CN108447961B - SMD light emitting diode and electronic equipment - Google Patents
SMD light emitting diode and electronic equipment Download PDFInfo
- Publication number
- CN108447961B CN108447961B CN201810341039.8A CN201810341039A CN108447961B CN 108447961 B CN108447961 B CN 108447961B CN 201810341039 A CN201810341039 A CN 201810341039A CN 108447961 B CN108447961 B CN 108447961B
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- China
- Prior art keywords
- metal bracket
- metal
- wrapping section
- emitting diode
- type light
- Prior art date
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- 239000002184 metal Substances 0.000 claims abstract description 69
- 239000000084 colloidal system Substances 0.000 claims abstract description 39
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to the technical field of LED production, and particularly relates to a chip-type light-emitting diode and electronic equipment, wherein a chip light-emitting body in the chip-type light-emitting diode is directly arranged on a first metal bracket and is connected with a second metal bracket through a wire, and the chip light-emitting body is usually arranged on a plastic shell in the prior art. In addition, compared with the prior art, the patch type light-emitting diode provided by the invention is composed of metal, colloid and a wafer, the structure is simple, the colloid shell is used for fixedly sealing the metal bracket, the lead and the wafer luminous body in a film pressing packaging mode, and the patch type light-emitting diode is integrally formed, stable in structure and high in production efficiency.
Description
Technical Field
The invention belongs to the technical field of LED (LIGHT EMITTING Diode) production, and particularly relates to a patch type LED and electronic equipment.
Background
At present, the infrared LED has the advantages of long service life, low energy consumption, quick starting and the like, and is widely applied to the fields of night vision illumination and the like in the security camera industry.
As shown in fig. 1, the conventional infrared patch LED includes a plastic housing 10 having a concave cup at the center, and two conductive plates 20 are disposed under the plastic housing 10, wherein one of the conductive plates 20 is connected to a positive electrode of a power source, and the other conductive plate is connected to a negative electrode of the power source. A single-chip illuminant 30 is disposed in the concave cup of the plastic housing 10, and the ends of the two conductive plates 20 extend into the concave cup to be electrically connected with the single-chip illuminant 30, wherein the single-chip illuminant 30 is directly electrically connected and fixed with one conductive plate 20 in the concave cup, and one wire 40 is connected to a bonding wire point on the other conductive plate 20 from the single-chip illuminant 30, so that the single-chip illuminant 30 is respectively connected with the two conductive plates 20 to form a path. The chip illuminant 30 is covered by the spherical colloid 50. The structure is complex in structure and easy to cause poor internal contact due to the inclusion of metal, plastic and colloid.
Disclosure of Invention
The invention aims to solve the technical problem of providing a patch type light-emitting diode and electronic equipment, and aims to solve the problems that the patch type light-emitting diode in the prior art is complex in structure and poor in contact easily occurs.
In order to solve the above technical problems, the present invention is implemented as a patch type light emitting diode for optical imaging technology, comprising:
The LED chip comprises a metal bracket, a wire, a colloid shell and at least one chip illuminant, wherein the metal bracket comprises a first metal bracket and a second metal bracket which are mutually separated, and the first metal bracket and the second metal bracket are respectively connected with a positive electrode and a negative electrode of a power supply;
The wafer luminous body is arranged on the first metal support, the wafer luminous body is connected with the second metal support through the lead, and the colloid shell wraps the metal support, the lead and the wafer luminous body.
Further, a bowl-shaped concave structure is arranged on the upper surface of the first metal support, and the wafer illuminant is arranged in the bowl-shaped concave structure.
Further, the surface of the bowl-shaped concave surface structure is a reflecting surface.
Further, two ends of the metal support are respectively provided with an oval through groove, and corresponding parts of the colloid shell penetrate through the oval through grooves to wrap the metal support.
Further, two ends of the metal bracket are exposed out of the colloid shell.
Further, both ends of the metal support exposed out of the colloid shell are downwards bent and are flush with the bottom of the colloid shell.
Further, the part of the first metal support, which is exposed out of the colloid shell, is bent to form a first wrapping section and a second wrapping section, the part of the second metal support, which is exposed out of the colloid shell, is bent to form a third wrapping section and a fourth wrapping section, and the first wrapping section, the second wrapping section, the third wrapping section and the fourth wrapping section form a wrapping space for the bottom of the colloid shell, and the second wrapping section and the fourth wrapping section are flush with the bottom of the colloid shell.
Further, the end part of the metal bracket, which is encapsulated in the colloid shell, is provided with fins.
Further, the colloid shell is made of light-transmitting materials, and the outer contour of the top is spherical.
The invention also provides electronic equipment comprising the patch type light-emitting diode.
Compared with the prior art, the invention has the beneficial effects that: in the patch type light-emitting diode, the wafer light-emitting body is directly arranged on the first metal bracket and is connected with the second metal bracket through the lead, and the wafer light-emitting body is usually arranged on the plastic shell in the prior art. In addition, compared with the prior art, the patch type light-emitting diode provided by the invention is composed of metal, colloid and a wafer, the structure is simple, the colloid shell is used for fixedly sealing the metal bracket, the lead and the wafer luminous body in a film pressing packaging mode, and the patch type light-emitting diode is integrally formed, stable in structure and high in production efficiency.
Drawings
FIG. 1 is a schematic diagram of a prior art chip LED;
fig. 2 is a schematic structural diagram of a patch led according to an embodiment of the present invention;
Fig. 3 is a top view of fig. 2.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 2 and 3, a patch type light emitting diode according to an embodiment of the present invention includes a metal bracket 1, a wafer illuminant 2, a wire 3, and a colloid housing 4, where the metal bracket 1 includes a first metal bracket 11 and a second metal bracket 12 that are separated from each other, and the first metal bracket 11 and the second metal bracket 12 are respectively connected to positive and negative electrodes (not shown in the figure) of a power supply.
It will be appreciated that the number of the wafer emitters 2 is not limited in the present invention, and in the present embodiment, one wafer emitter 2 is illustrated as an example.
The wafer illuminant 2 is arranged on the first metal bracket 11, the wafer illuminant 2 is connected with the second metal bracket 12 through the lead 3, and the colloid shell 4 wraps the metal bracket 1, the lead 3 and the wafer illuminant 2.
The upper surface of the first metal bracket 11 is provided with a bowl-shaped concave structure 111, the wafer illuminant 2 is arranged in the bowl-shaped concave structure 111, the concave surface is bowl-shaped, and the surface is a reflecting surface, so that the light rays emitted by the wafer illuminant 2 can be effectively gathered, and the luminous efficiency of the patch type light-emitting diode is improved. The material of the colloid shell 4 is light-transmitting material, and the external outline of the top is spherical crown shape, so that the patch type light-emitting diode achieves better light-emitting effect.
The first metal bracket 11 has a bowl-shaped concave structure 111 for mounting the wafer illuminant 2, so that the area thereof is much larger than that of the second metal bracket 12, and generally occupies more than 70% of the area of the metal bracket 1.
Two ends of the metal bracket 1 are respectively provided with an oval through groove 13, and corresponding parts of the colloid shell 4 penetrate through the oval through grooves 13 to wrap the metal bracket 1, wherein the oval through grooves 13 are used for improving the success rate of film pressing and packaging and improving the yield of products.
The two ends of the metal bracket 1 are exposed out of the colloid shell 4, and the exposed parts are bent downwards and are parallel to the bottom of the colloid shell 4. The exposed part of the metal bracket 1 clamps the colloid shell 4, so that the bonding force of the connection of the metal bracket 1 and the colloid shell 4 is increased, and the stability of the product structure is improved. The bottom of the metal bracket 1 is exposed and is flush with the bottom of the colloid shell 4, so that the welding is convenient. Specifically, the portion of the first metal bracket 11 exposed out of the colloid shell 4 is bent to form a first wrapping section 112 and a second wrapping section 113, the portion of the second metal bracket 12 exposed out of the colloid shell 4 is bent to form a third wrapping section 121 and a fourth wrapping section 122, the first wrapping section 112, the second wrapping section 113, the third wrapping section 121 and the fourth wrapping section 122 form a wrapping space to the bottom of the colloid shell 4, and the second wrapping section 113 and the fourth wrapping section 122 are flush with the bottom of the colloid shell 4.
The end of the metal bracket 1 encapsulated in the colloid shell 4 is provided with fins 14 for improving the stability of the structure.
The invention also provides electronic equipment, and the patch type light-emitting diode is applied to the electronic equipment. The electronic device may include, but is not limited to: indicator lights, displays, lighted keyboards, and various light fixtures.
In the patch type light-emitting diode and the electronic device of the embodiment, the wafer light-emitting body is directly arranged on the first metal bracket and is connected with the second metal bracket through the lead, and the wafer light-emitting body is usually arranged on the plastic shell in the prior art. In addition, compared with the prior art, the patch type light-emitting diode provided by the invention is composed of metal, colloid and a wafer, the structure is simple, the colloid shell is used for fixedly sealing the metal bracket, the lead and the wafer luminous body in a film pressing packaging mode, and the patch type light-emitting diode is integrally formed, stable in structure and high in production efficiency.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (8)
1. A patch-type light emitting diode, comprising:
The LED chip comprises a metal bracket, a wire, a colloid shell and at least one chip illuminant, wherein the metal bracket comprises a first metal bracket and a second metal bracket which are mutually separated, and the first metal bracket and the second metal bracket are respectively connected with a positive electrode and a negative electrode of a power supply;
the wafer luminous body is arranged on the first metal bracket, the wafer luminous body is connected with the second metal bracket through the lead, and the colloid shell wraps the metal bracket, the lead and the wafer luminous body;
two ends of the metal support are respectively provided with an oval through groove, the corresponding part of the colloid shell passes through the oval through grooves to wrap the metal support, and the oval through grooves are used for improving the success rate of film pressing encapsulation;
The end part of the metal support, which is encapsulated in the colloid shell, is provided with fins.
2. The chip led of claim 1, wherein the first metal bracket has a bowl-shaped concave structure formed on an upper surface thereof, and the die illuminant is disposed in the bowl-shaped concave structure.
3. The patch led of claim 2, wherein the surface of the bowl-shaped concave structure is a reflective surface.
4. The patch-type light-emitting diode according to claim 1, wherein both ends of the metal holder are exposed to the colloid case.
5. The led of claim 4, wherein the two ends of the metal frame exposed to the gel housing are bent downward and flush with the bottom of the gel housing.
6. The patch-type light emitting diode of claim 5, wherein the portion of the first metal bracket exposed to the gel housing is bent to form a first wrapping section and a second wrapping section, the portion of the second metal bracket exposed to the gel housing is bent to form a third wrapping section and a fourth wrapping section, the first wrapping section, the second wrapping section, the third wrapping section and the fourth wrapping section form a wrapping space for the bottom of the gel housing, and the second wrapping section and the fourth wrapping section are flush with the bottom of the gel housing.
7. The led of any of claims 1-6, wherein the encapsulant is a light transmissive material and the top has a spherical cap shape.
8. An electronic device comprising the chip-type light emitting diode according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810341039.8A CN108447961B (en) | 2018-04-17 | 2018-04-17 | SMD light emitting diode and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810341039.8A CN108447961B (en) | 2018-04-17 | 2018-04-17 | SMD light emitting diode and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108447961A CN108447961A (en) | 2018-08-24 |
| CN108447961B true CN108447961B (en) | 2024-07-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810341039.8A Active CN108447961B (en) | 2018-04-17 | 2018-04-17 | SMD light emitting diode and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108447961B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124328A (en) * | 2013-04-26 | 2014-10-29 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
| CN208045534U (en) * | 2018-04-17 | 2018-11-02 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202025798U (en) * | 2011-04-06 | 2011-11-02 | 广东银雨芯片半导体有限公司 | SMD (Surface Mounted Device) LED (Light Emitting Diode) bracket and LED adopting same |
| CN202434510U (en) * | 2011-12-14 | 2012-09-12 | 四川柏狮光电技术有限公司 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
| CN202839741U (en) * | 2012-10-18 | 2013-03-27 | 深圳市斯迈得光电子有限公司 | Surface-mounted light emitting diode support |
| CN203536465U (en) * | 2013-07-19 | 2014-04-09 | 佛山市国星光电股份有限公司 | Top emission type LED bracket and top emission type LED device |
| CN204927338U (en) * | 2015-09-17 | 2015-12-30 | 深圳成光兴光电技术股份有限公司 | Paster LED packaging structure |
-
2018
- 2018-04-17 CN CN201810341039.8A patent/CN108447961B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124328A (en) * | 2013-04-26 | 2014-10-29 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
| CN208045534U (en) * | 2018-04-17 | 2018-11-02 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108447961A (en) | 2018-08-24 |
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