CN108400228B - 一种led灯丝光源倒装结构 - Google Patents
一种led灯丝光源倒装结构 Download PDFInfo
- Publication number
- CN108400228B CN108400228B CN201810138727.4A CN201810138727A CN108400228B CN 108400228 B CN108400228 B CN 108400228B CN 201810138727 A CN201810138727 A CN 201810138727A CN 108400228 B CN108400228 B CN 108400228B
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- electromagnet
- fixedly connected
- mounting box
- runner
- heat dissipation
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000002337 anti-port Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/70—Structural association with built-in electrical component with built-in switch
- H01R13/703—Structural association with built-in electrical component with built-in switch operated by engagement or disengagement of coupling parts, e.g. dual-continuity coupling part
- H01R13/7036—Structural association with built-in electrical component with built-in switch operated by engagement or disengagement of coupling parts, e.g. dual-continuity coupling part the switch being in series with coupling part, e.g. dead coupling, explosion proof coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810138727.4A CN108400228B (zh) | 2018-02-10 | 2018-02-10 | 一种led灯丝光源倒装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810138727.4A CN108400228B (zh) | 2018-02-10 | 2018-02-10 | 一种led灯丝光源倒装结构 |
Publications (2)
Publication Number | Publication Date |
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CN108400228A CN108400228A (zh) | 2018-08-14 |
CN108400228B true CN108400228B (zh) | 2020-01-03 |
Family
ID=63096473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201810138727.4A Active CN108400228B (zh) | 2018-02-10 | 2018-02-10 | 一种led灯丝光源倒装结构 |
Country Status (1)
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CN (1) | CN108400228B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110112616B (zh) * | 2019-05-17 | 2020-11-27 | 深圳市智瑞通科技有限公司 | 一种信息采集管理终端服务器设备 |
CN112056233A (zh) * | 2020-10-14 | 2020-12-11 | 朱家文 | 一种宠物狗进门快捷擦脚装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203431523U (zh) * | 2013-09-17 | 2014-02-12 | 潍坊永明光电有限公司 | 多功能led探照灯 |
CN206282220U (zh) * | 2016-11-21 | 2017-06-27 | 东莞市希捷五金科技有限公司 | 一种计算机主机高效散热装置 |
CN106996526A (zh) * | 2017-05-22 | 2017-08-01 | 佛山科瑞菲新能源科技有限公司 | 一种可提升式大型地面led灯体装置 |
CN206398395U (zh) * | 2017-01-18 | 2017-08-11 | 中山市品诚光电实业有限公司 | 一种高效散热的led光源模组 |
CN206600664U (zh) * | 2017-03-28 | 2017-10-31 | 温若愚 | 多功能led灯 |
CN206759884U (zh) * | 2017-06-05 | 2017-12-15 | 安陆华生摩丝网络科技有限公司 | 一种物联网交换机散热装置 |
-
2018
- 2018-02-10 CN CN201810138727.4A patent/CN108400228B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203431523U (zh) * | 2013-09-17 | 2014-02-12 | 潍坊永明光电有限公司 | 多功能led探照灯 |
CN206282220U (zh) * | 2016-11-21 | 2017-06-27 | 东莞市希捷五金科技有限公司 | 一种计算机主机高效散热装置 |
CN206398395U (zh) * | 2017-01-18 | 2017-08-11 | 中山市品诚光电实业有限公司 | 一种高效散热的led光源模组 |
CN206600664U (zh) * | 2017-03-28 | 2017-10-31 | 温若愚 | 多功能led灯 |
CN106996526A (zh) * | 2017-05-22 | 2017-08-01 | 佛山科瑞菲新能源科技有限公司 | 一种可提升式大型地面led灯体装置 |
CN206759884U (zh) * | 2017-06-05 | 2017-12-15 | 安陆华生摩丝网络科技有限公司 | 一种物联网交换机散热装置 |
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Publication number | Publication date |
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CN108400228A (zh) | 2018-08-14 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right | ||
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Effective date of registration: 20191209 Address after: No.46 houxixi, Jinfeng Village, Dongyuan Town, Quanzhou Taishang investment district, Quanzhou City, Fujian Province Applicant after: Quanzhou Taiwanese Investment Zone Yipin Tea Co., Ltd. Address before: 362400 Zhuyang village 3, Xiping Town, Anxi, Quanzhou, Fujian Applicant before: Wang Youjian |
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Effective date of registration: 20220615 Address after: 415000 Chongde neighborhood committee, Deshan Town, Changde economic and Technological Development Zone, Hunan Province (3 / F, building 3, electronic information Industrial Park) Patentee after: Changde Extraordinary Lighting Electrical Appliances Co.,Ltd. Address before: 362000 No. 46, houxixi, Jinfeng Village, Dongyuan Town, Quanzhou Taiwan investment zone, Quanzhou City, Fujian Province Patentee before: Quanzhou Taiwanese Investment Zone Yipin Tea Co.,Ltd. |