CN108198951A - A kind of flexible OLED display part and its packaging method, netted dottle pin layer preparation method - Google Patents
A kind of flexible OLED display part and its packaging method, netted dottle pin layer preparation method Download PDFInfo
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- CN108198951A CN108198951A CN201711477369.1A CN201711477369A CN108198951A CN 108198951 A CN108198951 A CN 108198951A CN 201711477369 A CN201711477369 A CN 201711477369A CN 108198951 A CN108198951 A CN 108198951A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
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Abstract
The present invention provides a kind of flexible OLED display part and its packaging method, netted dottle pin layer preparation method, wherein flexible OLED display part include：Flexible base board（1）；It is successively set on flexible base board from bottom to top（1）On thin film field effect transistor TFT layer（2）, OLED device layer（3）And thin-film encapsulation layer（4）；Cover flexible base board（1）, thin film field effect transistor TFT layer（2）, OLED device layer（3）And thin-film encapsulation layer（4）Barrier layer（5）；It is arranged on OLED device layer（3）And thin-film encapsulation layer（4）Between netted dottle pin layer（6）, for being buffered in the stress generated when the bending of flexible OLED display part or extruding.Netted dottle pin layer of the present invention setting with buffering stress when flexible OLED display part is bent or is squeezed, can share the pressure differential generated during two kinds of film layer bendings, flexible base board is avoided to be damaged failure.
Description
Technical field
The present invention relates to screen display technology field more particularly to a kind of flexible OLED display part and its packaging method,
Netted dottle pin layer preparation method.
Background technology
OLED（Organic Light Emitting Diode, organic light emitting diode）It is maximum compared with TFT-LCD
Advantage is exactly that can prepare large scale, ultra-thin flexible display device.Meanwhile for OLED display device, encapsulation procedure be the service life,
Reliability and the determinant for showing quality.For different display devices, packaged type is also different.At present, flexible OLED is shown
Show that device relies primarily on thin film encapsulation technology, Fig. 1 show its encapsulating structure figure, set successively from bottom to top on flexible base board 1'
Thin film field effect transistor TFT layer 2', OLED device layer 3', thin-film encapsulation layer 4' are put, is then encapsulated by barrier layer 5'.Aforementioned
In thin-film package, most widely used is barrier layer, acts on main barrier water oxygen and enters display device, avoids display device aging
And failure.The production process on barrier layer is simple, and percent of pass is high, and flexible good.
Barrier layer generally use silicon nitride（SiN）Material is made, different from the material of flexible base board, and stress effect is not yet
Together, when display device stress is bent, the bending degree and curvature of barrier layer and flexible base board are different, can cause flexible base board by
Loss effect.
Invention content
The technical problems to be solved by the invention are, provide a kind of flexible OLED display part and its packaging method, net
Shape dottle pin layer preparation method, makes the major part of display device will not be stressed and damage failure, prolongs the service life.
In order to solve the above technical problem, the present invention provides a kind of flexible OLED display part, including：
Flexible base board；
Thin film field effect transistor TFT layer, OLED device layer and the film being successively set on from bottom to top on the flexible base board
Encapsulated layer；
Cover the barrier layer of the flexible base board, thin film field effect transistor TFT layer, OLED device layer and thin-film encapsulation layer；
The netted dottle pin layer being arranged between the OLED device layer and the thin-film encapsulation layer, the netted dottle pin layer are used to delay
The stress for being punched in the flexible OLED display part bending or being generated when squeezing.
Wherein, the netted dottle pin layer is additionally arranged between the thin-film encapsulation layer and the barrier layer.
Wherein, it is in elongated strip and staggered spacer material that the netted dottle pin layer, which is equipped with several,.
Wherein, the spacer material is made, and be transferred in the OLED device layer or described using aluminium oxide or titanium oxide
In thin-film encapsulation layer.
The embodiment of the present invention also provides a kind of packaging method of flexible OLED display part, including：
Flexible base board is provided；
Set gradually thin film field effect transistor TFT layer, OLED device layer and film envelope from bottom to top on the flexible base board
Fill layer；
Setting covers the blocking of the flexible base board, thin film field effect transistor TFT layer, OLED device layer and thin-film encapsulation layer
Layer；
Netted dottle pin layer is set between the OLED device layer and the thin-film encapsulation layer, and the netted dottle pin layer is used to buffer
The stress generated when the flexible OLED display part is bent or is squeezed.
Wherein, netted dottle pin layer is set to specifically include between the OLED device layer and the thin-film encapsulation layer：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in the OLED device layer, and remove the mesh template；
Curing process is carried out to the OLED device layer for carrying unfashioned spacer material, obtains the netted dottle pin layer.
Wherein, the packaging method further includes：
The netted dottle pin layer is set between the thin-film encapsulation layer and the barrier layer.
Wherein, the netted dottle pin layer is set to specifically include between the thin-film encapsulation layer and the barrier layer：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in the thin-film encapsulation layer, and removes the mesh template；
Curing process is carried out to the thin-film encapsulation layer for carrying unfashioned spacer material, obtains the netted dottle pin layer.
Wherein, the spacer material is staggered in elongated strip and on the netted dottle pin layer.
Wherein, the spacer material material is aluminium oxide or titanium oxide.
The embodiment of the present invention also provides a kind of netted dottle pin layer preparation method, and the netted dottle pin layer is used to be buffered in flexibility
The stress that OLED display device is bent or is generated when squeezing, the preparation method include：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in corresponding film layer in the flexible OLED display part, and removes the netted mould
Plate；
Curing process is carried out to the film layer for carrying unfashioned spacer material, obtains the netted dottle pin layer.
Wherein, the film layer is OLED device layer or thin-film encapsulation layer.
Wherein, the spacer material is staggered in elongated strip and on the netted dottle pin layer.
Wherein, the spacer material material is aluminium oxide or titanium oxide.
The advantageous effect of the embodiment of the present invention is：Being added to one kind between two kinds of film layers of different nature has
The netted dottle pin layer of stress is buffered, when flexible OLED display part is bent or is squeezed, netted dottle pin layer can be shared
The pressure differential generated during the bending of two kinds of film layers, has the function that reduce stress, and the major part of whole display part is just not
It can be stressed and damage failure, substantially prolong service life.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the encapsulating structure schematic diagram of existing flexible OLED display part.
Fig. 2 is a kind of encapsulating structure schematic diagram of one flexible OLED display part of the embodiment of the present invention.
Fig. 3 is a kind of another encapsulating structure schematic diagram of one flexible OLED display part of the embodiment of the present invention.
Fig. 4 is the structure diagram of netted dottle pin layer in the embodiment of the present invention one.
Fig. 5 is the flow diagram that netted dottle pin layer is prepared in the embodiment of the present invention one.
Fig. 6 is a kind of flow diagram of the packaging method of two flexible OLED display part of the embodiment of the present invention.
Fig. 7 is a kind of flow diagram of netted dottle pin layer preparation method of the embodiment of the present invention three.
Specific embodiment
The explanation of following embodiment is refer to the attached drawing, can be to the specific embodiment implemented to the example present invention.
It please referring to shown in Fig. 2, the embodiment of the present invention one provides a kind of flexible OLED display part, including：
Flexible base board 1；
It is successively set on thin film field effect transistor TFT layer 2 on the flexible base board 1, OLED device layer 3 and thin from bottom to top
Film encapsulated layer 4；
Cover the barrier layer of the flexible base board 1, thin film field effect transistor TFT layer 2, OLED device layer 3 and thin-film encapsulation layer 4
5；
The netted dottle pin layer 6 being arranged between the OLED device layer 3 and the thin-film encapsulation layer 4, the netted dottle pin layer 6 are used
The stress generated when being buffered in the flexible OLED display part bending or squeezing.
Since the present embodiment is between two kinds of film layers of different nature（OLED device layer 3 and thin-film encapsulation layer 4 it
Between）It is added to a kind of structure with buffering stress respectively（Netted dottle pin layer 6）, when flexible OLED display part bending or
When person squeezes, the power that OLED device layer 3, thin-film encapsulation layer 4 are subject to can be all focused on netted dottle pin layer 6, and netted dottle pin layer 6 can
To share the pressure differential generated during two kinds of film layer bendings, have the function that reduce stress, the main portion of whole display part
Dividing would not be stressed and damage failure, substantially prolong service life.
Further, as shown in figure 3, the present embodiment can also set netted dottle pin between thin-film encapsulation layer 4 and barrier layer 5
Layer 6, formed it is double netted every cushion layer structure, it is OLED device layer 3, thin in this way when flexible OLED display part is bent or is squeezed
The power that film encapsulated layer 4 and outermost barrier layer 5 are subject to can be all focused on two netted dottle pin layers 6, and netted dottle pin layer 6 can
To share the pressure differential generated during two kinds of film layer bendings, have the function that reduce stress, the main portion of whole display part
Dividing would not be stressed and damage failure, substantially prolong service life.
In the present embodiment, netted dottle pin layer material can select aluminium oxide or titanium oxide, both materials are due to it
Body structure property has preferable buffering stress.The thickness of netted dottle pin layer is 3-5 microns, and uses transfer modes system
It is standby.
Incorporated by reference to shown in Fig. 4, netted dottle pin layer 6 is equipped with several spacer materials 60 in elongated strip and is staggered,
This reticular structure can buffer stress well.Fig. 4 show 60 criss-cross arrangement of spacer material, can also oblique staggered row
Row, the stress variation of all directions can be corresponded to when flexible OLED display part is bent or is squeezed.
Referring again to shown in Fig. 5, in the present embodiment, the preparation process of netted dottle pin layer 6 is as follows（It is corresponding shown in figure
The sectional drawing of structure）：
First, a mesh template 61 is provided, the groove 62 of respective depth is made on mesh template 61 using lithographic method；
Then spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on mesh template
On 61；
Spacer material is transferred in corresponding film layer again（Shown in Fig. 5 for being transferred in OLED device layer 3, similarly, spacer material
Thin-film encapsulation layer 4 can be transferred in）, mesh template 61 is removed, retains unfashioned spacer material；
Curing process is carried out to the film layer for carrying unfashioned spacer material, to ensure the stress effect of dottle pin layer, finally obtains net
Shape dottle pin layer.
It is aforementioned double netted every cushion layer structure for the present embodiment, due to needing in 4 turns of OLED device layer 3 and thin-film encapsulation layer
Impression is directed to different basement membrane layers into two layers of netted dottle pin layer 6（OLED device layer 3 or thin-film encapsulation layer 4）, need to adopt
With different curing modes：If spacer material is transferred to OLED device layer 3, because OLED device layer 3 can not be heated at high temperature,
Air dry cure can only then be used；If spacer material is transferred to thin-film encapsulation layer 4, then it can be used and be heating and curing.
Corresponding to the embodiment of the present invention one, the embodiment of the present invention two provides a kind of encapsulation side of flexible OLED display part
Method, including：
Flexible base board 1 is provided；
Set gradually thin film field effect transistor TFT layer 2, OLED device layer 3 and film from bottom to top on the flexible base board 1
Encapsulated layer 4；
Setting covers the resistance of the flexible base board 1, thin film field effect transistor TFT layer 2, OLED device layer 3 and thin-film encapsulation layer 4
Barrier 5；
Netted dottle pin layer 6 is set between the OLED device layer 3 and the thin-film encapsulation layer 4, and the netted dottle pin layer 6 is used for
The stress for being buffered in the flexible OLED display part bending or being generated when squeezing.
Wherein, netted dottle pin layer 6 is set to specifically include between the OLED device layer 3 and the thin-film encapsulation layer 4：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in the OLED device layer 3, and remove the mesh template；
Curing process is carried out to the OLED device layer 3 for carrying unfashioned spacer material, obtains the netted dottle pin layer 6.
Wherein, the packaging method further includes：
The netted dottle pin layer 6 is set between the thin-film encapsulation layer 4 and the barrier layer 5.
Wherein, the netted dottle pin layer 6 is set to specifically include between the thin-film encapsulation layer 4 and the barrier layer 5：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in the thin-film encapsulation layer 4, and remove the mesh template；
Curing process is carried out to the thin-film encapsulation layer 4 for carrying unfashioned spacer material, obtains the netted dottle pin layer 6.
Wherein, the spacer material is staggered in elongated strip and on the netted dottle pin layer 6.
Wherein, the spacer material material is aluminium oxide or titanium oxide.
Corresponding to the embodiment of the present invention one, the embodiment of the present invention three provides a kind of netted dottle pin layer preparation method, the net
Shape dottle pin layer is used for the stress for being buffered in the bending of flexible OLED display part or being generated when squeezing, which is characterized in that the preparation
Method includes：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in corresponding film layer in the flexible OLED display part, and removes the netted mould
Plate；
Curing process is carried out to the film layer for carrying unfashioned spacer material, obtains the netted dottle pin layer.
Wherein, the film layer is OLED device layer or thin-film encapsulation layer.
Wherein, the spacer material is staggered in elongated strip and on the netted dottle pin layer.
Wherein, the spacer material material is aluminium oxide or titanium oxide.
Operation principle in relation to embodiment two, three can be found in the explanation of the embodiment of the present invention one, and details are not described herein again.
By above description it is found that the advantageous effect of the embodiment of the present invention is：In two kinds of film layers of different nature
Between be added to it is a kind of have buffering stress netted dottle pin layer, when flexible OLED display part be bent or squeeze when,
Netted dottle pin layer can share the pressure differential generated during two kinds of film layer bendings, have the function that reduce stress, entire to show
The major part of device would not be stressed and damage failure, substantially prolong service life.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, therefore equivalent variations made according to the claims of the present invention, is still within the scope of the present invention.
Claims (10)
1. a kind of flexible OLED display part, which is characterized in that including：
Flexible base board（1）；
It is successively set on the flexible base board from bottom to top（1）On thin film field effect transistor TFT layer（2）, OLED device layer
（3）And thin-film encapsulation layer（4）；
Cover the flexible base board（1）, thin film field effect transistor TFT layer（2）, OLED device layer（3）And thin-film encapsulation layer（4）
Barrier layer（5）；
It is arranged on the OLED device layer（3）With the thin-film encapsulation layer（4）Between netted dottle pin layer（6）, it is described it is netted every
Bed course（6）For being buffered in the stress generated when the flexible OLED display part bending or extruding.
2. flexible OLED display part according to claim 1, which is characterized in that the netted dottle pin layer（6）It also sets up
In the thin-film encapsulation layer（4）With the barrier layer（5）Between.
3. flexible OLED display part according to claim 2, which is characterized in that the netted dottle pin layer（6）It is equipped with
Several is in elongated strip and staggered spacer material（60）.
4. flexible OLED display part according to claim 3, which is characterized in that the spacer material（60）Using aluminium oxide
Or titanium oxide is made, and is transferred in the OLED device layer（3）Or the thin-film encapsulation layer（4）On.
5. a kind of packaging method of flexible OLED display part, which is characterized in that including：
Flexible base board is provided（1）；
In the flexible base board（1）On set gradually thin film field effect transistor TFT layer from bottom to top（2）, OLED device layer（3）
And thin-film encapsulation layer（4）；
Setting covers the flexible base board（1）, thin film field effect transistor TFT layer（2）, OLED device layer（3）And thin-film package
Layer（4）Barrier layer（5）；
In the OLED device layer（3）With the thin-film encapsulation layer（4）Between netted dottle pin layer is set（6）, the netted dottle pin
Layer（6）For being buffered in the stress generated when the flexible OLED display part bending or extruding.
6. packaging method according to claim 5, which is characterized in that further include：
In the thin-film encapsulation layer（4）With the barrier layer（5）Between the netted dottle pin layer is set（6）.
7. packaging method according to claim 5, which is characterized in that described in the OLED device layer（3）With it is described thin
Film encapsulated layer（4）Between netted dottle pin layer is set（6）It specifically includes：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in the OLED device layer（3）, and remove the mesh template；
To carrying the OLED device layer of unfashioned spacer material（3）Curing process is carried out, obtains the netted dottle pin layer
（6）.
8. packaging method according to claim 6, which is characterized in that described in the thin-film encapsulation layer（4）With the resistance
Barrier（5）Between the netted dottle pin layer is set（6）It specifically includes：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in the thin-film encapsulation layer（4）, and remove the mesh template；
To carrying the thin-film encapsulation layer of unfashioned spacer material（4）Curing process is carried out, obtains the netted dottle pin layer
（6）.
9. a kind of netted dottle pin layer preparation method, the netted dottle pin layer is bent or squeezes for being buffered in flexible OLED display part
The stress generated during pressure, which is characterized in that the preparation method includes：
One mesh template is provided, the groove of respective depth is made on the mesh template using lithographic method；
Spacer material material and anhydrous solution are mixed to get mixed solution, and mixed solution is coated uniformly on the mesh template
On；
Unfashioned spacer material is transferred in corresponding film layer in the flexible OLED display part, and removes the netted mould
Plate；
Curing process is carried out to the film layer for carrying unfashioned spacer material, obtains the netted dottle pin layer.
10. preparation method according to claim 9, which is characterized in that the spacer material is in elongated strip and in the net
It is staggered on shape dottle pin layer, the spacer material material is aluminium oxide or titanium oxide.
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|---|---|---|---|
| CN201711477369.1A CN108198951A (en) | 2017-12-29 | 2017-12-29 | A kind of flexible OLED display part and its packaging method, netted dottle pin layer preparation method |
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|---|---|---|---|
| CN201711477369.1A CN108198951A (en) | 2017-12-29 | 2017-12-29 | A kind of flexible OLED display part and its packaging method, netted dottle pin layer preparation method |
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Application publication date: 20180622 |