CN108399990A - The production method and its PPTC plates of PPTC plates - Google Patents
The production method and its PPTC plates of PPTC plates Download PDFInfo
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- CN108399990A CN108399990A CN201810142171.6A CN201810142171A CN108399990A CN 108399990 A CN108399990 A CN 108399990A CN 201810142171 A CN201810142171 A CN 201810142171A CN 108399990 A CN108399990 A CN 108399990A
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- pptc
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of production method of PPTC plates, first, is sequentially placed PCB copper foils, prepreg, PPTC chips, prepreg and PCB copper foils, and carries out pressing and form laminated body；Drilling forms via hole in laminated body；Copper facing forms copper plate on via hole；Then, outer-layer circuit is made, the pad that PCB copper foils are used as welding is retained.By the internal layer of PPTC chips embedding layer stack by the way of pressing, the rigidity of PPTC chips is improved.The pad that via hole is set on laminated body, and outer layer PCB copper foils are used as welding, can solve tie point rosin joint in the prior art or using when tie point falls off caused by temperature is excessively high the technical issues of.The production method of PPTC plates provided by the invention, high degree of automation, cost of labor are low, production efficiency is high, and PPTC plates obtained are safe and reliable, have very high economic benefit and practical value.The present invention also provides a kind of PPTC plates.
Description
Technical field
The present invention relates to the production methods and its PPTC plates of electronic information member arts more particularly to a kind of PPTC plates.
Background technology
PPTC is widely used as circuit protection device, with when overcurrent flows through electrical equipment, protection structure is electrically set
Standby electrical equipment.When PPTC devices are also widely used as electrical equipment failure, interruptive current flows through the protection of electrical equipment
Device.
Currently, the method for PPTC electrode machinings has following 3 kinds of modes：1) in the two sides welding lead of PPTC chips；2) exist
Weld nickel sheet in the two sides of PPTC chips；3) in the two sides welding support of PPTC chips.But in these three methods, conducting wire, nickel sheet, branch
Frame it is of high cost, economy consumption is big, and PPTC electrodes made of these three methods, and finished size is big, it is difficult to meet actual dress
With demand.In addition, the degree of automation of these three methods is low, high labor cost and productivity effect is poor cannot meet the life of reality
Production demand.Therefore, there is an urgent need for a kind of production automation degree height, production cost is low and can meet the PPTC electrodes of practical application request
Production method.
Invention content
It is high that the purpose of the present invention is to provide a kind of production automation degrees, and production cost is low, production efficiency is high one
The production method and its PPTC plates of kind PPTC plates.
To achieve the above object, the present invention provides a kind of production method of PPTC plates, includes the following steps：
S1. it presses, PPTC chips, prepreg and PCB copper foils is provided, be sequentially placed the PCB copper foils, the semi-solid preparation
Piece, the PPTC chips, the prepreg and the PCB copper foils, and carry out pressing and form laminated body；
S2. it drills, drilling in the laminated body forms via hole；
S3. copper facing, the copper facing formation copper plate on the via hole；
S4. outer-layer circuit is made, the pad that the PCB copper foils are used as welding is retained.
Preferably, the making outer-layer circuit includes by the method for exposure, development, etching, remove other than outer layer pad
The PCB copper foils, retain remaining described PCB copper foil as the pad that uses of welding.
Preferably, further including before the step S1：
S01. nickel is removed, the chip nickel layer of the PPTC chip surfaces is removed；
S02. internal layer circuit is made, PPTC chips described in internal layer are subjected to electrode resigning, by electrode resigning part
The PPTC copper foils of the PPTC chip surfaces remove, and specifically by the method for exposure, development, etching, remove described in internal layer
The unwanted PPTC copper foils of PPTC chips, the i.e. copper foil of electrode resigning part retain remaining PPTC copper foil as the PPTC
The electrode section of chip；
S03. brown, by the PPTC roughening of copper foil of the rest part of the PPTC chip surfaces.By PPTC chip surfaces
Chip nickel layer removes, and contributes to the pressing of PPTC chips and prepreg；PPTC chip surfaces are subjected to electrode resigning processing, it will
PPTC copper foils removal at electrode resigning, it is ensured that the electric current one-way flow in PPTC plates avoids the failures such as short circuit from occurring.
Preferably, further including between the step S2 and step S3：
S21. de-smear removes the hole wall gel generated in the step S2 boring procedures.In boring procedure, stacking
Resin around body via hole is influenced by high temperature, is flowed around hole wall, and one layer of thin glue residue, i.e. hole wall gel are generated.It will
Hole wall gel removes, and can provide guarantee for the conducting of internal layer circuit and outer-layer circuit.
Preferably, the de-smear using plasma technique or chemistry removing glue technique.Specifically, chemistry removing glue technique can
Using one kind in potassium permanganate de-smear technique, concentrated sulfuric acid de-smear technique, complex acid de-smear technique.
Preferably, the step S3 includes heavy copper and electro-coppering, the heavy copper deposits one layer of gold on the via hole
Belong to copper to form copper plate as conductting layer, the electro-coppering is added the copper plate on the via hole by the way of plating
It is thick.The copper plate that heavy copper is formed thickeies, and can reinforce the integrality of via hole hole wall, improves leading for internal layer circuit and outer-layer circuit
It is logical.
Preferably, further including after the step S4：
S41. silk-screen, including silk-screen welding resistance and character silk printing, the silk-screen welding resistance form solder mask using as protective layer,
The character silk printing forms character layer to distinguish model；
S42. it is electroplated, after the step S41, first plates one layer of nickel layer on surface, then plate one layer of tin layers again；
S43. finished product packing is cut manufactured PPTC plates, visual examination and packaging.Manufactured PPTC plates are carried out
Cutting, cuts into an equal amount of PPTC plates by actual demand, can meet actual assembly demand.
The present invention also provides PPTC plates made of a kind of production method PPTC plates described above.With above-mentioned side
PPTC plates made of method, resistance stability is high, and reliability is high, can meet actual use demand, has very high practical valence
Value.
Preferably, being followed successively by PCB copper foils, prepreg, PPTC chips, prepreg and PCB copper foils from top to bottom.PPTC
Include prepreg and PCB copper foils outside chip, the rigidity of PPTC chips can be enhanced,
Preferably, the prepreg is PP pieces.
Compared with prior art, the production method of PPTC plates provided by the invention, will be in the chip buried laminated bodies of PPTC
Layer, and via hole is set on laminated body, the pad that the PCB copper foils of outer layer are used as welding.By PPTC chips using pressure
The internal layer of the mode embedding layer stack of conjunction, can improve the rigidity of PPTC chips, and the process of pressing also contributes to improve PPTC cores
The stability of piece resistance value.Via hole, and the pad that outer layer PCB copper foils are used as welding are set on laminated body, can be solved
In the prior art tie point rosin joint or using when tie point falls off caused by temperature is excessively high the technical issues of.It is provided by the invention
The production method of PPTC plates, high degree of automation, cost of labor are low, production efficiency is high, and PPTC plates obtained are safe and reliable, tool
There are very high economic benefit and practical value.
Description of the drawings
Fig. 1 is the production method flow chart of PPTC plates of the present invention；
Fig. 2 is the bonding processes schematic diagram of the production method of PPTC plates of the present invention；
Fig. 3 is the product cross section figure of PPTC plates of the present invention.
Specific implementation mode
For the purpose of the present invention, technical solution and advantageous effect is better described, below in conjunction with specific embodiment to this
Invention is described further.It should be noted that following the methods of implementing are further explained to what the present invention was done, do not answer
When as limitation of the present invention.
Referring to Fig. 1 and Fig. 2, the present invention provides a kind of production method of PPTC plates, specifically comprises the following steps：
S01. nickel is removed：PPTC chips are provided, in the present embodiment, the PPTC chip surfaces provided are provided with 25-35 μm
PPTC copper foils and 2.0-5.0 μm of nickel layer.By the chip nickel layer removal on the PPTC chips provided, carried for subsequent brown technique
For convenient.
S02. internal layer circuit is made：Meet from one end inflow other end outflow for the current lead-through of PPTC plates made from guarantee
Design requirement, need to the PPTC copper foils of PPTC chip surfaces be subjected to electrode resigning processing, that is, pass through exposure, development, etching
Method removes the unwanted PPTC copper foils of internal layer, i.e. the PPTC copper foils of electrode resigning part, retains remaining PPTC copper foil conduct
The electrode section of PPTC chips, and remaining PPTC copper foils are not allow for, short circuit etc. occur to avoid PPTC plates obtained is not inconsistent
The problem of closing actual current flow-through design demand.
S03. brown：It, specifically can be in the table of PPTC copper foils by the PPTC roughening of copper foil of the rest part of PPTC chip surfaces
Face forms layer of oxide layer.
S1. it presses：Referring to Fig. 2, successively by PCB copper foils 6, prepreg 2, PPTC chips 1, prepreg 2, PCB copper foils 6
It is placed on lamination board, is then pressed, form laminated body.In bonding processes, to the heat treatment process of PPTC chips, have
Help improve the resistance stability of PPTC plates.In addition, prepreg uses PP pieces.
S2. it drills：It presses and drills on the laminated body of formation in step sl, form via hole, by internal layer circuit and outside
Layer solder pad conducting.
S21. de-smear：Remove the hole wall gel generated in step S2 boring procedures.In step S2 boring procedures, lead
Resin around through-hole can form one layer of hole wall gel due to being influenced by high temperature on hole wall, and the circuit for influencing PPTC plates is led
It is logical.De-smear can provide guarantee for the conducting of internal layer circuit and outer-layer circuit.In the present embodiment, de-smear using plasma
Technique.It is removed in addition, the chemistry such as potassium permanganate de-smear technique, concentrated sulfuric acid de-smear technique, complex acid de-smear technique can also be used
Glue residue technique.
S3. copper facing：Including heavy copper and electro-coppering, heavy copper deposits one layer of copper facing using chemical deposition on via hole
The conductor that layer is connected as internal layer circuit with outer-layer circuit.Electro-coppering is added the copper plate that heavy copper is formed by the way of plating
It is thick.The copper plate that heavy copper is formed is relatively thin, thickeies copper plate by plating mode, on the one hand can reinforce the complete of via hole hole wall
On the other hand whole property can also improve internal layer circuit and the conduction property of outer-layer circuit.
S4. outer-layer circuit is made：Retain the system of pad and follow-up cutting Cutting Road that PCB copper foils are used as welding
Make.It can specifically remove the PCB copper foils other than outer layer pad by the method for exposure, development, etching, retain remaining PCB copper foil
The pad used as welding.
S41. silk-screen：Including silk-screen welding resistance and character silk printing, silk-screen welding resistance forms solder mask using as protective layer, silk-screen
Word forms character layer to distinguish model.
S42. it is electroplated：After step S41, one layer of nickel layer is first plated on surface, then plates one layer of tin layers again, ensures pad
Solderability.
S43. finished product packing：Manufactured PPTC plates are cut, visual examination and packaging.Manufactured PPTC plates are carried out
Cutting, cuts into an equal amount of PPTC plates by actual demand, meets actual assembly demand.PPTC plates obtained are carried out outer
It sees and checks, it is ensured that appearance meets the requirements.
Embodiment 1
PPTC plates 100 are made according to the production method of above-mentioned PPTC plates, PPTC plates 100 are last cutting finished product obtained,
As shown in Figure 3.PPTC plates 100 include PPTC chips 1, semi-solid preparation layer 2, solder mask 3, character layer 4 and are set to 100 liang of PPTC plates
The via hole of side.Wherein, it is provided with PPTC copper foils 11 on PPTC chips 1, copper plate 51, nickel layer 52 and tin layers are coated on via hole
53。
By PPTC plates 100 made from embodiment 1 and PPTC electrodes (i.e. comparative example 1, the comparative example 2 and right bought on the market
Ratio 3) according to national standard GB/T2791-1995 methods progress peel strength test, carry out resistance according to GB/T7153-2002 methods
Range test, according to GB/T7153-2002 standard testing resistant to flow resistance change rates；According to GB/T7153-2002 standard testings 30V
Pressure-resistant 48 hours resistance change rates, and place 1000h resistance variations according to 85 DEG C of 85% humidity of GB/T7153-2002 standard testings
Rate, acquisition the results are shown in Table 1.
1 embodiment of table and comparative example test result
From table 1 it follows that the PPTC plates 100 in embodiment 1, peeling force is higher than all comparative examples, illustrates the present invention
PPTC plates production method made of PPTC plates have better mechanical performance.In addition, embodiment 1 does the resistance of durable test
Change rate is smaller than comparative example, illustrates that the durability of PPTC plates provided by the invention is good and stability is high.
Above disclosed is only the preferred embodiments of the present invention, and the interest field of the present invention cannot be limited with this,
Therefore equivalent changes made in accordance with the claims of the present invention belong to the range that the present invention is covered.
Claims (10)
1. a kind of production method of PPTC plates, which is characterized in that include the following steps：
S1. press, PPTC chips, prepreg and PCB copper foils be provided, be sequentially placed the PCB copper foils, the prepreg,
The PPTC chips, the prepreg and the PCB copper foils, and carry out pressing and form laminated body；
S2. it drills, drilling in the laminated body forms via hole；
S3. copper facing, the copper facing formation copper plate on the via hole；
S4. outer-layer circuit is made, the pad that the PCB copper foils are used as welding is retained.
2. the production method of PPTC plates as described in claim 1, which is characterized in that the making outer-layer circuit includes passing through exposure
Light, development, etching method, remove the PCB copper foils other than the pad, retain remaining described PCB copper foil as institute
State the pad that welding uses.
3. the production method of PPTC plates as described in claim 1, which is characterized in that further include before the step S1：
S01. nickel is removed, the chip nickel layer of the PPTC chip surfaces is removed；
S02. internal layer circuit is made, PPTC chips described in internal layer are subjected to electrode resigning, described in electrode resigning part
The PPTC copper foils of PPTC chip surfaces remove；
S03. brown, by the PPTC roughening of copper foil of the rest part of the PPTC chip surfaces.
4. the production method of PPTC plates as described in claim 1, which is characterized in that also wrapped between the step S2 and step S3
It includes：
S21. de-smear removes the hole wall gel generated in the step S2 boring procedures.
5. the production method of PPTC plates as claimed in claim 4, which is characterized in that the de-smear using plasma technique
Or chemistry removing glue technique.
6. the production method of PPTC plates as described in claim 1, which is characterized in that the step S3 includes heavy copper and plating
Copper, the heavy copper deposit one layer of metallic copper to form copper plate as conductting layer on the via hole, and the electro-coppering is
The copper plate on the via hole is thickeied by the way of plating.
7. the production method of PPTC plates as described in claim 1, which is characterized in that further include after the step S4：
S41. silk-screen, including silk-screen welding resistance and character silk printing；
S42. it is electroplated, after the step S41, first plates one layer of nickel layer on surface, then plate one layer of tin layers again；
S43. finished product packing is cut manufactured PPTC plates, visual examination and packaging.
8. PPTC plates made of a kind of production method claim 1-7 any one of them PPTC plates.
9. PPTC plates as claimed in claim 8, which is characterized in that be followed successively by PCB copper foils, prepreg, PPTC from top to bottom
Chip, prepreg and PCB copper foils.
10. PPTC plates as claimed in claim 9, which is characterized in that the prepreg is PP pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810142171.6A CN108399990A (en) | 2018-02-11 | 2018-02-11 | The production method and its PPTC plates of PPTC plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810142171.6A CN108399990A (en) | 2018-02-11 | 2018-02-11 | The production method and its PPTC plates of PPTC plates |
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| CN108399990A true CN108399990A (en) | 2018-08-14 |
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| CN201810142171.6A Pending CN108399990A (en) | 2018-02-11 | 2018-02-11 | The production method and its PPTC plates of PPTC plates |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109171700A (en) * | 2018-10-11 | 2019-01-11 | 南京大学 | A kind of physiology electro-detection shielding active electrode |
| CN110335731A (en) * | 2019-06-21 | 2019-10-15 | 深圳市金瑞电子材料有限公司 | The manufacturing method of high voltage withstanding secondary safeguard protection element |
| CN114423176A (en) * | 2021-12-28 | 2022-04-29 | 芯讯通无线科技（上海）有限公司 | PCB (printed circuit board) comprising side PIN (personal identification number) PINs, manufacturing method thereof and communication module |
| CN116403791A (en) * | 2022-09-28 | 2023-07-07 | 芜湖佳宏新材料股份有限公司 | PPTC component manufacturing equipment and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109171700A (en) * | 2018-10-11 | 2019-01-11 | 南京大学 | A kind of physiology electro-detection shielding active electrode |
| CN110335731A (en) * | 2019-06-21 | 2019-10-15 | 深圳市金瑞电子材料有限公司 | The manufacturing method of high voltage withstanding secondary safeguard protection element |
| CN114423176A (en) * | 2021-12-28 | 2022-04-29 | 芯讯通无线科技（上海）有限公司 | PCB (printed circuit board) comprising side PIN (personal identification number) PINs, manufacturing method thereof and communication module |
| CN114423176B (en) * | 2021-12-28 | 2023-12-01 | 芯讯通无线科技（上海）有限公司 | PCB (printed circuit board) comprising side PIN PINs, manufacturing method of PCB and communication module |
| CN116403791A (en) * | 2022-09-28 | 2023-07-07 | 芜湖佳宏新材料股份有限公司 | PPTC component manufacturing equipment and preparation method thereof |
| CN116403791B (en) * | 2022-09-28 | 2023-09-08 | 芜湖佳宏新材料股份有限公司 | PPTC component manufacturing equipment and preparation method thereof |
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Application publication date: 20180814 |