CN114828428A - Electrolytic etching process of circuit board - Google Patents

Electrolytic etching process of circuit board Download PDF

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Publication number
CN114828428A
CN114828428A CN202210300268.1A CN202210300268A CN114828428A CN 114828428 A CN114828428 A CN 114828428A CN 202210300268 A CN202210300268 A CN 202210300268A CN 114828428 A CN114828428 A CN 114828428A
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China
Prior art keywords
circuit board
etching
layer
etching process
circuit
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CN202210300268.1A
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Chinese (zh)
Inventor
曾松
李传明
胡德忠
郭世永
秦衎
陈崚嵘
张华弟
张齐冬
段景彬
王涛
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Guangde Xinsanlian Electronics Co ltd
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Guangde Xinsanlian Electronics Co ltd
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Priority to CN202210300268.1A priority Critical patent/CN114828428A/en
Publication of CN114828428A publication Critical patent/CN114828428A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

An electrolytic etching process of a circuit board, comprising the steps of: s1, coating a layer of dielectric material on at least one side surface of the carrier material, and drying and curing to form a dielectric layer to obtain a composite board; s2, depositing copper on the surface of the dielectric layer of the composite board and then electroplating a layer of copper alloy to obtain a circuit substrate; s3, attaching a dry film to the surface of the copper alloy of the circuit substrate, and exposing and developing to obtain a film-coated plate; s4, placing the film-coated plate in an electrolytic cell for anode electrolysis to obtain a primary etched plate; s5, soaking the primary etching plate in an etching solution to form a fine etching plate; and S6, removing the dry film to obtain the circuit board. The invention provides an electrolytic etching process of a circuit board. According to the invention, the electroplated copper alloy is used as the circuit layer of the circuit board, so that the etching difficulty of the circuit layer is improved to a certain extent, the corrosion to the side edge of the circuit line on the circuit board is reduced, and the etching precision of the circuit board is improved.

Description

Electrolytic etching process of circuit board
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to an electrolytic etching process of a circuit board.
Background
The circuit board is an indispensable part in an electronic product or electrical equipment, along with electron, the development of electrical technology, people also more and more high to the requirement of circuit board, especially along with LED is as lighting device, walk into people's life back, it is also more and more high to the heat dispersion requirement of circuit board, at present, some circuit boards that need high heat dispersion all adopt aluminium base circuit board, it is equipped with one deck heat-conducting glue on aluminum plate, can play the effect of heat conduction on the one hand, on the other hand has insulating effect, adhere to one deck copper film circuit board circuit on heat-conducting glue, but the heat conductivility of heat-conducting glue is not very good, thereby can influence the heat conductivility of whole circuit board. Along with the circuit board in the etching process, because the etching liquid corrodes the circuit layer and all takes place in each direction of conducting wire, can continue to corrode the side of circuit, seriously reduced the precision of circuit board etching.
For example, chinese patent application No. CN201610790296.0 discloses an etching method for a thick copper circuit board, which includes the following steps: providing an etching production line, a thick copper circuit board, a turnover device and a return device, wherein the etching production line comprises a film stripping station, an etching station and a tin stripping station; the thick copper circuit board is arranged with one side facing upwards and the other side facing downwards and is horizontally conveyed along the etching production line; the turnover device is arranged on the etching production line, and the return device is used for reversely conveying the thick copper circuit board along the etching production line; removing a film of the thick copper circuit board, removing a dry film on the surface of the thick copper circuit board by using a film removing liquid, and exposing a copper surface which is not processed by a circuit; the first etching, the thick copper circuit board is transmitted in the etching station, and the simultaneous etching of the upper surface and the lower surface is completed; turning and returning, namely after the thick copper circuit board is conveyed to an outlet of the etching station, turning the thick copper circuit board by 180 degrees by the turning device, and returning the thick copper circuit board to an inlet of the etching station by the returning device; etching for the second time, wherein the turned thick copper circuit board passes through the etching station again to complete simultaneous etching of the upper surface and the lower surface; and (3) stripping tin of the thick copper circuit board, wherein the thick copper circuit board enters a tin stripping station to carry out a tin stripping process after being conveyed to an outlet of the etching station. The technical problem exists in the preparation process of the circuit board, circuit lines required to be reserved on the circuit board can be corroded by etching liquid to remove the side edges, and the etching precision of the circuit board is reduced.
Disclosure of Invention
In order to solve the technical problem, the invention provides an electrolytic etching process of a circuit board. According to the invention, the electroplated copper alloy is used as the circuit layer of the circuit board, so that the etching difficulty of the circuit layer is improved to a certain extent, the corrosion to the side edge of the circuit line on the circuit board is reduced, and the etching precision of the circuit board is improved.
The invention specifically comprises the following contents:
an electrolytic etching process of a circuit board, comprising the steps of:
s1, coating a layer of dielectric material on at least one side surface of the carrier material, and drying and curing to form a dielectric layer to obtain a composite board;
s2, depositing copper on the surface of the dielectric layer of the composite board and then electroplating a layer of copper alloy to obtain a circuit substrate;
s3, attaching a dry film to the surface of the copper alloy of the circuit substrate, and exposing and developing to obtain a film-coated plate;
s4, placing the film-coated plate in an electrolytic cell for anode electrolysis to obtain a primary etched plate;
s5, soaking the primary etching plate in an etching solution to form a fine etching plate;
and S6, removing the dry film to obtain the circuit board.
In the prior art, a copper foil is attached to the surface of a carrier plate, then exposure, development and etching are carried out, and then an anti-corrosion film is removed to obtain a circuit board, wherein the circuit board is inevitably subjected to side etching of a conductive circuit in the preparation process, and the side etching can usually cause the circuit with a rectangular cross section to be corroded into the conductive circuit with a trapezoidal cross section; there is also a possibility that a groove is etched on the side surface of the conductive circuit, and a side etching protruding edge is formed on the upper side of the groove.
In the technical scheme of the invention, a layer of copper alloy is electroplated on the surface of a dielectric layer to be used as a conductive layer, and then a circuit board finished product is obtained through the steps of film pasting, exposure, development, etching and the like; in the conducting layer of the circuit board, a certain amount of other metal elements are contained and are more difficult to etch, so that anodic etching is carried out in an electrolytic cell to remove most unnecessary copper alloy, then part of the copper alloy is removed through chemical etching and part of deposited copper is removed, and thus, in the second process, the conducting circuit can be prevented from being subjected to transitional corrosion in the chemical etching process, particularly corrosion occurring on the side face of the conducting circuit; because the copper alloy is more corrosion-resistant, more time is needed in the chemical etching, and the etching state is more convenient to operate and control due to long time; the electrochemical etching and the chemical etching are combined for use, so that the side etching caused by the excessively fast etching speed of electrochemistry is avoided, and the low efficiency caused by the excessively slow etching speed of the chemical etching is also avoided.
Preferably, in step S2, the copper alloy at least contains one non-copper metal, and the non-copper metal is selected from one or more of tin and zinc.
Preferably, in step S2, the copper alloy at least contains one non-copper metal, and the non-copper metal is selected from one or more of tin and zinc.
Preferably, in step S2, the electroplating solution in the electroplating process includes sodium cyanide, cuprous cyanide, sodium stannate, and sodium hydroxide; the cyanide ions and the cuprous ions are coordinated, the hydroxide ions and the tetravalent tin ions are coordinated, the deposition potentials of the cyanide ions and the cuprous ions are controlled to be close, and the deposition of the alloy is facilitated.
Preferably, in step S2, the content of cuprous cyanide is 30-50 g/L and the content of sodium stannate is 5-15 g/L.
Preferably, in the step S2, the pH of the plating solution is 11 to 12.
Preferably, in step S2, the current density of the cathode is 9-11A/dm 2 。
Preferably, in step S2, the plating time is 1.5 to 2.5 hours.
Preferably, in the step S2, after electroplating for 1 hour, sodium stannate is supplemented to the electroplating solution to make the content of sodium stannate reach 20-30 g/l; in the technical scheme, in the electroplating process, the content of tin in the electroplated alloy coating is controlled by adding a proper amount of sodium stannate into an electroplating solution, so that different parts of an electroplated alloy layer have certain difference, specifically, the content of tin in the inner layer alloy which is plated firstly is lower, and the surface layer alloy which is plated later contains more tin; when the surface alloy is chemically etched in step S5, the surface alloy has better corrosion resistance, and compared to the surface alloy, the inner alloy is more easily corroded, and the side of the circuit line etched when the inner alloy is corroded is not easily corroded, thereby improving the accuracy of etching the circuit board on the surface.
Preferably, in step S1, the carrier material is selected from one of polyimide film, glass fiber cloth or polyvinylidene fluoride film.
Preferably, in step S1, the dielectric material includes a polymer resin, a curing agent, and a filler; the polymer resin is any one of epoxy resin, polyimide resin or phenolic resin or a mixture of at least two of the epoxy resin, the polyimide resin or the phenolic resin; the curing agent is any one of diamine, dianhydride or phenol resin or a mixture of at least two of the diamine, the dianhydride or the phenol resin; the filler is ceramic filler; the ceramic filler has good heat conduction and heat dissipation effects.
In conclusion, the beneficial effects of the invention are as follows:
1. electroplating a layer of copper alloy on the surface of a dielectric layer to serve as a conducting layer, and then carrying out film pasting, exposure, development, etching and other steps to obtain a finished product of the circuit board; the conducting layer of the circuit board is copper alloy, contains a certain amount of other metal elements and is more difficult to etch, so that anode etching is carried out in an electrolytic cell to remove most of unnecessary copper alloy, then part of copper alloy is removed and part of copper is deposited through chemical corrosion, and thus, the conducting circuit is prevented from being excessively corroded in the chemical etching process in the second chemical etching process, particularly the corrosion occurring on the side face of the conducting circuit;
2. the electrochemical etching and the chemical etching are combined for use, so that the side etching caused by the excessively high etching speed of the electrochemistry is avoided, and the low efficiency caused by the excessively low etching speed of the chemical etching is also avoided;
3. in the electroplating process, the content of tin in the electroplated alloy coating is controlled by adding a proper amount of sodium stannate into an electroplating solution, so that different parts of an electroplated alloy layer have certain difference, specifically, the content of tin in the plated inner layer alloy is lower, and the plated surface layer alloy contains more tin; when the surface alloy is chemically etched in step S5, the surface alloy has better corrosion resistance, and compared to the surface alloy, the inner alloy is more easily corroded, and the side of the circuit line etched when the inner alloy is corroded is not easily corroded, thereby improving the accuracy of etching the circuit board on the surface.
Drawings
FIG. 1 is a schematic diagram of an undercut.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
An electrolytic etching process of a circuit board, comprising the steps of:
s1, coating a layer of dielectric material on the surface of one side of the glass fiber cloth, drying and curing to form a dielectric layer, and obtaining the composite board;
s2, depositing copper on the surface of the dielectric layer of the composite board, and then electroplating a layer of copper-tin alloy to obtain a circuit substrate;
s3, attaching a dry film to the surface of the copper alloy of the circuit substrate, and exposing and developing to obtain a film-coated plate;
s4, placing the film-coated plate in an electrolytic cell for anode electrolysis to obtain a primary etched plate;
s5, soaking the primary etching plate in etching solution to form a fine etching plate;
s6, removing the dry film to obtain a circuit board;
wherein the dielectric material comprises a polymer resin, a curing agent and a filler; the polymer resin is any one of epoxy resin, polyimide resin or phenolic resin or a mixture of at least two of the epoxy resin, the polyimide resin or the phenolic resin; the curing agent is any one of diamine, dianhydride or phenol resin or a mixture of at least two of the diamine, the dianhydride or the phenol resin; the filler is a high thermal conductivity ceramic filler.
In the technical scheme of the invention, a layer of copper alloy is electroplated on the surface of a dielectric layer to be used as a conductive layer, and then a circuit board finished product is obtained through the steps of film pasting, exposure, development, etching and the like; in the conducting layer of the circuit board, a certain amount of other metal elements are contained and are more difficult to etch, so that the anode etching is carried out in an electrolytic cell to remove most of unnecessary copper alloy, then part of the copper alloy is removed through chemical corrosion and part of deposited copper is removed, and thus, in the second process, the conductive circuit can be prevented from being subjected to transitional corrosion in the chemical etching process, particularly corrosion occurring on the side face of the conductive circuit; because the copper alloy is more corrosion-resistant, more time is needed in the chemical etching, and the etching state is more convenient to operate and control due to long time; the electrochemical etching and the chemical etching are combined for use, so that the side etching caused by the excessively fast etching speed of electrochemistry is avoided, and the low efficiency caused by the excessively slow etching speed of the chemical etching is also avoided.
In step S2, the plating solution in the plating process includes sodium cyanide, cuprous cyanide, sodium stannate, and sodium hydroxide.
In step S2, the content of the cuprous cyanide is 50g/L, and the content of the sodium stannate is 15 g/L.
In step S2, the plating solution has a pH of 11.
In step S2, the current density of the cathode is 10.2-10.3A/dm 2 during the electroplating process.
In step S2, the plating time is 2 hours.
In step S2, after electroplating for 1h, supplementing sodium stannate into the electroplating solution to make the content of sodium stannate reach 30 g/l; in the technical scheme, in the electroplating process, the content of tin in the electroplated alloy coating is controlled by adding a proper amount of sodium stannate into an electroplating solution, so that different parts of an electroplated alloy layer have certain difference, specifically, the content of tin in the inner layer alloy which is plated firstly is lower, and the surface layer alloy which is plated later contains more tin; when the surface alloy is chemically etched in step S5, the surface alloy has better corrosion resistance, and compared to the surface alloy, the inner alloy is more easily corroded, and the side of the circuit line etched when the inner alloy is corroded is not easily corroded, thereby improving the accuracy of etching the circuit board on the surface.
Example 2
An electrolytic etching process of a circuit board, comprising the steps of:
s1, coating a layer of dielectric material on the two side surfaces of the glass fiber cloth respectively, and drying and curing to form a dielectric layer to obtain a composite board;
s2, depositing copper on the surface of the dielectric layer of the composite board, and then electroplating a layer of copper-tin alloy to obtain a circuit substrate;
s3, attaching a dry film to the surface of the copper alloy of the circuit substrate, and exposing and developing to obtain a film-coated plate;
s4, placing the film-coated plate in an electrolytic cell for anode electrolysis to obtain a primary etched plate;
s5, soaking the primary etching plate in an etching solution to form a fine etching plate;
s6, removing the dry film to obtain a double-layer circuit board;
wherein the dielectric material comprises a polymer resin, a curing agent and a filler; the polymer resin is any one of epoxy resin, polyimide resin or phenolic resin or a mixture of at least two of the epoxy resin, the polyimide resin or the phenolic resin; the curing agent is any one of diamine, dianhydride or phenol resin or a mixture of at least two of the diamine, the dianhydride or the phenol resin; the filler is a high thermal conductivity ceramic filler.
In the technical scheme of the invention, a layer of copper alloy is electroplated on the surface of a dielectric layer to be used as a conductive layer, and then a circuit board finished product is obtained through the steps of film pasting, exposure, development, etching and the like; in the conducting layer of the circuit board, a certain amount of other metal elements are contained and are more difficult to etch, so that the anode etching is carried out in an electrolytic cell to remove most of unnecessary copper alloy, then part of the copper alloy is removed through chemical corrosion and part of deposited copper is removed, and thus, in the second process, the conductive circuit can be prevented from being subjected to transitional corrosion in the chemical etching process, particularly corrosion occurring on the side face of the conductive circuit; because the copper alloy is more corrosion-resistant, more time is needed in the chemical etching, and the etching state is more convenient to operate and control due to long time; the electrochemical etching and the chemical etching are combined for use, so that the side etching caused by the excessively fast etching speed of electrochemistry is avoided, and the low efficiency caused by the excessively slow etching speed of the chemical etching is also avoided.
In step S2, the plating solution in the plating process includes sodium cyanide, cuprous cyanide, sodium stannate, and sodium hydroxide.
In step S2, the content of the cuprous cyanide is 50g/L, and the content of the sodium stannate is 15 g/L.
In step S2, the plating solution has a pH of 11.
In step S2, the current density of the cathode is 10.2-10.3A/dm 2 。
In step S2, the plating time is 2 hours.
In step S2, after electroplating for 1h, supplementing sodium stannate into the electroplating solution to make the content of sodium stannate reach 30 g/l; in the technical scheme, in the electroplating process, the content of tin in the electroplated alloy coating is controlled by adding a proper amount of sodium stannate into an electroplating solution, so that different parts of an electroplated alloy layer have certain difference, specifically, the content of tin in the inner layer alloy which is plated firstly is lower, and the surface layer alloy which is plated later contains more tin; when the surface alloy is chemically etched in step S5, the surface alloy has better corrosion resistance, and compared to the surface alloy, the inner alloy is more easily corroded, and the side of the circuit line etched when the inner alloy is corroded is not easily corroded, thereby improving the accuracy of etching the circuit board on the surface.
Comparative example
An electrolytic etching process of a circuit board, comprising the steps of:
s1, coating a layer of dielectric material on the surface of one side of the glass fiber cloth, drying and curing to form a dielectric layer, and obtaining the composite board;
s2, performing copper deposition on the surface of the dielectric layer of the composite board and then electroplating copper to obtain a circuit substrate;
s3, attaching a dry film to the surface of the copper alloy of the circuit substrate, and exposing and developing to obtain a film-coated plate;
s4, placing the film-coated plate in an electrolytic cell for anode electrolysis to obtain a primary etched plate;
s5, soaking the primary etching plate in an etching solution to form a fine etching plate;
s6, removing the dry film to obtain a circuit board;
wherein the dielectric material comprises a polymer resin, a curing agent and a filler; the polymer resin is any one of epoxy resin, polyimide resin or phenolic resin or a mixture of at least two of the epoxy resin, the polyimide resin and the phenolic resin; the curing agent is any one of diamine, dianhydride or phenol resin or a mixture of at least two of the diamine, the dianhydride or the phenol resin; the filler is a high thermal conductivity ceramic filler.
For examples 1-2 and comparative examples, the inventors performed the following experiments:
measurement of etching factor: as shown in fig. 1, the etching solution not only corrodes downward but also acts in both right and left directions during etching, so that side etching is unavoidable. Where we reflect the size of the undercut by the etch factor, the undercut factor = undercut width/etch depth. The smaller the etching factor, the better the etching effect and the better the impedance control. The test results were as follows:
Figure DEST_PATH_IMAGE001
as can be seen from the above table, the etching production by the method of the present invention can significantly reduce the side etching of the conductive circuit during the etching process by the etching solution.
The foregoing merely represents preferred embodiments of the invention, which are described in some detail and detail, and therefore should not be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, various changes, modifications and substitutions can be made without departing from the spirit of the present invention, and these are all within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An electrolytic etching process of a circuit board, comprising the steps of:
s1, coating a layer of dielectric material on at least one side surface of the carrier material, and drying and curing to form a dielectric layer to obtain a composite board;
s2, depositing copper on the surface of the dielectric layer of the composite board and then electroplating a layer of copper alloy to obtain a circuit substrate;
s3, attaching a dry film on the copper alloy surface of the circuit substrate, and exposing and developing to obtain a film-coated plate;
s4, placing the film-coated plate in an electrolytic cell for anode electrolysis to obtain a primary etched plate;
s5, soaking the primary etching plate in an etching solution to form a fine etching plate;
and S6, removing the dry film to obtain the circuit board.
2. The process of claim 1, wherein in step S2, the copper alloy contains at least one non-copper metal selected from one or more of tin and zinc.
3. The electrolytic etching process for a circuit board according to claim 2, wherein in step S2, the plating solution in the plating process comprises nacn, cuprous cyanide, sodium stannate and naoh.
4. The electrolytic etching process for a circuit board according to claim 3, wherein in step S2, the content of cuprous cyanide is 30-50 g/L, and the content of sodium stannate is 5-15 g/L.
5. The electrolytic etching process for a circuit board according to claim 3, wherein in step S2, the pH of the plating solution is 11-12.
6. The electrolytic etching process for a circuit board according to claim 3, wherein in step S2, the current density of the cathode during electroplating is 9 to 11A/dm 2 。
7. The electrolytic etching process for circuit board according to claim 3, wherein in step S2, the plating time is 1.5-2.5 h.
8. The electrolytic etching process of a circuit board according to claim 7, wherein in step S2, after electroplating for 1 hour, sodium stannate is supplemented to the electroplating solution to make the content of sodium stannate reach 20-30 g/l.
9. The process of claim 1, wherein in step S1, the carrier material is selected from one of polyimide film, glass fiber cloth or polyvinylidene fluoride film.
10. The electrolytic etching process of a circuit board according to claim 1, wherein in step S1, the dielectric material contains a polymer resin, a curing agent and a filler; the polymer resin is any one of epoxy resin, polyimide resin or phenolic resin or a mixture of at least two of the epoxy resin, the polyimide resin or the phenolic resin; the curing agent is any one of diamine, dianhydride or phenol resin or a mixture of at least two of the diamine, the dianhydride or the phenol resin; the filler is ceramic filler.
CN202210300268.1A 2022-03-25 2022-03-25 Electrolytic etching process of circuit board Pending CN114828428A (en)

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Publications (1)

Publication Number Publication Date
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