CN108456846A - 掩膜板及其制备方法 - Google Patents

掩膜板及其制备方法 Download PDF

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Publication number
CN108456846A
CN108456846A CN201810277643.9A CN201810277643A CN108456846A CN 108456846 A CN108456846 A CN 108456846A CN 201810277643 A CN201810277643 A CN 201810277643A CN 108456846 A CN108456846 A CN 108456846A
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CN
China
Prior art keywords
area
mask
region
auxiliary pixel
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810277643.9A
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English (en)
Chinese (zh)
Inventor
李伟丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Priority to CN202211563012.6A priority Critical patent/CN116024523A/zh
Priority to CN201810277643.9A priority patent/CN108456846A/zh
Priority to KR1020207005442A priority patent/KR20200028483A/ko
Priority to EP18912788.9A priority patent/EP3640365A4/en
Priority to JP2020501465A priority patent/JP6977140B2/ja
Priority to PCT/CN2018/101549 priority patent/WO2019184205A1/zh
Publication of CN108456846A publication Critical patent/CN108456846A/zh
Priority to TW107131963A priority patent/TWI726240B/zh
Priority to US16/524,190 priority patent/US20190345599A1/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201810277643.9A 2018-03-30 2018-03-30 掩膜板及其制备方法 Pending CN108456846A (zh)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CN202211563012.6A CN116024523A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法
CN201810277643.9A CN108456846A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法
KR1020207005442A KR20200028483A (ko) 2018-03-30 2018-08-21 마스크 및 이의 제조 방법
EP18912788.9A EP3640365A4 (en) 2018-03-30 2018-08-21 MASK PLATE AND ITS PREPARATION PROCESS
JP2020501465A JP6977140B2 (ja) 2018-03-30 2018-08-21 マスク及びその製作方法
PCT/CN2018/101549 WO2019184205A1 (zh) 2018-03-30 2018-08-21 掩膜板及其制备方法
TW107131963A TWI726240B (zh) 2018-03-30 2018-09-12 罩幕板及其製備方法
US16/524,190 US20190345599A1 (en) 2018-03-30 2019-07-29 Mask plates and preparation methods thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810277643.9A CN108456846A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202211563012.6A Division CN116024523A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法

Publications (1)

Publication Number Publication Date
CN108456846A true CN108456846A (zh) 2018-08-28

Family

ID=63237826

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201810277643.9A Pending CN108456846A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法
CN202211563012.6A Pending CN116024523A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202211563012.6A Pending CN116024523A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法

Country Status (7)

Country Link
US (1) US20190345599A1 (https=)
EP (1) EP3640365A4 (https=)
JP (1) JP6977140B2 (https=)
KR (1) KR20200028483A (https=)
CN (2) CN108456846A (https=)
TW (1) TWI726240B (https=)
WO (1) WO2019184205A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109487206A (zh) * 2018-12-11 2019-03-19 武汉华星光电半导体显示技术有限公司 掩膜版及采用该掩膜版的掩膜装置
CN109913805A (zh) * 2019-03-27 2019-06-21 京东方科技集团股份有限公司 一种掩膜版
CN110760790A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN110760791A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7749925B2 (ja) * 2020-03-13 2025-10-07 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法
KR102836687B1 (ko) * 2020-05-11 2025-07-22 삼성디스플레이 주식회사 마스크 검사 장치 및 이를 이용한 마스크 검사 방법
CN116657099A (zh) * 2023-05-31 2023-08-29 京东方科技集团股份有限公司 遮挡用金属掩膜板、张网组件、掩膜板以及显示面板

Citations (6)

* Cited by examiner, † Cited by third party
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CN202530150U (zh) * 2012-01-16 2012-11-14 昆山允升吉光电科技有限公司 蒸镀掩模板
CN103014618A (zh) * 2012-12-25 2013-04-03 唐军 蒸镀用掩模板及其制造方法
CN104630705A (zh) * 2015-03-13 2015-05-20 合肥鑫晟光电科技有限公司 一种掩膜板及其制备方法
CN104846328A (zh) * 2014-02-14 2015-08-19 三星显示有限公司 掩模框架组件及其制造方法
US20160076132A1 (en) * 2014-09-12 2016-03-17 Kabushiki Kaisha Toshiba Stencil mask, stencil mask manufacturing method, and imprinting method
CN206512267U (zh) * 2016-10-28 2017-09-22 京东方科技集团股份有限公司 一种掩模片及掩模板

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JP4608874B2 (ja) * 2003-12-02 2011-01-12 ソニー株式会社 蒸着マスクおよびその製造方法
JP4915312B2 (ja) * 2007-08-08 2012-04-11 ソニー株式会社 蒸着用マスクの製造方法
KR20160015214A (ko) * 2013-04-22 2016-02-12 어플라이드 머티어리얼스, 인코포레이티드 능동적으로-정렬되는 미세 금속 마스크
KR102106336B1 (ko) * 2013-07-08 2020-06-03 삼성디스플레이 주식회사 증착용 마스크
KR102106331B1 (ko) * 2013-07-08 2020-05-06 삼성디스플레이 주식회사 마스크 조립체 및 이의 제조 방법
CN104593721B (zh) * 2013-10-30 2017-08-08 昆山国显光电有限公司 一种蒸镀用精密金属掩膜板的张网方法及其获得的掩膜板
KR102541449B1 (ko) * 2015-12-22 2023-06-09 삼성디스플레이 주식회사 박막 증착용 마스크 어셈블리
JP6465075B2 (ja) * 2016-05-26 2019-02-06 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機ｅｌディスプレイの製造方法
KR102366019B1 (ko) * 2016-06-28 2022-02-23 다이니폰 인사츠 가부시키가이샤 증착 마스크, 유기 반도체 소자의 제조 방법 및 유기 el 디스플레이의 제조 방법
CN205844737U (zh) * 2016-07-29 2016-12-28 昆山国显光电有限公司 掩膜板
US20180040855A1 (en) * 2016-08-04 2018-02-08 Hon Hai Precision Industry Co., Ltd. Deposition mask for making oled display panel
CN106502044B (zh) * 2017-01-10 2020-01-24 昆山国显光电有限公司 掩膜板及其制造方法
JP6304412B2 (ja) * 2017-02-06 2018-04-04 大日本印刷株式会社 金属フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、パターンの形成方法
CN107435131B (zh) * 2017-09-29 2019-08-02 上海天马微电子有限公司 掩膜装置、蒸镀设备以及掩膜装置制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202530150U (zh) * 2012-01-16 2012-11-14 昆山允升吉光电科技有限公司 蒸镀掩模板
CN103014618A (zh) * 2012-12-25 2013-04-03 唐军 蒸镀用掩模板及其制造方法
CN104846328A (zh) * 2014-02-14 2015-08-19 三星显示有限公司 掩模框架组件及其制造方法
US20160076132A1 (en) * 2014-09-12 2016-03-17 Kabushiki Kaisha Toshiba Stencil mask, stencil mask manufacturing method, and imprinting method
CN104630705A (zh) * 2015-03-13 2015-05-20 合肥鑫晟光电科技有限公司 一种掩膜板及其制备方法
CN206512267U (zh) * 2016-10-28 2017-09-22 京东方科技集团股份有限公司 一种掩模片及掩模板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109487206A (zh) * 2018-12-11 2019-03-19 武汉华星光电半导体显示技术有限公司 掩膜版及采用该掩膜版的掩膜装置
CN110760790A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN110760791A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN109913805A (zh) * 2019-03-27 2019-06-21 京东方科技集团股份有限公司 一种掩膜版
CN109913805B (zh) * 2019-03-27 2021-01-26 京东方科技集团股份有限公司 一种掩膜版

Also Published As

Publication number Publication date
US20190345599A1 (en) 2019-11-14
EP3640365A4 (en) 2020-08-19
CN116024523A (zh) 2023-04-28
EP3640365A1 (en) 2020-04-22
JP2020526670A (ja) 2020-08-31
JP6977140B2 (ja) 2021-12-08
WO2019184205A1 (zh) 2019-10-03
TW201843864A (zh) 2018-12-16
TWI726240B (zh) 2021-05-01
KR20200028483A (ko) 2020-03-16

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Application publication date: 20180828

RJ01 Rejection of invention patent application after publication