tungsten carbide powder after the coating is completed, the coating is complete and uniform, and the copper is tested to obtain nanocrystalline copper; FIG. 2c is a cross-sectional view after plating is complete and the copper cladding is found to be intact and uniform; fig. 2d, e, f are the surface topography scans from the beginning of plating (d), to 7min (e), to 12min (f), with increasing amount of nanocrystalline copper on the surface over time during plating.
The invention has the advantages that:
the invention utilizes the electrodeposition method to prepare the copper-coated tungsten carbide powder core-shell structure, has high plating speed and can realize the mass production of enterprises; compared with a chemical method, the pretreatment process is simple, economic and environment-friendly; the centrifuged plating solution can be reused after supplementing copper ions, and the utilization rate is high; the prepared powder with the core-shell structure is in a nanometer scale, which is different from the micrometer level prepared by researchers before; the dispersibility is good, as shown in the overall scanning diagram of the copper-clad tungsten carbide in fig. 3a, the coating is uniform, as shown in the scanning diagram of the copper-clad tungsten carbide in fig. 3 b.
The invention relates to a method for preparing nano copper-coated tungsten carbide powder by utilizing pulse power supply electrodeposition. The copper-coated tungsten carbide core-shell structure powder has the advantages of high conductivity, high strength, high softening temperature and the like, and has wide application prospects in the fields of heat dissipation substrates of electronic devices, vacuum equipment, vertical target heat dissipation fins of thermal nuclear experimental reactor (ITER) divertors and the like. And (3) carrying out intermittent pulse electrodeposition on the tungsten carbide powder after the pickling in the prepared plating solution by using a pulse power supply to obtain the copper-clad tungsten carbide core-shell structure powder with small particle size, good cladding property and good dispersibility.
Drawings
FIG. 1a scan of an un-pickled raw tungsten carbide powder;
FIG. 1b is a scanned tungsten carbide powder after acid pickling;
FIG. 2a scanned tungsten carbide powder prior to plating;
FIG. 2b is a scanned drawing of the tungsten carbide powder coated with copper after the plating is finished;
FIG. 2c is a schematic view of a copper-clad tungsten carbide powder after the completion of plating;
FIG. 2d, e, f are scanning graphs of the surface change of the tungsten carbide powder with the plating time;
FIG. 3a is a scanning image of the whole copper-clad tungsten carbide;
FIG. 3b is a copper-clad tungsten carbide overlay;
FIG. 3c, d, e are area diagrams of each element (W, C, Cu) of copper-clad tungsten carbide;
FIG. 4a transmission diagram of copper clad tungsten carbide;
FIGS. 4b, C, d are sectional views of Cu, W, C in copper-clad tungsten carbide;
FIG. 5a is a scanned graph of the overall effect of copper-clad tungsten carbide;
FIG. 5b is a cross-sectional view of the overall effect of copper-clad tungsten carbide;
FIGS. 5c, e, d are the respective area scan profiles of element W, C, Cu;
FIG. 6a is a full area view of the distribution of elements;
FIGS. 6b, C and d are the surface views of Cu, W and C.
Detailed Description
The features of the present invention are further described below by way of examples, but the present invention is not limited to the following examples.
Example 1
Firstly, 10g of tungsten carbide powder is weighed, 20% nitric acid etching treatment is carried out on the tungsten carbide powder, and the tungsten carbide powder is centrifugally cleaned and dried for later use. The bath composition is shown in Table 1. Prepared with 350ml of plating solution, the specific components are shown in Table 2
TABLE 1 example 1 electroplating bath composition
Placing the acid-washed and dried powder into a plating solution, wherein the anode is a copper sheet, the cathode is a niobium plate, mechanically stirring and ultrasonically vibrating (simultaneously) for 3min, standing for 3min, and electroplating with a pulse power supply, wherein the pulse width is 1ms, the pulse period is 11ms, and the current density is 4A/dm2The plating time was 2min, after which the process was repeated 6 times. The effective electroplating time is 12min, standing for 30s, pouring out supernatant, centrifugally cleaning bottom liquid, and drying to obtain copper-coated tungsten carbide powder. Small particle size, good coating effect, and good dispersion effect, as shown in the scanned graph of tungsten carbide powder coated with copper after the coating in fig. 2b and the scanned graph of tungsten carbide surface coated for 12min in fig. 2 f.
Example 2
Firstly, 20g of tungsten carbide powder is weighed, acid-washed and etched by 30ml/L of HF, and then electroplated. 700ml of plating solution is prepared, and the components of the prepared solution are as shown in the table 1. Placing the acid-washed and dried powder into a plating solution, wherein the anode is a copper sheet, the cathode is a niobium plate, firstly carrying out mechanical stirring and ultrasonic vibration (simultaneously) for 5min, then standing for 5min, and electroplating by using a pulse power supply, wherein the pulse width is 5ms, the pulse period is 15ms, and the current density is 5A/dm2The plating time was 3min, after which the process was repeated 6 times. The effective electroplating time is 18min, standing for 30s, pouring out supernatant, centrifugally cleaning bottom liquid, and drying to obtain copper-coated tungsten carbide powder. The particle size is small, the coating effect is good, and the dispersion effect is good, as shown in fig. 3. FIG. 3a is an overall scanning chart of copper-clad tungsten carbide, which shows that the dispersion effect is good; the good coating effect is seen in the scanning of the copper-clad tungsten carbide surface in fig. 3b, and the uniform and complete coating is further illustrated in the scanning of each element (W, C, Cu) of the copper-clad tungsten carbide surface in fig. 3c, d and e.
Example 3
Firstly, 10g of tungsten carbide powder is weighed, and the tungsten carbide powder is subjected to 20% nitric acid etching treatment. The bath composition is shown in Table 2.
Table 2 example 3 bath composition
Preparing 350ml of plating solution, putting the powder after acid cleaning and drying into the plating solution, wherein the anode is a copper sheet, the cathode is a niobium sheet, firstly carrying out mechanical stirring and ultrasonic vibration (simultaneously) for 3min, then standing for 3.5min, electroplating by using a pulse power supply, the pulse width is 1ms, the pulse period is 11ms, and the current density is 10A/dm2The plating time was 2min, after which the process was repeated 6 times. The effective electroplating time is 12min, standing for 30s, pouring out supernatant, centrifugally cleaning bottom liquid, and drying to obtain copper-coated tungsten carbide powder. As shown in fig. 4a, the transmission diagram of copper-coated tungsten carbide shows that the coating is complete and uniform, and fig. 4b, C, d are sectional views of Cu, W, C in the copper-coated tungsten carbide.
Example 4
Firstly, 10g of tungsten carbide powder is weighed, and 20% nitric acid etching treatment is carried out on the tungsten carbide powder. The bath composition is shown in Table 4.
Table 3 example 4 bath composition
Preparing 350ml of plating solution, putting the powder after acid cleaning and drying into the plating solution, wherein the anode is a copper sheet, the cathode is a niobium sheet, firstly carrying out mechanical stirring and ultrasonic vibration (simultaneously) for 3min, then standing for 3.5min, electroplating by using a pulse power supply, the pulse width is 1ms, the pulse period is 11ms, and the current density is 4.3A/dm2The plating time was 2min, after which the process was repeated 6 times. The effective electroplating time is 12min, standing for 30s, pouring out supernatant, centrifugally cleaning bottom liquid, and drying to obtain copper-coated tungsten carbide powder. The dispersion effect is good, as shown in figure 5a, a scanning diagram of the overall effect of copper-clad tungsten carbide; the particle size is small, the coating effect is good, as shown in the overall effect surface scanning diagram of the copper-coated tungsten carbide in fig. 5b, fig. 5c, e and d are surface scanning distribution diagrams of element W, C, Cu, and further show the coating uniformity and integrity.
Example 5
Firstly, 50g of tungsten carbide powder is weighed, the tungsten carbide powder is subjected to 20% nitric acid etching treatment, and the tungsten carbide powder is centrifugally cleaned and dried for later use. The bath composition is shown in Table 1. Prepared with 1800ml of plating solution, the specific components are shown in Table 4
TABLE 4 example 5 electroplating bath composition
Placing the acid-washed and dried powder into a plating solution, wherein the anode is a copper sheet, the cathode is a niobium plate, mechanically stirring and ultrasonically vibrating (simultaneously) for 10min, standing for 10min, and electroplating with a pulse power supply, wherein the pulse width is 10ms, the pulse period is 20ms, and the current density is 5A/dm2The plating time was 2min, after which the process was repeated 10 times. The effective electroplating time is 20min, standing for 30s, pouring out supernatant, centrifugally cleaning bottom liquid, and drying to obtain copper-coated tungsten carbide powder. Small grain size, good coating effect and good dispersion effect. As shown in fig. 6, fig. 6a is a whole surface scanning diagram of the distribution of each element, the white place is the place where tungsten carbide and nano-copper exist at the same time, the black place is nano-crystalline copper, and the coating is complete; fig. 6b is a surface scanning view of Cu, showing that Cu is uniformly distributed, and fig. 6c and d are surface scanning distribution diagrams of W, C, which are uniformly distributed but have a smaller area than the copper distribution area, and further illustrate that the copper coating effect is better.
Claims (5)
1. A method for preparing nano-copper-coated tungsten carbide core-shell structure powder by using a pulse electrodeposition method is characterized by comprising the following steps:
1) firstly, carrying out acid washing and etching on original tungsten carbide powder in acid, and cleaning and drying the tungsten carbide powder for later use;
2) carrying out intermittent nano-copper electroplating on the tungsten carbide powder subjected to acid cleaning in the prepared electroplating solution by using a pulse power supply;
3) and centrifugally cleaning and drying the powder to obtain the nano-scale tungsten carbide powder coated with copper, which has good dispersibility and good coating property.
2. The method as set forth in claim 1, wherein the composition and content per liter of plating solution in step 2) are as follows:
3. the method according to claim 1, wherein the electroplating in step 2) is performed by using a pulse power supply with a pulse width of 1 to 10ms, a pulse period of 11 to 20ms, and a current density of 4 to 10A/dm2。
4. The method as claimed in claim 1, wherein the step 2) of intermittent electroplating is that the cathode of the plating bath is at the bottom during electroplating, the cathode is a conductive acid and alkali resistant niobium plate, and the anode is a copper sheet; firstly, stirring for 3-10 min, wherein the stirring is carried out simultaneously by mechanical stirring and ultrasonic stirring; standing and settling for 3-10 min to enable the tungsten carbide powder after stirring to settle to the bottom niobium plate; electroplating is then performed, which is a cycle.
5. The method of claim 1, wherein the acid etching is performed with a strong acid of nitric acid or hydrofluoric acid.
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| CN112708794A (en) * | 2021-03-29 | 2021-04-27 | 陕西斯瑞新材料股份有限公司 | Method for preparing copper-tungsten alloy by adopting superfine tungsten powder |
| CN113084186A (en) * | 2021-03-30 | 2021-07-09 | 武汉大学 | Flower-shaped copper particle and preparation method thereof |
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| CN113084186A (en) * | 2021-03-30 | 2021-07-09 | 武汉大学 | Flower-shaped copper particle and preparation method thereof |
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