CN108291047B - 聚烯烃系树脂发泡片材及粘合胶带 - Google Patents
聚烯烃系树脂发泡片材及粘合胶带 Download PDFInfo
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- CN108291047B CN108291047B CN201680068692.0A CN201680068692A CN108291047B CN 108291047 B CN108291047 B CN 108291047B CN 201680068692 A CN201680068692 A CN 201680068692A CN 108291047 B CN108291047 B CN 108291047B
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- foamed sheet
- polyolefin resin
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- mass
- further preferably
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- C08J9/103—Azodicarbonamide
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Abstract
本发明提供一种聚烯烃系树脂发泡片材,其是将聚烯烃系树脂发泡而得到的,前述发泡片材的发泡倍率为1.5~20cm3/g,前述发泡片材的MD方向及TD方向的平均气泡直径均为130μm以下,前述发泡片材满足下述式(1)及式(2)。TM/D≥6 (1);TT/D≥5 (2);TM:90℃时的MD方向的抗拉强度,TT:90℃时的TD方向的抗拉强度,D:前述发泡片材的密度(g/cm3)。
Description
技术领域
本发明涉及将聚烯烃系树脂发泡而形成的聚烯烃系树脂发泡片材及使用了其的粘合胶带。
背景技术
在智能手机、笔记本电脑等具有显示画面的电子设备中,在保护显示画面的面板与壳体之间,设置有用于吸收冲击、保护显示画面的缓冲材料(例如专利文献1)。而且,前述电子设备常常以使显示画面沿竖直方向竖立的状态使用,因此,要求前述缓冲材料具有优异的剪切强度。进而,对于前述电子设备而言,由于高密度地集积的电子部件产生大量的热,因而电子设备的内部容易成为高温,另外,有时前述电子设备本身在气温高的户外使用,因此,期望前述缓冲材料即使在高温下也具有优异的剪切强度。
现有技术文献
专利文献
专利文献1:国际公开2013/099755号
发明内容
发明所要解决的课题
在想要提高发泡片材的剪切强度的情况下,需要加厚发泡片材,因此,难以用于小型的电子设备。
本发明是鉴于上述的以往的情况而作出的,目的在于提供一种即使厚度薄也具有优异的剪切强度的聚烯烃系树脂发泡片材、及使用了其的粘合胶带。
用于解决课题的手段
本发明人等进行了深入研究,结果发现,若进行调整使得高温下的发泡片材的抗拉强度与密度满足一定的关系,则可解决前述课题,从而完成了本发明。
即,本发明的要点在于以下的[1]~[2]。
[1]一种聚烯烃系树脂发泡片材,其是将聚烯烃系树脂发泡而得到的,前述发泡片材的发泡倍率为1.5~20cm3/g,前述发泡片材的MD方向及TD方向的平均气泡直径均为130μm以下,前述发泡片材满足下述式(1)及式(2)。
TM/D≥6 (1)
TT/D≥5 (2)
TM:90℃时的MD方向的抗拉强度
TT:90℃时的TD方向的抗拉强度
D:前述发泡片材的密度(g/cm3)
[2]一种粘合胶带,其是在前述[1]所述的聚烯烃系树脂发泡片材的至少一面设置粘合剂层而得到的。
发明的效果
通过本发明,可提供即使厚度薄也具有优异的剪切强度的聚烯烃系树脂发泡片材、及使用了其的粘合胶带。
具体实施方式
[聚烯烃系树脂发泡片材]
本发明的聚烯烃系树脂发泡片材(以下,也称为“发泡片材”)是将聚烯烃系树脂发泡而形成的片材,具有大量的气泡。
以下,进一步详细地说明本发明的聚烯烃系树脂发泡片材。
<发泡倍率>
对于本发明的发泡片材的发泡倍率而言,从提高冲击吸收性的观点考虑,为1.5cm3/g以上,更优选为1.7cm3/g以上,进一步优选为1.9cm3/g以上,从提高发泡片材的剪切强度的观点考虑,为20cm3/g以下,优选为18cm3/g以下,更优选为17cm3/g以下,进一步优选为15cm3/g以下,更进一步优选为14cm3/g以下,更进一步优选为12cm3/g以下,更进一步优选为10cm3/g以下,更进一步优选为8cm3/g以下,更进一步优选为6cm3/g以下。
需要说明的是,本发明中的发泡倍率是指按照JIS K7222测得的发泡片材的密度的倒数。
<平均气泡直径>
对于本发明的发泡片材的MD方向的平均气泡直径而言,从提高发泡片材的柔软性及高低差追随性的观点考虑,优选为10μm以上,更优选为20μm以上,进一步优选为30μm以上,更进一步优选为35μm以上,更进一步优选为40μm以上,更进一步优选为45μm以上,更进一步优选为50μm以上,从提高发泡片材的剪切强度的观点考虑,为130μm以下,优选为120μm以下,更优选为110μm以下,进一步优选为100μm以下,更进一步优选为90μm以下,更进一步优选为80μm以下,更进一步优选为70μm以下。
对于本发明的发泡片材的TD方向的平均气泡直径而言,从提高发泡片材的柔软性及高低差追随性的观点考虑,优选为10μm以上,更优选为20μm以上,进一步优选为30μm以上,更进一步优选为40μm以上,更进一步优选为50μm以上,从提高发泡片材的剪切强度的观点考虑,为130μm以下,优选为125μm以下,更优选为120μm以下,进一步优选为110μm以下,更进一步优选为100μm以下,更进一步优选为90μm以下,更进一步优选为80μm以下,更进一步优选为70μm以下。
需要说明的是,本发明中,“MD”是指加工方向(Machine Direction),是指与聚烯烃系树脂发泡片材的挤出方向等一致的方向。另外,“TD”是指横向(TransverseDirection),是指与MD正交且与发泡片材平行的方向。
需要说明的是,前述平均气泡直径可按照后述的实施例的方法测定。
<发泡片材的密度(D)与90℃时的抗拉强度的关系>
本发明的发泡片材满足下述式(1)及式(2)。
TM/D≥6 (1)
TT/D≥5 (2)
TM:90℃时的MD方向的抗拉强度
TT:90℃时的TD方向的抗拉强度
D:前述发泡片材的密度(g/cm3)
需要说明的是,本发明中,所谓“抗拉强度”,是指在90℃的条件下、按照JIS K6767对将发泡片材切割成JIS K6251 4.1中规定的哑铃状1号形状而得的试样进行测定而得到的MD方向及TD方向的强度。
对于式(1)中的TM/D而言,从提高发泡片材的剪切强度的观点考虑,为6以上,优选为6.1以上,更优选为6.5以上,进一步优选为7.0以上,更进一步优选为7.5以上,而且,优选为48以下,更优选为20以下,进一步优选为16以下,更进一步优选为14以下,更进一步优选为12以下,更进一步优选为10以下。
对于式(2)中的TT/D而言,从提高发泡片材的剪切强度的观点考虑,为5以上,优选为5.2以上,更优选为5.4以上,进一步优选为5.6以上,更进一步优选为5.8以上,而且,优选为30以下,更优选为20以下,进一步优选为16以下,更进一步优选为14以下,更进一步优选为12以下,更进一步优选为10以下,更进一步优选为8以下。
<密度>
对于本发明的发泡片材的密度而言,从提高发泡片材的剪切强度的观点、及提高材料强度的观点考虑,优选为0.01g/cm3以上,更优选为0.03g/cm3以上,进一步更优选为0.05g/cm3以上,从提高发泡片材的柔软性的观点考虑,优选为1g/cm3以下,更优选为0.8g/cm3以下,进一步优选为0.6g/cm3以下。需要说明的是,密度是按照JIS K7222测得的值。
<90℃时的MD方向的抗拉强度>
对于本发明的发泡片材的90℃时的MD方向的抗拉强度而言,从提高发泡片材的剪切强度的观点、及提高材料强度的观点考虑,优选为0.1MPa以上,更优选为0.3MPa以上,进一步优选为0.5MPa以上,更进一步优选为0.7MPa以上,更进一步优选为0.9MPa以上,从提高发泡片材的加工性的观点考虑,优选为10MPa以下,更优选为8MPa以下,进一步优选为6MPa以下,更进一步优选为5MPa以下,更进一步优选为4MPa以下。
需要说明的是,90℃时的抗拉强度可按照后述的实施例中记载的方法测定。
<90℃时的TD方向的抗拉强度>
对于本发明的发泡片材的90℃时的TD方向的抗拉强度而言,从提高发泡片材的剪切强度的观点、及提高材料强度的观点考虑,优选为0.1MPa以上,更优选为0.3MPa以上,进一步优选为0.5MPa以上,更进一步优选为0.7MPa以上,更进一步优选为0.9MPa以上,从提高发泡片材的加工性的观点考虑,优选为10MPa以下,更优选为8MPa以下,进一步优选为6MPa以下,更进一步优选为5MPa以下,更进一步优选为4MPa以下。
<23℃时的MD方向的抗拉强度>
对于本发明的发泡片材的23℃时的MD方向的抗拉强度而言,从提高发泡片材的剪切强度的观点、及提高材料强度的观点考虑,优选为0.5MPa以上,更优选为1MPa以上,进一步优选为1.5MPa以上,更进一步优选为2.0MPa以上,更进一步优选为2.5MPa以上,从提高发泡片材的加工性的观点考虑,优选为35MPa以下,更优选为32MPa以下,进一步优选为30MPa以下,更进一步优选为28MPa以下,更进一步优选为26MPa以下,更进一步优选为24MPa以下。
需要说明的是,23℃时的抗拉强度可按照后述的实施例中记载的方法测定。
<23℃时的TD方向的抗拉强度>
对于本发明的发泡片材的23℃时的TD方向的抗拉强度而言,从提高发泡片材的剪切强度的观点、及提高材料强度的观点考虑,优选为0.5MPa以上,更优选为1MPa以上,进一步优选为1.3MPa以上,更进一步优选为1.7MPa以上,更进一步优选为2.0MPa以上,从提高发泡片材的加工性的观点考虑,优选为30MPa以下,更优选为28MPa以下,进一步优选为26MPa以下,更进一步优选为24MPa以下,更进一步优选为22MPa以下,更进一步优选为20MPa以下。
<90℃时的剪切强度>
对于本发明的发泡片材的90℃时的剪切强度而言,从适于作为电子设备的显示画面的缓冲材料使用的观点考虑,优选为0.3MPa以上,更优选为0.6MPa以上,进一步优选为0.8MPa以上,更进一步优选为0.9MPa以上,而且,优选为10MPa以下,更优选为5MPa以下。
需要说明的是,90℃时的剪切强度可按照后述的实施例中记载的方法测定。
<厚度>
对于本发明的发泡片材的厚度而言,从提高发泡片材的剪切强度的观点、及提高材料强度的观点考虑,优选为0.02mm以上,更优选为0.05mm以上,进一步优选为0.08mm以上,更进一步优选为0.1mm以上,从提高柔软性及高低差追随性的观点、及在薄型的电子设备的内部使用的观点考虑,优选为0.8mm以下,更优选为0.75mm以下,更进一步优选为0.7mm以下,更进一步优选为0.65mm以下。
<25%压缩强度>
对于本发明的发泡片材的25%压缩强度而言,从提高发泡片材的剪切强度及冲击吸收性的观点考虑,优选为10kPa以上,更优选为15kPa以上,进一步优选为20kPa以上,更进一步优选为25kPa以上,更进一步优选为30kPa以上,更进一步优选为35kPa以上,从提高发泡片材的柔软性的观点、及提高高低差追随性的观点考虑,优选为1,000kPa以下,更优选为900kPa以下,进一步优选为850kPa以下,更进一步优选为800kPa以下,更进一步优选为750kPa以下,更进一步优选为700kPa以下。本发明中,可提供使压缩强度低从而使柔软性良好、并且剪切强度优异的发泡片材。
需要说明的是,25%压缩强度可按照后述的实施例中记载的方法测定。
<凝胶分率(交联度)>
从提高发泡片材的剪切强度的观点考虑,本发明的发泡片材优选为经交联的发泡片材,此时的凝胶分率(交联度)优选为5~60质量%。另外,凝胶分率更优选为55质量%以下。另外,凝胶分率更优选为25质量%以上,进一步优选为35质量%以上,更进一步优选为40质量%以上。凝胶分率(交联度)为前述下限值以上时,可形成充分的交联,通过使其发泡,可得到剪切强度优异的发泡片材。需要说明的是,凝胶分率高时,容易提高剪切强度。另外,凝胶分率(交联度)为前述上限值以下时,容易确保发泡片材的柔软性。
需要说明的是,凝胶分率(交联度)可按照后述的实施例中记载的方法测定。
<独立气泡率>
优选发泡片材的气泡为独立气泡。气泡为独立气泡是指,相对于全部气泡而言的独立气泡的比例(称为独立气泡率)为70%以上。气泡为独立气泡时,在受到冲击时,可抑制气泡的变形量,由此,也可抑制发泡片材相对于冲击的变形量,因此,容易进一步提高冲击吸收性。
对于前述独立气泡率而言,为了进一步提高冲击吸收性,优选为70~100%,更优选为80~100%,进一步优选为90~100%。
另外,在独立气泡为前述范围时,发泡片材内部的空气的移动被限制,可抑制因空气的对流而导致的热传导,隔热性提高。
需要说明的是,所谓独立气泡率,是指按照ASTM D2856(1998)测得的值。
[聚烯烃系树脂]
作为为了形成发泡片材而使用的聚烯烃系树脂,可举出聚乙烯系树脂、聚丙烯系树脂、或它们的混合物。
<聚乙烯系树脂>
聚乙烯系树脂可以是乙烯均聚物,但优选通过将乙烯与根据需要的少量(例如为全部单体的30质量%以下,优选为10质量%以下)的α-烯烃共聚而得到的聚乙烯系树脂,其中,优选直链状低密度聚乙烯。
作为构成聚乙烯系树脂的α-烯烃,具体而言,可举出丙烯、1-丁烯、1-戊烯、4-甲基-1-戊烯、1-己烯、1-庚烯及1-辛烯等。其中,优选碳原子数4~10的α-烯烃。
另外,作为聚乙烯系树脂,还优选乙烯-乙酸乙烯酯共聚物。乙烯-乙酸乙烯酯共聚物通常为含有50质量%以上乙烯单元的共聚物。乙烯-乙酸乙烯酯共聚物的乙酸乙烯酯含有率例如为5~50质量%,优选为10~40质量%,更优选为15~35质量%。需要说明的是,乙酸乙烯酯含有率是按照JIS K6924-1测得的值。
为了提高发泡片材的柔软性、提高耐冲击吸收性,聚乙烯系树脂优选为低密度。具体而言,聚乙烯系树脂的密度优选为0.920g/cm3以下,更优选为0.880~0.915g/cm3,进一步优选为0.885~0.910g/cm3。作为具有这样的密度的聚乙烯系树脂,可举出直链状低密度聚乙烯。需要说明的是,密度是按照ASTM D792测得的值。
<聚丙烯系树脂>
作为聚丙烯系树脂,可举出例如丙烯均聚物、含有50质量%以上丙烯单元的丙烯-乙烯共聚物、丙烯-乙烯-α-烯烃共聚物、及丙烯-α-烯烃共聚物等。它们可单独使用1种,也可并用2种以上。
作为构成丙烯-α-烯烃共聚物的α-烯烃,具体而言,可举出1-丁烯、1-戊烯、4-甲基-1-戊烯、1-己烯、1-庚烯、1-辛烯等,这些中,优选碳原子数6~12的α-烯烃。
作为本发明中的聚烯烃系树脂,从提高柔软性及冲击吸收性的观点考虑,优选通过使用茂金属化合物、齐格勒-纳塔化合物、氧化铬化合物等作为催化剂进行聚合而得到的聚乙烯系树脂、聚丙烯系树脂、或它们的混合物,聚乙烯系树脂中,更优选直链状低密度聚乙烯。
需要说明的是,使用通过使用茂金属化合物作为催化剂而得到的聚乙烯系树脂、乙烯-乙酸乙烯酯共聚物、或它们的混合物的情况下,其含量优选为聚烯烃系树脂整体的40质量%以上,更优选为50质量%以上,进一步优选为60质量%以上,更进一步优选为100质量%。
另外,使用直链状低密度聚乙烯的情况下,可将直链状低密度聚乙烯作为聚烯烃系树脂单独使用,也可与直链状低密度聚乙烯以外的聚烯烃系树脂并用。作为并用的聚烯烃系树脂,可举出乙烯-乙酸乙烯酯共聚物。另外,在使用直链状低密度聚乙烯的情况下,直链状低密度聚乙烯的含量优选为聚烯烃系树脂整体的20~100质量%以上,优选为30~100质量%。另一方面,与直链状低密度聚乙烯并用的乙烯-乙酸乙烯酯共聚物的含量优选为80质量%以下,更优选为70质量%以下。
<茂金属化合物>
作为优选的茂金属化合物,可举出具有由π电子系的不饱和化合物夹着过渡金属的结构的双(环戊二烯基)金属络合物等化合物。更具体而言,可举出1个或2个以上的环戊二烯基环或其类似物作为配体(ligand)存在于钛、锆、镍、钯、铪及铂等四价的过渡金属的化合物。
这样的茂金属化合物的活性点的性质均匀,各活性点具有相同的活性度。使用茂金属化合物合成的聚合物的分子量、分子量分布、组成、组成分布等的均匀性提高,因此,在将包含使用茂金属化合物合成的聚合物的片材交联的情况下,交联均匀地进行。均匀地交联而得的片材容易均匀地拉伸,因此,容易使交联聚烯烃系树脂发泡片材的厚度均匀。
作为配体,可举出例如环戊二烯基环、茚基环等。这些环式化合物可被烃基、取代烃基或烃-取代准金属基取代。作为烃基,可举出例如甲基、乙基、各种丙基、各种丁基、各种戊基、各种己基、2-乙基己基、各种庚基、各种辛基、各种壬基、各种癸基、各种鲸蜡基、苯基等。需要说明的是,所谓“各种”,是指包含正、仲、叔、异在内的各种异构体。
另外,也可将以环式化合物作为低聚物聚合而成的物质作为配体使用。
此外,除了π电子系的不饱和化合物以外,还可使用氯、溴等的一价的阴离子配体或二价的阴离子螯合配体、烃、醇盐、芳基酰胺、芳族醚(aryl oxide)、酰胺、芳基酰胺、磷化物、芳基磷化物等。
作为包含四价的过渡金属、配体的茂金属化合物,可举出例如环戊二烯基三(二甲基氨基)钛、甲基环戊二烯基三(二甲基氨基)钛、双(环戊二烯基)二氯化钛、二甲基甲硅烷基四甲基环戊二烯基-叔丁基氨基二氯化锆等。
茂金属化合物通过与特定的共催化剂(助催化剂)组合,从而在进行各种烯烃的聚合时,发挥作为催化剂的作用。作为具体的共催化剂,可举出甲基铝氧烷(MAO)、硼系化合物等。需要说明的是,共催化剂相对于茂金属化合物的使用比例优选为10~100万摩尔倍,更优选为50~5,000摩尔倍。
<齐格勒-纳塔化合物>
齐格勒-纳塔化合物是三乙基铝-四氯化钛固体复合物,优选利用下述方法制造:将用有机铝化合物将四氯化钛还原、进而用各种电子供体及电子受体进行处理而得到的三氯化钛组合物、有机铝化合物、和芳香族羧酸酯组合的方法(参见日本特开昭56-100806号、日本特开昭56-120712号、日本特开昭58-104907号的各公报)、及使卤化镁与四氯化钛和各种电子供体接触的担载型催化剂的方法(参见日本特开昭57-63310号、日本特开昭63-43915号、日本特开昭63-83116号的各公报)等。
<聚烯烃系树脂中可包含的其他成分>
作为聚烯烃系树脂,也可并用上述的聚烯烃系树脂以外的树脂。
进而,也可在聚烯烃系树脂中混合后述的各种添加剂、其他的任选成分,发泡片材可以是将该混合物交联、发泡而得到的物质。
作为发泡片材中含有的任选成分,可举出聚烯烃系树脂以外的树脂、橡胶,它们的总含量少于聚烯烃系树脂的含量,相对于聚烯烃系树脂100质量份而言,通常为50质量份以下,优选为30质量份以下左右。
[发泡片材的制造方法]
本发明的发泡片材可通过利用常规方法将聚烯烃系树脂发泡而制造,对其制造方法没有特别限制,也可通过将聚烯烃系树脂组合物根据需要交联后、将其发泡从而制造。
具体而言,本发明的发泡片材例如可利用具有以下的工序(1)~(3)的方法制造。
工序(1):将聚烯烃系树脂、热分解型发泡剂、及其他的添加剂供给至挤出机,进行熔融混炼,从挤出机挤出成片状,由此,得到已成为片状的聚烯烃系树脂组合物的工序,
工序(2):将已成为片状的聚烯烃系树脂组合物交联的工序,
工序(3):对已交联的片状的聚烯烃系树脂组合物进行加热,使热分解型发泡剂发泡,优选沿MD方向或TD方向中的任意一者或两者进行拉伸的工序,
需要说明的是,作为交联聚烯烃系树脂发泡片材的制造方法,除了该方法之外,也可利用国际公开第2005/007731号中记载的方法制造。
作为热分解型发泡剂,没有特别限制,可举出例如偶氮二甲酰胺、N,N’-二亚硝基五亚甲基四胺、对甲苯磺酰基氨基脲等。这些中,优选偶氮二甲酰胺。需要说明的是,热分解型发泡剂可单独使用,也可组合2种以上而使用。
对于聚烯烃系树脂组合物中的热分解型发泡剂的含量而言,相对于聚烯烃系树脂100质量份,优选为1~15质量份,更优选为1~12质量份,进一步优选为1~8质量份。热分解型发泡剂的含量在上述范围内时,聚烯烃系树脂组合物的发泡性提高,容易得到具有所期望的发泡倍率的聚烯烃系树脂发泡片材,并且,抗拉强度及压缩恢复性提高。
作为前述工序(1)中使用的其他添加剂,可举出例如分解温度调节剂、交联助剂、抗氧化剂等。
分解温度调节剂是为了以降低热分解型发泡剂的分解温度、或加快分解速度的方式进行调节而配合的物质,作为具体的化合物,可举出氧化锌、硬脂酸锌、脲等。为了调节发泡片材的表面状态等,例如,相对于聚烯烃系树脂100质量份,配合0.01~5质量份的分解温度调节剂。
作为交联助剂,可使用多官能单体。通过向聚烯烃系树脂中添加交联助剂,从而减少后述的工序(2)中照射的电离性放射线量,从而防止因电离性放射线的照射而导致的树脂分子的切断、劣化。
作为交联助剂,具体而言,可举出三羟甲基丙烷三甲基丙烯酸酯、三羟甲基丙烷三丙烯酸酯、偏苯三酸三烯丙酯、1,2,4-苯三甲酸三烯丙酯、三烯丙基异氰脲酸酯等在1分子中具有3个官能团的化合物、1,6-己二醇二甲基丙烯酸酯、1,9-壬二醇二甲基丙烯酸酯、1,10-癸二醇二甲基丙烯酸酯、二乙烯基苯等在1分子中具有2个官能团的化合物、邻苯二甲酸二烯丙酯、对苯二甲酸二烯丙酯、间苯二甲酸二烯丙酯、乙基乙烯基苯、新戊二醇二甲基丙烯酸酯、甲基丙烯酸月桂基酯、甲基丙烯酸硬脂基酯等。
这些交联助剂单独使用或组合2种以上而使用。
对于交联助剂的添加量而言,相对于树脂成分100质量份,优选为0.2~10质量份,更优选为0.3~5质量份,进一步优选为0.5~5质量份。该添加量为0.2质量份以上时,能稳定地得到发泡片材所期望的交联度,为10质量份以下时,容易进行发泡片材的交联度的控制。
另外,作为抗氧化剂,可举出2,6-二叔丁基对甲酚等酚系抗氧化剂等。
作为使聚烯烃系树脂组合物发泡的方法,没有特别限制,例如,可举出将聚烯烃系树脂组合物利用热风进行加热的方法、利用红外线进行加热的方法、利用盐浴进行加热的方法、利用油浴进行加热的方法等,这些方法可以并用。
需要说明的是,聚烯烃系树脂组合物的发泡不限于使用热分解型发泡剂的例子,也可使用基于丁烷气体等的物理发泡。
作为使聚烯烃系树脂组合物进行交联的方法,例如,可举出下述方法:预先在聚烯烃系树脂组合物中配合有机过氧化物,对聚烯烃系树脂组合物进行加热从而使有机过氧化物分解。
作为用于交联的有机过氧化物,可举出例如1,1-双(叔丁基过氧基)3,3,5-三甲基环己烷、1,1-双(叔丁基过氧基)环己烷等。它们可单独使用1种,也可并用2种以上。对于有机过氧化物的添加量而言,相对于聚烯烃系树脂100质量份,优选为0.01~5质量份,更优选为0.1~3质量份。有机过氧化物的添加量在上述范围内时,聚烯烃系树脂组合物的交联容易进行,另外,可抑制得到的交联聚烯烃系树脂发泡片材中的有机过氧化物的分解残渣的量。
另外,作为使聚烯烃系树脂组合物进行交联的方法,还可举出向聚烯烃系树脂组合物照射电子束、α射线、β射线、γ射线等电离性放射线的方法。
对于电离性放射线的照射量而言,以凝胶分率成为5~60质量%的方式,优选为0.5~20Mrad,更优选为3~12Mrad。
使前述的聚烯烃系树脂组合物进行交联的方法可以并用,但从均匀地进行交联的观点考虑,优选照射电离性放射线的方法。
如上所述,本发明的聚烯烃系树脂发泡片材优选沿MD方向或TD方向中的任意一者或两者拉伸。
前述拉伸可在使聚烯烃系树脂组合物发泡而得到发泡片材后进行,也可在使聚烯烃系树脂组合物发泡的同时进行。需要说明的是,在使聚烯烃系树脂组合物发泡而得到发泡片材后对发泡片材进行拉伸的情况下,优选不将发泡片材冷却而在维持发泡时的熔融状态的情况下接连地对发泡片材进行拉伸,但也可在将发泡片材冷却后,再次将发泡片材加热而使其成为熔融或软化状态后对发泡片材进行拉伸。
另外,发泡片材的MD方向的拉伸倍率优选为1.1~3.2倍,更优选为1.3~3.0倍。若使发泡片材的MD方向的拉伸倍率为上述下限值以上,则发泡片材的隔热性、柔软性及抗拉强度容易变得良好。另一方面,若使发泡片材的MD方向的拉伸倍率为上限值以下,则可防止发泡片材在拉伸期间断裂、或发泡气体从发泡中的发泡片材逸出而使发泡倍率下降,发泡片材的柔软性、抗拉强度变得良好,品质也容易变得均匀。另外,发泡片材优选沿TD方向也以上述范围的拉伸倍率进行拉伸。
[粘合胶带]
本发明的粘合胶带是使用本发明涉及的发泡片材作为基材、在发泡片材的一面或两面设置有粘合剂层的制品。粘合胶带的厚度通常为0.03~2.0mm,优选为0.05~1.0mm。
构成粘合胶带的粘合剂层的厚度优选为5~200μm,更优选为7~150μm,进一步优选为10~100μm。构成粘合胶带的粘合剂层的厚度为5~200μm时,能使粘合胶带的厚度变薄,而且能有助于使用粘合胶带的电子设备自身的小型化及薄厚度化。
作为构成被设置在发泡片材的一面或两面的粘合剂层的粘合剂,没有特别限制,可使用例如丙烯酸系粘合剂、氨基甲酸酯系粘合剂、橡胶系粘合剂等。
作为向发泡片材涂布粘合剂而将粘合剂层层叠在发泡片材上的方法,例如,可举出下述方法:使用涂料器(coater)等涂布机在发泡片材的至少一面涂布粘合剂的方法;利用喷涂器(spray)在发泡片材的至少一面喷雾、涂布粘合剂的方法;使用刷毛在发泡片材的一面涂布粘合剂的方法;等等。
使用了本发明的发泡片材的粘合胶带可作为防止向安装于移动型电话机、摄像机(video camera)等电子设备本体内的电子部件施加冲击的冲击吸收材料、防止灰尘、水分等侵入电子设备本体内的密封材料使用。
实施例
通过实施例进一步详细地说明本发明,但本发明不受这些例子的任何限制。
[测定方法]
本说明书中的各物性的测定方法如下所述。
<密度及发泡倍率>
按照JIS K7222测定实施例及比较例中得到的发泡片材的密度,将其倒数作为发泡倍率。
<独立气泡率>
按照ASTM D2856(1998),使用株式会社岛津制作所制アキュピック1330进行测定。
<凝胶分率(交联度)>
从实施例及比较例中得到的发泡片材中取约50mg的试验片,精密称量试验片的重量A(mg)。接下来,将该试验片浸渍于105℃的二甲苯30ml中,放置24小时,然后,用200目的金属网进行过滤,采集金属网上的不溶解成分,进行真空干燥,精密称量不溶解成分的重量B(mg)。利用下述式,由得到的值算出凝胶分率(质量%)。
凝胶分率(质量%)=(B/A)×100
<平均气泡直径>
将实施例及比较例中得到的发泡片材切割成50mm见方,在液氮中浸渍1分钟,然后,用剃刀片沿与MD方向及ZD方向平行的面切割。针对切割截面,使用数码显微镜(株式会社キーエンス制“VHX-900”)拍摄200倍的放大照片,针对MD方向的长度2mm的部分的切割截面中存在的全部气泡,测定MD方向的气泡直径。反复进行5次该操作,将全部的MD方向气泡直径的平均值作为MD方向的平均气泡直径。
沿与发泡片材TD方向及ZD方向平行的面进行切割,除此之外,与上述同样地操作,拍摄200倍的放大照片,针对TD方向的长度2mm的部分的切割截面中存在的全部气泡,测定TD方向的气泡直径。反复进行5次该操作,将全部的TD方向气泡直径的平均值作为TD方向的平均气泡直径。
<23℃时的抗拉强度及90℃时的抗拉强度>
使用拉伸试验机,在23℃或90℃的条件下,按照JIS K6767(A法),对实施例及比较例中得到的发泡片材的抗拉强度进行测定。从提高片材的剪切强度的观点考虑,优选抗拉强度的值大。
<25%压缩强度>
25%压缩强度是指按照JIS K6767对聚烯烃系树脂发泡片材进行测定而得到的值。从提高柔软性及高低差追随性的观点考虑,优选25%压缩强度的值小。
<90℃时的剪切强度>
在发泡片材的30mm见方的范围涂布粘接剂。然后立即以与前述的粘接剂涂布部分重叠的方式放置短边为30mm、长边为100mm的木制的夹具A,将发泡片材与夹具A压接,然后,按照夹具A的大小切割发泡片材。
接下来,在切割了的发泡片材的未粘接夹具A的面涂布粘接剂,然后立即重叠木制的夹具B,将发泡片材与夹具B压接。
通过将其在室温下放置24小时,从而养护粘接剂,制成剪切强度测定用样品。
接下来,以发泡片材的片材面与拉伸方向平行的方式将剪切强度测定用样品安装于设置有1kN的测力传感器(load cell)的试验机(株式会社エー·アンド·デイ制“テンシロン万能材料试验机”)。以100mm/分钟的速度将其中一个夹具垂直向上拉拽,使发泡片材进行层间剥离。测定此时的负荷,将其最大值作为剪切强度,由此进行测定。
实施例1
将作为聚烯烃系树脂的直链状低密度聚乙烯(LLDPE)(エクソンケミカル社制“Exact3027”,密度:0.900g/cm3)100质量份、作为热分解型发泡剂的偶氮二甲酰胺2.0质量份、作为分解温度调节剂的氧化锌1质量份、及作为抗氧化剂的2,6-二叔丁基对甲酚0.5质量份供给至挤出机,于130℃进行熔融混炼,挤出厚度约0.3mm的长尺寸片状的聚烯烃系树脂组合物。
接下来,向上述长尺寸片状的聚烯烃系树脂组合物的两面照射4.5Mrad的加速电压为500kV的电子束而使其进行交联,然后,连续地送入到利用热风及红外线加热器而保持为250℃的发泡炉内从而进行加热而使其发泡,并且,一边进行发泡,一边以MD的拉伸倍率为1.5倍、TD的拉伸倍率为1.7倍的方式进行拉伸,由此,得到厚度为0.06mm的发泡片材。将得到的发泡片材的评价结果示于表1。
实施例2~9、比较例1~8
如表1及2所示那样地变更聚烯烃系树脂组合物的配合,并且,以成为表1及2的凝胶分率(交联度)的方式调节交联时的电子束的量,将TD的拉伸倍率调节为1.2倍~3.5倍,除此之外,与实施例1同样地实施。
需要说明的是,实施例8、9、比较例8中,如表1、2中记载那样,作为聚烯烃树脂,除了实施例1中使用的直链状低密度聚乙烯之外,还使用了乙烯-乙酸乙烯酯共聚物(EVA)(乙酸乙烯酯量19质量%,東ソー株式会社制,商品名“ウルトラセン636”)。
[表1]
表1
[表2]
表2
根据上述的结果可知,通过本发明,可提供即使厚度薄也具有优异的剪切强度的聚烯烃系树脂发泡片材。更具体而言,例如,在使用相同树脂、并且具有同等程度的压缩强度的发泡片材中,即使厚度薄也能发挥优异的剪切强度。
Claims (6)
1.一种聚烯烃系树脂发泡片材,其是将聚烯烃系树脂发泡而得到的,所述发泡片材的发泡倍率为1.5~20cm3/g,所述发泡片材的MD方向及TD方向的平均气泡直径均为130μm以下,90℃时的剪切强度为0.3~10Mpa,所述发泡片材满足下述式(1)及式(2),
TM/D≥6 (1)
TT/D≥5 (2)
TM:90℃时的MD方向的抗拉强度
TT:90℃时的TD方向的抗拉强度
D:所述发泡片材的密度,其单位为g/cm3,
所述发泡片材的厚度为0.10~0.8mm。
2.如权利要求1所述的聚烯烃系树脂发泡片材,其25%压缩强度为10~1,000kPa。
3.如权利要求1或2所述的聚烯烃系树脂发泡片材,其23℃时的MD方向的抗拉强度为0.5~35MPa。
4.如权利要求1或2所述的聚烯烃系树脂发泡片材,其23℃时的TD方向的抗拉强度为0.5~30MPa。
5.如权利要求1或2所述的聚烯烃系树脂发泡片材,其凝胶分率为5~60质量%。
6.一种粘合胶带,其是在权利要求1~5中任一项所述的聚烯烃系树脂发泡片材的至少一面设置粘合剂层而得到的。
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