CN108400105A - With recovery method and with retracting device - Google Patents

With recovery method and with retracting device Download PDF

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Publication number
CN108400105A
CN108400105A CN201810128777.4A CN201810128777A CN108400105A CN 108400105 A CN108400105 A CN 108400105A CN 201810128777 A CN201810128777 A CN 201810128777A CN 108400105 A CN108400105 A CN 108400105A
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CN
China
Prior art keywords
band
adhesive tape
holding
cut
recycling bins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810128777.4A
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Chinese (zh)
Inventor
奥野长平
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Nitto Denko Corp
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Nitto Denko Corp
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Filing date
Publication date
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Publication of CN108400105A publication Critical patent/CN108400105A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Labeling Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

The present invention provides the band recovery method that the recovery process of the lengthwise belt of releasing can be made more highly to automate and with retracting device.After the state that do not extended flatly with (Tn) of lengthwise is cut into individual, not being laminated and being accommodated in recycling bins with (Tn) for individual shape is made while maintain the flat state.In this case, due to not being laminated neatly and economically respectively with (Tn), accordingly, with respect to should not the storage amount with (Tn) do not inhibit in minimum limit with the volume shared by (Tn).Since the replacement frequency of recycling bins can be reduced, it is capable of the running efficiency of significantly lifting device.In addition, since the speed that do not accumulated with (Tn) becomes constant, easily perform planned operation.

Description

With recovery method and with retracting device
Technical field
The present invention relates to for being pasted on semiconductor crystal wafer, LED (Light emitting diode：Light-emitting diodes Pipe), the band that recycles unwanted lengthwise shape in the supply process of the adhesive tape of various substrates such as electronic circuit etc. take back debit Method and with retracting device.
Background technology
It is formed with the circuit pattern of multiple element on the surface of semiconductor crystal wafer (hereinafter, being suitably referred to as " wafer ").For example, Convex block, fine circuitry are formed in crystal column surface.Therefore, in order to prevent overleaf be ground when and conveying when the circuit face pollution and Damage, has the adhesive tape of protection in the surface mount of wafer.
Here, explanation uses, the previous structure with sticker for the surface mount adhesive tape in wafer.Such as figure Shown in 33, previous band sticker 101 includes band supply unit 103, isolation film stripping portion 105, holding station 107, band paste section 109, band cutting mechanism 111, band recoverer 113 and isolation film recoverer 115 etc..
The confession rolled up from the adhesive tape for being filled with the adhesive tape TS with isolation film for having wound circuit protection with supply unit 103 It is released to spool and guides adhesive tape TS.Isolation film stripping portion 105 removes isolation film S from the adhesive tape TS released.It keeps The wafer W that platform 107 becomes circuit forming face state upward carries out absorption holding.Band paste section 109 is as an example Sticking roller, in fig. 33, left direction move horizontally.It is moved horizontally by this, band paste section 109 will remove isolation film S Adhesive tape T be pasted on the wafer W in holding station 107.
Band cutting mechanism 111 includes cutter 111a, by making band cutting mechanism 111 vertical axis shown in the reference numeral P Line rotates, to which adhesive tape T is cut by the shape along wafer W.After cutting it is unwanted should not with Tn constitute band recycling It is wound into web-like at the wireline reel in portion 113 and is recovered.In addition, the isolation film S that auto-adhesive tape T has been removed is constituting isolation film It is wound into web-like at the wireline reel of recoverer 115 and is recovered.
In such band sticker, in the case where the loadings of the adhesive tape T with supply unit 103 are less than constant basis Or be brought back the recycling of receipts portion 113 not need replacing roller in the case that the amount with Tn etc. is more than constant basis.It is viscous in previous band In label apparatus 101 in the case of more roll change, operator needs to carry out complicated operation with manually.
That is, in band supply unit 103, need by adhesive tape T cut-out that auto-adhesive tape volume is released, replace adhesive tape volume, into A series of operation as the engagement of adhesive tape T after row cut-out and the again releasing of progress adhesive tape T.Also, in band In recoverer 113 etc., need to cut off unwanted band Tn, go divided by web-like recycling after should not with Tn, relative to wireline reel into Row should not the engagement with Tn and carry out again should not a series of operation as the winding with Tn.In previous device, During carrying out this series of operation, need to make the operation interrupted with sticker.
In recent years, it in order to avoid the reduction of the sticking efficiency caused by the operation interrupted with sticker, attempts automatically The operation for carrying out the replacement operation of roller, the end of the adhesive tape T after cut-out especially being made to engage each other.As one Example, it is proposed that following such band joint method (for example, referring to patent document 1).That is, by leading with isolation film The end of adhesive tape T pastes adhesive member and the adhesive member is made to carry out leaving movement relative to the release direction of adhesive tape T, from And by adhesive tape T and film stripping specific length is isolated.Then, the end for the adhesive tape T for having removed isolation film is pasted on certainly The fore-end of the subsequent adhesive tape T with isolation film of new adhesive tape volume supply, thus enables that the bonding with isolation film End with T automatically engages each other.
Patent document 1：Japanese Unexamined Patent Publication 2014-133616 bulletins
Invention content
Problems to be solved by the invention
However, there are problems that as follows in above-mentioned previous device.
That is, previous automatic joint method to be premised on being suitable for band supply unit, and it is difficult to be suitable for band recoverer, isolation Film recoverer.In previous device, for example, band recoverer in, by lengthwise should not tape wrapping recycled on axis. In such previous recovery method, cut-out should not with later, need wound into rolls and be recovered should not band together with Axis takes out and replaces with new axis together.
Due to not being wound with band etc. on new axis, therefore, it is difficult to be applicable in previous automatic joint method.Therefore, each Should not the yield of band when reaching specified amount or more, need with manually come carry out with remove by with web-like recycle should not be with to open The operation of complexity begin, a series of.As a result, the burden of operator increases.In addition, after making device stop, carrying out Should not band a series of operation such as removal, the operation after be again started up device, therefore make the working efficiency of device It reduces.Also, in the structure for winding and recycling, therefore the wireline reel for needing setting large-scale also worries that adhesive tape joining is made to fill Set enlarged this problem.
The present invention has been made in view of such circumstances, its main purpose is, providing the lengthwise belt that can make releasing The band recovery method that more highly automates of recovery process and with retracting device.
The solution to the problem
In order to realize that such purpose, the present invention use following structure.
That is, the present invention provides a kind of band recovery method, which is characterized in that the band recovery method includes：Holding process, will be with The region of the specific length from the front end for the band that lengthwise shape is released remains flat state；Cutting-off process, will be with flat state The band kept cuts into individual；And storage process, the flat state for being cut into individual the band is maintained on one side, The band for being cut into individual is laminated on one side and is accommodated in band recycling bins.
(function and effect) use this method, the region of the specific length from the front end of the band of lengthwise shape are remained flat State, and the band of the flat condition is cut into individual.Then, by the belt of individual shape while maintaining the flat state It folds and is accommodated in band recycling bins.In this case, it is more than regulation in the storage amount of recycling bins in the action recycled to the band In the case of amount, most of process automation other than the operation for replacing the recycling bins can be made, therefore dress can be promoted The working efficiency set.
In addition, be laminated neatly and economically respectively due to being accommodated in the band of individual shape with recycling bins, therefore, it is possible to Storage amount relative to band will inhibit with shared volume in minimum limit.As a result, it is possible to reduce the replacement frequency with recycling bins Rate, therefore it is capable of the running efficiency of significantly lifting device.In addition, due to the speed of the band accumulation of individual shape in recycling bins As constant, therefore, planned replacement operation is easily performed.
In addition, in the present invention as stated above, it is preferred that during the holding, holding mechanism is from the front end by the band The region of specific length remains flat state, in the cutting-off process, remains as flat in the holding mechanism The band in the state of the band cut into individual, during the storage, brought into described in individual to being cut into The holding mechanism that row is kept is guided together with the band to the band recycling bins.
(function and effect) use the structure, and in the state that band is remained flat by holding mechanism, band is cut into list , also, be cut off after this maintain flat state to be stacked and store with holding mechanism together with one side.In the situation Under, the band of lengthwise shape be used in be kept that the state of mechanism holding is stacked and stores it is a series of during.Cause And band reliably can be laminated and be stored with flat condition.
In addition, in the present invention as stated above, it is preferred that the holding mechanism is remained the band by adsorbing the band Flat state.Using the structure, since holding mechanism adsorbs to the band, therefore, it is possible to will be easier and reliably protect It holds as flat state.
In order to realize that such purpose, the present invention can also use structure as following.
That is, the present invention provides a kind of band retracting device, which is characterized in that the band retracting device includes：Band holding mechanism, The region of the specific length from the front end for the band released with lengthwise shape is remained into flat state；Band cutting mechanism, will be with flat The band that smooth state is kept cuts into individual；Band recycling bins, storage are cut into individual the band；And band Guiding mechanism will be cut into individual the band and draw to the band recycling bins while being maintained flat state It leads, makes to be cut into individual the band and be laminated and be accommodated in the band recycling bins.
(function and effect) use this method, the region of the specific length from the front end of the band of lengthwise shape are remained flat State, and the band of the flat condition is cut into individual.Then, by the belt of individual shape while maintaining the flat state It folds and is accommodated in band recycling bins.In this case, the major part other than the operation to being replaced with recycling bins can be made Process automation, therefore be capable of the working efficiency of lifting device.
In addition, be laminated neatly and economically respectively due to being accommodated in the band of individual shape with recycling bins, therefore, it is possible to Storage amount relative to band will inhibit with shared volume in minimum limit.As a result, it is possible to reduce the replacement frequency with recycling bins Rate, therefore it is capable of the running efficiency of significantly lifting device.In addition, due to the speed of the band accumulation of individual shape in recycling bins As constant, therefore, planned replacement operation is easily performed.
In addition, in the present invention as stated above, it is preferred that it is described with cutting mechanism by it is described remain with holding mechanism described in Band cuts into individual, it is described with guiding mechanism by the band holding mechanism that the band for being cut into individual is kept with The band is guided to the band recycling bins together.
(function and effect) use the structure, and in the state that band is remained flat by holding mechanism, band is cut into list , also, be cut off after this maintain flat state to be stacked and store with holding mechanism together with one side.In the situation Under, the band of lengthwise shape be used in be kept that the state of mechanism holding is stacked and stores it is a series of during.Cause And band reliably can be laminated and be stored with flat condition.
It is further preferred, that the band recycling bins be equipped with it is multiple, which includes switching mechanism, the switching machine Structure will be as the band recycling bins switching of the object guided to the band for being cut into individual with guiding mechanism For another band recycling bins.
(function and effect) use the structure, can will be guided to the band for being cut into individual as with guiding mechanism The band recycling bins of object be switched to another band recycling bins.That is, even if the amount for being accommodated in the band with recycling bins be specified amount with In the case of upper, also allow hand over recycling bins and continue the recycling operation of band and can replace to reach taking back for specified amount Receive case.Therefore, it is possible to which the time for the operation interrupted for making device is greatly decreased, it is thus possible to the operating effect of further lifting device Rate.
In addition, in the present invention as stated above, it is preferred that the band holding mechanism includes：Flat horizontal surface is connected to the band； And adsorption hole, absorption holding is carried out to the band by the flat horizontal surface.Using the structure, holding mechanism is on one side by flat Face is connected to band one side and is adsorbed to the band, therefore, it is possible to be easier band and be securely maintained flat state.
The effect of invention
Band recovery method using the present invention and with retracting device, since the most of process recycled to the band can be made Automation, therefore the burden of operator can be mitigated.In addition, since the replacement frequency with recycling bins can be reduced, it can The running efficiency of lifting device.In addition, since the speed of the band accumulation of individual shape in recycling bins becomes constant, hold The replacement operation of easy executive plan.
Description of the drawings
Fig. 1 is the front view of the basic structure for the adhesive tape joining apparatus for indicating embodiment.
Fig. 2 is the figure for the structure with supply unit for indicating embodiment.(a) of Fig. 2 is the stereogram with supply unit, Fig. 2's (b) it is the front view with supply unit.
Fig. 3 is to indicate that the handle part of embodiment forms the figure of the structure of unit.
Fig. 4 is the figure of the structure for the band engagement unit for indicating embodiment.
Fig. 5 is the figure for the structure with recoverer for indicating embodiment.
Fig. 6 is the figure of the structure for the isolation film recoverer for indicating embodiment.
Fig. 7 is the flow chart of the action for the adhesive tape joining apparatus for indicating embodiment.(a) of Fig. 7 is indicated adhesive tape It is pasted on the flow chart of the summary of the action of wafer, (b) of Fig. 7 is the stream that the detailed content of the action to step S7 illustrates (c) of Cheng Tu, Fig. 7 be to recycling should not band action the flow chart that illustrates of detailed content.
Fig. 8 is the figure of the action for the step S2 for indicating embodiment.(a) of Fig. 8 indicates that Sticking roller is located at initial position The figure of state, (b) of Fig. 8 are to indicate that Sticking roller is moved to the figure of the state of terminal location.
Fig. 9 is the figure of the action for the step S3 for indicating embodiment.
Figure 10 is the figure of the action for the step S4 for indicating embodiment.
Figure 11 is the figure of the action for the step S7-1 for indicating embodiment.
Figure 12 is the figure of the action for the step S7-1 for indicating embodiment.
Figure 13 is the figure of the action for the step S7-1 for indicating embodiment.
Figure 14 is the figure of the action for the step S7-1 for indicating embodiment.
Figure 15 is the figure of the action for the step S7-1 for indicating embodiment.
Figure 16 is the figure of the action for the step S7-2 for indicating embodiment.
Figure 17 is the figure of the action for the step S7-3 for indicating embodiment.
Figure 18 is the figure of the action for the step S7-4 for indicating embodiment.(a) of Figure 18 indicates to be clamped before leading band The figure of state, (b) of Figure 18 are the figures for indicating to be clamped the state after band in advance, and (c) of Figure 18 is to indicate that handle holds handle part State figure.
Figure 19 is the figure of the action for the step S7-5 for indicating embodiment.
Figure 20 is the figure of the action for the step S7-6 for indicating embodiment.
Figure 21 is the figure of the action for the step S7-7 for indicating embodiment.(a) of Figure 21 is before indicating switching adhesive tape volume State figure, (b) of Figure 21 be indicate switching adhesive tape volume after state figure.
Figure 22 is the figure of the action for the step S7-8 for indicating embodiment.(a) of Figure 22 is indicated after releasing before row band The figure of state, (b) of Figure 22 are the figures of the state after row band after indicating to release.
Figure 23 is the figure of the action for the step S7-9 for indicating embodiment.(a) of Figure 23 is the rear end indicated using leading band Come the figure of the state of the front end of row band after being clamped and engaging, (b) of Figure 23 is the figure for indicating to release the state of the band after engagement.
Figure 24 is the figure of the action for the step S5-1 for indicating embodiment.(a) of Figure 24 is to indicate band holding member to terminal The figure of the state of position movement, (b) of Figure 24 be indicate with holding member keep should not band state figure, (c) of Figure 24 be Indicate with holding member pull out should not band state figure.
Figure 25 is the figure of the action for the step S5-2 for indicating embodiment.
Figure 26 is the figure of the action for the step S5-3 for indicating embodiment.(a) of Figure 26 be indicate embodiment cutter it is dynamic The figure of work, (b) of Figure 26 are the figures of an example of the variation for the action for showing cutter.
Figure 27 is the figure of the action for the step S5-4 for indicating embodiment.
Figure 28 is the figure of the action for the step S5-5 for indicating embodiment.
Figure 29 is the figure for the action for indicating to replace the recycling bins of embodiment.
Figure 30 is the figure being compared with previous example on the adhesive tape joint method of embodiment.(a) of Figure 30 is to indicate So that adsorption element is adsorbed in the figure of the state of band in previous example, (b) of Figure 30 be indicate to make in previous example adsorption element from The figure for the state opened, (c) of Figure 30 are figure the problem of expression using previous example in the case of the higher band of bonding force, figure 30 (d) is the figure for the structure for indicating embodiment.
Figure 31 is the figure being compared with previous example on the adhesive tape recovery method of embodiment.
(a) of Figure 31 is figure the problem of indicating previous example, and (b) of Figure 31 is the figure for the structure for indicating embodiment.
Figure 32 is the figure of the structure for the adhesive tape engagement device for indicating variation.(a) of Figure 32 is before indicating adhesive tape The figure of the structure with holding member of end, (b) of Figure 32 are the figures for the structure for indicating the step S7-9 in variation.
Figure 33 is the figure of the structure for the adhesive tape engagement device for indicating previous example.
Reference sign
1, adhesive tape joining apparatus；3, band engagement device；5, holding station；7, band application unit；9, band cutting unit；11、 Band separative element；13, band recoverer；15, isolation film recoverer；17, band supply unit；19, handle part forms unit；21, band connects Close unit；31, stripping unit；33, component is released；35, press bonding roller；41, knife unit；43, holding unit；45, holding unit； 51, band holding member；53, band pressing member；55, knife unit；57, band recovery unit；T, adhesive tape；TSa, leading band； TSb, rear row band；S, isolation film；F, recycling bins；G, recycling bins；H, handle part.
Specific implementation mode
Hereinafter, being described with reference to the embodiment of the present invention.Fig. 1 is to indicate there is the with engagement device, viscous of embodiment The front view of the basic structure of crossed belt sticker 1.In addition, in the figure for indicating adhesive tape joining apparatus 1, it is omitted for branch Hold the diagram of the bearing part and the driving part for making various structures be driven etc. of various structures.
In the present embodiment, it is illustrated by taking following situations as an example：Lengthwise shape supply to be bonded with isolation film S will glue It is affixed on the adhesive tape T of the surface protections of various substrates such as semiconductor crystal wafer (hreinafter referred to as " wafer "), and will in downstream side It cuts into regulation shape.That is, in the present embodiment, the adhesive tape of lengthwise is bonded to each other.
In addition, in the present embodiment, " upstream " and " downstream " is defined along the release direction of adhesive tape.I.e. " upstream " refers in the release direction of adhesive tape close to the aftermentioned side with supply unit.In addition, isolation film S will be bonded with State adhesive tape T be referred to as band TS.
Integrally-built explanation
As shown in Figure 1, the adhesive tape joining apparatus 1 of embodiment include band engagement device 3, holding station 5, band application unit 7, Band cutting unit 9, band separative element 11, band recoverer 13 and isolation film recoverer 15.Band engagement device 3 is by another band TS Front end be engaged in the rear end of leading band TS.The concrete structure with engagement device 3 is described below.
Simultaneously holding circuit forms face-up wafer W to the mounting of holding station 5.In embodiment, as holding station 5, suction is used The attached chuck stage for keeping wafer W, but the structure of holding station 5 is not limited to this.In addition, in order to make to be set to aftermentioned band cutting unit 9 cutter 9c cuts off adhesive tape T along the shape moving in rotation of wafer W, and cutter row is formed in the upper surface of the holding station 5 Into slot 5a.
Adhesive tape T is pasted on to the circuit of wafer W for being loaded and being maintained at by absorption in holding station 5 with application unit 7 Face.As shown in Figure 1, including the movable table 7a and axis moved back and forth along left and right horizontal along track (not shown) with application unit 7 It is supported on and the Sticking roller 7b of the movable table 7a brackets being connected.
In band cutting unit 9, it is installed with supporting arm 9b in the lower part for the movable table 9a that can drive lifting, drives the branch Bearing arm 9b can be rotated around the supercentral vertical axis P positioned at holding station 5.In addition, in the free end side of supporting arm 9b Point of a knife cutter 9c directed downwardly is installed.That is, be configured to by making supporting arm 9b be rotated by rotation center of vertical axis P, Adhesive tape T is cut to make cutter 9c be moved along the periphery of wafer W.
After making to be cut and be pasted on by cutter 9c the adhesive tape Tw behind the surface of wafer W with separative element 11 and being cut It is unwanted not to be separated with Tn.With separative element 11 include maintain it is unwanted should not be with the guide reel 11a of the tension of Tn With pinch roll 12.Pinch roll 12 is made of the pinch roller 12a and the feed rolls 12b being driven by a motor for capableing of lifting moving.Band point It is constituted in a manner of it can be moved back and forth along track left and right horizontal (not shown) from unit 11.
Structure with engagement device
Here, structure of the explanation with engagement device 3.As shown in Figure 1, including band supply unit 17, handle part with engagement device 3 Form unit 19 and with engagement unit 21.Use the structure of oolemma supply unit 17 for each figure of Fig. 2.(a) of Fig. 2 is band (b) of the stereogram of supply unit 17, Fig. 2 is the front view with supply unit 17.
As shown in (a) of Fig. 2, band supply unit 17 is configured to, and is erect in swivel plate 23 and multiple spools 25 are arranged, will be with TS's Adhesive tape volume 28 is loaded on each spool 25.In embodiment, two spools 25A, 25B stand up swivel plate 23.To dress The adhesive tape label note reference numeral 28A of spool 25A is filled in, the adhesive tape label to being loaded on spool 25B notes reference numeral 28B, to be distinguished to the two.
Swivel plate 23 is configured to rotate around central axis 26 by driving mechanism 24.By the rotation of swivel plate 23, respectively A spool 25 can be mutually shifted between supply position and position of readiness.In each figure of Fig. 2, spool 25A configurations are shown It is configured at the state of position of readiness in supply position and spool 25B.
In addition, the adhesive tape volume 28 for being configured at position of readiness is configured to glue to adhesive tape by shutter door (not shown) The external of label apparatus 1 is taken out.Operator can take out adhesive tape volume 28 and new adhesive tape volume 28 is set to position of readiness.Separately Outside, in band supply unit 17, it is configured to position of readiness positioned at the position than central portion of the supply position far from adhesive tape joining apparatus 1 It sets.In general, the central portion in adhesive tape joining apparatus 1 is equipped with structure, cutter and the movable part etc. that can much reach a high temperature. Therefore, it is possible to avoid replace be switched to the volume of the adhesive tape after position of readiness 28 when operator close to high-temperature portion, movable part etc..
In each spool 25 equipped with band holding member 27 and guide reel 29.28 are rolled up from the adhesive tape for being loaded on spool 25 to draw The front end of the band TS gone out is directed to band holding member 27 while being guided roller 29 and maintaining tension.As an example, band Holding member 27 is made of two tabular components, using each tabular component come clamping band TS.
Include stripping unit 31, release component 33 and press bonding roller 35 as shown in figure 3, handle part forms unit 19.Stripping It is adhesive tape T and isolation film S that unit 31 will be removed with TS.Stripping unit 31 is made of guide reel 37 and feed rolls 39.
Guide reel 37 maintains the tension with the adhesive tape T after TS and stripping.Feed rolls 39 with can left and right horizontal it is reciprocal Mobile mode is constituted.Isolation film S after stripping is wound in feed rolls 39 and is guided to isolation film recoverer 15.
Component 33 is released to be configured to along the release direction L generally perpendicular directions R relative to adhesive tape T (in figure 3 For the directions y) it is driven comprising shell 33a and protrusion 33b.Protrusion 33b is disposed in the upper surface of inner panel 33c, interior Plate 33c is connected by elastic component 33d with the bottom surface of shell 33a.Shell 33a and inner panel 33c are configured to independently Ground is pushed along direction R.Also, it is configured to, by above pushing away inner panel 33c, to make protrusion 33b to the outer of shell 33a Side protrudes.
By making release component 33 be driven along direction R, thus abutting of the part of adhesive tape T because of protrusion 33b And it is prominent to direction R.Press bonding roller 35 is pressed adhesive tape T outstanding by being crimped on adhesive tape T outstanding to direction R each other It closes, to form handle part H.The specific action and the formation of handle part H for releasing component 33 and press bonding roller 35 is described below Process.
As shown in figure 4, including knife unit 41, holding unit 43 and holding unit 45 with engagement unit 21.Cutter list Member 41 includes movable table 41a and cutter 41b.
Movable table 41a can be driven by driving mechanism (not shown) along direction R.In addition, movable table 41a is with energy It is enough to be constituted along the mode that the width direction (being in Fig. 4 the directions z) with TS is driven.It is equipped in the front end of movable table 41a Cutter 41b.Cutter 41b at the specified position shown in reference number C in the direction of the width in the range of cut-out band TS.By making Cutter 41b cuts off leading band TS, to form the end section for being engaged with subsequent band TS on leading band TS.
As an example, holding unit 43 is configured to, and can be driven along direction R, and by the driving from every Place side from film S is connected to band TS.Holding unit 43 has clearance portion 44, and knife unit 41 is configured to, via clearance portion 44 Close to band TS, and band TS can be cut off at the C of specified position.
Holding unit 45 can be driven along direction R.Holding unit 45 is configured to, by being driven along direction R The place side of auto-adhesive tape T is connected to band TS.That is, holding unit 43 and holding unit 45 are respectively in a manner of clamping band TS It is driven to stably keep band TS.In addition, holding unit 43 and holding unit 45 are preferably configured as to carry out very respectively Suction is attached.In this case, by into vacuum adsorbed, can more stably keep band TS after being connected to band TS.
Holding unit 45 is made of multiple components arranged side by side on release direction L, has at least 1 between multiple component A clearance portion 46.In embodiment, the tool of holding unit 45 is there are two component 45a, 45b, the shape between component 45a and component 45b At there is clearance portion 46.
Component 45a and component 45b are configured to, and can be synchronously carried out driving to identical direction each other in a directionr, and It can round about be driven each other on release direction L.By making these components be driven round about, to Holding unit 45 is steadily held forms the handle part H that unit 19 is formed using handle part.By forming handle part in adhesive tape T H simultaneously makes holding unit 45 hold the structure of handle part H, even if can be if the bonding force of adhesive tape T is stronger Rear end with TS is reliably peeled adhesive tape T and isolation film S.
Structure with recoverer
Next, structure of the explanation with recoverer 13.As shown in figure 5, including being pressed with holding member 51, band with recoverer 13 Press component 53, knife unit 55 and with recovery unit 57.
Band holding member 51 includes movable table 51a and holding member 51b.Movable table 51a is configured to along left and right horizontal Direction moves back and forth.Holding member 51b is linked to movable table 51a.Holding member 51b by along it is unwanted should not be with the thickness of Tn Degree direction is movable and is clamped from surface and this both sides of the back side and keep should not be with Tn.Holding member 51b is not limited to clamping should not Structure with Tn can also use the structure etc. to not carry out absorption holding with Tn.By remain not in holding member 51b It to be guided to band recoverer 13 with making movable table 51a be moved to right direction shown in fig. 5 in the state of Tn to be guided roller 50 Should not with Tn it is in stable condition with what is pulled out to horizontal direction keep.
Band pressing member 53 includes movable table 53a and pressing plate 53b.Movable table 53a is configured to shown in Fig. 5 wait for Seat in the plane is set to be moved back and forth along the vertical direction between the recovery position of aftermentioned recycling bins F.Pressing plate 53b is connected to movable table The back side (downside of figure) of 53a, pressing plate 53b become flat.Also, as it is in the flat back side, at least band adsorb Part is equipped with adsorption hole.That is, steadily being adsorbed by the flat horizontal surface that be not pressed plate 53b with Tn after being pulled out with holding member 51 Remain the flat state extended in the horizontal direction.
Also, after it not cut off by aftermentioned knife unit 55 with Tn, make movable table 53a to being configured at recovery position Recycling bins F movement, be cut into individual as a result, not be accommodated in recycling with Tn with the flat state along horizontal extension Case.
Knife unit 55 includes movable table 55a and cutter 55b.Movable table 55a is configured to respectively along should not be with Tn's Width and thickness direction are driven.Cutter 55b is configured to, and is connected to the point of a knife of the front end of movable table 55a and cutter 55b Direction should not be with Tn.That is, with the driving of movable table 55a, cutter 55b is cut off in the direction of the width should not be with Tn.That is, should not band Tn is kept component 51b and pressing plate 53b stabilizations remain the state extended in the horizontal direction, not maintain the shape with Tn Individual is cut by cutter 55b while state.
Band recovery unit 57 includes turntable 58 and multiple recycling bins F.In embodiment, including two recycling bins F1, F2. Turntable 58 is configured to rotate around central axis V.By the rotation of turntable 58, to recycling bins F respectively recovery position with It is mutually shifted between position of readiness.In fig. 5 it is shown that recycling bins F1 be configured at recovery position and recycling bins F2 be configured at it is standby The state of position.
Recovery position is located at the underface with pressing member 53, is cut into not being accommodated in Tn after individual and is configured In the recycling bins F of recovery position.In addition, position of readiness is configured to be located at than recovery position further from the center with sticker 1 The position in portion, the recycling bins F for being configured at position of readiness can be by shutter door 59 shown in FIG. 1 to adhesive tape joining apparatus 1 It takes out outside.
The structure of isolation film recoverer
The structure of isolation film recoverer 15 and the structure with recoverer 13 are common.That is, as shown in fig. 6, isolation film returns Receipts portion 15 includes isolation film holding member 61, isolation film pressing member 63, knife unit 65 and isolation film recovery unit 67.
Isolation film holding member 61 includes movable table 61a and holding member 61b.By holding member 61b remain every From making movable table 61a be moved to left direction shown in fig. 6 in the state of film S, to be guided roller 60 to isolation film recoverer 15 The isolation film S of guiding is kept in stable conditionly with what is pulled out to horizontal direction.
Isolation film pressing member 63 includes movable table 63a and pressing plate 63b.Movable table 63a is configured to vertically side To reciprocating movement.Pressing plate 63b become the flat back side in, at least isolation film absorbed portion be equipped with adsorption hole, quilt Isolation film holding member 61 pull out after isolation film S be pressed plate 63b absorption remain extend in the horizontal direction it is flat State.
Knife unit 65 includes movable table 65a and cutter 65b.Movable table 65a is configured to respectively to the width of isolation film S Degree direction and thickness direction are driven.Cutter 65b is connected to the front end of movable table 65a, and isolation film S is cut off in the width direction At individual.
Isolation film recovery unit 67 includes turntable 68 and multiple recycling bins G.In embodiment, including two recycling bins G1、G2.Turntable 68 is configured to rotate around central axis W.By the rotation of turntable 68, to which recycling bins G is being recycled respectively It is mutually shifted between position Gc and position of readiness Gs.
In fig. 6 it is shown that recycling bins G1 is configured at recovery position Gc and recycling bins G2 is configured at the shape of position of readiness Gs State.It is cut into the isolation film S after individual and is accommodated in the recycling bins G for being configured in recovery position.It is configured at position of readiness Gs's Recycling bins G can be taken out by shutter door 69 shown in FIG. 1 to the external of adhesive tape joining apparatus 1.
The summary of sticking placement
Here, explanation by the adhesive tape T of circuit face protection using adhesive tape joining apparatus 1 for being pasted on wafer W's A series of elemental motion.(a) of Fig. 7 is the flow illustrated to the process that the adhesive tape T of protection is pasted on wafer W Figure.
When sending out stickup instruction, the wafer W for being accommodated in defined incorporating section is aligned on alignment tool, later quilt Wafer conveying mechanism (not shown) is placed in holding station 5.The wafer W after holding station 5 is placed in rotation and with the center of wafer W Mode on the center of holding station 5 is kept in the state of aligning by absorption.(step S1).
At this point, with application unit 7, with cutting unit 7 and with initial shown in stripping unit 11 respectively (a) to Fig. 8 It moves position.That is, being moved to the right side of holding station 5 with application unit 9, moved to the left side of holding station 5 with stripping unit 11.Separately Outside, standby in the top of holding station 5 with cutting unit 9.
In addition, the adhesive tape volume 28A for being loaded on the supply position with supply unit 17 certainly is downstream released and supply belt isolation The adhesive tape TS of film, it is adhesive tape T and isolation film S that band TS, which is stripped the stripping of unit 31,.Then, adhesive tape T is by band application unit 7 It is guided with band stripping unit 11.
Next, as shown in (b) of Fig. 8, adhesive tape T is pressed downwards one by the Sticking roller 7b with application unit 7 on one side While (being in fig. 8 left direction) rolls forwards on wafer W, to from initial position shown in dotted line to end shown in solid End position moves.Adhesive tape T is glued to the whole surface (step S2) of wafer W as a result,.
After adhesive tape T is glued to wafer W, as shown in figure 9, standby band cutting unit 9 declines above, and from Initial position shown in dotted line is moved to off-position shown in solid.Also, by making band cutting unit 9 under off-position Drop, to which cutter 9c pierces through adhesive tape T in the cutter traveling slot 5a of holding station 5.
After cutter 9c pierces through adhesive tape T, supporting arm 9b is rotated using vertical axis P as rotation center.Along with this, Cutter 9c movings in rotation on one side be slidingly contacted at wafer outer peripheral edge while and adhesive tape T is cut off (step along the shape of wafer S3)。
After completing along the shape cut-out adhesive tape T of wafer, original position of readiness is risen to cutting unit 9. Then, band 7 self terminal position of application unit is returned to initial position.Application unit 17 is returned to initial position, also, such as Figure 10 Shown such, (being in Fig. 10 right direction) is mobile forwards for band stripping unit 11.That is, with stripping unit 11 in Fig. 10 from point Initial position right direction shown in line is moved to terminal location shown in solid.
Rolled while being moved to terminal location with stripping unit 11 and remove it is in adhesive tape T, cut on wafer W Descend and cut off and left behind should not be with Tn (step S4).In addition, for surface in adhesive tape T, being pasted on wafer W Part, mark reference numeral Tw, with not distinguished with Tn.
After the end position that stripping unit 21 reaches overburden operation, band stripping unit 11 is from end position to initial bit Set return.At this point, be not wound with Tn, and guided and recycled to band recoverer 13, and included supply unit 17 release it is constant The band TS (step S5) of amount.
At the end of until being managed everywhere in step S5, the absorption of holding station 5 is released.After absorption releases, it is pasted with bonding Wafer W with Tw is conveyed by wafer conveying mechanism and is recovered to wafer recoverer (step S6) (not shown).More than, it completes 1 adhesive tape joining processing.
In addition, after completing adhesive tape joining processing, according to the band TS's for being configured at the supply position with supply unit 17 Adhesive tape rolls up the loadings of 28 (supply bands) and branches out process below.It is predetermined in the loadings of supply band In the case of specified amount is below, the automatic replacement (step S7) with TS is carried out.Confirming that supply is used using various sensors etc. The loadings of band be specified amount more than after, be repeated in above-mentioned action.
Illustrate the replacement process of band
Here, illustrate step S7, automatically replace the process with TS.It is specified amount or less in the loadings of supply band In the case of, shown in the flow chart of the replacement process of the band of step S7 according to (b) of Fig. 7, step S7-1~step 7-8 Process carries out.Process shown in (b) by Fig. 7 is configured at the adhesive tape volume 28 of the supply position with supply unit 17 by more The front end of (upstream side) with TS of the rear row for being changed to new adhesive tape volume 28, and releasing from new adhesive tape volume 28 and in advance The rear end of (downstream side) with TS is automatically joined together.
In addition, in the embodiment with supply unit 17, illustration will initially be configured with spool 25A in supply position and glue Crossed belt rolls up 28A and is that specified value adhesive tape below rolls up the case where 28A is changed to new adhesive tape volume 28B by loadings.
Step S7-1 (formation of handle part)
When executing the replacement of band, executes and form the process that unit 19 forms handle part in adhesive tape T using handle part. The initial position for holding each structure that portion forms unit 19 is as shown in Figure 3.That is, being stripped unit 31 with TS has removed isolation film S, from And the adhesive surface exposure of adhesive tape T.The bonding surface side that component 33 is configured at adhesive tape T is released, press bonding roller 35 is configured at adhesive tape T Non-adhering surface side.
In step S7-1, first, as shown in figure 11, inner panel 33c is independently moved to direction R relative to shell 33a And above push away protrusion 33b.Above push away protrusion 33b by inner panel 33c, to protrusion 33b front end by from shell 33a to It releases outside.
Next, in the state that the front end of protrusion 33b is released from shell 33a to outside, make release component 33 move in a directionr.As a result, as shown in figure 12, a part (adhesive tape Tp) of adhesive tape T is by protrusion 33b to conduct It is released with the direction R of release direction L generally perpendicular directions.
In the state of after protrusion 33b releases adhesive tape Tp to direction R, shell 33a is connected to be prolonged in directionl The adhesive tape T stretched.Therefore, it is possible to the position offset direction R for avoiding protrusion 33b from being pushed.It is further preferred, that in protrusion Portion 33b by adhesive tape Tp to direction R release after in the state of, the adhesive tape T released in directionl is with by shell 33a and pressure The mode that roller 35 is clamped is closed to keep.
In this case, can avoid when protrusion 33b releases adhesive tape Tp to direction R adhesive tape T in addition to viscous The extending direction offset direction L of part other than crossed belt Tp.Thus, it is possible to avoid generating the formation mistake of aftermentioned handle part H, The shapes and sizes of handle part H with it is originally envisaged that shape difference etc. as situation.
After being released adhesive tape Tp to direction R using release component 33, the adhesive tape Tp after release is by press bonding roller 35 It presses and forms handle part H.Specifically, first, as shown in figure 13, press bonding roller 35 is being released in a manner of close to each other respectively It is moved round about respectively on the L of direction.As a result, the non-adhering face of the adhesive tape Tp after being released to direction R is by press bonding roller 35 From sandwich.
After adhesive tape Tp is clamped by press bonding roller 35, as shown in figure 14, inner panel 33c above pushing away to protrusion 33b is released, The elastic component 33d of stretching is set to restore to the original state, thus protrusion 33b is incorporated in the inside of shell 33a.
Protrusion 33b leaves adhesive tape T because of storage, therefore can be pressed to adhesive tape Tp.That is, such as Figure 15 institutes Show, the both sides crimping adhesive tape Tp of 35 further auto-adhesive tape Tp of press bonding roller.In addition, while crimping adhesive tape Tp, make release Component 33 leaves adhesive tape T.As a result, the adhesive surface of adhesive tape Tp is formed handle part H by pressing each other.
In this way, keeping adhesive tape Tp prominent to direction R in defined handle part forming position Tf, further in release direction L On adhesive tape Tp is clamped and crimped from opposite directions, handle part is consequently formed.As a result, the shape of handle part H at For in the region of the length Pa of the adhesive tape T released in directionl to the shape of the prominent length Pb of direction R.Also, release direction Length Pa on L is length shorter in the thickness degree of adhesive tape T, on the other hand, for direction L generally perpendicular directions It can be correspondingly set as arbitrary length by the length Pb on R according to the shape of protrusion 33b.
Step S7-2 (being bonded again for isolation film)
After being formed with handle part, carry out isolation film is bonded operation again.That is, as shown in figure 16, making to be wound with isolation Front (left direction of Figure 16) of the feed rolls 39 of film S on the release direction L of adhesive tape T rolls.At this point, feed rolls 39 are constituted Formation to cross adhesive tape T rolls with having the specified position Tf of handle part H.
By making the initial position shown in the dotted line of feed rolls 39 be rolled to terminal location shown in solid, to be isolated Film S is adhered to again within the scope of the specific length of adhesive tape T of the base end part comprising handle part H.By the way that isolation film S is adhered to handle The base end part of portion H is held, can be prevented peeling-off between the adhesive surface for forming handle part H of adhesive tape T.As a result, energy It enough prevents the stripping between the adhesive surface of adhesive tape T from leading to the breaking-up of handle part H, therefore can more stably maintain to hold Portion H.
Step S7-3 (submitting of handle part)
After being bonded terminate again of isolation film, the submitting operation of handle part is carried out.That is, by releasing band TS, thus will Handle part H passes out to band engagement unit 21.In embodiment, closer to adhesive tape volume 28 position carry out cut-out with TS with Engagement, therefore, the position with engagement unit 21 are configured to be located at position (Fig. 1) more by the upstream than handle part forming position Tf.Cause This, as shown in figure 17, by making the release direction with TS be fallen back from direction L to direction Lr, thus by handle part H self-formings position Tf upstream sends out and is moved into band engagement unit 21.
Step S7-4 (holding of handle part)
As shown in (a) of Figure 18, forms unit 19 from handle part and be moved to the handle part H after being sent out with engagement unit 21 It is formed in the position of the clearance portion 46 of holding unit 45.After sending out handle part H to band engagement unit 21, handle part is carried out Holding operation.That is, as shown in (b) of Figure 18, by making holding unit 43 and holding unit 45 be moved to direction R, to profit With holding unit 43 and holding unit 45 come clamping band TS.It is clamped by using each unit, to prevent on release direction L Band TS dislocation.At this point, holding unit 43 carries out absorption holding to isolation film S.
In addition, holding unit 45 carries out absorption holding to adhesive tape T.It is kept by the absorption, band TS is more stably protected It holds.Then, the holding for being carried out handle part H using holding unit 45 while to being clamped with TS is operated.That is, such as Figure 18 (c) shown in, component 45a and component 45b is made to be moved round about each other on release direction L, in clearance portion 46 handle is clamped The mode for holding portion H is held.Since handle part H is to the prominent specific length with release direction L generally perpendicular directions, By holding handle part, holding unit 45 can more stably keep adhesive tape T.
Step S7-5 (cut-out of leading band)
After keeping handle part, the rupturing operation of leading band is carried out.Leading band refers to that autogamy is placed in supply position The band TS that adhesive tape volume 28 (rolling up 28A in embodiment for adhesive tape) is released.That is, as shown in Figure 19, making knife unit 41 Movable table 41a driven to direction R, and make cutter 41b pierce through band TS.
Then, by making movable table 41a be driven to the width direction with TS, to which cutter 41b is in reference number C institute The specified position shown cuts off leading band TS in the range of being in width direction.Leading band is cut off by using cutter 41b, to Leading band TS auto-adhesive tapes volume 28A is cut off.Also, it is formed in the rear end of leading band TS for rolling up 28 with from new adhesive tape The end section that the band of releasing engages.
Step S7-6 (stripping with rear end in advance)
After cut-out in advance band, the strip operation with rear end in advance is carried out.That is, as shown in figure 20, make to isolation film S into The holding unit 43 that row absorption is kept and the holding unit that absorption holding is carried out to adhesive tape T and handle part H is kept 45 leave in the opposite direction in a directionr respectively.By making Unit two leave while maintaining hold mode, to formerly The rear end Ba of capable band TS makes adhesive tape T and isolation film S strippings.
It is different from the previous structure that a face with TS is adsorbed and removed, in embodiment, become such as lower structure, That is, being formed to relative to the handle part H outstanding of the face generally perpendicular direction with TS, holding unit 45 keeps the handle part.With The structure that absorption holding is carried out to a face is compared, and is held and is kept the structure to generally perpendicular direction handle part H outstanding Band TS can more stably be kept.Therefore, in the structure of embodiment, even if the bonding force between adhesive tape T and isolation film S In the case of stronger, also adhesive tape T and isolation film S can be made to be reliably peeled in the rear end of leading band.
Step S7-7 (switching of adhesive tape volume)
After the rear end for having removed leading band, the handover operation of adhesive tape volume is carried out.That is, as shown in each figure of Figure 21, The swivel plate 23 with supply unit 17 is set suitably to rotate, the adhesive tape to handover configurations in supply position rolls up 28.Pass through swivel plate 23 rotation is configured at adhesive tape volume 28A ((a) of Figure 21) switchings that the adhesive tape volume 28 of supply position reduces from loadings 28B ((b) of Figure 21) is rolled up for the enough adhesive tapes of loadings.
In addition, in Figure 21 and later figure, the band holding member 27 to being provided to spool 25A marks reference numeral 27A, right The band holding member 27 for being provided to spool 25B marks reference numeral 27B, to be distinguished to the two.In addition, in Figure 22 and Figure 23 In, reference numeral a is marked respectively after the reference numeral of the band TS of leading band, adhesive tape T and isolation film S, in rear row band Band TS, adhesive tape T and isolation film S reference numeral after respectively reference numeral b, to be distinguished to the two.
Step S7-8 (releasing of rear row band)
After the switching for completing adhesive tape volume, the releasing operation of row band after progress.In the bonding that will be located at supply position At the time of band cut roll is changed to adhesive tape volume 28B, front end of the rear row with TSb is held in holding member 27B ((a) of Figure 22). Therefore, in order to make band TSa in advance and rear row band TSb engage, auto-adhesive tape rolls up row after 28B is released via band holding member 27B With TSb ((b) of Figure 22).As a result, rear front end Fw of the row with TSb is released to and can connect with the rear end Ba of leading band TSa The position of conjunction.
Step S7-9 (engagement of band)
After row band is fully released by after, the bonding operation of band is carried out.That is, as shown in (a) of Figure 23, absorption is made to protect It holds the holding unit 43 of isolation film Sa and absorption remains the holding unit 45 of adhesive tape Ta and moved to direction R, using leading Adhesive tape Ta and isolation film Sa come front end Fw of the row with TSb after being clamped.After being clamped, the rear end of adhesive tape Ta with It is engaged, is thus completed leading between the front end of adhesive tape Tb and between the rear end of isolation film Sa and the front end of isolation film Sb With TSa and rear row with the engagement between TSb.
In embodiment, as shown in each figure of Figure 22, it is included in the front end with TS and is pasted with by taking double-sides belt as an example in advance The structure of jointing material g.Therefore, rear end and the isolation of the front end and isolation film Sa of the rear end of adhesive tape Ta and adhesive tape Tb The front end of film Sb is kept unit 43 and the pressing of holding unit 45 and is engaged by jointing material g.
After completing in advance with TSa and rear row with the engagement between TSb, as shown in (b) of Figure 23, make holding unit 43 It is returned to initial position shown in solid with holding unit 45.Then, two bands after engagement are released to direction L.More than, it is complete At a series of action of step S7.That is, automatically carry out auto-adhesive tape volume 28A be changed to adhesive tape volume 28B operation, with And the engagement between the end of the band TSb of the band TSa and auto-adhesive tape volume 28B releasings of auto-adhesive tape volume 28A releasings.
In addition, in step S7-7, automatically supplying position and switching to the adhesive tape volume 28A of position of readiness can pass through and do not scheme The shutter door shown is removed to the external of adhesive tape joining apparatus 1.Also, operator will be new while removing adhesive tape and rolling up 28A Adhesive tape volume 28C be set to position of readiness.In the case where adhesive tape rolls up the loadings reduction of 28B, step S7 is carried out again Each process, thus, it is possible to automatically carry out auto-adhesive tape roll up 28B band TS to adhesive tape roll up 28C band TS switching.It is tied The operation of operator can be greatly decreased in fruit.
Explanation with recovery process
Next, in step S5 etc., illustrating should not be with the specific action of Tn with the recycling of recoverer 13.(c) of Fig. 7 is pair With the recycling of recoverer 13 flow chart illustrated is not acted respectively with recovery process with Tn.In addition, with 13 institute of recoverer Including each structure initial position it is as shown in Figure 5.In addition, in band recovery unit 57, recycling bins F1 is configured at recovery position Fc, recycling bins F2 are configured at position of readiness Fs.
Step S5-1 (pull-out of band)
In the band recovery process of embodiment, first, the pulling operation of band is carried out.It is recycled to band that is, roller 50 will be guided What portion 13 guided not pull out specific length with Tn.Specifically, as shown in (a) of Figure 24, band holding member 51 is from dotted line institute The initial position shown is moved to terminal location shown in solid.As long as terminal location be released should not with the position of Tn, It can suitably set.
To terminal location move with holding member 51 keep to recoverer 13 guide should not be with Tn.In embodiment In, as shown in (b) of Figure 24, become with lower structure, i.e., by making holding member 51b should not can on the thickness direction with Tn It is dynamic, and clamped from surface and this both sides of the back side and keep should not be with Tn.As long as band holding member 51 is that stably keep should not band The structure of Tn, however it is not limited to the structure held using holding member 51b, band holding member 51 or to should not The structure etc. of absorption holding is carried out with Tn.
Then, as shown in (c) of Figure 24, band holding member 51 remain should not be with Tn in the state of self terminal position to Initial position returns.By making band holding member 51 return to initial position, thus should not be with Tn by shown in reference numeral M Direction pulls out the specific length K until initial position is played in self terminal position.In embodiment, direction M is configured to horizontal direction, But direction M can be suitably changed.
Band (is remained flat condition) by step S5-2
After it not be drawn out specific length with Tn, pull-out flat state is not remained into Tn.That is, as schemed Shown in 25, make to move from initial position shown in dotted line to absorption position shown in solid with pressing member 53.
It then, should not band to what is be drawn out by the entire back side flat possessed by pressing plate 53b with pressing member 53 Tn carries out absorption holding.At this point, not be maintained as flat state in release direction and width direction with Tn.In addition, will Flat structure is not remained with Tn to be suitably changed, and as an example, can also be applied is had in pressing plate 53b The flat back side outer peripheral portion to not carried out with Tn absorption holding structure.
Band (is cut into individual) by step S5-3
After it not remain flat condition with Tn, band is cut into individual.That is, as shown in (a) of Figure 26, make knife Tool unit 55 from shown in dotted line initial position along should not the thickness direction with Tn moved to off-position shown in solid.With Afterwards, cutter 55b off-position puncture should not be with Tn.Later, by make movable table 55a to should not be with Tn width direction ( It is the directions z in figure) it is mobile, to which cutter 55b not cut into individual with Tn.In addition, however it is not limited to make cutter 55b in the side R Move up and pierce through should not be with the rear structure moved to width direction of Tn.As an example, such as (b) institute of Figure 26 Show, or by make should not the side with Tn standby cutter 55b make to cut to not moving with the width direction of Tn The point of a knife of knife 55b will not cut into individual structure with Tn.In this case, can omit makes movable table 55a be moved to direction R Dynamic structure.
Step S5-4 (storage of individual band)
After pull-out not be individual with Tn and by the partial cut after the pull-out, the stowing operation of individual band is carried out. First, so that knife unit 55 is returned to initial position, and release with holding member 51 to should not be with the holding of Tn.Then, such as Figure 27 It is shown, make with pressing member 53 absorption remain be cut into individual should not be with Tn in the state of further decline.
What is had dropped is moved to the bottom of recycling bins F1 shown in solid with the absorption position shown in the dotted line of pressing member 53 Near face.Then, released near the bottom surface of recycling bins F1 not keep with the absorption of Tn.Be released from absorption keep should not With Tn with flat state be accommodated in the bottom surface of recycling bins F1 or be accommodated in be accommodated in recycling bins F1 should not with Tna it On.
Due near the bottom surface of recycling bins F1 or not releasing near the upper surface with Tna of having stored is flat should not Absorption with Tn is kept, therefore can will be cut into not being laminated and being stored with flat state respectively with Tn after individual. That is, desorb certainly holding play store with being stacked until in a period of, not sent out with Tn for individual can be avoided The deformations such as raw bending.
If in addition, can not will be laminated respectively with flat state with Tn, it is not limited in the bottom surface of recycling bins F1 Neighbouring etc. the structure for desorbing holding.That is, it is further preferred that is had dropped remains absorption not with pressing member 53 With Tn guarantor is desorbed in the state of pressing on the bottom surface of recycling bins F1 or pressing on the surface that should not be with Tna stored It holds.Will be cut into individual should not with Tn be laminated be accommodated in recycling bins after, make band pressing member 53 rise and return Return initial position.
Later, according to stored in the recycling bins F1 for being configured at recovery position Fc should not the amount with Tn whether be advance More than determining specified amount correspondingly make process branch.In the case of insufficient specified amount, return to step S5-1 and repeat into The a series of action of row step S5-1~step S5-4, with continue should not be with the recycling of Tn.More than for specified amount In the case of, S5-5 is entered step, the switching of recycling bins F is carried out.
Step S5-5 (switchings of recycling bins)
In the case where carrying out the switching of recycling bins F, as shown in figure 28, make the turntable 58 for being placed with recycling bins F respectively It is rotated around central axis V.By the rotation of turntable 58, to be accommodated with specified amount or more should not the recycling bins F1 with Tn from Recovery position Fc is moved to position of readiness Fs.On the other hand, empty recycling bins F2 is moved to recovery position Fc from position of readiness Fs.
By the way that the recycling bins F for being configured at recovery position Fc is switched to recycling bins F2 from recycling bins F1, can by individual Recycling bins F2 is not accommodated in Tn.That is, by the recycling bins F1 for being configured at recovery position Fc be switched to empty recycling bins F2 it Afterwards, return to step S5-1 and start again at should not be with the recovery process of Tn.
Also, in embodiment, can on one side start again at should not be with Tn recovery process while be performed for more than and allowed The replacement operation of the recycling bins F of amount.That is, as shown in figure 29, operator will be moved into position of readiness by opening shutter door 59 Recycling bins F1 afterwards is fetched into the outside of adhesive tape joining apparatus 1.Then, operator is using empty new recycling bins F3 as recycling The replacement of case F1 is placed in the position of readiness Fs on turntable 58.
Position of readiness Fs is configured to be located at than recovery position Fc further from the position of the central portion with sticker 1.Therefore, Operator can be avoided in the taking-up and replacement of the recycling bins F after be moved to position of readiness Fs close to high-temperature portion, movable Portion etc..
In addition, recycling bins F2 can be kept mobile to recovery position Fc and started again at should not be with the state of the recycling of Tn It is lower that recycling bins F1 is changed to recycling bins F3.That is, other than making the process that turntable 58 rotates, it is not necessary to make with recoverer 13 Action stops, therefore is capable of the running efficiency of elevator belt recoverer 13.
Illustrate the action of isolation film recoverer
Here, illustrating the action of isolation film recoverer 15.The structure of isolation film recoverer 15 shown in fig. 6 with such as Fig. 5 institutes Show be with recoverer 13 it is common, the action of isolation film recoverer 15 is also common with the action with recoverer 13.
Draw to isolation film recoverer 15 that is, being stripped the isolation film S that 31 auto-adhesive tape T of unit has been removed and being guided roller 60 It leads.Isolation film holding member 61 holds the end of isolation film S being guided and by the end of isolation film S to predefining Direction (being in embodiment the left direction of Fig. 6) pull out specific length.
After pulling out isolation film S, isolation film pressing member 63 is made to decline.Then, by the entire flat of pressing plate 63b Face remains the isolation film S absorption of pull-out with flat state.The cutter 65b of knife unit 65 will stay in that flat state Isolation film S cut into individual.
Isolation film pressing member 63 cuts into individual isolation film S state and further declines to adsorb, and is moved to and matches It is placed near the bottom surface of recycling bins G1 of recovery position Gc.Then, isolation film pressing member 63 is near the bottom surface of recycling bins F1 The absorption for releasing isolation film S is kept.The isolation film S that absorption is kept is relieved to be stacked on one another with flat isolation film S the shape of multilayer State is accommodated in recycling bins G1.
After being accommodated in isolation film S in recycling bins G1 with flat state, knife unit 65 and isolation film is made to press Component 63 returns to initial position, repeats isolation film S being cut to individual later and stored with being laminated with flat state The process come.In the case where it is specified value or more to be configured at the isolation film storage amount of recycling bins G of recovery position Gc, make rotation Platform 68 makes recycling bins G2 be moved to recovery position Gc around central axis W rotations, starts again at the recycling work of isolation film S later Sequence.
Operator opens shutter door 69 and takes out the recycling bins G1 moved from recovery position Gc to position of readiness Gs, and will be new Recycling bins G be configured at position of readiness Gs.In the recovery process of such embodiment, the process in addition to making turntable 68 rotate In addition, it is not necessary to the action of isolation film recoverer 15 be made to stop.That is, even if replacing the recycling bins that storage amount has been more than specified value In the case of, the action for carrying out isolation film recoverer 15 is also can continue to, therefore the operating effect of isolation film recoverer 15 can be promoted Rate.
The effect of the structure of embodiment
In embodiment, make a part for leading adhesive tape substantially vertical to the release direction relative to the adhesive tape Direction is prominent and forms handle part, and the partial cut of rear end side will be leaned on than the handle part.Then, in the state that remain handle part Under, keep adhesive tape and isolation film mobile to the direction left at the rear portion of leading band and removes the two.Finally, row band after making Front is moved between the leading adhesive tape and isolation film after stripping, is clamped and is connect using leading adhesive tape and isolation film The front of row band after conjunction.
As the previous methods for making different bands automatically engage each other, method as following can be enumerated.That is, As shown in (a) of Figure 30, first, leading adhesive tape Ta is adsorbed using adsorption element J.Then, as shown in (b) of Figure 30 that Sample makes leading isolation film Sa and adsorption element J carry out leaving movement, to make isolation film Sa and adhesive tape Ta strippings.Finally, Using the rear portion of the adhesive tape Ta removed and the rear portion of isolation film Sa come front of the row with TSb after being clamped and engaging.
However, in such previous automatic joint method, the bonding force of adhesive tape Ta is stronger, adhesive tape Ta be isolated The adsorption capacity of bonding force between film Sa sometimes more than adsorption element J.In this case, as shown in (c) of Figure 30, even if making suction Attached component J carries out leaving movement, can not also make the rear portion of adhesive tape Ta and the rear portion stripping of isolation film Sa, to be difficult to carry out elder generation Row is with TSa and rear row with the engagement between TSb.
Relative to such previous method, in embodiment, as shown in (d) of Figure 30, holding member N remains on one side Handle part H carries out leaving movement on one side.Since handle part H is a part of adhesive tape Ta, though make holding member N into Row leaves movement, and handle part H auto-adhesive tapes Ta can also be avoided to be broken.
In addition, handle part H becomes in the region of the length Pa of adhesive tape T released in directionl protrudes length along direction R The shape of Pb.Length Pa is as length shorter in the thickness degree of adhesive tape T.Therefore, by making holding member N remain handle It holds portion H to carry out leaving movement to direction R, stronger tractive force can be made to act on the narrow range Pa on release direction L It is interior.The edge surface as a result, it is possible to tremendous improved between adhesive tape Ta and isolation film Sa acts on per unit area Power size.Thus, it is possible to make adhesive tape Ta and isolation film Sa be reliably peeled in the leading rear end Ba with TSa.
On the other hand, for the length Pb on the R of direction, can according to the shape for the protrusion 33b for releasing adhesive tape T come by It is correspondingly set as arbitrary length.That is, due to can length Pb be set to long enough, holding member N can be reliable And firmly hold handle part H.After more reliably avoiding generating such, leading band shown in (c) of Figure 30 Hold the stripping mistake of Ba.
Also, since handle part H is with sufficient length to direction R shapes outstanding, as holding member N, energy Enough it is applicable in diversified structure.As one example, the structures such as manipulator can be applicable in.Therefore, holding member N can be more Handle part H is stably kept, and adhesive tape T can be directed at while remain handle part H and execute complicated and accurate operation.
In addition, by a part of adhesive tape T being released to direction R and on release direction L from that in specified position Tf This opposite direction carries out pressing such shirtsleeve operation to a part of the adhesive tape T after release, can be in the specified position Form handle part H.Thus, it is possible to promote the positional precision of the forming position Tf of handle part.
In addition, in embodiment, in the case where recycling unwanted adhesive tape, isolation film, by the adhesive tape etc. of lengthwise Individual is cut into specific length.Then, individual adhesive tape of cut-out etc. is laminated and is received with the flat state extended It receives.
In previous recovery method as shown in Figure 33, in band recoverer, by lengthwise should not with it is equal wound on It is recycled on axis.In such previous structure, being wound recycle should not band amount be more than constant basis the case where Under, first, make device operating stop after cut-out should not band, wound into rolls is recovered should not band together with axis one It rises and takes out and replace with new axis.Then, by upstream should not band be wrapped on new axis and be attached and then secondary beginning Operating.
In conventional structure, it needs to carry out the operation of this series of complexity, therefore, the burden of operator with manually Increase.In addition, due to needing to make the operating of device to stop for a long time, therefore, it is difficult to promote operating efficiency.In addition, winding and returning In the structure of receipts, therefore the wireline reel for needing setting large-scale also worries adhesive tape joining apparatus enlargement this problem.
As without using wireline reel recycle lengthwise should not with etc. structure, alternatively it is conceivable to by the band of lengthwise It cuts into individual and the band of individual shape is launched to the method stored into recycling bins.However, in the structure of such comparative example In, worry to make operating efficiency reduce this problem due to recycling frequency and rising.
Research is repeated for such a problem, finally, it is found that the deformation institute of this band for being turned off into individual shape It is caused.That is, the tape wrapping due to lengthwise in multiple guide reels etc. and is guided, if the lengthwise belt is cut into individual, Then the strap of individual shape is easily deformed the shape for bending.Therefore, as shown in (a) of Figure 31, when by individual shape should not be with Tn Launch when being recycled in recycling bins F, in the inside of recycling bins F, can be deformed into Tn it is curly etc. variously-shaped, because This, multiple are not contained with Tn with mixed and disorderly state.
In this case, it is accommodated in not comparing comparatively fast with rising with the height Hn that Tn accumulates in recycling bins F.That is, due to Relative to should not should not be larger with the volume shared by Tn for the storage amount with Tn, therefore, the replacement frequency of recycling bins F rises, As a result, the running efficiency of device is made to reduce.In addition, due to it is each should not the shape with Tn be it is constant, the height of accumulation The rate of climb for spending Hn is uncertain.Accordingly, it is difficult at the time of predicting taking-up recycling bins F and replaced, thus it is very difficult to hold The planned operation of row.
On the other hand, in the present application, as shown in (b) of Figure 31, by lengthwise should not be with Tn flatly to expand The state of exhibition is cut into after individual, makes not being laminated and store with Tn for individual shape while maintain the flat state In in recycling bins.In the structure of such the present application, due to not being laminated neatly and economically with Tn, Relative to being suppressed in minimum limit with the volume shared by Tn for the storage amount with Tn.Since recycling can be reduced The replacement frequency of case F, therefore it is capable of the running efficiency of significantly lifting device.In addition, due to the height Hn that do not accumulated with Tn The rate of climb become it is constant, therefore, easily perform planned operation.
Present invention is not limited to the embodiments described above, and can be implemented in a manner of deformation as described below.
(1) in embodiment, it has been illustrated and is suitably removed in rear end the adhesive tape T for being formed with handle part is hold Adhesive tape T and isolation film S and the process for making the end with TS engage each other.But using being formed with the viscous of handle part The method of crossed belt T is not limited to adhesive tape joint method.That is, the process that handle part H is formed in adhesive tape T can be suitable for The processing method of adhesive tape for the method that the adhesive tape for the lengthwise released is conveyed to specified position, diversified. Here, " conveying " is not limited to convey the action of entire adhesive tape, also include the adhesive tape for making to have handle part a part to The action of specified position movement.
The process for conveying adhesive tape to specified position by handle part is as follows.First, make to release on release direction L One Tp of adhesive tape is to prominent (referring to Fig.1 2) relative to direction L generally perpendicular directions R.Next, utilizing press bonding roller 35 The Tp (3 and Figure 14 referring to Fig.1) to direction R adhesive tapes outstanding is pressed from direction L and the direction opposite with direction L. The pressing as a result, being formed with handle part H (referring to Fig.1 5) of the part with adhesive tape T to direction R shapes outstanding.With Afterwards, by holding handle part H (8 (d) referring to Fig.1), to which adhesive tape T be conveyed to specified position (with reference to Figure 20).
As shown in (c) of Figure 15 and Figure 30, handle part H have defined handle part forming position Tf to adhesive tape T Release direction generally perpendicular direction R shapes outstanding.Due to that can be redefined for arbitrarily to the prominent length Pb of direction R And sufficient length, therefore can easily and securely keep handle part H.Also, the adhesive tape of the lengthwise extended in directionl In T, the target in process object region can be to easily and reliably confirmed to be to direction R handle part H outstanding.Thus, it is possible to The position actually handled on the adhesive tape T of lengthwise is reliably avoided to deviate scheduled position.
On the other hand, the length Pa on the release direction L of handle part H is length shorter in the thickness degree of adhesive tape T. In addition, releasing the position of component 33 by suitably setting, the positional precision of handle part forming position Tf can be further promoted.Cause This, various processing are carried out by remain handle part H to adhesive tape T, and so that the component of wide cut is abutted and are adsorbed the knot of adhesive tape T Structure, the structure etc. directly picked in the adhesive tape T of the direction L lengthwises extended are compared, can be on the adhesive tape T of lengthwise critically Setting is related to the region of processing operation.
Especially, the structure of the handle part of the present embodiment is formed various to having the one-side band of adhesive layer to carry out in single side Advantageous effect is especially played in the case of processing.That is, as shown in figure 12, by using releasing component 33 etc., to make to putting The non-adhering surface side (being in fig. 12 upside) of the adhesive tape T for the lengthwise shape that outgoing direction L is released is prominent to direction R.Then, it utilizes Press bonding roller 35 is clamped from non-adhering surface side and presses a Tp of the adhesive tape highlighted and form handle part H.
At this point, press bonding roller 35 is crimped on the non-adhering face of adhesive tape T, therefore, it is possible to not glued to press bonding roller 35 Conjunction avoids press bonding roller 35 from being bonded in adhesive tape T in the case of handling.In addition, since press bonding roller 35 is from release direction L and and the party The direction opposite to L is pressed, thus handle part H suitably become to direction L generally perpendicular directions R shapes outstanding Shape.
Also, after forming handle part H, handle part H is held by using holding unit 45 etc., to relative to viscous Crossed belt T executes the various processing (Figure 19 and Figure 20) such as conveying, cut-out and stripping.Since handle part H is with the non-stick of adhesive tape T The mode that conjunction face is located at outside is prominent to direction R, and therefore, holding unit 45 holds the non-adhering face of adhesive tape.Thus, it is possible to Holding unit 45 is avoided to be bonded in adhesive tape T without not adhesion process.
Also, it by forming handle part H and holding handle part H, can be set as holding unit 45 being only set to adhesive tape T A face structure.In general, in the case where holding adhesive tape to convey etc., the surface side and the back of the body in adhesive tape are needed This both sides of surface side are arranged handle sturcture and adhesive tape are clamped from surface and the back side.As a result, from the sight of the size for occupying part etc. Point considers, can limit structure, the purpose of handle sturcture.
On the other hand, in the present invention, due to can holding unit, energy only be arranged in handle part that face outstanding Enough make the part smaller shared by holding unit 45, and the structure of holding unit 45 can be simplified.In addition, capableing of auto-adhesive tape T's One face firmly holds the adhesive tape and acts on stronger power to adhesive tape T to a defined direction.
Thus, it is possible to which the application architecture to be suitable for to be pasted on the process of the adhesive tape stripping of wafer, makes to put The process etc. of the linear shape change of the band of lengthwise is gone out.In this case, relative to the band for being formed with handle part, make holding list Member close to the band and holds the handle part from the single side of the band, makes the part including at least handle part in band to arbitrary position Mobile, thus, it is possible to suitably complete above-mentioned each process.
(2) in embodiment and each variation, using adhesive tape joining apparatus illustrate the present invention band engagement device and Band retracting device, but the present invention can also be used in sticker with engagement device and with retracting device except it is a variety of more The tape processing unit of sample.As the example of tape processing unit, can enumerate will be pasted on the band stripping of the various bands stripping of wafer Device or the mounting device (installing mechanism) etc. used in order to which wafer is installed on ring frame.
(3) it in embodiment and each variation, in the process for forming handle part H, is released by using protrusion 33b viscous Crossed belt T is prominent to direction R to make a part of adhesive tape T, but the structure for forming handle part H is not limited to this.That is, can also It is, by pulling out a part of adhesive tape T to outside, to keep a part of adhesive tape T prominent to direction R.As pull-out Structure example, can enumerate the part that adhesive tape T is held and pulled out using the component of manipulator shape structure, use Vacuum plant etc. adsorbs and pulls out the structure of a part of adhesive tape T.
(4) it in embodiment and each variation, is disposed in the volume of the adhesive tape with supply unit 17 28 and is not limited to two, also may be used To be arranged three or more.In addition, for the recycling bins G of the recycling bins F with recoverer 13 and isolation film supply unit 15, or Three or more structures are arranged.
(5) in embodiment and each variation, handle part H makes the adhesive tape T after stripping protrude, but forms handle part H's Place is not limited to the sides adhesive tape T with TS.That is, can also be that the isolation film S after stripping is made to protrude, at the place of isolation film S Side forms handle part H.
As the structure for forming handle part H in the place side of isolation film S, enumerate come from opposite direction crimp it is prominent to direction R Isolation film S after going out and apply heat, method that ultrasonic wave and making engages the isolation film S highlighted between is (with reference to scheming 12).It is ordered into order between to isolation film Ss of the direction R after prominent in a manner of stapler as other methods, enumerating Fastener for staple and the method engaged.Alternatively, it is also possible to be, band TS in, the place side of adhesive tape T and every This both sides of place side from film S are respectively formed handle part H.
(6) in embodiment and each variation, in each process of step S5-2~step S5-4 with recovery process, It should not be with Tn to adsorb using the entire flat horizontal surface of pressing plate 53b.But flatly expand as long as can not be remained with Tn The state of exhibition is then not limited to such structure.As other examples, it enumerates at four angles of the flat horizontal surface of pressing plate 53b Be arranged adsorption hole, using four angles come adsorb keep should not be with the structure of Tn.In addition, however it is not limited to the structure of holding is adsorbed, It can also be applied with lower structure etc.：It should not be flat to not remained with Tn with Tn to clamp by using mechanical structure State.
(7) in embodiment and each variation, the process for making to engage with TSb with TSa and rear row in advance of step S7-9 It is not limited to such, capable with TSb's after releasing in the state of securing the position with holding member 27 shown in (b) of Figure 22 The structure of front end Fw.That is, can also go after maintaining to remain with holding member 27 the front end Fw with TSb state while put Row band TSb after going out.
(8) in embodiment and each variation, as shown in (a) of Figure 22, the front end of the band TS of new adhesive tape volume 28 is The structure being clamped with holding member 27 by two, but it is not limited to this.That is, as shown in (a) of Figure 32, more preferably following knot Structure：It is in advance isolation film S and adhesive tape T by the part stripping of the front end with TS, the adhesive tape T removed is wound in one The isolation film S removed is wound in another band holding member 27 by band holding member 27.
In such variation, the case where so that the leading front of the rear portion with TSa and rear row with TSb is engaged Under, as shown in (b) of Figure 32, make after hold the band holding member 27 of front end Fw of the row with TSb together with front end Fw to putting Outgoing direction moves.Then, so that the rear portion of leading adhesive tape Ta and the front of the adhesive tape Tb of rear row is engaged, and make leading The front of the isolation film Sb of the rear portion of isolation film Sa and rear row engages.
It can make the area bigger being in contact in advance with TSb with TSa and rear row in the bonding process of such variation, Therefore two bands can be made to be securely engaged.Also, since adhesive surface of the rear row with TSb is exposed to outside, pass through Front end of the row with TSb after being clamped using leading band TSa, adhesive surface of the rear row with TSb to expose can be with leading band TSa Adhesive surface suitably contact.As a result, it is possible to further increase the power for making two bands engage.
(9) in embodiment and each variation, the process for making to engage with TSb with TSa and rear row in advance of step S7-9 The method for carrying out pressing engagement from both sides as being not limited to shown in (a) of Figure 23, using jointing material g.As its other party The example of method, can enumerate makes the two engage by heater is arranged in holding unit 43 or other structures to heat the two Structure, using ultrasonic wave generator ultrasonic bonding structure etc. is carried out to the two.

Claims (7)

1. a kind of band recovery method, which is characterized in that
The band recovery method includes：
The region of the specific length from the front end for the band released with lengthwise shape is remained flat state by holding process；
Cutting-off process will cut into individual with the band of flat state holding；And
Storage process maintains the flat state for being cut into individual the band, will be cut into individual institute on one side on one side Band is stated to be laminated and be accommodated in band recycling bins.
2. band recovery method according to claim 1, which is characterized in that
During the holding, the region of the specific length from the front end of the band is remained flat state by holding mechanism,
In the cutting-off process, the band is cut off in the state that the holding mechanism remains as the flat band At individual,
During the storage, the holding mechanism that the band to being cut into individual is kept is together with the band It is guided to the band recycling bins.
3. band recovery method according to claim 1 or 2, which is characterized in that
The band is remained flat state by the holding mechanism by adsorbing the band.
4. a kind of band retracting device, which is characterized in that
The band retracting device includes：
Band holding mechanism, flat state is remained by the region of the specific length from the front end for the band released with lengthwise shape；
Band cutting mechanism will cut into individual with the band of flat state holding；
Band recycling bins, storage are cut into individual the band；And
Band guiding mechanism will be cut into individual the band and be taken back to described while being maintained flat state Case guiding is received, makes to be cut into individual the band and is laminated and is accommodated in the band recycling bins.
5. band retracting device according to claim 4, which is characterized in that
It is described to cut into individual with the band that holding mechanism remains by described with cutting mechanism,
It is described with guiding mechanism by the band holding mechanism kept to the band for being cut into individual and the band one It rises to the band recycling bins and guides.
6. band retracting device according to claim 4 or 5, which is characterized in that
The band recycling bins be equipped with it is multiple,
The band retracting device includes switching mechanism, the switching mechanism by as it is described with guiding mechanism to being cut into individual institute The band recycling bins for stating the object that band guides are switched to another band recycling bins.
7. band retracting device according to claim 4 or 5, which is characterized in that
The band holding mechanism includes：
Flat horizontal surface is connected to the band；And
Adsorption hole carries out absorption holding by the flat horizontal surface to the band.
CN201810128777.4A 2017-02-08 2018-02-08 With recovery method and with retracting device Pending CN108400105A (en)

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