CN108214951A - 基板切割设备 - Google Patents

基板切割设备 Download PDF

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Publication number
CN108214951A
CN108214951A CN201611237507.4A CN201611237507A CN108214951A CN 108214951 A CN108214951 A CN 108214951A CN 201611237507 A CN201611237507 A CN 201611237507A CN 108214951 A CN108214951 A CN 108214951A
Authority
CN
China
Prior art keywords
substrate
along
unit
cutter unit
cutting wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611237507.4A
Other languages
English (en)
Chinese (zh)
Inventor
郑东俊
黄俊梧
张喜童
姜洙浩
卢光硕
成昊映
崔汉铉
金教承
徐正欢
金镇洛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Publication of CN108214951A publication Critical patent/CN108214951A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
    • C03B35/20—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201611237507.4A 2016-12-14 2016-12-28 基板切割设备 Pending CN108214951A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20160170295 2016-12-14
KR10-2016-0170295 2016-12-14

Publications (1)

Publication Number Publication Date
CN108214951A true CN108214951A (zh) 2018-06-29

Family

ID=62656482

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611237507.4A Pending CN108214951A (zh) 2016-12-14 2016-12-28 基板切割设备

Country Status (2)

Country Link
KR (1) KR102593615B1 (ko)
CN (1) CN108214951A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109437537A (zh) * 2018-12-11 2019-03-08 浙江旭恒甬鑫智能科技有限公司 玻璃基板切割机

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102267732B1 (ko) * 2019-10-08 2021-06-22 주식회사 탑 엔지니어링 스크라이빙 휠 교체 장치 및 이를 포함하는 스크라이빙 장치
KR102328420B1 (ko) * 2020-02-28 2021-11-18 한국미쯔보시다이아몬드공업(주) 취성기판 스크라이브 가공용 기판 지지장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006101087A1 (ja) * 2005-03-23 2006-09-28 Beldex Corporation スクライブ装置
CN1856392A (zh) * 2003-09-24 2006-11-01 三星钻石工业株式会社 基板切割系统、基板制造装置及基板切割方法
JP2010076957A (ja) * 2008-09-24 2010-04-08 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置および基板分断システム
CN102976599A (zh) * 2008-04-21 2013-03-20 塔工程有限公司 对结合基板进行台阶式划线的方法及其控制系统
CN104030558A (zh) * 2013-03-05 2014-09-10 三星钻石工业股份有限公司 基板处理系统及基板反转装置
TW201600479A (zh) * 2014-06-26 2016-01-01 Mitsuboshi Diamond Ind Co Ltd 刻劃裝置
CN105988236A (zh) * 2015-03-16 2016-10-05 塔工程有限公司 用于切割结合基板的系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116260A (ja) * 1997-10-08 1999-04-27 Mitsuboshi Diamond Kogyo Kk ガラス加工装置
DE69827029T2 (de) * 1998-08-28 2006-03-09 Bando Kiko Co., Ltd. Maschine zum brechen von glasscheiben
KR101074397B1 (ko) * 2004-12-23 2011-10-17 엘지디스플레이 주식회사 표시패널의 스크라이빙 장치 및 방법
JP5107514B2 (ja) * 2005-09-15 2012-12-26 株式会社シライテック 分断された基板の仕分け取り上げ装置
KR100753162B1 (ko) 2005-12-29 2007-08-30 주식회사 탑 엔지니어링 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버
JP5334443B2 (ja) * 2008-04-02 2013-11-06 日本メクトロン株式会社 板状ワーク反転装置
JP2010232472A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
KR101696718B1 (ko) * 2009-12-15 2017-01-16 주식회사 탑 엔지니어링 스크라이빙 조립체 및 스크라이빙 방법
KR101407415B1 (ko) * 2012-08-30 2014-06-17 주식회사 에스에프에이 기판 절단시스템
KR102216338B1 (ko) * 2014-07-11 2021-02-18 삼성디스플레이 주식회사 기판 절단 장치
JP3194224U (ja) * 2014-07-17 2014-11-13 株式会社シライテック パネルの折割装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1856392A (zh) * 2003-09-24 2006-11-01 三星钻石工业株式会社 基板切割系统、基板制造装置及基板切割方法
WO2006101087A1 (ja) * 2005-03-23 2006-09-28 Beldex Corporation スクライブ装置
CN102976599A (zh) * 2008-04-21 2013-03-20 塔工程有限公司 对结合基板进行台阶式划线的方法及其控制系统
JP2010076957A (ja) * 2008-09-24 2010-04-08 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置および基板分断システム
CN104030558A (zh) * 2013-03-05 2014-09-10 三星钻石工业股份有限公司 基板处理系统及基板反转装置
TW201600479A (zh) * 2014-06-26 2016-01-01 Mitsuboshi Diamond Ind Co Ltd 刻劃裝置
CN105988236A (zh) * 2015-03-16 2016-10-05 塔工程有限公司 用于切割结合基板的系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109437537A (zh) * 2018-12-11 2019-03-08 浙江旭恒甬鑫智能科技有限公司 玻璃基板切割机

Also Published As

Publication number Publication date
KR102593615B1 (ko) 2023-10-26
KR20180069677A (ko) 2018-06-25

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SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180629

WD01 Invention patent application deemed withdrawn after publication