CN108281243A - Discharge plasma handles the device and method on micro- laminating structure insulating materials surface - Google Patents
Discharge plasma handles the device and method on micro- laminating structure insulating materials surface Download PDFInfo
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- CN108281243A CN108281243A CN201810085786.XA CN201810085786A CN108281243A CN 108281243 A CN108281243 A CN 108281243A CN 201810085786 A CN201810085786 A CN 201810085786A CN 108281243 A CN108281243 A CN 108281243A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/04—Treating the surfaces, e.g. applying coatings
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Abstract
The invention discloses the device that a kind of discharge plasma handles micro- laminating structure insulating materials surface, which includes：High pressure introduces pole one end and is connect with the pulse power by power supply high voltage output terminal, and the other end is connect by high-voltage conductive rod with high-field electrode；Grounding electrode is set to the underface of high-field electrode, and grounding electrode connect and is grounded with pedestal by being grounded conducting rod；It is fixed between high-field electrode and grounding electrode by processing sample, and gapless is fitted closely by processing sample and high-field electrode and grounding electrode.The invention also discloses a kind of methods that discharge plasma handles micro- laminating structure insulating materials surface, including：Step 1 assembles processing unit according to each equipment；Step 2, placement are secured between high-field electrode and grounding electrode by processing sample and gap are not present；Step 3, the opening pulse power form uniform glow discharge；The low temperature plasma that step 4, glow discharge generate by processing specimen surface to being carried out ablating processing.
Description
Technical field
The present invention relates to insulator technology fields, insulate in particular to the micro- laminating structure of discharge plasma processing
The device and method of material surface.
Background technology
The metal and the stacked composite insulation structure that insulate of micro- laminating structure insulating materials, i.e. micron to grade thickness,
Outstanding surface insulation intensity is all shown in direct current, exchange and pulse high-voltage, substantially increases insulating efficiency and quality,
Key function for large-scale pulse-power apparatus, power equipment is realized and miniaturization, high efficiency provide approach.
The surface processing of micro- stack layers insulating materials and treatment process are the key technologies for ensureing its performance and realizing.Micro- stack layers are exhausted
Edge preparation process is complicated, and shape processing and surface treatment are carried out using mechanical processing, the fine method for polishing and being cleaned by ultrasonic.From
From the point of view of current using effect, the micro- stack layers insulating materials processed using this technique, its flashover property consistency is difficult
Ensure, this is mainly due to caused by insulator surface treatment process.As it can be seen that micro- stack layers insulation will reach outstanding edge flashing
Its process of surface treatment of intensity, which is key technology and its extensive use, to be solved the problems, such as.The shape of micro- stack layers insulator
It needs to obtain through over mechanical processing, although current machining accuracy is very high, surface seems very smooth, due to metal
With the huge difference of the mechanical property of insulating materials, from microcosmic, layer on surface of metal is inevitable there are microprotrusion and burr.Gold
Belong to protrusion high-field effect will remarkable effect in the uneven place on the two interface, make metal layer electron emission, electron charge
Movement and mutually collision characteristic generation acute variation, cause internal field to concentrate, so as to cause faster insulation breakdown, so wanting
Realize the excellent insulation performance of micro- stack layers insulation, it is necessary to there is good process of surface treatment to ensure.
Plasma surface treatment technology is the new skill of a kind of high-tech environmental protection occurred in material surface processing scientific domain
Art.The metal bump and pollutant that insulating materials surface can be effectively removed using cold-plasma surfaces treated technology, are ground
Metal layer is ground, the insulation of micro- stack layers can be surface-treated using plasma technique, eliminate micro- stack layers insulating materials surface
Metal bump, burr, insulation protrusion, ensure the uniformity on its surface, reduce the dispersibility of material insulation property, integrally carry
The surface insulation intensity of high material.
Invention content
To solve the above problems, the purpose of the present invention is to provide a kind of micro- laminating structure insulation of discharge plasma processing
The device and method of material surface eliminates the metal on micro- stack layers insulating materials surface, the protrusion of insulation, burr, ensures its surface
Uniformity, reduce the dispersibility of material insulation property, the whole surface insulation intensity for improving material.
The present invention provides the device that a kind of discharge plasma handles micro- laminating structure insulating materials surface, the device packets
It includes：
High pressure introduces pole, and one end is connect by power supply high voltage output terminal with the pulse power, and the high pressure introduces extremely another
One end is connect by high-voltage conductive rod with high-field electrode；
Grounding electrode is set to the underface of the high-field electrode, and the grounding electrode is by being grounded conducting rod and pedestal
It connects and is grounded；
By processing sample, be fixed between the high-field electrode and the grounding electrode, and it is described by processing sample with
The high-field electrode and the grounding electrode fit closely gapless.
As a further improvement on the present invention, the high pressure introduces isolated input there are one the outer covers of pole.
As a further improvement on the present invention, the high-voltage conductive rod, high-field electrode, described by processing sample, institute
It states grounding electrode and the ground connection conducting rod is in the confined space that discharge treatment chamber enclosure is formed with the pedestal.
As a further improvement on the present invention, the both sides of the discharge treatment chamber enclosure are respectively equipped with intake interface and outlet
Interface, and the intake interface is connect with gas cylinder, the outlet interface is connect with vacuum pump.
As a further improvement on the present invention, the pulse power output is the high-voltage pulse of nanosecond repetition rate,
Pulse width is 20ns~200ns, and pulsed discharge frequency is 200Hz~10k Hz, and voltage magnitude is 5kV~50kV, and power is
200W~2000W.
As a further improvement on the present invention, the vertical distance between the high-field electrode and the grounding electrode is 2mm
~30mm.
As a further improvement on the present invention, described by processing sample is cylinder, Elliptic Cylinder or plate.
As a further improvement on the present invention, when it is described by processing sample be cylinder, Elliptic Cylinder when, the high-voltage electricity
Pole and the grounding electrode are circular plate, and a diameter of the two of the high-field electrode and the grounding electrode with it is described
By the 2 times or more of longest direction distance on processing sample contacts face and 20mm cannot be less than；When described plate by processing sample
When, the high-field electrode is finger-like or strip with the grounding electrode, and the length of the high-field electrode and the grounding electrode is
5 times or more of distance between the two, and length and the length by processing sample of the high-field electrode with the grounding electrode
Degree described needs the length of processing region identical by processing sample.
As a further improvement on the present invention, the grounding electrode is the fixed electrode in position, and the high-field electrode is position
Set adjustable electrode.
The present invention also provides a kind of method that equal discharge ions body handles micro- laminating structure insulating materials surface, this method
Include the following steps：
Step 1, assembling discharge plasma handle the device on micro- laminating structure insulating materials surface；
Step 2 will be positioned on grounding electrode by processing sample, and adjust the position of high-field electrode, make to be handled sample
It is fixed between high-field electrode and grounding electrode and gap is not present；
Step 3 opens the pulse power, is applying high-tension pulse by the both ends of processing sample by high-field electrode and grounding electrode
Punching, and uniform glow discharge is being formed by the surface of processing sample；
In step 4, step 3 glow discharge generate low temperature plasma to by the metal of processing specimen surface, insulation
Protrusion or burr etc. carry out ablating processing；
Step 5 is waited being handled sample pretreating completion, is detected to its surface topography.
Beneficial effects of the present invention are：First, low temperature discharge corona treatment metal and insulating layer of the present invention
The method of folded composite material surface can make metal-insulator stacking composite material surface more smooth, reduce material under the electric field
Electric field distortion is conducive to improve its surface flashover characteristics；Second, method provided by the invention can solve general machining,
Grinding and buffing can not eliminate the destruction for the interface that insulate to metal-insulator stepped construction material metal, while can also be applied to pure
The burr and protrusion of material surface are eliminated in the surface treatment of metal material and insulating materials.
Description of the drawings
Fig. 1 handles the side on micro- laminating structure insulating materials surface for a kind of discharge plasma described in the embodiment of the present invention
Method flow chart；
Fig. 2 handles the dress on micro- laminating structure insulating materials surface for a kind of discharge plasma described in the embodiment of the present invention
Set the structural schematic diagram for handling plate treated sample；
Fig. 3 is the plate treated sample and high-field electrode, grounding electrode connection type side described in the embodiment of the present invention
View；
Fig. 4 is that the plate treated sample described in the embodiment of the present invention is bowed with high-field electrode, grounding electrode connection type
View；
Fig. 5 handles the dress on micro- laminating structure insulating materials surface for a kind of discharge plasma described in the embodiment of the present invention
Set the structural schematic diagram of the cylindrical treated sample of processing.
In figure,
1, high pressure introduces pole；2 isolated inputs；3, discharge treatment chamber enclosure；4, high-voltage conductive rod；5, high-field electrode；6、
By processing sample；7, grounding electrode；8, it is grounded conducting rod；9, intake interface；10, suction interface；11, pedestal；12, pulse electricity
Source；13, power supply high voltage output terminal；14, vacuum pump；15, gas cylinder.
Specific implementation mode
It is described in further detail below by specific embodiment and in conjunction with attached drawing to the present invention.
Embodiment 1
As shown in Fig. 2, described in the embodiment of the present invention 1 being that a kind of discharge plasma handles micro- laminating structure insulating materials
The device on surface handles plate treated sample, which includes：
High pressure introduces pole 1, and one end is connect by power supply high voltage output terminal 13 with the pulse power 12, and high pressure introduces pole 1
The other end is connect by high-voltage conductive rod 4 with high-field electrode 5；
Grounding electrode 7, is set to the underface of high-field electrode 5, and grounding electrode 7 is connected by being grounded conducting rod 8 with pedestal 11
It connects and is grounded；
It by processing sample 6, is fixed between high-field electrode 5 and grounding electrode 7, and by processing sample 6 and high-field electrode 5
Gapless is fitted closely with grounding electrode 7.
Further, high pressure introduces outside pole 1 and is cased with several isolated input 2.
Further, high-voltage conductive rod 4, high-field electrode 5, by processing sample 6, grounding electrode 7 and ground connection conducting rod 8 locate
In the confined space that discharge treatment chamber enclosure 3 and pedestal 11 are formed.
Further, the both sides of discharge treatment chamber enclosure 3 are respectively equipped with intake interface 9 and outlet interface 10, and air inlet connecting
Mouth 9 is connect with gas cylinder 15, and outlet interface 10 is connect with vacuum pump 14.
The device that discharge plasma handles micro- laminating structure insulating materials surface includes a set of power-supply system, a set of electrode
System and a discharge treatment room for handling sample：Power-supply system is by the pulse power 12 and power supply high voltage output terminal 13
Composition；Electrode system introduces pole 1, high-voltage conductive rod 4, high-field electrode 5, grounding electrode 7 and ground connection conducting rod 8 by high pressure and forms；
Discharge treatment room is made of isolated input 2, discharge treatment chamber enclosure 3, intake interface 9, outlet interface 10 and pedestal.Pulse electricity
12 high-pressure stage of source introduces pole 1 by discharge treatment room high pressure, high pressure guide rod 4 is input to high-field electrode 5, the low pressure of the pulse power 12
Pole and discharge treatment room pedestal 11 are grounded jointly, form discharge loop.The pedestal 11 of discharge treatment room is by being grounded guide rod 8 and connecing
Ground electrode 7 connects.Metal-insulator laminar composite material by processing sample 6, be fixed on high-field electrode 5 and grounding electrode 7 it
Between, two electrodes are fitted closely with by processing sample 6, and any gap, electric field between high-field electrode 5 and grounding electrode 7 is not present
Uniformly.
Further, the pulse power 12 output be nanosecond repetition rate high-voltage pulse, pulse width be 20ns~
200ns, pulsed discharge frequency are 200Hz~10k Hz, and voltage magnitude is 5kV~50kV, and power is 200W~2000W.Pulse
The parameter selection of power supply 12 need according to by the shape of processing sample 6, height and diameter and the indoor air pressure of discharge treatment and
Gaseous species determine.Higher by the height of processing sample 6, the voltage magnitude of corona discharge is higher, and frequency is faster；Discharge treatment
The voltage magnitude of the lower corona discharge of indoor air pressure is lower, and frequency is slower.Corona discharge parameter voltages amplitude, frequency, pulse
Relationship between width increases for voltage magnitude, and frequency and pulse width reduce；Frequency increases, voltage magnitude and pulse width drop
Low, pulse width increases, and voltage magnitude and frequency reduce.The parameter selection of the pulse power 12 will ensure that pulsed discharge is being handled
6 surface of sample generates uniform glow discharge and forms certain density plasma.To ensure to produce by 6 surface of processing sample
Raw uniform glow discharge, at 1 atmosphere pressure in air, by width (the i.e. high-field electrode 5 and grounding electrode 7 of processing sample 6
Between distance) when within 5mm, the design of pulse field strength can refer to 25kV/cm, pulse frequency 1kHz, pulse width 100ns；Quilt
When handling the width (i.e. distance between high-field electrode 5 and grounding electrode 7) of sample 6 between 5mm to 15mm, the electric discharge of the pulse power
Parameter designing can refer to pulse field strength 20kV/cm, pulse frequency 2kHz, pulse width 100ns；(i.e. by the width of processing sample 6
Distance between high-field electrode 5 and grounding electrode 7) between 15mm to 30mm when, the pulse power discharge parameter design can refer to arteries and veins
Rush field strength 18kV/cm, pulse frequency 1kHz, pulse width 100ns.The plasma density of formation is 1013-1014A/cm3It
Between.It can also be argon gas or other gases that the indoor gas of discharge treatment in the present embodiment, which can be nitrogen, air, at electric discharge
Reason room can bear the external and internal pressure of an atmospheric pressure, and generally tens Dao several kPas.And the high voltage input terminal of discharge treatment room
Highest can tolerate the nanosecond pulse voltage that repetition rate is 10kHz, 30kV between discharge treatment chamber enclosure 3.
Further, the vertical distance between high-field electrode 5 and grounding electrode 7 is 2mm~30mm.
Further, when being plate by processing sample 6, high-field electrode 5 is finger-like or strip, height with grounding electrode 7
The length of piezoelectricity pole 5 and grounding electrode 7 is 5 times or more of distance between the two, and the length of high-field electrode 5 and grounding electrode 7
Need the length of processing region identical with by the length of processing sample 6 or by processing sample 6.Between high-field electrode 5 and grounding electrode 7
Direction of an electric field and the length direction of the two are mutually perpendicular to.
Further, grounding electrode 7 is the fixed electrode in position, and high-field electrode 5 is the electrode of position-adjustable.It is placing
It when by processing sample 6, will be first positioned on grounding electrode 7 by processing sample 6, be adjusted by adjusting the position of high-field electrode 5
Whole high-field electrode 5 between grounding electrode 7 at a distance from, finally make by handle sample 6 be fixed on two electrodes center and with two
Electrode seal is bonded.
The present embodiment with length is 20mm, width for the processing region of 10mm is inner explanation.As shown in Fig. 2, discharge treatment
Room high pressure introduces pole 1 and is fixed on 4 one end of high-voltage conductive rod, and the other end is connect with high-field electrode 5, power supply low pressure pole and discharge treatment
Room metab 11 is grounded jointly, forms discharge loop.Discharge treatment room pedestal 11 is by being grounded conducting rod 8 and grounding electrode 7
Connection.
As shown in figure 3, high-field electrode 5 and grounding electrode 7 are pressed on respectively by processing sample 6, high-field electrode 5 and ground connection
Electrode 7 is in close contact with by processing sample 6, seamless.By region of the processing sample 6 between high-field electrode 5 and grounding electrode 7
It is the discharge treatment region for being handled sample 6.As shown in figure 4, in order to ensure that the electric field in discharge treatment region is substantially uniform, high pressure
The both sides rounding off of electrode 5 and grounding electrode 7.High-field electrode 5 and grounding electrode 7 are identical as by the length of processing sample 6, are
20mm.Distance between high-field electrode 5 and grounding electrode 7 with it is of same size by processing region by processing sample 6, be 10mm.
Pole 1 is introduced by high pressure, high-voltage conductive rod 4, high-field electrode 5, is connect as shown in Fig. 2, the pulse power 12 exports high pressure
Ground electrode 7, ground connection conducting rod 8 are applied to by 6 both ends of processing sample.12 output voltage amplitude of the pulse power is 18kV, frequency
5kHz, pulse width 70ns.Continuous electric discharge generates density about 1013A/cm3More Uniform Discharge plasma continuous action
By 6 surface of processing sample, the table for being made to be handled sample 6 by the protrusion and burr of 6 surface metal of processing sample, insulation is ablated
Face is more smooth, and the interface of metal and insulation is more clear, and improves by the surface insulation intensity of processing sample 6.
Embodiment 2
As shown in figure 5, described in the embodiment of the present invention 2 being that a kind of discharge plasma handles micro- laminating structure insulating materials
The cylindrical treated sample of device processing on surface：
Be in place of the difference of the present embodiment and embodiment 1, when it is described by processing sample be cylinder, Elliptic Cylinder when,
The high-field electrode and the grounding electrode are circular plate, and the high-field electrode and the grounding electrode it is a diameter of its
The two by the 2 times or more of longest direction distance on processing sample contacts face and cannot be less than 20mm with described.The present embodiment is with low
Air pressure argon gas as environmental gas, by a diameter of 15mm, highly for 20mm by processing sample 6 for illustrate.
As shown in figure 5, discharge treatment room high pressure, which introduces pole 1, is fixed on 4 one end of high-voltage conductive rod, the other end and high-field electrode
5 connections, power supply low pressure pole and discharge treatment room metab 11 are grounded jointly, form discharge loop.Discharge treatment room pedestal 11
It is connect with grounding electrode 7 by being grounded conducting rod 8.High-field electrode 5 compress be placed on 7 center of grounding electrode by processing sample 6
On, high-field electrode 5, grounding electrode 7 are in close contact with by processing sample 6, seamless.Cylindrical side by processing sample 6 is to put
Electric treatment region.Electric field in order to ensure discharge treatment region is substantially uniform, and the edge of high-field electrode 5 and grounding electrode 7 is round and smooth
Transition.High-field electrode 5 and grounding electrode 7 a diameter of 40mm, thickness 15mm.
As shown in figure 5, vacuum pump 14 is evacuated for discharge treatment room, the indoor vacuum degree of discharge treatment reaches 10-4Pa, vacuum
Pump 14 stops pumping, closes outlet interface 10.Gas cylinder 15 is passed through argon gas into discharge treatment room, and discharge treatment house vacuum degree reaches
When to 10Pa, stops input argon gas, close intake interface 9.
Pole 1 is introduced by high pressure, high-voltage conductive rod 4, high-field electrode 5, is connect as shown in figure 5, the pulse power 12 exports high pressure
Ground electrode 7, ground connection conducting rod 8 are applied to by 6 both ends of processing sample.12 output voltage amplitude of the pulse power is 3.5kV, frequency
1kHz, pulse width 70ns.Continuous electric discharge generates density about 1013A/cm3More Uniform Discharge plasma continuous action
By 6 surface of processing sample, the table for being made to be handled sample 6 by the protrusion and burr of 6 surface metal of processing sample, insulation is ablated
Face is more smooth, and the interface of metal and insulation is more clear, and improves by the surface insulation intensity of processing sample 6.
Embodiment 3
As shown in Figure 1, described in the embodiment of the present invention 2 being that a kind of discharge plasma handles micro- laminating structure insulating materials
The method on surface, this approach includes the following steps：
Step 1, the discharge plasma according to any one of claim 1-9 handle micro- laminating structure insulation material
Expect that the connection relation of each equipment room in surface apparatus, assembling discharge plasma handle micro- laminating structure insulating materials surface
Device：Discharge treatment room high pressure introduces pole 1 and is fixed on 4 one end of high-voltage conductive rod, and the other end is connect with high-field electrode 5, and power supply is low
It presses pole and discharge treatment room metab 11 to be grounded jointly, forms discharge loop.Discharge treatment room pedestal 11 is conductive by being grounded
Bar 8 is connect with grounding electrode 7.High-field electrode 5 compress be placed on 7 center of grounding electrode by processing sample 6, high-field electrode 5,
Grounding electrode 7 is in close contact with by processing sample 6, seamless.
Step 2 will be positioned on grounding electrode 7 by processing sample 6, and adjust the position of high-field electrode 5, make to be handled examination
Sample 6 is fixed between high-field electrode 5 and grounding electrode 7 and gap is not present；
Step 3 opens the pulse power 12, by high-field electrode 5 and grounding electrode 7 by the both ends application of processing sample 6
High-voltage pulse, and uniform glow discharge is being formed by the surface of processing sample 6；
In step 4, step 3 glow discharge generate low temperature plasma to by 6 surface of processing sample insulation protrusion or
Burr etc. carries out ablating processing；
Step 5 waits that being handled the processing of sample 6 completes, and is detected its surface topography.
The pulse power 12 applies repetition rate nanosecond by high-field electrode 5 and grounding electrode 7 at 6 both ends of treated sample
High-voltage pulse forms more uniform glow discharge on 6 surface of treated sample, glow discharge generate a certain concentration low temperature etc. from
Daughter ablates the metal on 6 surface of treated sample, insulation protrusion, burr etc., makes the surface of micro- laminating structure insulating materials more
Add smooth, the interface of metal and insulation is more clear, to improve the surface insulation intensity of treated sample 6.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of discharge plasma handles the device on micro- laminating structure insulating materials surface, which is characterized in that including：
High pressure introduces pole (1), and one end is connect by power supply high voltage output terminal (13) with the pulse power (12), and the high pressure is drawn
Enter pole (1) other end to connect with high-field electrode (5) by high-voltage conductive rod (4)；
Grounding electrode (7) is set to the underface of the high-field electrode (5), and the grounding electrode (7) is by being grounded conducting rod
(8) it connect and is grounded with pedestal (11)；
It by processing sample (6), is fixed between the high-field electrode (5) and the grounding electrode (7), and described by processing examination
Sample (6) fits closely gapless with the high-field electrode (5) and the grounding electrode (7).
2. discharge plasma according to claim 1 handles the device on micro- laminating structure insulating materials surface, feature
It is, the high pressure, which introduces outside pole (1), is cased with isolated input (2).
3. discharge plasma according to claim 1 handles the device on micro- laminating structure insulating materials surface, feature
It is, it is the high-voltage conductive rod (4), the high-field electrode (5), described by processing sample (6), the grounding electrode (7) and institute
Ground connection conducting rod (8) is stated to be in the confined space that discharge treatment chamber enclosure (3) is formed with the pedestal (11).
4. discharge plasma according to claim 3 handles the device on micro- laminating structure insulating materials surface, feature
It is, the both sides of the discharge treatment chamber enclosure (3) are respectively equipped with intake interface (9) and outlet interface (10), and the air inlet
Interface (9) is connect with gas cylinder (15), and the outlet interface (10) connect with vacuum pump (14).
5. discharge plasma according to claim 1 handles the device on micro- laminating structure insulating materials surface, feature
It is, the pulse power (12) output is the high-voltage pulse of nanosecond repetition rate, and pulse width is 20ns~200ns,
Pulsed discharge frequency is 200Hz~10k Hz, and voltage magnitude is 5kV~50kV, and power is 200W~2000W.
6. discharge plasma according to claim 1 handles the device on micro- laminating structure insulating materials surface, feature
It is, the vertical distance between the high-field electrode (5) and the grounding electrode (7) is 2mm~30mm.
7. discharge plasma according to claim 1 handles the device on micro- laminating structure insulating materials surface, feature
It is, described by processing sample (6) is cylinder, Elliptic Cylinder or plate.
8. discharge plasma according to claim 7 handles the device on micro- laminating structure insulating materials surface, feature
Be, when it is described by processing sample (6) be cylinder, Elliptic Cylinder when, the high-field electrode (5) and the grounding electrode (7)
For circular plate, a diameter of the two of the high-field electrode (5) and the grounding electrode (7) with it is described by processing sample
(6) 2 times or more of longest direction distance and 20mm cannot be less than on contact surface；When it is described by processing sample (6) be it is plate when,
The high-field electrode (5) and the grounding electrode (7) are finger-like or strip, the high-field electrode (5) and the grounding electrode (7)
Length 5 times or more of distance between the two, and the length of the high-field electrode (5) and the grounding electrode (7) with it is described
By the length of processing sample (6) or described need the length of processing region identical by processing sample (6).
9. discharge plasma according to claim 1 handles the device on micro- laminating structure insulating materials surface, feature
It is, the grounding electrode (7) is the fixed electrode in position, and the high-field electrode (5) is the electrode of position-adjustable.
10. a kind of method that discharge plasma handles micro- laminating structure insulating materials surface, which is characterized in that including following step
Suddenly：
Step 1, assembling discharge plasma handle the device on micro- laminating structure insulating materials surface；
Step 2 will be positioned on grounding electrode (7) by processing sample (6), and adjust the position of high-field electrode (5), make to be handled
Sample (6), which is fixed between high-field electrode (5) and grounding electrode (7), is not present gap；
Step 3 opens the pulse power (12), by high-field electrode (5) and grounding electrode (7) by the both ends of processing sample (6)
Apply high-voltage pulse, and uniform glow discharge is being formed by the surface of processing sample (6)；
In step 4, step 3 glow discharge generate low temperature plasma to by the metal on processing sample (6) surface, insulation it is convex
It rises or burr carries out ablating processing；
Step 5 waits that being handled sample (6) processing completes, and is detected its surface topography.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110739109A (en) * | 2019-10-10 | 2020-01-31 | 华北电力大学 | Increase C4F7System and method for electrical strength of insulator surface in N gas |
| CN114156026A (en) * | 2021-11-30 | 2022-03-08 | 中铁第一勘察设计院集团有限公司 | Processing method of high-voltage capacitive dry-type sleeve |
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