CN108493089A - Flow distributor and dry etching apparatus - Google Patents
Flow distributor and dry etching apparatus Download PDFInfo
- Publication number
- CN108493089A CN108493089A CN201810503257.7A CN201810503257A CN108493089A CN 108493089 A CN108493089 A CN 108493089A CN 201810503257 A CN201810503257 A CN 201810503257A CN 108493089 A CN108493089 A CN 108493089A
- Authority
- CN
- China
- Prior art keywords
- air valve
- gas
- valve blade
- blade
- flow distributor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Abstract
A kind of flow distributor of present invention offer and dry etching apparatus.The flow distributor of the present invention, by the way that air valve blade is arranged in the gas piping above each upper sky plate stomata, and the open degree of the air valve blade is adjusted by the way that drive component drives corresponding air valve blade to rotate, and then control the output gas flow of gas of corresponding gas piping, it can realize the accuracy and high efficiency of process gas distribution, the open degree of each region air valve blade can be effectively controlled by computer unit, plasma is uniformly distributed in the manufacture process cavity of realization dry etching apparatus, it is electrical to improve product, when needing to adjust process gas distribution, without being adjusted by maintenance engineering, save manpower and time cost that maintenance is brought, improve production efficiency, and then distribution of air flow can quickly be adjusted for different electrical requirements according to different product.
Description
Technical field
The present invention relates to the processing procedure field of display more particularly to a kind of flow distributors and dry etching apparatus.
Background technology
In display technology field, Thin Film Transistor-LCD (Thin Film Transistor Liquid
Crystal Display, TFT-LCD) there are many merits such as thin fuselage, power saving, radiationless, it is widely used, such as：
Mobile phone, personal digital assistant (PDA), digital camera, computer screen or notebook screens etc..
Liquid crystal display generally comprises shell, the liquid crystal display panel in shell and the backlight module in shell
(backlight module).The operation principle of liquid crystal display panel is that liquid crystal point is placed in the parallel glass substrate of two panels
Son, controls liquid crystal molecule and changes direction whether energization by glass substrate, the light refraction of backlight module is out generated picture
Face.
In the manufacturing process of above-mentioned TFT-LCD, especially in the manufacturing process of thin-film transistor array base-plate, etching technics
It is a most important figure transfer process step, especially etching polysilicon, is applied to the occasion of removal silicon.
Etching refers to selectively removing the mistake of unwanted material from material membrane surface using chemically or physically method
The purpose of journey, the basic technology of etching is correctly to copy mask pattern in the material membrane on piece of gluing, and etching is typically in light
Carry out after carving technology, it would be desirable to figure stay in material membrane on piece, etching can be referred to as final and most important figure
Shifting process step.
Dry etching is typically to be generated comprising charged particles such as ion, electronics and with height in the way of glow discharge
The plasma-based for spending chemically active neutral atom, molecule and free radical, to carry out the lithographic technique of pattern transfer, dry etching has
Good anisotropy line width control, dry etching is the main method of etched features under submicron-scale, is widely used in
In the microelectric techniques such as semiconductor or LCD front-end process.
In dry method etch technology, the Line-width precision and homogeneity of product are determined by process gas distribution
It is fixed；Process gas can be in high vacuum high-frequency electrical after entering inside processing procedure chamber (Process Chamber, PC) of dry etching board
Different plasma (Plasma) is formed under the conditions of pressure, and different distribution of air flow determines different Plasma distributions, leads to
Control distribution of air flow is crossed, homogeneity finally can be preferably etched, line width homogeneity will be optimized, to ensure product
High electrical requirements.
The processing procedure chamber of dry etching board is mainly made of top electrode portion, lower electrode portion and processing procedure cavity wall, top electrode portion, under
Plasma vacuum region of discharge is constituted between electrode portion and processing procedure cavity wall, wherein top electrode portion includes upper sky plate, in upper sky plate
It is even to be dispersed with multiple stomatas for reaction gas to be imported to processing procedure chamber.The method for realizing process gas distribution at present is to go up to the sky
Different stomata valves (GasNozzle) is set on plate, the throughput of different zones is determined by different stomata valves.Such as Fig. 1
Shown, reaction gas enters the closed area on 100 top of upper sky plate by pipeline, then via under stomata 110 and stomata 110
The stomata valve 200 of side enters in manufacture process cavity.As shown in Fig. 2, there are many types for existing stomata valve, main includes closing
Formula, monotrysian type and porous type, wherein porous type have including ditrysian type, four cellular types, Eight-hole type etc..Conventional method passes through different gas
Ports valve designs to realize the distribution of process gas, and to reach etching Line-width precision and homogeneity, Fig. 3 is that a kind of existing stomata valve is set
The schematic diagram of meter mode.
However, there are certain inherent shortcomings for above-described distribution of air flow pattern：1, it can not be realized not according to product
Same distribution of air flow；Different product may the different distribution of air flow of demand, but the said flow method of salary distribution can not direct control, nothing
Method realizes different distribution of air flow on different product；2, air-flow is cannot achieve accurately to distribute；3, it cannot achieve process gas
Efficiently adjustment；When demand changes distribution of air flow when process conditions change situations such as, (PM) mode can only be maintained by board and is carried out
Adjustment, but PM labor intensive time costs.
Invention content
The purpose of the present invention is to provide a kind of flow distributors, can realize accuracy, the height of process gas distribution
Different electrical requirements can quickly be adjusted distribution of air flow according to different product, avoid and adjusted by frequently maintaining by effect property
It is whole, improve production efficiency.
The present invention also aims to provide a kind of dry etching apparatus, using said flow distributor, system can be realized
Accuracy, the high efficiency of journey distribution of air flow can quickly adjust distribution of air flow for different electrical requirements according to different product, avoid
It is adjusted by frequently maintaining, improves production efficiency.
To achieve the above object, the present invention provides a kind of flow distributor, including upper sky plate, is evenly distributed on sky plate
On multiple stomatas, respectively and multiple gas pipings of connection corresponding with the multiple stomata, be respectively arranged in upper sky plate
Multiple air valve blades in the multiple gas piping and the multiple air valve blade is driven to be rotated in gas piping respectively
Multigroup drive component；
In use, each gas piping passes through the outside output gas of corresponding stomata；Phase is driven by the driving component
It answers air valve blade to rotate and adjusts the open degree of the air valve blade, and then control the output gas flow of gas of corresponding gas piping.
Each drive component includes pedestal, blade rotation axis and power control system；Wherein, the pedestal and dynamic Control
System is fixed in the upper sky plate, and the blade rotation axis is mounted on pedestal and across corresponding gas piping and air valve blade
Connection, the power control system makes air valve blade be rotated by blade rotation axis, to control air valve blade open degree.
Each drive component further includes driving wheel, driven wheel and driving shaft, and the power control system passes through the active
Axis connection driving wheel, the driving wheel connect with driven wheel and driven wheel are driven to rotate, and the driven wheel and blade rotation axis connect
It connects, the power control system controls driving wheel by driving shaft and rotates and be further driven to driven wheel, and driven wheel passes through blade
Rotation axis makes air valve blade be rotated, to control air valve blade open degree.
The power control system is connect by control circuit with computer unit, and the computer unit is by different telecommunications
Number the power control system is transferred to by control circuit to control the rotation of the blade rotation axis.
The pedestal is through corresponding gas piping and is fitted on the outer surface of the gas piping.
The power control system is stepping motor or servomotor.
The material of the air valve blade is anticorrosion material.
Include the processing procedure chamber for carrying out dry etching processing procedure, the processing procedure the present invention also provides a kind of dry etching apparatus
Intracavitary is provided with positioned at the top electrode portion at top；
The top electrode portion includes flow distributor as described above, and the gas piping of the flow distributor passes through
Corresponding stomata inputs reaction gas to processing procedure intracavitary.
The material of the upper sky plate is ceramic material.
The dry etching apparatus further includes the lower electrode positioned at processing procedure bottom of chamber portion opposite with the top electrode portion
Portion.
Beneficial effects of the present invention：The flow distributor of the present invention, passes through the gas above each upper sky plate stomata
Air valve blade is set in pipeline, and adjusts the unlatching of the air valve blade by the way that drive component drives corresponding air valve blade to rotate
Degree, and then the output gas flow of gas of corresponding gas piping is controlled, it can realize the accuracy and high efficiency of process gas distribution, it can
The open degree that each region air valve blade is effectively controlled by computer unit, realizes plasma in the manufacture process cavity of dry etching apparatus
Body is uniformly distributed, and improvement product is electrical, when needing to adjust process gas distribution, without being adjusted by maintenance engineering
It is whole, manpower and time cost that maintenance is brought are saved, improves production efficiency, and then can be according to different product for different electrical
Demand quickly adjusts distribution of air flow.The dry etching apparatus of the present invention can realize process gas using said flow distributor
The accuracy and high efficiency of distribution, without being adjusted by maintenance engineering, are saved when needing to adjust process gas distribution
The manpower and time cost that maintenance is brought improve production efficiency, and then can be fast for different electrical requirements according to different product
Velocity modulation section distribution of air flow.
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with the detailed of the present invention
Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
Description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the specific implementation mode to the present invention, technical scheme of the present invention will be made
And other advantageous effects are apparent.
In attached drawing,
Fig. 1 is the schematic diagram of distribution of air flow in existing dry etching processing procedure；
Fig. 2 is existing different types of stomata valve arrangement schematic diagram；
Fig. 3 is a kind of existing schematic diagram of stomata valve design method；
Fig. 4 is the floor map of flow distributor of the present invention；
Fig. 5 is the cross-sectional view of flow distributor of the present invention line A-A along Fig. 4；
Fig. 6 is the schematic diagram of air valve blade difference open degree state in flow distributor of the present invention；
Fig. 7 is the structural schematic diagram of the dry etching apparatus of the present invention.
Specific implementation mode
Further to illustrate the present invention technological means and its effect taken, below in conjunction with the embodiment of the present invention and
Its attached drawing is described in detail.
Fig. 4-5 is please referred to, present invention firstly provides a kind of flow distributor, including upper sky plate 10, is evenly distributed on
Multiple stomatas 11 in sky plate 10, in upper sky plate 10 and respectively multiple flues of connection corresponding with the multiple stomata 11
Road 20, the multiple air valve blades 30 being respectively arranged in the multiple gas piping 20 and the multiple air valve blade 30 is driven respectively
The multigroup drive component 40 rotated in gas piping 20；
In use, each gas piping 20 passes through 11 outside output gas of corresponding stomata；Pass through the driving component 40
It drives corresponding air valve blade 30 to rotate and adjusts the open degree of the air valve blade 30, and then control the output of corresponding gas piping 20
Gas flow.
Specifically, each drive component 40 includes pedestal 41, blade rotation axis 42 and power control system 43；Wherein, institute
It states pedestal 41 and power control system 43 is fixed in the upper sky plate 10, the blade rotation axis 42 is mounted on pedestal 41 simultaneously
It is connect with air valve blade 30 across corresponding gas piping 20, the power control system 43 makes air valve leaf by blade rotation axis 42
Piece 30 is rotated, to control 30 open degree of air valve blade.
Specifically, each drive component 40 further includes driving wheel 45, driven wheel 44 and driving shaft 46, the dynamic Control system
System 43 connects driving wheel 45 by the driving shaft 46, and the driving wheel 45 connect with driven wheel 44 and drives 44 turns of driven wheel
Dynamic, the driven wheel 44 and blade rotation axis 42 connect, and the power control system 43 controls driving wheel 45 by driving shaft 46
Driven wheel 44 is rotated and is further driven to, driven wheel 44 makes air valve blade 30 be rotated by blade rotation axis 42, to reach
To the effect of control 30 open degree of air valve blade.
Specifically, the power control system 43 is connect by control circuit 46 with computer unit 50, the computer
Different electrical signals are transferred to the power control system 43 to control the blade rotation axis by unit 50 by control circuit 46
42 rotation.
Specifically, in use, 30 open degree of air valve blade to be set in advance as to the arrange parameter of an interval range, such as
0-100, wherein open degree are that 0 to represent air valve blade 30 be full closing state, and open degree is that 100 to represent air valve blade 30 be standard-sized sheet
State is opened, as shown in fig. 6, air valve blade 30 divides by rotating the different open degree states realized, when needing adjustment process gas
Timing, without being adjusted by maintenance engineering, it is only necessary to be led to the electric signal of corresponding different parameters by computer unit 50
It crosses control circuit 46 and is transferred to the power control system 43 to control the rotation of the power control system 43, realize to air valve
The control of blade 30, and then control the output gas flow of gas of corresponding gas piping.
Specifically, the pedestal 41 runs through corresponding gas piping 20 and is fitted in the outer surface of the gas piping 20
On.
Specifically, the power control system 43 is stepping motor or servomotor.
Specifically, the material of the air valve blade 30 is anticorrosion material, such as ceramic material etc..
The flow distributor of the present invention, by the way that gas is arranged in the gas piping 20 above 10 stomata 11 of each upper sky plate
Valve blade 30, and the open degree of the air valve blade 30 is adjusted by the way that drive component 40 drives corresponding air valve blade 30 to rotate, into
And the output gas flow of gas of corresponding gas piping 20 is controlled, it can realize the accuracy and high efficiency of process gas distribution, can lead to
The open degree that computer unit 50 effectively controls each region air valve blade 30 is crossed, realizes the processing procedure intracavitary plasma of dry etching apparatus
Body is uniformly distributed, and improvement product is electrical, when needing to adjust process gas distribution, without being adjusted by maintenance engineering
It is whole, manpower and time cost that maintenance is brought are saved, improves production efficiency, and then can be according to different product for different electrical
Demand quickly adjusts distribution of air flow.
Referring to Fig. 7, based on above-mentioned flow distributor, the present invention provides a kind of dry etching apparatus, including be used for into
The processing procedure chamber 1 of row dry etching processing procedure is provided with positioned at the top electrode portion 2 at top and is powered on described in the processing procedure chamber 1
The opposite lower electrode portion 3 positioned at 1 bottom of processing procedure chamber in pole portion 2 is plasma between the top electrode portion 2, lower electrode portion 3
Body vacuum discharge area 5
The top electrode portion 2 includes flow distributor as described above, the gas piping 20 of the flow distributor
By corresponding stomata 11 reaction gas is inputted into processing procedure chamber 1.The particular technique feature of the flow distributor with it is above-mentioned
Embodiment is identical, and details are not described herein.
Specifically, the material of the upper sky plate 21 is ceramic material.
Specifically, the course of work of flow distributor is as follows in dry etching apparatus of the invention：
1, when off working state：Air valve blade 30 is in full closing state；
2, it works the incipient stage：Set the open degree parameter of air valve blade 30 in the digital section of such as 0-100, according to
Open degree parameter is transferred to computer unit 50 and is reconverted into corresponding electric signal and is transmitted to power control system by concrete condition
43；Power control system 43 is controlled the rotational angle of driving wheel 45 by the electric signal received, and drives driven wheel 45 and blade
Rotation axis 42 and the opening degree for controlling air valve blade 30；
3, work process stage：After dry etching processing procedure starts, process gas enters gas pipeline 20 by main pipeline, and
It is entered in processing procedure chamber 1 via air valve blade 30, the open degree of air valve blade 30 can effectively control gas flow here, to real
The gas flow of corresponding region in existing manufacture process cavity 1, and then can be obtained required plasma distribution, realize different product for
The demand of different distribution of air flow；
4, reset state：After processing procedure, it is extensive to control air valve blade 30 that computer control unit can provide 0 electric signal
Multiple full closing state.
The dry etching apparatus of the present invention, using said flow distributor, by above 10 stomata 11 of each upper sky plate
Gas piping 20 in setting air valve blade 30, and drive corresponding air valve blade 30 to rotate by drive component 40 by adjust the gas
The open degree of valve blade 30, and then the output gas flow of gas of corresponding gas piping 20 is controlled, it can realize process gas distribution
Accuracy and high efficiency can effectively control the open degree of each region air valve blade 30 by computer unit 50, realize dry etching
Plasma is uniformly distributed in 1 body of processing procedure chamber of equipment, and it is electrical to improve product, when needing to adjust process gas distribution, nothing
It need to be adjusted by maintenance engineering, save manpower and time cost that maintenance is brought.
In conclusion the flow distributor of the present invention, by being set in the gas piping above each upper sky plate stomata
Air valve blade is set, and drives corresponding air valve blade to rotate by drive component by adjusts the open degree of the air valve blade, and then is controlled
The output gas flow of gas of corresponding gas piping is made, the accuracy and high efficiency of process gas distribution can be realized, calculating can be passed through
Machine unit effectively controls the open degree of each region air valve blade, realizes the uniform of plasma in the manufacture process cavity of dry etching apparatus
Distribution, improvement product is electrical, when needing to adjust process gas distribution, without being adjusted by maintenance engineering, saves
The manpower and time cost brought is maintained, improves production efficiency, and then can be quick for different electrical requirements according to different product
Adjust distribution of air flow.The dry etching apparatus of the present invention can realize the essence of process gas distribution using said flow distributor
True property and high efficiency, without being adjusted by maintenance engineering, save maintenance band when needing to adjust process gas distribution
The manpower and time cost come improves production efficiency, and then can quickly adjust gas for different electrical requirements according to different product
Stream distribution.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding change and deformations are made in design, and all these change and distortions should all belong to the appended right of the present invention
It is required that protection domain.
Claims (10)
1. a kind of flow distributor, which is characterized in that including upper sky plate (10), be evenly distributed on it is multiple in upper sky plate (10)
Stomata (11), be set to upper sky plate (10) on and respectively multiple gas pipings (20) of connection corresponding with the multiple stomata (11),
Multiple air valve blades (30) for being respectively arranged in the multiple gas piping (20) and the multiple air valve blade is driven respectively
(30) the multigroup drive component (40) rotated in gas piping (20)；
In use, each gas piping (20) passes through corresponding stomata (11) outside output gas；Pass through the driving component
(40) the corresponding air valve blade (30) of drive rotates and adjusts the open degree of the air valve blade (30), and then controls corresponding gas piping
(20) output gas flow of gas.
2. flow distributor as described in claim 1, which is characterized in that each drive component (40) include pedestal (41),
Blade rotation axis (42) and power control system (43)；Wherein, the pedestal (41) and power control system (43) are fixed on institute
It states in sky plate (10), the blade rotation axis (42) is mounted on pedestal (41) and passes through corresponding gas piping (20) and air valve
Blade (30) connects, and the power control system (43) makes air valve blade (30) be rotated by blade rotation axis (42), from
And control air valve blade (30) open degree.
3. flow distributor as claimed in claim 2, which is characterized in that each drive component (40) further includes driving wheel
(45), driven wheel (44) and driving shaft (46), the power control system (43) connect driving wheel by the driving shaft (46)
(45), the driving wheel (45) connect with driven wheel (44) and driven wheel (44) is driven to rotate, the driven wheel (44) and blade
Rotation axis (42) connects, and the power control system (43) controls driving wheel (45) rotation and further band by driving shaft (46)
Dynamic driven wheel (44), driven wheel (44) makes air valve blade (30) be rotated by blade rotation axis (42), to control air valve
Blade (30) open degree.
4. flow distributor as claimed in claim 2, which is characterized in that the power control system (43) passes through control line
Road (46) is connect with computer unit (50), and the computer unit (50) transmits different electrical signals by control circuit (46)
To the power control system (43) to control the rotation of the blade rotation axis (42).
5. flow distributor as claimed in claim 2, which is characterized in that the pedestal (41) runs through corresponding gas piping
(20) it and is fitted on the outer surface of the gas piping (20).
6. flow distributor as claimed in claim 4, which is characterized in that the power control system (43) is that stepping is electronic
Machine or servomotor.
7. flow distributor as described in claim 1, which is characterized in that the material of the air valve blade (30) is anticorrosion
Material.
8. a kind of dry etching apparatus, which is characterized in that include the processing procedure chamber (1) for carrying out dry etching processing procedure, the processing procedure
It is provided with positioned at the top electrode portion (2) at top in chamber (1)；
The top electrode portion (2) includes the flow distributor as described in any one of claim 1-7, the distribution of air flow dress
The gas piping (20) set inputs reaction gas into processing procedure chamber (1) by corresponding stomata (11).
9. dry etching apparatus as claimed in claim 8, which is characterized in that the material of the upper sky plate (21) is ceramic material.
10. dry etching apparatus as claimed in claim 8, which is characterized in that further include the position opposite with the top electrode portion (2)
Lower electrode portion (3) in processing procedure chamber (1) bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810503257.7A CN108493089A (en) | 2018-05-23 | 2018-05-23 | Flow distributor and dry etching apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810503257.7A CN108493089A (en) | 2018-05-23 | 2018-05-23 | Flow distributor and dry etching apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108493089A true CN108493089A (en) | 2018-09-04 |
Family
ID=63351142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810503257.7A Pending CN108493089A (en) | 2018-05-23 | 2018-05-23 | Flow distributor and dry etching apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108493089A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211900A (en) * | 2019-05-31 | 2019-09-06 | 昆山国显光电有限公司 | A kind of sky plate and dry etching equipment |
| CN113113283A (en) * | 2021-04-08 | 2021-07-13 | 中国科学院光电技术研究所 | Plasma density distribution regulation and control method based on air inlet distribution control |
| TWI807341B (en) * | 2020-07-27 | 2023-07-01 | 大陸商中微半導體設備（上海）股份有限公司 | Plasma treatment device, airflow adjustment cover and airflow adjustment method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW481352U (en) * | 2000-12-29 | 2002-03-21 | Taiwan Semiconductor Mfg | Pressure control device of manufacturing chamber |
| CN1987953A (en) * | 2006-11-28 | 2007-06-27 | 杨再勇 | Automatic speed limiting method and device for motor vehicle |
| CN101167164A (en) * | 2005-04-26 | 2008-04-23 | 应用材料公司 | O-ringless tandem throttle valve for a plasma reactor chamber |
| TW201421579A (en) * | 2012-11-01 | 2014-06-01 | Advanced Micro Fab Equip Inc | Plasma reactor and manufacturing method of semiconductor substrate |
| CN105849446A (en) * | 2013-12-25 | 2016-08-10 | 爱三工业株式会社 | Double eccentric valve |
| JP2017201161A (en) * | 2016-05-06 | 2017-11-09 | 愛三工業株式会社 | Exhaust gas recirculation valve |
| CN107400879A (en) * | 2017-08-01 | 2017-11-28 | 成都天马微电子有限公司 | A kind of display panel film-forming apparatus and method |
| CN207246442U (en) * | 2017-09-11 | 2018-04-17 | 昆山浦元真空技术工程有限公司 | A kind of car lamp vacuum coating equipment pipeline throttle valve structure |
-
2018
- 2018-05-23 CN CN201810503257.7A patent/CN108493089A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW481352U (en) * | 2000-12-29 | 2002-03-21 | Taiwan Semiconductor Mfg | Pressure control device of manufacturing chamber |
| CN101167164A (en) * | 2005-04-26 | 2008-04-23 | 应用材料公司 | O-ringless tandem throttle valve for a plasma reactor chamber |
| CN1987953A (en) * | 2006-11-28 | 2007-06-27 | 杨再勇 | Automatic speed limiting method and device for motor vehicle |
| TW201421579A (en) * | 2012-11-01 | 2014-06-01 | Advanced Micro Fab Equip Inc | Plasma reactor and manufacturing method of semiconductor substrate |
| CN105849446A (en) * | 2013-12-25 | 2016-08-10 | 爱三工业株式会社 | Double eccentric valve |
| JP2017201161A (en) * | 2016-05-06 | 2017-11-09 | 愛三工業株式会社 | Exhaust gas recirculation valve |
| CN107400879A (en) * | 2017-08-01 | 2017-11-28 | 成都天马微电子有限公司 | A kind of display panel film-forming apparatus and method |
| CN207246442U (en) * | 2017-09-11 | 2018-04-17 | 昆山浦元真空技术工程有限公司 | A kind of car lamp vacuum coating equipment pipeline throttle valve structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211900A (en) * | 2019-05-31 | 2019-09-06 | 昆山国显光电有限公司 | A kind of sky plate and dry etching equipment |
| CN110211900B (en) * | 2019-05-31 | 2022-02-25 | 昆山国显光电有限公司 | Top board and dry etching equipment |
| TWI807341B (en) * | 2020-07-27 | 2023-07-01 | 大陸商中微半導體設備（上海）股份有限公司 | Plasma treatment device, airflow adjustment cover and airflow adjustment method thereof |
| CN113113283A (en) * | 2021-04-08 | 2021-07-13 | 中国科学院光电技术研究所 | Plasma density distribution regulation and control method based on air inlet distribution control |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108493089A (en) | Flow distributor and dry etching apparatus | |
| CN101620972B (en) | Plasma processing apparatus | |
| US8257501B2 (en) | Plasma doping device with gate shutter | |
| CN105605909B (en) | Substrate-cleaning method | |
| TWI586900B (en) | Shared gas panels, apparatus,and methods for supplying process gases in plasma processing systems | |
| CN106992136B (en) | Wet etching equipment and wet etching method | |
| TW202011498A (en) | Device of dynamically controlling gas circulation mode and wafer processing method and equipment dynamically adjusting pattern of plasma and state of free radical on wafer surfaces | |
| WO2015089933A1 (en) | Pecvd (plasma enhanced chemical vapor deposition) processing device and method for implementing pecvd processing on substrate | |
| US20200381220A1 (en) | Reaction chamber, dry etching machine and etching method | |
| CN104032283B (en) | A kind of control device of large-area flat-plate PECVD device reaction chamber pressure | |
| CN100443627C (en) | Off-axis sputtering control method for improving thickness uniformity of film | |
| CN104022006A (en) | Dry etching equipment and method thereof | |
| CN2775832Y (en) | Air inlet nozzle and its inductive coupling plasma device | |
| CN101345114B (en) | Inductance coupling coil and inductance coupling plasma apparatus using the same | |
| CN101930181B (en) | Proximity exposure apparatus, method for controlling substrate temperature and method of manufacturing panel substrate | |
| JPH0252428A (en) | Treatment apparatus | |
| CN102856167B (en) | Flexible base, board processing method and bearing substrate | |
| CN206481488U (en) | A kind of novel microwave plasma processing apparatus | |
| CN203346476U (en) | Single cavity coating equipment | |
| CN101989005B (en) | Structural substrate, conveying device and box pairing device | |
| JP2715134B2 (en) | Processing method | |
| TWM598519U (en) | Plasma power supply system | |
| US20130092083A1 (en) | Photoresist coater carrying system and photoresist coater having the same | |
| CN212722002U (en) | Laboratory is with wet electron chemistry article evaluation equipment of modularization fountain | |
| CN201121209Y (en) | Plasma chemistry vapor deposition apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180904 |
|
| RJ01 | Rejection of invention patent application after publication |