CN108299830B - 硅橡胶基柔性石墨烯发热膜及其制备方法、发热器件和应用 - Google Patents
硅橡胶基柔性石墨烯发热膜及其制备方法、发热器件和应用 Download PDFInfo
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- CN108299830B CN108299830B CN201810121177.5A CN201810121177A CN108299830B CN 108299830 B CN108299830 B CN 108299830B CN 201810121177 A CN201810121177 A CN 201810121177A CN 108299830 B CN108299830 B CN 108299830B
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 250
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 248
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- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000011347 resin Substances 0.000 claims abstract description 60
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 58
- 239000010703 silicon Substances 0.000 claims abstract description 58
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- 239000006185 dispersion Substances 0.000 claims description 32
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- 238000004073 vulcanization Methods 0.000 claims description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 11
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 8
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- 238000000227 grinding Methods 0.000 claims description 4
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 claims description 4
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- 230000000052 comparative effect Effects 0.000 description 27
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
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- 239000004020 conductor Substances 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- YCOZIPAWZNQLMR-UHFFFAOYSA-N pentadecane Chemical compound CCCCCCCCCCCCCCC YCOZIPAWZNQLMR-UHFFFAOYSA-N 0.000 description 4
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- 238000005485 electric heating Methods 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- CUPCBVUMRUSXIU-UHFFFAOYSA-N [Fe].OOO Chemical compound [Fe].OOO CUPCBVUMRUSXIU-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
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- 238000013019 agitation Methods 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JJWIOXUMXIOXQN-UHFFFAOYSA-N cyclohexadecane Chemical compound C1CCCCCCCCCCCCCCC1 JJWIOXUMXIOXQN-UHFFFAOYSA-N 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
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- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
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- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
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- 239000000203 mixture Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
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- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
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CN201810121177.5A CN108299830B (zh) | 2018-02-07 | 2018-02-07 | 硅橡胶基柔性石墨烯发热膜及其制备方法、发热器件和应用 |
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CN201810121177.5A CN108299830B (zh) | 2018-02-07 | 2018-02-07 | 硅橡胶基柔性石墨烯发热膜及其制备方法、发热器件和应用 |
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CN108299830B true CN108299830B (zh) | 2021-02-23 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109593362A (zh) * | 2018-10-12 | 2019-04-09 | 安徽理工大学 | 一种柔性的少层石墨烯/有机硅橡胶复合材料及制备方法 |
CN110010962A (zh) * | 2019-01-03 | 2019-07-12 | 深圳天元羲王材料科技有限公司 | 一种石墨烯固态硅胶方向性电解质制备方法 |
CN109673069A (zh) * | 2019-01-04 | 2019-04-23 | 珠海鸿儒通汇科技有限公司 | 一种石墨烯硅胶发热垫及其制备方法 |
CN110944416A (zh) * | 2019-10-29 | 2020-03-31 | 珠海烯蟀科技有限公司 | 一种石墨烯复合浆料、发热涂层及其制备方法 |
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CN103342896A (zh) * | 2013-06-26 | 2013-10-09 | 苏州天脉导热科技有限公司 | 一种耐高温导热硅胶片及其制备方法 |
CN103772992A (zh) * | 2014-01-22 | 2014-05-07 | 华为技术有限公司 | 一种导热复合材料及其制备方法 |
CN105315672A (zh) * | 2015-12-07 | 2016-02-10 | 德阳烯碳科技有限公司 | 一种含纳米碳材料的硅橡胶垫复合材料的制备方法 |
US9478727B2 (en) * | 2012-03-12 | 2016-10-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Fluorosilicone-based dielectric elastomer and method for its production |
CN106633901A (zh) * | 2016-09-12 | 2017-05-10 | 中国航空工业集团公司北京航空材料研究院 | 一种含石墨烯耐高温缩合型室温硫化硅橡胶 |
CN106810875A (zh) * | 2015-12-02 | 2017-06-09 | 中国科学院金属研究所 | 一种含石墨烯的导热导电复合材料及其制备方法和应用 |
CN108696953A (zh) * | 2017-04-12 | 2018-10-23 | 江南石墨烯研究院 | 一种耐高温、耐溶剂硅橡胶基柔性石墨烯发热膜 |
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2018
- 2018-02-07 CN CN201810121177.5A patent/CN108299830B/zh active Active
Patent Citations (7)
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US9478727B2 (en) * | 2012-03-12 | 2016-10-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Fluorosilicone-based dielectric elastomer and method for its production |
CN103342896A (zh) * | 2013-06-26 | 2013-10-09 | 苏州天脉导热科技有限公司 | 一种耐高温导热硅胶片及其制备方法 |
CN103772992A (zh) * | 2014-01-22 | 2014-05-07 | 华为技术有限公司 | 一种导热复合材料及其制备方法 |
CN106810875A (zh) * | 2015-12-02 | 2017-06-09 | 中国科学院金属研究所 | 一种含石墨烯的导热导电复合材料及其制备方法和应用 |
CN105315672A (zh) * | 2015-12-07 | 2016-02-10 | 德阳烯碳科技有限公司 | 一种含纳米碳材料的硅橡胶垫复合材料的制备方法 |
CN106633901A (zh) * | 2016-09-12 | 2017-05-10 | 中国航空工业集团公司北京航空材料研究院 | 一种含石墨烯耐高温缩合型室温硫化硅橡胶 |
CN108696953A (zh) * | 2017-04-12 | 2018-10-23 | 江南石墨烯研究院 | 一种耐高温、耐溶剂硅橡胶基柔性石墨烯发热膜 |
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Effective date of registration: 20230220 Address after: Room 208, Unit 1, Building 4, Shimao Jiangbin Commercial Center, Baiyang Street, Qiantang District, Hangzhou City, Zhejiang Province, 310000 Patentee after: Zhejiang Xiongda New Material Technology Co.,Ltd. Address before: 310000 room 315, building 3, No.68 Keye Road, Jianggan District, Hangzhou City, Zhejiang Province Patentee before: HANGZHOU BAIXIONG TECHNOLOGY CO.,LTD. |
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Address after: Room 208, Unit 1, Building 4, Shimao Jiangbin Commercial Center, Baiyang Street, Qiantang District, Hangzhou City, Zhejiang Province, 310000 Patentee after: Hangzhou Xiong Dad Energy Technology Co.,Ltd. Country or region after: China Address before: Room 208, Unit 1, Building 4, Shimao Jiangbin Commercial Center, Baiyang Street, Qiantang District, Hangzhou City, Zhejiang Province, 310000 Patentee before: Zhejiang Xiongda New Material Technology Co.,Ltd. Country or region before: China |