CN108178991A - Novel heat-conducting adhesive tape and preparation method thereof - Google Patents
Novel heat-conducting adhesive tape and preparation method thereof Download PDFInfo
- Publication number
- CN108178991A CN108178991A CN201711458197.3A CN201711458197A CN108178991A CN 108178991 A CN108178991 A CN 108178991A CN 201711458197 A CN201711458197 A CN 201711458197A CN 108178991 A CN108178991 A CN 108178991A
- Authority
- CN
- China
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- heat
- conducting
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
A kind of novel heat-conducting adhesive tape in function tape technology field and preparation method thereof, the heat-conducting glue band includes heat conduction functional layer and the pressure sensitive adhesive for being coated on one side surface of heat conduction functional layer, the pressure sensitive adhesive has diffusion micro-structure on the surface far from heat conduction functional layer side, and the pressure sensitive adhesive for being mixed with metal powder is filled in the diffusion micro-structure.The present invention in pressure sensitive adhesive by setting metal powder to improve the heat conductivility of pressure sensitive adhesive, and so as to improve the radiating efficiency of heat-conducting glue band entirety, radiating efficiency can improve 10%~30%.
Description
Technical field
The present invention relates to a kind of technology of function adhesive tape area, specifically a kind of novel heat-conducting adhesive tape and its preparation side
Method.
Background technology
OLED technology is widely used in portable device at present.In the design of OLED screen curtain, often using glass or
PI is as substrate, and the radiating efficiency of glass and PI is not high, needs to take cooling measure, is typically employed in OLED screen backstage face paste
The mode of heat-conducting glue band reaches heat dissipation effect.
Current heat-conducting glue band needs pressure-sensitive adhesive coating mainly using copper foil as functional layer.Although copper foil radiating efficiency
It is higher, but pressure sensitive adhesive is high-molecular compound, heat transfer efficiency is relatively low, therefore current heat-conducting glue band synthesis radiating efficiency is not
It is high.
Invention content
The present invention is directed to deficiencies of the prior art, it is proposed that a kind of novel heat-conducting adhesive tape and preparation method thereof,
The heat conductivility of pressure sensitive adhesive can be improved, so as to improve the radiating efficiency of heat-conducting glue band entirety.
The present invention is achieved by the following technical solutions：
The present invention relates to a kind of novel heat-conducting adhesive tape, the heat-conducting glue band includes heat conduction functional layer and is coated on heat conduction work(
The pressure sensitive adhesive of one side surface of ergosphere, the pressure sensitive adhesive have diffusion micro-structure, institute on the surface far from heat conduction functional layer side
Filled with the pressure sensitive adhesive for being mixed with metal powder in the diffusion micro-structure stated.
The pressure sensitive adhesive for being mixed with metal powder is fitted with release film on the surface far from heat conduction functional layer side.
The heat conduction functional layer is copper foil or aluminium foil, it is preferable that is copper foil；
The metal powder is copper powder, aluminium powder, silver powder or the mixed metal powder including three；Preferably, it is copper powder.
The present invention relates to a kind of preparation method of heat-conducting glue band, including：
A then) the pressure-sensitive adhesive coating on diffusion micro-structure master mold is bonded heat conduction functional layer, stripping diffusion micro-structure master mold
The semi-finished product with diffusion micro-structure are made afterwards；
B) metal powder is dispersed in volatile organic solvent, adds in pressure sensitive adhesive and is uniformly mixed, treat that organic solvent is waved
Send out spare；
C) semi-finished product with diffusion micro-structure are placed on screen printing platform, in diffusion micro-structure surface coating mixing
Pressure sensitive adhesive, is finally bonded by the pressure sensitive adhesive of metal powder with release film, and novel heat-conducting adhesive tape is made.
In the step B, in parts by weight, metal powder is 10~20 parts, and volatile organic solvent is 60~80 parts,
Pressure sensitive adhesive is 80~100 parts.
Preferably, the volatile organic solvent is selected from ethyl acetate, butyl acetate, butanone, toluene, ethyl alcohol.
The diffusion micro-structure master mold is any one diffusion barrier, and surface is coated with silicone oil；Preferably, the diffusion
Prism spacing is 20~30 microns in film, and depth is 8~10 microns.
Technique effect
Compared with prior art, the present invention in pressure sensitive adhesive by setting metal powder to improve the thermal conductivity of pressure sensitive adhesive
Can, so as to improve the radiating efficiency of heat-conducting glue band entirety, radiating efficiency can improve 10%~30%.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the process flow chart of the present invention；
In figure：Heat conduction functional layer 1, pressure sensitive adhesive 2, diffusion micro-structure 3, release film 4, diffusion barrier 5.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention will be described in detail.
Embodiment 1
As shown in Figure 1, the present embodiment is related to a kind of novel heat-conducting adhesive tape, the heat-conducting glue band includes heat conduction functional layer 1
With the pressure sensitive adhesive 2 for being coated on 1 one side surface of heat conduction functional layer, the pressure sensitive adhesive 2 is on the surface far from 1 side of heat conduction functional layer
With diffusion micro-structure 3, exist in the diffusion micro-structure 3 filled with the pressure sensitive adhesive for being mixed with metal powder, the pressure sensitive adhesive
Release film 4 is fitted with far from heat conduction functional layer side.
The thermal conductivity factor of the heat-conducting glue band is 10w/ (mk), and 180 ° of peeling forces are 600gf.
Preferably, the heat conduction functional layer 1 is copper foil.
Preferably, the metal powder is copper powder.
As shown in Fig. 2, the present embodiment is related to a kind of preparation method of novel heat-conducting adhesive tape, include the following steps：
S1, 30 microns of prism spacing, 10 microns of depth diffusion barrier 5 on, be coated with silicone oil, be made off-type force 10gf a left side
Right diffusion micro-structure master mold；
S2, the pressure-sensitive adhesive coating 2 on diffusion micro-structure master mold is bonded 9 microns of copper foil on pressure sensitive adhesive 2, then removes expansion
Micro-structure master mold is dissipated, obtains semi-finished product；
S3, semi-finished product are placed on screen printing platform, is coated in micro-structure 3 is spread and is mixed with the pressure-sensitive of copper powder
Pressure sensitive adhesive is finally bonded by glue with release film 4, and novel heat-conducting adhesive tape is made.
The pressure sensitive adhesive for being mixed with copper powder is prepared with the following method, in parts by weight, 20 parts of copper powders is dispersed in 80
In part butanone, the pressure sensitive adhesive of 100 parts of soken Co., Ltd. model C 502C is then added in, passes through high speed dispersor or ultrasonic wavelength-division
It dissipates and is uniformly mixed, and is spare after organic matter volatilizees completely.
It is emphasized that：It the above is only presently preferred embodiments of the present invention, not the present invention made in any form
Limitation, any simple modification, equivalent change and modification that every technical spirit according to the present invention makees above example,
In the range of still falling within technical solution of the present invention.
Claims (9)
1. a kind of novel heat-conducting adhesive tape, which is characterized in that the heat-conducting glue band includes heat conduction functional layer and is coated on heat conduction work(
The pressure sensitive adhesive of one side surface of ergosphere, the pressure sensitive adhesive have diffusion micro-structure, institute on the surface far from heat conduction functional layer side
Filled with the pressure sensitive adhesive for being mixed with metal powder in the diffusion micro-structure stated.
2. heat-conducting glue band according to claim 1, it is characterized in that, the pressure sensitive adhesive for being mixed with metal powder is led separate
The surface of hot merit ergosphere side is fitted with release film.
3. heat-conducting glue band according to claim 1, it is characterized in that, the heat conduction functional layer is copper foil or aluminium foil, preferably
Ground is copper foil；The metal powder is copper powder, aluminium powder, silver powder or the mixed metal powder including three, it is preferable that is copper
Powder.
4. a kind of preparation method of novel heat-conducting adhesive tape described in any of the above-described claim, which is characterized in that including：
A then) the pressure-sensitive adhesive coating on diffusion micro-structure master mold is bonded heat conduction functional layer, is made after stripping diffusion micro-structure master mold
Obtain the semi-finished product with diffusion micro-structure；
B) metal powder is dispersed in volatile organic solvent, adds in pressure sensitive adhesive and is uniformly mixed；
C) semi-finished product with diffusion micro-structure are placed on screen printing platform, gold is mixed in diffusion micro-structure surface coating
Belong to the pressure sensitive adhesive of powder, be finally bonded pressure sensitive adhesive with release film, novel heat-conducting adhesive tape is made.
5. the preparation method of novel heat-conducting adhesive tape according to claim 4, it is characterized in that, the metal powder that is mixed with
In pressure sensitive adhesive, in parts by weight, the metal powder is 10~20 parts, and the pressure sensitive adhesive is 80~100 parts.
6. the preparation method of novel heat-conducting adhesive tape according to claim 5, it is characterized in that, in parts by weight, described waves
Hair property organic solvent is 60~80 parts.
7. the preparation method of novel heat-conducting adhesive tape according to claim 5, it is characterized in that, the volatile organic solvent
Selected from ethyl acetate, butyl acetate, butanone, toluene, two propyl alcohol methyl ethers.
8. the preparation method of novel heat-conducting adhesive tape according to claim 4, it is characterized in that, the diffusion micro-structure master mold
For any one diffusion barrier, surface is coated with silicone oil.
9. the preparation method of novel heat-conducting adhesive tape according to claim 8, it is characterized in that, prism spacing in the diffusion barrier
It it is 20~30 microns, depth is 8~10 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711458197.3A CN108178991A (en) | 2017-12-28 | 2017-12-28 | Novel heat-conducting adhesive tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711458197.3A CN108178991A (en) | 2017-12-28 | 2017-12-28 | Novel heat-conducting adhesive tape and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108178991A true CN108178991A (en) | 2018-06-19 |
Family
ID=62548196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711458197.3A Pending CN108178991A (en) | 2017-12-28 | 2017-12-28 | Novel heat-conducting adhesive tape and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108178991A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924761A1 (en) * | 1997-12-22 | 1999-06-23 | Nitto Denko Corporation | Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same |
| CN106189912A (en) * | 2016-08-12 | 2016-12-07 | 斯迪克新型材料（江苏）有限公司 | A kind of Copper Foil conduction, the preparation method of heat conduction one-faced tapes |
-
2017
- 2017-12-28 CN CN201711458197.3A patent/CN108178991A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924761A1 (en) * | 1997-12-22 | 1999-06-23 | Nitto Denko Corporation | Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same |
| CN106189912A (en) * | 2016-08-12 | 2016-12-07 | 斯迪克新型材料（江苏）有限公司 | A kind of Copper Foil conduction, the preparation method of heat conduction one-faced tapes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202322703U (en) | Adhesive tape with heat conduction performance | |
| CN107031144B (en) | A kind of high efficiency and heat radiation metal foil and the preparation method and application thereof | |
| CN203537732U (en) | Graphene heat radiation film | |
| CN204529729U (en) | A kind of printable hot phase change material conductive adhesive film | |
| CN109935159B (en) | Reticulate pattern heat-conducting adhesive label material with flame retardant function and preparation method thereof | |
| CN106414649B (en) | Enhancing contact adhesive for thermal management application | |
| CN204526317U (en) | A kind of containing reticular supporting structure can printing heat phase-change material conductive adhesive film | |
| CN204999844U (en) | Heat dissipation sticky tape | |
| CN109996423B (en) | Composite multilayer graphite sheet structure, manufacturing method, heat dissipation structure and electronic device | |
| CN1913763A (en) | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method | |
| CN108178991A (en) | Novel heat-conducting adhesive tape and preparation method thereof | |
| CN202941077U (en) | Graphite heat radiation structure for electronic product | |
| CN202941076U (en) | Graphite heat radiation sheet for electronic product | |
| CN106189913B (en) | Heat-conducting glue band and heat-conducting double-sided adhesive tape | |
| CN109266178A (en) | A kind of LED light source heat radiation coating and its application | |
| CN207911211U (en) | Novel ray machine cooling fin | |
| KR101993000B1 (en) | Heat spreader | |
| CN205473544U (en) | Sticky tape of area heat dissipation function | |
| CN107331650A (en) | Tack fin and circuit board and chip | |
| CN114437644A (en) | Composite heat dissipation shielding adhesive tape and preparation method thereof | |
| CN203225057U (en) | Heat conducting thin film and heat conducting label | |
| TWI651210B (en) | Composite multi-layer graphite flake structure and its manufacturing method, heat disspation structure and electronic device | |
| CN208970017U (en) | A kind of adhesive label | |
| CN202849308U (en) | Thermal tape | |
| CN204022726U (en) | A kind of high-heat-conductivity glue |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180619 |
|
| RJ01 | Rejection of invention patent application after publication |